CN220781834U - Die carrier device for drawing tungsten-molybdenum wire - Google Patents
Die carrier device for drawing tungsten-molybdenum wire Download PDFInfo
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- CN220781834U CN220781834U CN202321777850.3U CN202321777850U CN220781834U CN 220781834 U CN220781834 U CN 220781834U CN 202321777850 U CN202321777850 U CN 202321777850U CN 220781834 U CN220781834 U CN 220781834U
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- die carrier
- die
- tungsten
- carrier
- grooves
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- MGRWKWACZDFZJT-UHFFFAOYSA-N molybdenum tungsten Chemical compound [Mo].[W] MGRWKWACZDFZJT-UHFFFAOYSA-N 0.000 title claims abstract description 20
- 238000005491 wire drawing Methods 0.000 claims abstract description 29
- 238000010438 heat treatment Methods 0.000 claims description 34
- 238000007599 discharging Methods 0.000 claims description 10
- 238000009413 insulation Methods 0.000 claims description 7
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 238000001514 detection method Methods 0.000 description 7
- 238000005461 lubrication Methods 0.000 description 5
- 239000000306 component Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Metal Extraction Processes (AREA)
Abstract
The utility model relates to the technical field of tungsten-molybdenum wire drawing, and discloses a die frame device for tungsten-molybdenum wire drawing, which comprises a die frame, wherein one side of the die frame is provided with a plurality of ash discharge grooves, the front surface of the die frame is provided with a plurality of transverse grooves, the front surface of the die frame is provided with a plurality of wire drawing die supporting parts, the plurality of wire drawing die supporting parts are arranged in the transverse grooves, and the front surface of the die frame is also provided with a plurality of die grooves.
Description
Technical Field
The utility model relates to the technical field of tungsten-molybdenum wire drawing, in particular to a die carrier device for tungsten-molybdenum wire drawing.
Background
The die carrier is used as a core component in a wire drawing machine, the design format is various, but the tungsten-molybdenum wire drawing is different from the traditional water tank type wet drawing process, the tungsten-molybdenum wire drawing adopts a hot drawing process, the die carrier is relatively complex in design due to the fact that the die carrier needs to be heated due to the different lubrication modes, the design structure is still perfect, and the existing die carrier mainly has the following problems:
1. an external temperature sensor or a heating pipe is integrated with the temperature sensor, and the temperature detection has deviation;
2. the design of the ash discharge groove is not reasonable enough, and lubrication failure is easy to cause due to difficult ash discharge;
3. after heating, the die carrier can be thermally expanded, and the condition that the die is not aligned with the lead is caused, so that the quality of the silk thread is affected;
4. the mould frame on the market is complex in structure and high in processing difficulty;
5. the body type is larger, the temperature rising speed is slower, and the cost is higher.
Disclosure of Invention
In order to overcome the defects in the prior art, the utility model provides a die carrier device for drawing tungsten-molybdenum wires, which solves the problems in the prior art.
The utility model provides the following technical scheme: the utility model provides a die carrier device for tungsten molybdenum wire drawing, includes the die carrier, a plurality of ash discharging grooves have been seted up to one side of die carrier, a plurality of transverse grooves have been seted up to the front of die carrier, the front of die carrier is equipped with a plurality of wire drawing die supporting parts, and is a plurality of wire drawing die supporting parts set up in the transverse groove, a plurality of die grooves have still been seted up to the front of die carrier, a plurality of wire drawing die supporting parts are symmetric distribution along the die carrier, one side of die carrier is equipped with the die carrier heat insulating board, one side that the die carrier heat insulating board kept away from the die carrier is equipped with the die carrier seat, one side that the die carrier seat kept away from the heat insulating board is equipped with a plurality of set screw, die carrier, heat insulating board and die carrier seat pass through set screw fixed connection.
Further, a through hole is formed in the middle of the top of the die frame, a single-head heating pipe is arranged on the inner wall of the through hole of the die frame, and a K-type thermocouple is fixedly connected to one side, close to the single-head heating pipe, of the top of the die frame.
Further, the distance between two adjacent die grooves is set to be 20mm, a straight section with the diameter of 1.5mm is designed at the bottom of each die groove, the straight section is used for freely adjusting the position of the die, and the width of each ash discharge groove is set to be 10mm.
Further, the diameter of the single-end heating pipe is set to be 20mm, the purpose of increasing the diameter of the heating pipe is to improve the heating speed, the diameter of the K-type thermocouple is set to be 3mm, the purpose of reducing the diameter of the thermocouple is to improve the response speed of temperature detection, and the hysteresis of the temperature detection is reduced.
Furthermore, the front ash discharge groove and the rear ash discharge groove form included angles of 25 degrees and 42 degrees with the vertical direction respectively, and the angles are reduced as much as possible to ensure the smoothness of ash discharge so as to improve the lubrication effect.
Furthermore, the die carrier heat insulation plate and the die carrier seat adopt 310S heat-resistant stainless steel or 3Cr2W8V, H and other hot die steel.
Further, a temperature sensor is further arranged between the die frame and the wire drawing die supporting component, the die frame is in tight contact with the die frame, the contact length is about 120mm, the temperature of the die frame can be accurately collected, the diameter of the temperature sensor is set to be 3mm, and the length of the die frame is set to be 270mm.
The utility model has the technical effects and advantages that:
the utility model integrally adopts an integral structure, simultaneously reduces the volume, reduces the manufacturing cost, simultaneously selects materials to reduce the thermal deformation of the die, prolongs the service life, increases the volume of the heating pipe in a limited space, realizes high heating power, quick temperature rise and reduced temperature fluctuation, reasonably arranges the temperature sensor, ensures the accuracy of temperature detection, avoids the wire deflection phenomenon in the heating process, achieves the purposes of protecting the die and improving the quality of the wire, has more reasonable design of the ash discharge groove, discharges ash smoothly, avoids lubrication failure caused by accumulated ash at the die opening, realizes the free alignment of the die by reasonably reserving a translation space, and improves the quality of the wire.
Drawings
FIG. 1 is a front view of a heating module assembly of the present utility model.
Fig. 2 is an isometric view of a heating module of the present utility model.
Fig. 3 is a left side view of the heating module assembly of the present utility model.
FIG. 4 is a schematic view of an exploded view of a heating module assembly according to the present utility model.
Fig. 5 is a three-view of the scaffold of the present utility model.
Fig. 6 is a schematic view of a partial cross-sectional structure of a mold frame according to the present utility model.
The reference numerals are: 1. a mould frame; 2. a wire drawing die support member; 3. the mould frame heat insulation plate; 4. a mold frame seat; 5. a single-head heating pipe; 6. a type K thermocouple; 7. and (5) fixing the screw.
Detailed Description
The embodiments of the present utility model will be clearly and completely described below with reference to the drawings in the present utility model, and the form of each structure described in the following embodiments is merely an example, and the die carrier device for drawing tungsten-molybdenum wire according to the present utility model is not limited to each structure described in the following embodiments, and all other embodiments obtained by a person skilled in the art without making any inventive effort are within the scope of the present utility model.
Referring to fig. 1-6, the utility model provides a die carrier device for tungsten-molybdenum wire drawing, which comprises a die carrier 1, wherein one side of the die carrier 1 is provided with a plurality of ash discharging grooves, the front surface of the die carrier 1 is provided with a plurality of transverse grooves, the front surface of the die carrier 1 is provided with a plurality of wire-drawing die supporting parts 2, the plurality of wire-drawing die supporting parts 2 are arranged in the transverse grooves, the front surface of the die carrier 1 is also provided with a plurality of die grooves, the plurality of wire-drawing die supporting parts 2 are symmetrically distributed along the die carrier 1, one side of the die carrier 1 is provided with a die carrier heat insulating plate 3, one side of the die carrier heat insulating plate 3, which is far away from the die carrier 1, is provided with a die carrier seat 4, one side of the die carrier seat 4, which is far away from the die carrier heat insulating plate 3, is provided with a plurality of fixing screws 7, the die carrier 1, the die carrier heat insulating plate 3 and the die carrier seat 4 are fixedly connected through the fixing screws 7, the die carrier 1 adopts an integral structure through the arranged, simultaneously reduces the volume, reduces the manufacturing cost, reasonably selects materials, prolongs the service life while prolonging the volume of a die, and increases the volume of a heating pipe in a limited space, realizes large heating power, fast temperature lifting, reduces temperature fluctuation, the structural design of the grooves avoids the generation of deflection in the heating process, and improves the wire deformation phenomenon, and protects the wire.
In a preferred embodiment, a through hole is formed in the middle of the top of the die frame 1, a single-head heating pipe 5 is arranged on the inner wall of the through hole of the die frame 1, and a K-type thermocouple 6 is fixedly connected to one side, close to the single-head heating pipe 5, of the top of the die frame 1.
In a preferred embodiment, the distance between two adjacent mold cavities is set to 20mm, a flat section of 1.5mm is designed at the bottom of each mold cavity, the flat section is used for freely adjusting the position of the mold, the width of each ash discharging groove is set to 10mm, the length of each mold cavity 1 is set to 270mm, a flat section of 1.5mm is designed at the bottom of each mold cavity and used for freely adjusting the position of the mold, because the mold cavity 1 needs to be heated to about 500 ℃, the length of each mold cavity 1 is 270mm, the overall expansion of the mold cavity 1 is known to be about 1.5mm according to the linear thermal expansion coefficient of metal, and the space for moving left and right is increased in the design of the mold cavities for freely adjusting the position in order to compensate the position change of the mold caused by the length change of the mold under thermal expansion.
In a preferred embodiment, the diameter of the single-end heating pipe 5 is set to 20mm, the purpose of increasing the diameter of the heating pipe is to increase the heating speed, the diameter of the K-type thermocouple 6 is set to 3mm, the purpose of decreasing the diameter of the thermocouple is to increase the response speed of temperature detection, and the hysteresis of temperature detection is reduced.
In a preferred embodiment, the front and rear ash discharge grooves form an angle of 25 ° and 42 ° with the vertical direction, respectively, and the angle is reduced as much as possible in order to ensure smooth ash discharge for improving lubrication effect.
In a preferred embodiment, the die carrier 1, the die carrier insulating plate 3 and the die carrier seat 4 are made of 310S heat-resistant stainless steel or 3Cr2W8V, H and other hot die steel, and the common material is easily oxidized at the temperature of about 500 ℃ for a long time, and the common steel has large thermal expansion ratio, so that the positions of the wire drawing dies are greatly displaced in a cold state and a hot state, the deflection of wires is easily generated, and the drawing effect on the fine wires is large.
In a preferred embodiment, a temperature sensor is further arranged between the die frame 1 and the wire drawing die supporting component 2, the die frame 1 is in close contact with the die frame, the contact length is about 120mm, the die frame temperature can be accurately acquired, the diameter of the temperature sensor is set to be 3mm, and the temperature sensor does not adopt a single-head heating pipe built-in structure, because the temperature inside the single-head heating pipe 5 is acquired under the structure instead of the temperature of the die frame 1. The external contact type is not adopted, and in this case, the temperature sensor and the die carrier 1 cannot be in close contact, and the acquisition temperature is not accurate. Therefore, the temperature sensor is arranged between the die carrier 1 and the die carrier heat insulation plate 3 and is in close contact with the die carrier 1, the contact length is about 120mm, the temperature of the die carrier 1 can be accurately acquired, the diameter of the temperature sensor is about 3mm, and the larger the diameter is, the larger the temperature acquisition lag is, the smaller the diameter is, the shorter the service life is, so that the temperature sensor cannot be too small.
The working principle of the utility model is as follows: when the die carrier device for tungsten-molybdenum wire drawing is used, firstly, heating is started through the single-head heating pipe 5 after equipment is started, so that the temperature of the die carrier 1 is increased, heat is transmitted to the wire drawing die supporting component 2 through the die carrier 1, the temperature of the die carrier 1 is continuously collected through the K-type thermocouple 6 in the whole working process and fed back to the PLC, the PLC determines the starting and stopping of the operation of the single-head heating pipe 5 according to the comparison of the preset temperature and the collected temperature, the device integrally adopts an integral structure, meanwhile, the volume is reduced, the manufacturing cost is reduced, meanwhile, the material selection reduces the thermal deformation of a die, the service life is prolonged, the volume of the heating pipe is increased in a limited space, the heating power is high, the temperature is increased quickly, the temperature fluctuation is reduced, the reasonable setting of a temperature sensor is guaranteed, the accuracy of temperature detection is guaranteed, the structural design of the die groove avoids the wire deflection phenomenon in the heating process, the purposes of protecting the die and improving the quality of wires are achieved, part of lubricating graphite on the surface of wires in the wire drawing process is partially fallen from the surface when passing through the wire drawing die supporting component 2, the ash discharging groove on the part falls off from the surface of the wire die carrier 1, the ash discharging groove on the part falls to the ash discharging groove on the wire die carrier 1, the ash discharging groove is reduced, the ash is completely, the ash is discharged through the ash discharging groove, the ash is more reasonably and the ash discharging hole is more well, the ash is prevented from the die groove is more well and the quality is more well and the quality and has the quality due to the quality to be more well to be more due to the realization.
Claims (7)
1. The die carrier device for drawing the tungsten-molybdenum wire comprises a die carrier (1), and is characterized in that: a plurality of ash discharging grooves are formed in one side of the die carrier (1), a plurality of transverse grooves are formed in the front side of the die carrier (1), a plurality of wire drawing die supporting parts (2) are arranged in the front side of the die carrier (1), the wire drawing die supporting parts (2) are arranged in the transverse grooves, a plurality of die grooves are further formed in the front side of the die carrier (1), the wire drawing die supporting parts (2) are symmetrically distributed along the die carrier (1), a die carrier heat insulation plate (3) is arranged on one side of the die carrier (1), a die carrier seat (4) is arranged on one side, far away from the die carrier (1), of the heat insulation plate (3), a plurality of fixing screws (7) are arranged on one side, far away from the die carrier seat (4), of the die carrier (1), the heat insulation plate (3) and the die carrier seat (4) are fixedly connected through the fixing screws (7).
2. A die carrier device for drawing tungsten-molybdenum wires according to claim 1, wherein: the novel die carrier is characterized in that a through hole is formed in the middle of the top of the die carrier (1), a single-head heating pipe (5) is arranged on the inner wall of the through hole of the die carrier (1), and a K-type thermocouple (6) is fixedly connected to one side, close to the single-head heating pipe (5), of the top of the die carrier (1).
3. A die carrier device for drawing tungsten-molybdenum wires according to claim 1, wherein: the interval of two adjacent mould grooves is set to 20mm, and the bottom design of mould groove has a 1.5mm straight section, and this straight section is used for the free adjustment of mould position, the width of ash discharge groove sets to 10mm.
4. A die carrier device for drawing tungsten-molybdenum wires according to claim 2, wherein: the diameter of the single-head heating pipe (5) is set to be 20mm, and the diameter of the K-type thermocouple (6) is set to be 3mm.
5. A die carrier device for drawing tungsten-molybdenum wires according to claim 1, wherein: the included angles formed by the front ash discharge groove and the rear ash discharge groove and the vertical direction are 25 degrees and 42 degrees respectively.
6. A die carrier device for drawing tungsten-molybdenum wires according to claim 1, wherein: the die carrier (1), the die carrier heat insulation plate (3) and the die carrier seat (4) are made of 310S heat-resistant stainless steel or 3Cr2W8V, H13 hot work die steel.
7. A die carrier device for drawing tungsten-molybdenum wires according to claim 1, wherein: the die carrier temperature measuring device is characterized in that a temperature sensor is further arranged between the die carrier (1) and the wire-drawing die supporting component (2) and is in tight contact with the die carrier (1), the contact length is about 120mm, the die carrier temperature can be accurately collected, the diameter of the temperature sensor is set to be 3mm, and the length of the die carrier (1) is set to be 270mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321777850.3U CN220781834U (en) | 2023-07-07 | 2023-07-07 | Die carrier device for drawing tungsten-molybdenum wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321777850.3U CN220781834U (en) | 2023-07-07 | 2023-07-07 | Die carrier device for drawing tungsten-molybdenum wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220781834U true CN220781834U (en) | 2024-04-16 |
Family
ID=90653377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321777850.3U Active CN220781834U (en) | 2023-07-07 | 2023-07-07 | Die carrier device for drawing tungsten-molybdenum wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220781834U (en) |
-
2023
- 2023-07-07 CN CN202321777850.3U patent/CN220781834U/en active Active
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