CN220781020U - Glue homogenizing machine for gluing semiconductor wafer - Google Patents
Glue homogenizing machine for gluing semiconductor wafer Download PDFInfo
- Publication number
- CN220781020U CN220781020U CN202322449954.8U CN202322449954U CN220781020U CN 220781020 U CN220781020 U CN 220781020U CN 202322449954 U CN202322449954 U CN 202322449954U CN 220781020 U CN220781020 U CN 220781020U
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- glue
- box
- ring
- piece
- dropper
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- 239000003292 glue Substances 0.000 title claims abstract description 84
- 239000004065 semiconductor Substances 0.000 title claims abstract description 21
- 238000004026 adhesive bonding Methods 0.000 title claims abstract description 6
- 238000003860 storage Methods 0.000 claims abstract description 45
- 238000001179 sorption measurement Methods 0.000 claims abstract description 17
- 230000000149 penetrating effect Effects 0.000 claims abstract description 16
- 235000012431 wafers Nutrition 0.000 claims description 22
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 229920002120 photoresistant polymer Polymers 0.000 claims 5
- 238000009434 installation Methods 0.000 description 8
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 230000035515 penetration Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Abstract
The utility model relates to the technical field of semiconductors, and provides a spin coater for gluing a semiconductor wafer, which comprises the following components: a body assembly; the device comprises a telescopic piece, a glue dropping piece, a storage piece, a connecting piece and a protecting piece; the telescopic piece comprises a fixed rod penetrating through the top end of the main body assembly, a connecting rod arranged at the top end of the fixed rod and a telescopic rod sleeved at the bottom of the fixed rod; the glue dropping piece comprises a dropper penetrating through the center of the glue dropping cover and a hose connected to the top end of the dropper; the problem that in the prior art, when the glue is dripped on the wafer, glue is dripped into a hole in the center of a glue dripping cover by using a needle tube manually is solved, the glue is dripped into the surface of the wafer from the hole, the mode is complicated, if the glue is not injected in the direction of the hole, the glue flows to the surface of the box cover, so that the glue is wasted, and the glue is injected for multiple times; meanwhile, when the inner adsorption disc rotates to evenly glue, glue is easy to fall to the inner side surface, and the problem of neatness in the box is affected.
Description
Technical Field
The utility model relates to the technical field of semiconductors, in particular to a spin coater for gluing a semiconductor wafer.
Background
The semiconductor refers to a material with conductivity between a conductor and an insulator at normal temperature, and glue is required to be dripped by a glue homogenizing machine and a glue dripping machine to isolate the semiconductor in the manufacturing process of the semiconductor, so that the corrosion and pollution of air, moisture, dust and the like to a wafer are effectively prevented, and the reliability and the stability of a semiconductor device are improved. In the prior art, when the glue is dripped on the wafer by the glue homogenizing machine, the needle tube is used for manually dripping the glue into the hole in the center of the glue dripping cover, and the glue is dripped on the surface of the wafer inside from the hole, so that the mode is complicated, if the glue is not injected in the direction of the hole, the glue can flow to the surface of the box cover, the glue is wasted, and the glue is injected for many times inside; meanwhile, when the inner adsorption disc rotates and spin the glue evenly, the glue is easy to throw to the inner side surface, and the inside of the box is affected to be tidy.
Disclosure of Invention
The utility model provides a glue homogenizing machine for gluing a semiconductor wafer, which solves the problems that in the prior art, when the glue homogenizing machine is used for dripping glue on the wafer, glue is dripped into a hole in the center of a glue dripping cover by using a needle tube manually, and is dripped into the surface of the wafer inside from the hole, the mode is complicated, if the glue is not injected aiming at the hole, the glue flows to the surface of a box cover, so that the glue is wasted, and the glue is required to be injected into the interior for many times; meanwhile, when the inner adsorption disc rotates and spin the glue evenly, the glue is easy to throw to the inner side surface, and the tidy problem in the box is affected.
The utility model relates to a spin coater for coating a semiconductor wafer, which comprises:
a body assembly;
the telescopic piece penetrates through the top end of the main body assembly;
the glue dropping piece is connected to the top end of the main body component;
the storage piece is arranged on the right side of the main body assembly;
the two ends of the connecting piece are connected between the inner sides of a group of telescopic pieces;
and the protection piece is arranged inside the main body assembly.
Further, the telescopic piece comprises a group of fixing rods penetrating through the top end of the main body component, a connecting rod arranged on the top end of the fixing rods and telescopic rods sleeved at the bottoms of the fixing rods;
the connecting rod and the telescopic rod extend a part of the connecting rod and the telescopic rod into the fixing rod, and the fixing rod is provided with a clamping groove at a corresponding position at the top end of the main body assembly;
specifically, set up a set of extensible member on the top of main part subassembly, be convenient for remove the burette in the middle inside through the extensible member, after the drip is accomplished to the burette inside, accessible telescopic link removes to the external world, and when the interior adsorption disk of accessible rotated, the side does not have the influence object.
Further, the main body component comprises a box cover, a glue dripping cover sleeved at the center of the box cover, a placing box connected below the box cover, a box body arranged below the placing box, an operation screen connected to the front surface of the box body, and an adsorption disc arranged at the center inside the placing box;
wherein, the center of the glue dropping cover is provided with a glue dropping opening which is a penetrating hole;
specifically, the case cover is used for covering the inside of the placement case; the placing box is used for placing other objects such as the adsorption disc; the box body is used for supporting the upper part; the operation screen is used for controlling internal operation; the adsorption disc is used for placing objects such as wafers.
Further, the glue dropping piece comprises a dropper penetrating through the center of the glue dropping cover and a hose connected to the top end of the dropper;
the dropper extends to the upper part of the adsorption disc and is connected with one end of the hose through a connecting block at the top end;
wherein the dropper is connected between the fixed rods;
specifically, the dropper extends above the adsorption disc, so that the dropper can be directly dripped on the surface of the wafer; the dropper is spliced with one end of the hose through the connecting block at the top end, so that the hose can be taken out when not in use, and the dropper is convenient to store.
Further, the storage piece comprises a storage box connected to the right side of the storage box, a box door arranged on the front side of the storage box, a connecting ring connected to the top end of the storage box and a storage box sleeved in the storage box;
the inner side of the connecting ring is provided with a wiping ring, and the other end of the hose is clamped with the wiping ring;
specifically, the other end of the hose is spliced with the wiping ring in the connecting ring, so that the hose can be conveniently stored, and meanwhile, the wiping ring is arranged at the joint of the connecting ring and the other end of the hose, so that when the hose is taken out, glue drops on the surface of the hose can be wiped and cleaned, and no glue exists on the surface of the taken-out hose; and meanwhile, the box door is connected with the storage box through a hinge, so that the inner storage box can be conveniently taken.
Further, the connecting piece comprises a group of connecting pipes connected to the inner side of the bottom end of the telescopic rod and a fixing ring arranged between the connecting pipes;
wherein the connecting pieces are arranged in a group and are respectively positioned above and below the dropper;
wherein, the dropper of the glue dropping piece penetrates through the fixing ring;
specifically, set up solid fixed ring in the top and the below of burette, gu fixed ring is connected with connecting rod, telescopic link through the connecting rod of both sides, can be like this when the adsorption disc rotates, remove the burette to the external world through telescopic connecting rod and telescopic link, can not influence the rotation of adsorption disc.
Further, the protection piece comprises a protection ring sleeved at the center of the inside of the placement box, two groups of installation rods penetrating through the four end edges of the protection ring, an installation ring arranged at the bottom of the penetration part below the protection ring and the installation rods, a limit rod connected to the center of the top end of the installation rod, and a movable ring sleeved at the periphery of the limit rod;
threads are arranged on the surface of the limiting rod and the inner side of the movable ring, and the limiting rod and the movable ring are rotationally connected;
specifically, four installation poles are arranged to penetrate through four end edges of the protection ring, the installation ring is arranged at the penetrating position of the protection ring and the lower part of the installation pole, the protection ring can be placed on the installation ring, then the protection ring is rotated through the movable ring above to be connected and fixed with the limiting rod, the movable ring is rotatable to fix the protection ring, the protection ring is convenient to detach, glue on the protection ring is cleaned, and the protection ring can be reused.
Further, the front end and the rear end of the storage box are slope-shaped, and the hose extends to the inner bottom surface of the box;
specifically, the two ends of the storage box are arranged in a slope shape, glue is gathered in the middle of the inside of the storage box, and the hose is convenient to suck.
The working principle and the beneficial effects of the utility model are as follows:
in order to simplify the glue dripping step, reduce the waste of glue and reduce the manual injection times of the glue, a storage box for the glue is arranged on the right side of the storage box, meanwhile, the glue is conveyed into a dropper in the middle of a box cover through a hose above the storage box, meanwhile, the dropper penetrates through the box cover through a hole in the middle of the box cover, telescopic connecting rods and telescopic rods are arranged on two sides of the dropper, the connecting rods and the telescopic rods are connected with the dropper through connecting pieces in the middle, and the dropper moves up and down through the connecting rods and the telescopic rods so as to adjust the positions; the dropper is connected with the right glue storage box through a hose at the top end, so that the frequency of glue injection can be reduced; meanwhile, the periphery of the rotary adsorption disc is provided with a protection ring to protect the glue thrown out during rotation, so that the cleanliness in the box is improved.
Drawings
The utility model will be described in further detail with reference to the drawings and the detailed description.
FIG. 1 is a schematic view of the appearance structure of the present utility model;
FIG. 2 is a schematic diagram of the explosive structure of FIG. 1 according to the present utility model;
FIG. 3 is an enlarged schematic view of the structure A and an enlarged schematic view of the structure B of FIG. 2 according to the present utility model;
FIG. 4 is a schematic illustration of the front cross-sectional structure of FIG. 1 in accordance with the present utility model;
fig. 5 is a schematic view of the right side cross-sectional structure of fig. 1 according to the present utility model.
In the figure: 1. a body assembly; 11. a case cover; 12. a glue dripping cover; 13. placing a box; 14. a case; 15. an operation screen; 16. an adsorption plate; 2. a telescoping member; 21. a fixed rod; 211. a clamping groove; 22. a connecting rod; 23. a telescopic rod; 3. a glue dropping piece; 31. a dropper; 32. a hose; 4. a storage member; 41. a storage case; 42. a door; 43. a connecting ring; 431. a wiper ring; 44. a storage box; 5. a connecting piece; 51. a connecting pipe; 52. a fixing ring; 6. a guard; 61. a guard ring; 62. a mounting rod; 63. a mounting ring; 64. a limit rod; 65. a movable ring.
Detailed Description
The technical solutions of the embodiments of the present utility model will be clearly and completely described below in conjunction with the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
As shown in fig. 1 to 4, the present embodiment provides a spin coater for coating a semiconductor wafer, which includes:
a body assembly 1;
the telescopic piece 2 penetrates through the top end of the main body assembly 1;
the glue dropping piece 3 is connected with the top end of the main body component 1;
the storage piece 4 is arranged on the right side of the main body assembly 1;
the two ends of the connecting piece 5 are connected between the inner sides of the group of telescopic pieces 2;
a guard 6, the guard 6 being disposed inside the body assembly 1;
the telescopic piece 2 comprises a group of fixed rods 21 penetrating through the top end of the main body assembly 1, a connecting rod 22 arranged on the top end of the fixed rods 21, and a telescopic rod 23 sleeved at the bottom of the fixed rods 21;
wherein, the connecting rod 22 and the telescopic rod 23 extend a part of the inside of the fixed rod 21, and the fixed rod 21 is provided with a clamping groove 211 at a corresponding position at the top end of the main body component 1;
the glue dropping piece 3 comprises a dropper 31 penetrating through the center of the glue dropping cover 12 and a hose 32 connected to the top end of the dropper 31;
wherein, the dropper 31 extends to the upper part of the adsorption disc 16, and the dropper 31 is connected with one end of the hose 32 through a connecting block 311 at the top end;
wherein the dropper 31 is connected between the fixing rods 21;
the storage part 4 comprises a storage box 41 connected to the right side of the storage box 13, a box door 42 arranged on the front surface of the storage box 41, a connecting ring 43 connected to the top end of the storage box 41, and a storage box 44 sleeved in the storage box 41;
wherein, the inner side of the connecting ring 43 is provided with a wiping ring 431, and the other end of the hose 32 is clamped with the wiping ring 431;
the connecting piece 5 comprises a group of connecting pipes 51 connected to the inner side of the bottom end of the telescopic rod 23 and a fixed ring 52 arranged between the connecting pipes 51;
wherein the connecting pieces 5 are arranged in a group and are respectively positioned above and below the dropper 31;
wherein the dropper 31 of the glue dropping piece 3 penetrates through the fixed ring 52;
the front and rear ends of the storage box 44 are sloped, and the hose 32 extends to the bottom surface of the box;
in order to understand how to use the telescopic member 2, the glue dropping member 3, the storage member 4 and the connecting member 5, the following steps are published:
the connecting rod 22 and the telescopic rod 23 extend downwards, meanwhile, the middle fixing ring 52 is driven to extend towards the inside of the placement box 13, after the fixing ring 52 is moved to a proper position, the dropper 31 is inserted into the fixing ring 52, then two ends of the hose 32 are respectively inserted into the connecting block 311 and the wiping ring 431, after the insertion, the operation screen 15 is controlled, the hose 32 starts to suck the glue in the storage box 41, the glue is conveyed into the dropper 31, and the dropper 31 drops the glue onto the surface of a wafer;
after the glue in the storage box 44 is used, the box door 42 is opened, the inner storage box 44 is taken out, the glue is supplemented, and after the glue is supplemented, the storage box 44 is placed in the storage box 41, and the box door 42 is closed;
the step can quickly drop the glue on the surface of the wafer, reduce the waste of the glue, simplify the step and reduce the times of manual injection.
Example 2
As shown in fig. 2 to 5, based on the same concept as that of the above embodiment 1, the present embodiment also proposes that the guard 6 includes a guard ring 61 sleeved at the center of the inside of the placement box 13, two sets of mounting rods 62 penetrating through four edges of the guard ring 61, a mounting ring 63 disposed at the bottom of the penetration below the guard ring 61 and the mounting rods 62, a limit rod 64 connected to the center of the top end of the mounting rod 62, and a movable ring 65 sleeved at the periphery of the limit rod 64;
the surface of the limiting rod 64 and the inner side of the movable ring 65 are provided with threads, and the limiting rod 64 and the movable ring 65 are rotationally connected;
to see how the guard 6 is used, the following steps are published:
the edge of the protection ring 61 passes through the mounting rod 62 and is placed on the mounting ring 63, the movable ring 65 is inserted into the limiting rod 64, the movable ring 65 is rotated to the penetrating position above the protection ring 61 and the mounting rod 62, and the protection ring 61 on the mounting ring 63 is fixed;
when the adsorption disc 16 rotates to uniformly glue, the protective ring 61 protects the thrown glue at the periphery;
this step can protect the thrown glue and improve the neatness of the inside of the placement box 13.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.
Claims (8)
1. A glue homogenizing machine for gluing a semiconductor wafer is characterized by comprising the following components:
a body assembly (1);
the telescopic piece (2) penetrates through the top end of the main body assembly (1);
the glue dropping piece (3), the glue dropping piece (3) is connected to the top end of the main body component (1);
the storage piece (4) is arranged on the right side of the main body assembly (1);
the two ends of the connecting piece (5) are connected between the inner sides of a group of telescopic pieces (2);
and the protection piece (6) is arranged inside the main body assembly (1).
2. The spin coater for coating semiconductor wafers according to claim 1, wherein the telescopic member (2) comprises a group of fixing rods (21) penetrating through the top end of the main body assembly (1), a connecting rod (22) arranged on the top end of the fixing rods (21), and a telescopic rod (23) sleeved at the bottom of the fixing rods (21);
wherein, connecting rod (22) and telescopic link (23) all extend a part to dead lever (21) inside, and dead lever (21) are offered draw-in groove (211) in the corresponding position department in main part subassembly (1) top.
3. The spin coater for coating semiconductor wafers according to claim 1, wherein the main body assembly (1) comprises a box cover (11), a glue dropping cover (12) sleeved in the center of the box cover (11), a placement box (13) connected below the box cover (11), a box body (14) arranged below the placement box (13), an operation screen (15) connected to the front surface of the box body (14), and an adsorption disc (16) arranged in the center inside the placement box (13);
wherein, the center of the glue dropping cover (12) is provided with a glue dropping opening which is a penetrating hole.
4. The photoresist evening machine for semiconductor wafer photoresist according to claim 1, wherein the photoresist dropping piece (3) comprises a dropper (31) penetrating through the center of the photoresist dropping cover (12) and a hose (32) connected to the top end of the dropper (31);
the dropper (31) extends to the upper part of the adsorption disc (16), and the dropper (31) is connected with one end of the hose (32) through a connecting block (311) at the top end;
wherein the dropper (31) is connected between the fixing rods (21).
5. The spin coater for coating semiconductor wafers according to claim 1, wherein the storage unit (4) comprises a storage box (41) connected to the right side of the storage box (13), a box door (42) arranged on the front surface of the storage box (41), a connecting ring (43) connected to the top end of the storage box (41), and a storage box (44) sleeved inside the storage box (41);
the inner side of the connecting ring (43) is provided with a wiping ring (431), and the other end of the hose (32) is clamped with the wiping ring (431).
6. The spin coater for coating semiconductor wafers according to claim 1, wherein the connecting member (5) comprises a group of connecting pipes (51) connected to the inner side of the bottom end of the telescopic rod (23), and a fixing ring (52) arranged between the connecting pipes (51);
wherein the connecting pieces (5) are arranged in a group and are respectively positioned above and below the dropper (31);
wherein, the dropper (31) of the glue dropping piece (3) penetrates through the fixing ring (52).
7. The photoresist leveler for coating semiconductor wafers according to claim 1, wherein the guard (6) comprises a guard ring (61) sleeved at the center inside the placement box (13), two groups of mounting rods (62) penetrating through the four edges of the guard ring (61), a mounting ring (63) arranged at the bottom of the penetrating part below the guard ring (61) and the mounting rod (62), a limiting rod (64) connected at the center of the top end of the mounting rod (62), and a movable ring (65) sleeved at the periphery of the limiting rod (64);
threads are arranged on the surface of the limiting rod (64) and the inner side of the movable ring (65), and the limiting rod and the movable ring are rotationally connected.
8. The spin coater for coating semiconductor wafers as set forth in claim 5, wherein the front and rear ends of the storage box (44) are sloped, and the hose (32) extends to the bottom surface of the box.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322449954.8U CN220781020U (en) | 2023-09-11 | 2023-09-11 | Glue homogenizing machine for gluing semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322449954.8U CN220781020U (en) | 2023-09-11 | 2023-09-11 | Glue homogenizing machine for gluing semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220781020U true CN220781020U (en) | 2024-04-16 |
Family
ID=90637384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322449954.8U Active CN220781020U (en) | 2023-09-11 | 2023-09-11 | Glue homogenizing machine for gluing semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220781020U (en) |
-
2023
- 2023-09-11 CN CN202322449954.8U patent/CN220781020U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant |