CN220775834U

CN220775834U - Optical module and switching equipment

Info

Publication number: CN220775834U
Application number: CN202322157543.1U
Authority: CN
Inventors: 张强; 司明钢; 李江
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2023-08-09
Filing date: 2023-08-09
Publication date: 2024-04-12
Anticipated expiration: 2033-08-09

Abstract

The embodiment of the application discloses an optical module and switching equipment, which are used for reducing the power consumption of the optical module and the insertion loss of signals transmitted by the optical module under the condition of improving service types. The optical module comprises a first photoelectric converter and a processor which are sequentially connected, wherein the processor comprises a first digital-to-analog conversion interface, the first digital-to-analog conversion interface is connected with the first photoelectric converter, and the processor comprises a middle-distance MR interface or a long-distance LR interface; the first photoelectric converter is used for receiving an optical signal and converting the optical signal into an electric signal; the first digital-to-analog conversion interface is used for converting the electric signal into a digital signal; the processor is used for processing the digital signals and sending the processed signals outwards through the MR interface or the LR interface.

Description

Optical module and switching equipment

Technical Field

The embodiment of the application relates to the technical field of optical communication, in particular to an optical module and switching equipment.

Background

The optical transmission apparatus includes an optical module. The optical module is built into a framing (Framer) chip. The optical module receives the optical signals carrying various services and encapsulates the optical signals carrying various services into transmission frames. For example, the optical module receives an ethernet service optical signal, the optical module performs photoelectric conversion on the ethernet service optical signal to obtain an ethernet service electrical signal, the frame chip encapsulates the ethernet service electrical signal into an ethernet transmission frame, and the optical module outputs the ethernet transmission frame. For another example, an optical module receives an optical transport network (optical transport network, OTN) service optical signal, the optical module performs photoelectric conversion on the OTN service optical signal to obtain an OTN service electrical signal, and a Framer chip encapsulates the OTN service electrical signal into OTN transmission frames with various rates, and the optical module emits the OTN transmission frames.

It can be known that the transmission frame emitted by the optical module varies with the type of the carried service, so that the format of the transmission frame varies. Along with the continuous growth of fixed network, mobile and private line services, the type of the frame format of the transmission frame emitted by the optical module is improved, so that the insertion loss of the transmission frame emitted by the optical module is relatively large. The optical module at the receiving side needs to process transmission frames in various formats, so that the power consumption of the optical module at the receiving side is improved.

Disclosure of Invention

The embodiment of the application provides a service transmission method, an optical module and transmission equipment, which are used for reducing the power consumption of the optical module for processing the service under the condition of improving the service type.

In a first aspect, an embodiment of the present application provides a method for transmitting a service, where the method includes: first, an optical module receives an optical signal that carries traffic data. Second, the optical module converts the optical signal into an electrical signal. And thirdly, the optical module carries out digital signal processing on the electric signal to obtain a service cell or a service packet. The optical module can convert various types of services, such as synchronous digital hierarchy service, packet service, ethernet service, flexible ethernet network, forwarding service, optical transport network service, storage service, data center service or super computing service, etc., into service cells or service packets with uniform format based on a digital signal processing manner. And finally, the optical module sends the service cell or the service packet outwards.

By adopting the scheme, even if the type of the service received by the optical module is improved along with the continuous growth of fixed network, mobile and private line services, the optical module can convert different services into service cells or service packets in a uniform format. Then, the other optical module as the receiving side directly receives the service cell or the service packet, and the power consumption of the other optical module for processing the service cell or the service packet is reduced because the formats of the service cell or the service packet are unified. In addition, various types of services are transmitted through the service cells or the service packets, so that successful transmission of the services is ensured, and the reliability of service transmission is improved.

Based on the first aspect, in an optional implementation manner, the optical module performs digital signal processing on the electrical signal, and obtaining a service cell or a service packet includes: the optical module converts the electrical signal into a digital signal; the optical module demaps the digital signal to obtain a demapped signal; and the optical module slices the demapping signal to obtain the service cell or the service packet.

By adopting the implementation mode, the optical module can convert various types of services into the service cells or the service packets in a unified format based on digital signal processing, so that the power consumption of the optical module for processing the service cells or the service packets is reduced, and the reliability of service transmission is improved.

Based on the first aspect, in an optional implementation manner, the optical module slices the demapped signal, and obtaining the service cell or the service packet includes: and the optical module slices the demapping signal according to the byte number or the bit number to obtain a plurality of paths of service cells.

By adopting the implementation mode, various types of services can be sliced according to the byte number or the bit number, so that the service exchange efficiency and the service transmission reliability are improved.

Based on the first aspect, in an optional implementation manner, the demapping signal includes a plurality of subframes, and the optical module slices the demapping signal to obtain the service cell or the service packet includes: and the optical module slices the demapping signal according to the length of the subframe to obtain the service packet, wherein the service packet comprises at least one subframe.

By adopting the implementation mode, each service packet comprises at least one complete subframe, so that the packet loss rate of service transmission is effectively reduced, and the reliability of service transmission is improved.

Based on the first aspect, in an optional implementation manner, after the optical module slices the demapped signal to obtain the service cell or the service packet, the method further includes: the optical module adds an overhead in the service cell or the service packet, wherein the overhead carries at least one of the following items: information for indicating a destination port, operation and maintenance information, switching information or timing information, wherein the switching information is used for indicating a switching mode of the service cell or the service packet, and the timing information is used for indicating a timing of sending the service cell or the service packet.

By adopting the implementation mode, the increased cost of the service cells or the service packets can ensure the successful exchange of the service, and the reliability of service transmission is improved.

Based on the first aspect, in an optional implementation manner, the sending, by the optical module, the service cell or the service packet includes: and the optical module sends the service cell or the service packet to the switching chip through a first transmission medium.

By adopting the implementation mode, the optical module is directly connected with the switching chip through the first transmission medium, and the optical module can send the service cell or the service packet to the switching chip through the first transmission medium, so that the switching chip can successfully switch the service cell or the service packet to the corresponding target port.

Based on the first aspect, in an optional implementation manner, the sending, by the optical module, the service cell or the service packet includes: and the optical module sends the service cell or the service packet to another optical module through a second transmission medium.

By adopting the implementation mode, the optical module is directly connected with the other optical module through the second transmission medium, so that the reliability of transmission of the service cell or the service packet is improved, and the transmission time delay of the service cell or the service packet is reduced.

Based on the first aspect, in an optional implementation manner, the sending, by the optical module, the service cell or the service packet includes: the optical module converts the service cell or the service packet into a transmission optical signal; the optical module sends the transmission optical signal outwards through a first transmission medium or a second transmission medium, the first transmission medium is used for connecting the optical module and the exchange chip, and the second transmission medium is used for connecting the optical module and another optical module.

By adopting the implementation mode, the optical module converts the service cell or the service packet into the transmission optical signal, and realizes the transmission of the service cell or the service packet by transmitting the optical signal, thereby reducing the time delay of the transmission of the service cell or the service packet.

Based on the first aspect, in an optional implementation manner, the optical module is a direct-detection optical module, the optical module demaps the digital signal, and after obtaining a demapped signal, the method further includes: the optical module performs Forward Error Correction (FEC) decoding on the demapped signal to obtain a first decoded signal; the optical module slicing the demapped signal, and obtaining the service cell or the service packet includes: and the optical module slices the first decoding signal to obtain the service cell or the service packet.

By adopting the implementation mode, the input optical fiber of the optical module is used for receiving the optical signal carrying the service data, the FEC decoding of the optical module can improve the reliability of the optical signal transmission, reduce the error rate of the optical signal and effectively inhibit the intersymbol interference of the optical signal transmission path.

Based on the first aspect, in an optional implementation manner, the optical module is a direct detection optical module or a coherent optical module, and after the optical module demaps the digital signal to obtain a demapped signal, the method further includes: the optical module performs FEC decoding on the demapping signal to obtain a first decoding signal; the optical module slicing the demapped signal, and obtaining the service cell or the service packet includes: the optical module slices the first decoding signal to obtain the service cell or the service packet; the optical module slices the demapped signal to obtain the service cell or the service packet, and the method further includes: the optical module performs FEC coding on the service cell or the service packet to obtain a first coding signal; the sending the service cell or the service packet by the optical module includes: the optical module transmits the first encoded signal outwards.

By adopting the implementation mode, the input optical fiber of the optical module is used for receiving the optical signal carrying the service data, the FEC decoding of the optical module can improve the reliability of the optical signal transmission, reduce the error rate of the optical signal and effectively inhibit the intersymbol interference of the optical signal transmission path. The FEC coding of the optical module can improve the reliability of the transmission of the service cell or the service packet sent outwards by the optical module and reduce the error rate of the service cell or the service packet.

Based on the first aspect, in an optional implementation manner, the optical module performs digital signal processing on the electrical signal, and obtaining a service cell or a service packet includes: the optical module performs digital signal processing on the electric signal and converts the electric signal into N paths of first transmission data streams, wherein each path of first transmission data stream comprises the service cell or the service packet, and N is any integer not less than 1; the optical module performs redundancy protection on the N paths of first transmission data streams and converts the N paths of first transmission data streams into M paths of second transmission data streams, wherein M is any integer greater than N; the sending the service cell or the service packet by the optical module includes: and the optical module sends the M paths of second transmission data streams outwards.

By adopting the implementation mode, the optical module converts the N paths of first transmission data streams into the M paths of second transmission data streams, thereby realizing redundancy protection for service data transmission and improving the reliability of service transmission.

In a second aspect, an embodiment of the present application provides a method for transmitting a service, where the method includes: the optical module receives a service cell or a service packet, wherein the service cell or the service packet is used for bearing service data; the optical module carries out digital signal processing on the service cell or the service packet to obtain an electric signal; the optical module converts the electrical signal into an optical signal; the optical module transmits the optical signal outwards.

For an explanation of the beneficial effects of this aspect, please refer to the first aspect, and detailed descriptions thereof are omitted.

Based on the second aspect, in an optional implementation manner, the optical module performs digital signal processing on the service cell or the service packet, and obtaining the electrical signal includes: the optical module combines the service cells or the service packets into a service flow according to the time sequence of the service cells or the service packets; the optical module maps the service flow to obtain a mapping signal; the optical module converts the mapping signal into the electrical signal, which is an analog signal.

Based on the second aspect, in an optional implementation manner, the service cell or the service packet includes an overhead, where the overhead carries at least one of the following: information for indicating a destination port, operation and maintenance information, switching information or timing information, wherein the switching information is used for indicating a switching mode of the service cell or the service packet, and the timing information is used for indicating a timing of the service cell or the service packet being sent.

Based on the second aspect, in an optional implementation manner, the receiving, by the optical module, a service cell or a service packet includes: the optical module receives the service cell or the service packet through a first transmission medium.

Based on the second aspect, in an optional implementation manner, the receiving, by the optical module, a service cell or a service packet includes: the optical module receives the service cell or the service packet through a second transmission medium.

Based on the second aspect, in an optional implementation manner, the receiving, by the optical module, a service cell or a service packet includes: the optical module receives and transmits an optical signal through a first transmission medium or a second transmission medium, the second transmission medium is used for connecting the optical module and another optical module, and the first transmission medium is used for connecting the optical module and the exchange chip; the optical module converts the transmitted optical signal into the service cell or the service packet.

Based on the second aspect, in an optional implementation manner, the optical module is a direct optical detection module, and after the optical module combines the service cells or the service packets into a service flow according to a timing sequence of sending the service cells or the service packets, the method further includes: the optical module performs Forward Error Correction (FEC) coding on the service flow to obtain a second coding signal; the optical module maps the service flow, and obtaining a mapping signal comprises the following steps: and the optical module maps the second coded signal to obtain the mapped signal.

Based on the second aspect, in an optional implementation manner, the optical module is a direct detection optical module or a coherent optical module, and the combining the service cells or the service packets into a service flow according to the timing sequence of the service cells or the service packets includes: the optical module performs FEC decoding on the service cell or the service packet to obtain a second decoding signal; and the optical module combines the second decoding signal into the service flow according to the time sequence of the service cell or the service packet.

Based on the second aspect, in an optional implementation manner, the receiving, by the optical module, a service cell or a service packet includes: the optical module receives Q paths of second transmission data streams, each path of second transmission data stream comprises the service cell or the service packet, and Q is any integer not less than 1; and the optical module performs redundancy protection on the Q paths of second transmission data streams to obtain N paths of first transmission data streams, wherein N is any integer not smaller than 1, and Q is not smaller than N.

In a third aspect, an embodiment of the present application provides an optical module, where the optical module includes a photoelectric converter and a processor that are sequentially connected; the photoelectric converter is used for receiving an optical signal and converting the optical signal into an electric signal, and the optical signal carries service data; the processor is used for carrying out digital signal processing on the electric signals to obtain service cells or service packets, and sending the service cells or the service packets outwards.

The optical module shown in the present aspect is configured to execute the method shown in the first aspect, and the specific execution process and the description of the beneficial effects are shown in the first aspect, which is not repeated.

Based on the third aspect, in an optional implementation manner, the processor includes a digital signal processor and a switching network interface FIC; the digital signal processor is used for converting the electric signal into a digital signal and demapping the digital signal to obtain a demapped signal; the FIC is configured to slice the demapped signal to obtain the service cell or the service packet.

In a fourth aspect, an embodiment of the present application provides an optical module, where the optical module includes a photoelectric converter and a processor that are sequentially connected; the photoelectric converter is used for receiving service cells or service packets, and the service cells or the service packets are used for bearing service data; the processor is used for carrying out digital signal processing on the service cell or the service packet to obtain an electric signal; the photoelectric converter is also used for converting the electric signal into an optical signal and sending the optical signal outwards.

The optical module shown in the present aspect is configured to execute the method shown in the second aspect, and the specific execution process and the description of the beneficial effects are shown in the second aspect, which is not repeated.

In a fifth aspect, the present application provides a transmission device, where the transmission device includes a device board and an optical module connected to the device board, where the optical module is as described in the third aspect.

In an optional implementation manner, the processor includes a control interface, where the control interface is connected to the device board, and the control interface is configured to receive control signaling from the device board.

In a sixth aspect, the present application provides a transmission device, where the transmission device includes a device board and an optical module connected to the device board, where the optical module is as described in the fourth aspect.

In a seventh aspect, an embodiment of the present application provides a switching device, where the switching device includes a first optical module and a second optical module; the first optical module is used for receiving an optical signal, the optical signal carries service data, the optical signal is converted into an electric signal, digital signal processing is carried out on the electric signal, a service cell or a service packet is obtained, and the service cell or the service packet is sent to the second optical module; the second optical module is configured to receive the service cell or the service packet, perform digital signal processing on the service cell or the service packet, obtain an electrical signal, convert the electrical signal into an optical signal, and send the optical signal to the outside.

The switching device shown in this aspect is used to perform the method according to any one of the first aspect or the second aspect, and the specific performing process and the description of the beneficial effects refer to any one of the first aspect or the second aspect.

Based on the seventh aspect, in an optional implementation manner, the first optical module includes M interfaces, where M is any integer not less than 2, and the M interfaces include a first interface and a second interface, where the first interface is connected to a first switching chip, and the second interface is connected to a second switching chip, and the first switching chip is different from the second switching chip; the first optical module is used for sending a first service flow to the first exchange chip through the first interface, and the first exchange chip is used for sending the first service flow to the second optical module; the first optical module is configured to send a second service flow to the second switching chip through the second interface, the second switching chip is configured to send the second service flow to the second optical module, and the first service flow and the second service flow are respectively configured to carry the service cell or the service packet. Each first interface may be an electrical interface or an optical interface.

In an eighth aspect, embodiments of the present application provide a computer-readable storage medium having stored therein computer instructions that, when run on a computer, cause the computer to perform the method of any one of the first or second aspects.

In a ninth aspect, embodiments of the present application provide a chip including a processor. The processor is configured to read and execute a computer program stored in the memory to perform the method of any one of the first or second aspects. Optionally, the chip further comprises a memory, and the memory is connected with the processor through a circuit or a wire. Optionally, the chip further comprises a control interface or a clock interface.

In a tenth aspect, an embodiment of the present application provides an optical module, including a first photoelectric converter and a processor that are sequentially connected, where the processor includes a first digital-to-analog conversion interface, the first digital-to-analog conversion interface is connected to the first photoelectric converter, and the processor includes a middle-distance MR interface or a long-distance LR interface; the first photoelectric converter is used for receiving an optical signal and converting the optical signal into an electric signal; the first digital-to-analog conversion interface is used for converting the electric signal into a digital signal; the processor is used for processing the digital signals and sending the processed signals outwards through the MR interface or the LR interface.

By adopting the structure of the optical module shown in the scheme, the first optical module directly and outwards transmits the signal processed by the digital signal through the processor through the MR interface or the LR interface, and the insertion loss of the signal processed by the digital signal is effectively reduced by the transmission of the MR interface or the LR interface.

The optical module shown in this aspect may be used to perform the method of any one of the first aspect or the second aspect, and the detailed implementation process and the beneficial effects are described in the first aspect, which is not repeated.

Based on the tenth aspect, in an optional implementation manner, the processor includes a digital signal processor and a framer, where the digital signal processor and the framer are connected through an ultrashort distance XSR interface or an ultrashort distance VSR, and the framer includes the MR interface or the LR interface.

By adopting the structure of the optical module in the implementation manner, the digital signal processor is connected with the framing device through the XSR interface or the VSR interface, so that the digital signal processor is not connected with the framing device through a connector of a circuit board, the length (for example, centimeter level) of an electric connection path between the digital signal processor and the framing device is effectively reduced, and the insertion loss of signals transmitted between the digital signal processor and the framing device is effectively reduced.

In an optional implementation manner, the optical module includes a circuit board, and the digital signal processor and the framer are independently mounted on the circuit board.

By adopting the structure of the optical module in the implementation manner, the digital signal processor and the framing device are subjected to signal interaction through the circuit board, and the first optical module directly and outwardly transmits signals subjected to digital signal processing through the processor through the MR interface or the LR interface, so that the insertion loss of the signals subjected to digital signal processing through the transmission of the MR interface or the LR interface is effectively reduced.

In an optional implementation manner, the processor includes a digital signal processor and a framing device, and the digital signal processor and the framing device are connected through a core interconnection interface.

By adopting the structure of the optical module shown in the scheme, the digital signal processor is connected with the framing device through the core particle interconnection interface, and the length (for example, micron level or millimeter level) of an electric connection path between the digital signal processor and the framing device is effectively reduced by the core particle interconnection interface, so that the insertion loss of signals transmitted between the digital signal processor and the framing device is effectively reduced.

In an alternative implementation manner, the digital signal processor and the framing device are integrally mounted on a circuit board of the optical module.

By adopting the structure of the optical module shown in the scheme, the digital signal processor and the framing device are integrally arranged on the circuit board of the optical module, so that the length of an electric connection path between the digital signal processor and the framing device is effectively reduced, and the insertion loss of signals transmitted between the digital signal processor and the framing device is effectively reduced.

Based on the tenth aspect, in an optional implementation manner, the processor integrates a digital signal processor and a framing device, and the processor includes a clock interface and/or a control interface, where the control interface is used to receive control signaling, and the clock interface is used to receive a clock synchronization signal.

By adopting the structure of the optical module shown in the implementation manner, the integrated processing module integrates the functions of the digital signal processor and the functions of the framing device, so that the information interaction between the digital signal processor and the framing device is realized without a physical interface, and the wiring connection inside the processor is adopted, thereby effectively reducing the error rate of the signal transmitted by the integrated processing module.

Based on the tenth aspect, in an alternative implementation manner, the MR interface or the LR interface is connected to a transmission medium, and the transmission medium is used for connecting to a switching chip or another optical module.

Based on the tenth aspect, in an optional implementation manner, the processor further includes a second digital-to-analog conversion interface, the optical module further includes a second photoelectric converter, the second photoelectric converter is connected to the MR interface or the LR interface, and the second digital-to-analog conversion interface is connected to the second photoelectric converter; the second digital-analog conversion interface is used for converting the processed signal into an analog signal, and the second photoelectric converter is used for converting the analog signal into another optical signal and sending the other optical signal outwards.

By adopting the optical module structure in the implementation mode, the optical module can send the signal processed by the digital signal outwards through the optical signal, and can receive the signal processed by the digital signal through the optical signal, so that the time delay of signal transmission is reduced, and the reliability is improved.

In an eleventh aspect, an embodiment of the present application provides a switching device, including a backplane, an optical module mounted on the backplane, and a switching chip, where the optical module is as in any one of the tenth aspect, and the MR interface or the LR interface of the optical module is connected to the switching chip through the backplane.

Based on the eleventh aspect, in an optional implementation manner, the optical module is mounted on the back board through a first device board, the switch chip is mounted on the back board through a second device board, and the first device board and the second device board are connected through the back board.

Drawings

Fig. 1a is a diagram illustrating an example structure of an optical network according to an embodiment;

FIG. 1b is a schematic diagram of an exemplary configuration of the switching device shown in FIG. 1 a;

fig. 2 is a flowchart illustrating steps of a first embodiment of a method for transmitting a service provided in the present application;

FIG. 3 is a schematic diagram of a first embodiment of the first optical module shown in FIG. 1 b;

FIG. 4a is a first exemplary view of a slice provided herein;

FIG. 4b is a second exemplary view of a slice provided herein;

fig. 5 is a diagram showing another exemplary configuration of the switching device shown in fig. 1 a;

fig. 6 is a diagram showing another structural example of the switching device shown in fig. 1 a;

FIG. 7 is a schematic diagram of a second optical module shown in FIG. 1 b;

fig. 8 is a structural example diagram of an embodiment of a switching device provided in the present application;

fig. 9 is a flowchart illustrating steps of a second embodiment of a method for transmitting a service provided in the present application;

fig. 10 is a structural example diagram of another embodiment of a switching device provided in the present application;

Fig. 11 is a flowchart illustrating steps of a third embodiment of a method for transmitting a service provided in the present application;

FIG. 12 is a third exemplary slice diagram provided herein;

FIG. 13a is a schematic view of an embodiment of the first optical module shown in FIG. 10;

FIG. 13b is a schematic diagram of another embodiment of the first optical module shown in FIG. 10;

FIG. 14 is a diagram showing an exemplary structure of an embodiment of the second optical module shown in FIG. 10;

FIG. 15 is a diagram illustrating a structure of another embodiment of the second optical module shown in FIG. 10;

fig. 16 is a flowchart illustrating steps of a fourth embodiment of a method for transmitting a service provided in the present application;

FIG. 17 is a diagram illustrating a structure of a coherent optical module according to an embodiment of the present invention;

FIG. 18 is a schematic diagram of another embodiment of a coherent optical module according to the present application;

FIG. 19 is a schematic view of a first embodiment of an optical module according to the present disclosure;

FIG. 20 is a diagram illustrating a second exemplary structure of an optical module provided herein;

FIG. 21 is a diagram illustrating a third exemplary structure of an optical module provided herein;

FIG. 22 is a diagram showing a fourth exemplary structure of an optical module according to the present application;

FIG. 23 is a schematic diagram of a fifth embodiment of an optical module according to the present disclosure;

Fig. 24 is a structural example diagram of another embodiment of the switching device provided in the present application.

Detailed Description

The embodiment of the application provides a service transmission method, an optical module and transmission equipment, which can reduce the power consumption of the optical module for processing various services. Fig. 1a is a structural example diagram of an optical network according to an embodiment. The optical network includes a switching device 100 for receiving various services, where the switching device 100 aggregates the various services into a transmission frame, and transmits the transmission frame to a switching device 140 after zooming out via an optical system, and the switching device 140 parses the various services from the transmission frame and transmits the various services to a user device (e.g., a computer, a telephone, or a television).

Fig. 1b is a schematic diagram of an exemplary configuration of the switching device shown in fig. 1 a. Taking the switching device 100 as an example, the switching device 100 includes a first transmission device 101, a switching chip 110, and a second transmission device 120. The first transmission device 101 may be referred to as a tributary board, the second transmission device 120 may be referred to as a circuit board, and the switch chip 110 may be referred to as a cross board or a switch board. The first transmission device 101 includes a device board 102 and a first optical module 103 connected to the device board 102, where in this example, the first optical module 103 is detachably connected to the device board 102, and in other examples, the first optical module 103 is integrated with the device board 102, so as to implement a non-detachable connection. The second transmission device 120 includes a device board 121 and a second optical module 122, and for the description of the second transmission device 120, please refer to the description of the first transmission device 101, which is not described in detail. It should be noted that the types and numbers of boards included in the switching device 100 may be different according to specific needs. The switching device 100 may also include a power supply 130, a heat dissipation system 131, and an auxiliary class board 132. Power supply 130 is used to power switching device 100 and may include both primary and backup power supplies. The heat dissipation system 131 is used for dissipating heat of the switching device 100. The auxiliary class board 132 is used to provide auxiliary functions such as external alarms or access to an external clock. The device type of the first transmission device 101 may be an optical transmission device, an optical access device, a router, a switch, a wireless base station, a wireless remote access device, a wireless baseband signal processing device, or the like, or may be a computing server (generally abbreviated as a server), a high-performance computer (high performance computer, HPC), a storage server, or a memory resource pool, or the like. The present example is not limited in type to the first transmission device 101 as long as the first transmission device 101 has an electro-optical conversion function, has an optical interface capable of connecting an optical fiber, and has an electrical interface capable of connecting the switch chip 110.

The execution process of the service transmission method provided in the present application will be described with reference to fig. 2, based on the description of fig. 1a and 1b, where fig. 2 is a flowchart illustrating steps of a first embodiment of the service transmission method provided in the present application.

Step 201, a first optical module receives an optical signal.

The method of the present embodiment is specifically described with reference to fig. 1b and fig. 3, where fig. 3 is a schematic diagram of a structural example of the first optical module shown in fig. 1 b. The first optical module 103 comprises an input optical fiber 301, which input optical fiber 301 is arranged to receive an optical signal carrying traffic data. The service data shown in this embodiment may carry various types of services, for example, a synchronous digital hierarchy (synchronous digital hierarchy, SDH) service, a packet service, an ethernet (ethernet) service, a flexible ethernet (flexible ethernet, flexE), a forwarding service, an optical transport network (optical transport network, OTN) service, a storage service, a data center service, or an supercomputer service, and the number of services carried by the service signal and the specific type are not limited in this embodiment. If the service type carried by the optical signal is an OTN service, the data frame included in the optical signal is an OTN frame. The OTN frame may be an optical data unit (ODUk), ODUCn, ODU flexible (Flex), or an optical channel transmission unit (optical transport unit k, OTUk), OTUCn, or OTN Flex, etc. Where ODU frames differ from OTU frames in that OTU frames comprise ODU frames and OTU overhead, k represents different rate classes and Cn represents a variable rate. The OTN frames may also be optical service unit (optical service unit, OSU) frames. The OSU is only an example, and should not be limited to the frame structure defined in the present application. The name may be replaced by other names such as a low rate frame, a low rate service frame, or an optical service data unit frame. As OTN technology evolves, new types of OTN frames may be defined, as well as applicable to the present application. As another example, the data frame may also be an optical transport unit (OTUk). As another example, the data frame may also be a signal such as an optical payload unit (OPUk). If the type of traffic carried by the optical signal is ethernet traffic, the data frame may be an ethernet data frame.

The optical signal received by the first optical module shown in this embodiment includes data frames of various types and rates. For example, the optical signals shown in this embodiment include ODU1, ODU2, ethernet data frames, and the like.

Step 202, the first optical module converts the optical signal into an electrical signal.

In fig. 3, an input optical fiber 301 of the first optical module 103 is connected to a photoelectric converter 302, and the photoelectric converter 302 is configured to photoelectrically convert (demodulate) an optical signal to output an electrical signal. The photoelectric converter 302 may employ a photodiode (positive intrinsic-negative, PIN), an avalanche diode (avalanche photo diode, APD), or the like, and is not particularly limited.

Step 203, the first optical module performs digital signal processing on the electrical signal to obtain a demapped signal.

The first optical module 103 shown in fig. 3 includes a processor 303 connected to a photoelectric converter 302. The processor 303 may be one or more chips, or one or more integrated circuits, among others. As another example, the processor 303 may be one or more optical digital signal processors (optical digital signal processor, oDSP), field-programmable gate arrays (field-programmable gate array, FPGA), application-specific integrated chips (application specific integrated circuit, ASIC), system-on-chip (SoC), central processing unit (central processor unit, CPU), network processor (network processor, NP), microprocessor (microcontroller unit, MCU), programmable processor (programmable logic device, PLD), network card chip, memory interface chip or other integrated chip, or any combination of the above, or the like, not specifically described.

In particular, the processor 303 comprises a digital signal processor 321, which digital signal processor 321 may in particular comprise an analog-to-digital converter (analog to digital converter, ADC) and a demapping module. Wherein the ADC performs analog-to-digital conversion of the electrical signal from the photoelectric converter 302 to obtain a digital signal. The demapping module of the digital signal processor 321 demaps the digital signal to obtain a demapped signal. In this embodiment, the demapping module performs constellation demapping on the digital signal in cooperation with hard decision forward error correction (forward error correction, FEC). The constellation demapping refers to demapping the demapping signal from the constellation map. The constellation includes constellation points, such as constellation point 1+j in a QPSK constellation, from which the demapping module demaps bits "01", it being understood that the demapping module demaps the demapped signals from the respective constellation points included in the constellation as a binary bit sequence, such as "0101001010101010 … …", and that the demapped signals carry traffic data. It should be noted that the description of the processing of the digital signal processor 321 in this embodiment is an optional example, and is not limited, for example, the digital signal processor 321 may perform clock recovery, channel compensation, multiple-in multiple-out (MIMO) equalization, carrier phase recovery, dispersion estimation, and the like.

Step 204, the first optical module slices the demapped signal to obtain a service cell or a service packet.

In fig. 3, the processor 303 further includes a switching network interface (fabric interface controller, FIC) 322 coupled to the digital signal processor 321. The FIC322 is used to slice the demapped signal to obtain a service cell (cell) or a service packet (packet). In this embodiment, the processor 303 includes the FIC322 as an example, and in other examples, the FIC is provided as a separate chip from the processor 303 in the first optical module 103, which is not limited in particular. Specifically, the FIC322 includes a slicing module and an overhead module. The slicing module receives the demapped signal from the demapping module and slices the demapped signal to obtain a service cell or service packet.

Example 1, this example illustrates the process of FIC slicing the demapped signal to obtain a plurality of service cells:

referring to fig. 4a, fig. 4a is a first exemplary slice diagram provided in the present application. After receiving the demapping signal from the demapping module, the slicing module slices the demapping signal into K slicing signals according to the number of bytes or the number of bits, wherein the value of K is any integer greater than 1, and each slicing signal comprises R bytes or the number of bits. This embodiment takes the example that each slice includes R bytes. The slicing module takes the 1 st byte to the R th byte of the demapping signal as a first slicing signal, the slicing module takes the R+1st byte to the 2R bytes of the demapping signal as a second slicing signal, and so on, and the slicing module obtains the K slicing signal. In this embodiment, the same number of bytes is included in different slice signals, and optionally, the number of bytes included in different slice signals may also be different, and in particular, slicing may be performed according to requirements. The overhead module adds Overhead (OH) to each slice signal to obtain service cells. As shown in fig. 4a, the overhead module obtains a service cell 401, the service cell 401 includes OH411 and a first slice signal, the overhead module obtains a service cell 402, the service cell 402 includes OH412 and a second slice signal, and so on, the overhead module obtains a service cell 40K, the service cell 40K includes OH41K and a kth slice signal. Taking the service cell 401 as an example, the OH411 included in the service cell 401 carries at least one of the following:

Information indicating a destination port, operation and maintenance information, exchange information, or timing information. Where the destination port refers to a port for receiving the service cell 401, for example, the information of the destination port may be a destination port number or a media access control address (media access control address, MAC) of a device receiving the service cell 401. The operation and maintenance information can be used for cyclic redundancy check (cyclic redundancy check, CRC) and the like. The switching information is used to indicate the switching mode of the service cell 401, which may be unicast (unicasting) or multicast (multicast). The timing information is used to indicate the timing of sending the traffic cell 401. For example, of the K service cells, the first optical module transmits service cell 401 first, and so on, and finally transmits service cell 40K. Then, the timing information carried in OH411 of the service cell 401 is used to indicate the time of sending the service cell 401, and the timing information carried in OH41K of the service cell 40K is used to indicate the time of sending the service cell 40K. The content carried by the timing information in this embodiment is not limited, for example, the timing information carried by OH is used to indicate the sequence of each service cell in K service cells. The information carried by the OH is not limited in this embodiment, for example, the OH may also carry information for indicating an output electrical interface through which the first optical module outputs the service cell 401.

Example 2, this example illustrates the process of FIC slicing the demapped signal to obtain multiple service packets:

the demapping signal in this embodiment may include a plurality of subframes, for example, if the demapping signal is used to carry ethernet traffic, each subframe included in the demapping signal may be an ethernet data frame. As another example, if the demapping signal is used to carry OTN traffic, the type of each subframe included in the demapping signal may be an OTN frame. In this example, each subframe included in the demapped signal is an ethernet data frame, and see fig. 4b, where fig. 4b is a second slice example diagram provided in this application. And after receiving the demapping signals from the demapping module, the slicing module slices according to the length of each subframe to obtain K slicing signals, wherein the value of K is any integer greater than 1. For example, if the demapped signal includes K subframes (e.g., K ethernet data frames), the slicing module slices each subframe, and then each service packet obtained includes one subframe. It will be appreciated that each service packet shown in this embodiment includes a complete sub-frame. In this embodiment, taking an example that each service packet includes one subframe, in other examples, each service packet may include more than two complete subframes. For example, the slicing module slices the complete first subframe, second subframe, and so on to the kth subframe from the demapped signal. The overhead module adds OH for each subframe to obtain the traffic packet. The overhead module obtains a service packet 421, the service packet 421 includes OH431 and a first subframe, the overhead module obtains a service packet 422, the service packet 422 includes OH432 and a second subframe, and so on, the overhead module obtains a service packet 42K, the service packet 42K includes OH43K and a kth subframe. For the description of OH carried by each service packet, please refer to the description of OH in the above example 1, and detailed descriptions thereof are omitted. In this example, each service packet includes at least one complete subframe, so that the packet loss rate of service transmission is effectively reduced, and the reliability of service transmission is improved.

In fig. 3, the processor 303 of the first optical module further includes a control interface, specifically, the digital signal processor includes the control interface, or the FIC includes the control interface, which is not limited specifically. The control interface is connected with the equipment single board and is used for receiving the control signaling from the equipment single board. For example, the control signaling is used to instruct the digital signal processor to perform the digital signal processing, and for example, the control signaling is used to instruct the FIC to perform the slicing processing, which is not limited in this embodiment, so long as the first optical module performs the transmission process of the service shown in this embodiment according to the control instruction. The processor 303 may further include a clock interface, and the description of the clock interface position is referred to as the description of the control interface position, which is not repeated. The first optical module receives clock information from the equipment single board according to the clock interface so as to realize clock synchronization.

Step 205, the first optical module sends a service cell or a service packet to the switch chip.

Step 206, the switching chip sends the service cell or the service packet to the second optical module.

Fig. 5 is a diagram showing another exemplary configuration of the switching device shown in fig. 1 a. The first optical module shown in this embodiment comprises a first electrical interface which is connected to a first transmission medium. The first optical module is connected with the exchange chip through the first transmission medium. The first transmission medium may be a cable, a trace of a circuit board, or an electrical connector. In this embodiment, the first transmission medium is taken as an example of a cable. For example, the first optical module includes K first electrical interfaces, that is, the first electrical interfaces 501, 502, and so on, and the first electrical interfaces 50K, it should be clear that the number of the first electrical interfaces included in the first optical module is not limited in this embodiment. Each first electrical interface included in the first optical module is connected to the switching chip by a cable. In this embodiment, the first electrical interface 501 sends the service cell 401 to the switch chip through the cable, the first electrical interface 502 sends the service cell 402 to the switch chip through the cable, and so on, and the first electrical interface 50K sends the service cell 40K to the switch chip through the cable. In this embodiment, taking an example that each first electrical interface of the first optical module sends one path of service cells, in other examples, each first electrical interface of the first optical module may send more than one path of service cells, which is not limited in particular.

With continued reference to fig. 4a, after each service cell is received by the switch chip, an OH is extracted from the service cell, and a destination port for receiving the service cell is determined according to the OH. For example, the switch chip obtains information of the destination port according to OH411 (the present example is taken as an example where the information of the destination port is used to indicate the second electrical interface 511 of the second optical module), and then the switch chip sends the service cell 401 to the second electrical interface 511 of the second optical module according to OH 411. The switch chip obtains the information of the destination port according to the OH412 (in this example, the information of the destination port is used to indicate the second electrical interface 512 of the second optical module), and then the switch chip sends the service cell 402 to the second electrical interface 512 of the second optical module according to the OH 412. And so on, the switch chip obtains the information of the target port according to the OH41K (in this example, the information of the target port is used to indicate the second electrical interface 51K of the second optical module, for example), and then, the switch chip sends the service cell 40K to the second electrical interface 51K of the second optical module according to the OH 41K. In this embodiment, the exchange chip is connected to the second optical module through a first transmission medium, and for the description of the first transmission medium, please refer to the description of the first transmission medium, details are not repeated. In this embodiment, the first transmission medium is taken as an example of a cable. The switch chip sends the service cells 401, 402 to the service cell 40K via cables to the second electrical interface 511, 512 to 51K of the second optical module, respectively. In this embodiment, if the OH carries the exchange information, the exchange chip exchanges the service cells according to the exchange information, for example, if the exchange information is used to indicate unicast, the exchange chip sends the service cells to the second optical module in a unicast manner. If the OH carries the operation and maintenance information, the switch chip may perform corresponding operation and maintenance on the service cell according to the operation and maintenance information, for example, perform CRC on the service cell.

Fig. 6 is a diagram showing another structural example of the switching device shown in fig. 1 a. In the example shown in fig. 5, the transmission of the service cell or the service packet between the first optical module and the switching chip is exemplified by the electrical signal, and the transmission of the service cell or the service packet between the switching chip and the second optical module is exemplified by the electrical signal. In the example shown in fig. 6, the service cells or service packets between the first optical module and the switch chip are transmitted through optical signals, and the service cells or service packets between the switch chip and the second optical module are transmitted through optical signals, so that the reliability of the transmission of the service cells or service packets is improved, and the transmission delay of the service cells or service packets is reduced. The first optical module includes a photoelectric converter 611, a photoelectric converter 612 to a photoelectric converter 61K, which are respectively connected to the FIC. The switching chip includes photoelectric converters 621, 622 to 62K, and the photoelectric converters 621, 622 to 62K are connected to the photoelectric converters 611, 612 to 61K through first transmission media, respectively. The first transmission medium shown in this example is an optical transmission medium such as an optical cable, an optical fiber, or an optical waveguide for transmitting an optical signal. The switch chip further includes photoelectric converters 631, 632 to 63K, and the second optical module includes photoelectric converters 651, 652 to 65K, wherein the photoelectric converters 631, 632 to 63K are connected to the photoelectric converters 651, 652 to 65K through first transmission media, respectively. The first transmission medium shown in this embodiment is an optical cable, and for the description of the first transmission medium, please refer to the description of the first transmission medium, details are not repeated.

Taking the service cell 401 as an example, the photoelectric converter 611 performs electro-optical conversion on the service cell 401 from the FIC to obtain a transmission optical signal, and the photoelectric converter 611 transmits the transmission optical signal to the photoelectric converter 621 of the switching chip through an optical cable. The photoelectric converter 621 photoelectrically converts the transmission optical signal to obtain a service cell, extracts OH from the service cell, sends the service cell to the photoelectric converter 631 according to the OH determination, the photoelectric converter 631 photoelectrically converts the service cell to obtain a transmission optical signal, and sends the transmission optical signal to the photoelectric converter 651 of the second optical module through the optical cable, and the photoelectric converter 651 photoelectrically converts the transmission optical signal to obtain the service cell, so as to ensure that the second optical module can successfully receive the service cell from the first optical module.

In this embodiment, taking the exchange of service cells by the exchange chip as an example, the exchange chip may also exchange service packets, and the description of the exchange of service packets by the exchange chip is referred to the description of the exchange of service cells by the exchange chip shown in this embodiment, which is not repeated in detail.

Step 207, the second optical module performs digital signal processing on the service cell or service packet to obtain an electrical signal.

The process of the second optical module for digital signal processing of a service cell or service packet is described in connection with fig. 7. Fig. 7 is a schematic diagram of an exemplary structure of the second optical module shown in fig. 1 b. The second optical module 122 includes a processor 701, a photoelectric converter 702, and an output optical fiber 703. The processor 701 in this embodiment specifically includes an FIC711 and a digital signal processor 712. The digital signal processor 712 specifically includes a mapping module and a digital-to-analog converter (digital to analog converter, DAC). For a description of the processor 701 type and the FIC, please refer to fig. 3, which is not described in detail.

The FIC711 of the second optical module specifically includes an overhead extraction module and a combination module. Continuing to refer to fig. 4a, after the overhead extraction module receives the service cells, the OH of each service cell is extracted. For example, the overhead extraction module extracts OH411 from the traffic cell 401, OH412 from the traffic cell 402, and OH41K from the traffic cell 40K. In this embodiment, each OH already carries timing information, and for the description of the timing information, please refer to step 204, details are not repeated. The combining module of the second optical module combines the K slice signals from the first optical module into a service stream based on the timing information carried by each OH. The timing of each slice signal in the demapping signal is the same as the timing of each slice signal in the traffic stream. For example, the first slice signal is the first of K slice signals sent by the first optical module, and then the first slice signal is one slice signal in the traffic stream obtained by the second optical module. The second slice signal is the second of the K slice signals sent by the first optical module, and then the second slice signal is the second slice signal in the traffic stream obtained by the second optical module. The kth slice signal is the last slice signal in the K slice signals sent by the first optical module, and then the kth slice signal is the last slice signal in the traffic stream obtained by the second optical module. It should be noted that, in this embodiment, the plurality of service cells received by the second optical module are all from the same first optical module, and in other examples, the plurality of service cells received by the second optical module may be from a plurality of different first optical modules, and then, the second optical module combines the plurality of received service cells into the service flow according to the timing sequence of the plurality of service cells according to the timing sequence information carried by each OH. Optionally, if the OH also carries operation and maintenance information, the FIC may operate and maintain the service cell according to the operation and maintenance information, for example, the FIC performs CRC on the service cell according to the operation and maintenance information.

The mapping module of the digital signal processor 712 maps the traffic stream into a mapped signal. In this embodiment, the mapping module performs constellation mapping on the service flow, and converts the service flow into a mapping signal. Constellation mapping means that the mapping module maps each bit of the service stream onto a constellation point of the constellation diagram to output a mapping signal. The spectral efficiency and noise immunity of service transmission can be improved based on constellation mapping. The DAC receives the mapping signal from the mapping module and performs digital-to-analog conversion on the mapping signal to output an electrical signal, which is an analog signal.

Step 208, the second optical module converts the electrical signal into an optical signal, and emits the optical signal.

With continued reference to fig. 7, the photoelectric converter 702 receives an electrical signal from the DAC and performs electro-optical conversion (demodulation) on the electrical signal to obtain an optical signal, the photoelectric converter 702 being connected to an output optical fiber 703, the photoelectric converter 702 transmitting the optical signal through the output optical fiber 703. The photoelectric converter 702 shown in this embodiment may employ a direct modulation laser (direct modulation laser, DML), an electro-absorption modulation laser (electro-absorption modulated laser, EML), or a vertical cavity surface emitting laser (vertical cavity surface emitting laser, VCSEL). As another example, the photoelectric converter 702 may also adopt a structure of a laser and a photoelectric converter, and the photoelectric converter may be a mach-zehnder photoelectric converter (mach-zehnder modulator, MZM) or a micro-ring photoelectric converter (miro ring modulator, MRM) or the like.

In this embodiment, taking the digital signal processing performed by the second optical module as an example, in other examples, the digital signal processing may also be performed by the second device board, where the second device board is connected to the second optical module, and in this example, the second optical module is only used for performing photoelectric conversion. The second device board performs digital signal processing to obtain the electrical signal, and the description of the second optical module performing digital signal processing to obtain the electrical signal is not described in detail.

In fig. 7, the processor 701 of the second optical module may further include a control interface, specifically, the digital signal processor includes the control interface, or the FIC includes the control interface, which is not limited in detail. The control interface is connected with the equipment single board and is used for receiving the control signaling from the equipment single board. For example, the control signaling is used to instruct the digital signal processor to perform a process of digital signal processing, for example, the control signaling is used to instruct the FIC to perform a process of combining to obtain a service flow, and the description of the control signaling in this embodiment is not limited, as long as the second optical module performs the transmission process of the service shown in this embodiment according to the control instruction. The processor 701 may further include a clock interface, and a description of a clock interface position is referred to as a description of a control interface position, which is not described in detail. And the second optical module receives clock information from the equipment single board according to the clock interface so as to realize clock synchronization.

By adopting the method shown in the embodiment, even if the type of the service received by the first optical module is improved along with the continuous growth of fixed network, mobile and private line services, the first optical module can convert different services into service cells or service packets in a unified format. The second optical module directly receives the service cells or the service packets, and the power consumption of the second optical module for processing the service cells or the service packets is reduced because the formats of the service cells or the service packets are unified. In addition, various types of services are transmitted through the service cells or the service packets, so that successful transmission of the services is ensured, and the reliability of service transmission is improved.

In the embodiment shown in fig. 2, the service cells or service packets emitted from the first optical module need to be exchanged to the second optical module through the exchange chip, whereas in fig. 8, the first optical module directly sends the service cells or service packets to the second optical module. Fig. 8 is a structural example diagram of an embodiment of a switching device provided in the present application. The switching device shown in this embodiment includes a plurality of optical modules, and the number of the optical modules included in the switching device is not limited in this embodiment, and the switching device includes a first optical module 801, a second optical module 802, and a third optical module 803 in this embodiment. Any two of the FIC of the first optical module 801, the FIC of the second optical module 802, and the FIC of the third optical module 803 are connected through a transmission medium, and detailed description is omitted herein for description of fig. 3 or fig. 7.

Fig. 9 is a flowchart of steps of a second embodiment of a method for transmitting services provided in the present application, based on the illustration in fig. 8.

Step 901, a first optical module receives an optical signal.

Step 902, the first optical module converts the optical signal into an electrical signal.

In step 903, the first optical module performs digital signal processing on the electrical signal to obtain a demapped signal.

For the description of the execution process of step 901 to step 903 in this embodiment, please refer to step 201 to step 203 corresponding to fig. 2, which is not described in detail.

Optionally, the FIC of the first optical module 801 shown in this embodiment may also be connected to the device board 804, where the FIC of the first optical module 801 receives a service electrical signal from the device board 804, and the first optical module 801 performs digital signal processing on the service electrical signal from the device board 804 to obtain a demapped signal.

Step 904, the first optical module slices the demapped signal to obtain a service cell or a service packet.

For a description of the execution process of step 904 shown in this embodiment, please refer to step 204 corresponding to fig. 2, which is not described in detail.

In step 905, the first optical module sends a service cell or a service packet to the second optical module.

Because the FIC of the first optical module in this embodiment is connected to the FIC of the second optical module through the second transmission medium, the first optical module may directly send the service cell or the service packet to the second optical module through the second transmission medium. For the description of the second transmission medium shown in the embodiment, please refer to the description of the first transmission medium in the embodiment corresponding to fig. 2, which is not repeated.

Optionally, the FIC of the first optical module may include a photoelectric converter, the FIC of the second optical module may include a photoelectric converter, and the photoelectric converter of the first optical module is connected with the photoelectric converter of the second optical module through a second transmission medium, so that the photoelectric converter can perform electro-optical conversion on the service cell or the service packet to obtain a transmission optical signal, and send the transmission optical signal to the photoelectric converter of the second optical module through the second transmission medium, and the photoelectric converter of the second optical module performs photoelectric conversion on the transmission optical signal to obtain the service cell or the service packet, which is described in detail, but reference may be made to the description of the specific process in which the first optical module shown in fig. 6 sends the transmission optical signal to the switch chip.

Step 906, the second optical module performs digital signal processing on the service cell or the service packet to obtain an electrical signal.

For a description of the execution of step 906 in this embodiment, please refer to step 207, which is not described in detail.

In step 907, the second optical module converts the electrical signal into an optical signal, and emits the optical signal.

For the description of the execution process of step 906 to step 907 in this embodiment, please refer to step 207 to step 208 corresponding to fig. 2, and the detailed execution process is not described in detail.

In the embodiment shown in fig. 8, for a description of a process of exchanging service cells or service packets between any two optical modules of the first optical module, the second optical module, and the third optical module, please refer to the description of the first optical module shown in fig. 9 for sending service cells or service packets to the second optical module, which is not described in detail.

By adopting the method shown in the embodiment, even if the type of the service received by the first optical module is improved along with the continuous growth of fixed network, mobile and private line services, the first optical module can convert different services into service cells or service packets in a unified format. The second optical module directly receives the service cells or the service packets, and the power consumption of the second optical module for processing the service cells or the service packets is reduced because the formats of the service cells or the service packets are unified. In addition, in the process that the first optical module sends the service cell or the service packet to the second optical module, exchange through the exchange chip is not needed, and the time delay of the transmission of the service cell or the service packet is reduced.

In the example shown in fig. 1a, the first optical module is connected to one switch chip, and in the embodiment shown in fig. 10, the first optical module may be connected to a plurality of different switch chips, where fig. 10 is a structural example diagram of another embodiment of the switch device provided in the present application.

The FIC of the first optical module 1001 shown in this embodiment includes a plurality of electrical interfaces, for example, the FIC of the first optical module includes M electrical interfaces, which are an integer greater than 1, respectively, from the electrical interface 1011, the electrical interface 1012 to the electrical interface 101M. M electrical interfaces of the first optical module are respectively connected with M exchange chips. For example, electrical interface 1011 is connected to switch chip 1021, electrical interface 1012 is connected to switch chip 1022, and so on, electrical interface 101M is connected to switch chip 102M. The FIC of the second optical module 1021 includes M electrical interfaces, electrical interface 1031, electrical interface 1032 through electrical interface 103M, respectively. Electrical interfaces 1031, 1032 to 103M are connected to switch chips 1021, 1022 to 102M, respectively.

Fig. 11 is a flowchart of steps of a third embodiment of a method for transmitting services provided in the present application, based on the switching device shown in fig. 10.

Step 1101, the first optical module receives an optical signal.

Step 1102, the first optical module converts the optical signal into an electrical signal.

For a description of the execution process of steps 1101 to 1102 in this embodiment, please refer to steps 201 to 202 corresponding to fig. 2, which is not described in detail.

In step 1103, the first optical module performs digital signal processing on the electrical signal, and converts the electrical signal into M paths of second transmission data streams.

In step 1104, the first optical module sends M paths of second transmission data streams to M switching chips.

The first optical module performs digital signal processing on the electrical signal to obtain a demapped signal, and the description of the process of the first optical module obtaining the demapped signal is referred to in step 203 corresponding to fig. 2, which is not described in detail.

The procedure of the first optical module obtaining M paths of second transmission data streams will be described with reference to fig. 12 and 13 a. Fig. 12 is a third exemplary slice diagram provided herein. Fig. 13a is a structural example diagram of an embodiment of the first optical module shown in fig. 10. The first optical module 1001 in this embodiment specifically includes an input optical fiber 1301, an optical-electrical converter 1302, and a processor 1303, and the detailed description is referred to the corresponding description in fig. 3, which is not repeated. The slice module, the overhead module and the sharing module in the FIC shown in this embodiment are sequentially connected.

The slicing module slices the demapped signal to obtain K-way slice signals. The slice module shown in this embodiment sends K slices to the overhead module, and the overhead module obtains K service cells according to the K slice signals, and for a description of obtaining K service cells by the overhead module, please refer to the description corresponding to fig. 4a, which is not described in detail. After OH is added in each slice signal, the overhead module sends N paths of first transmission data streams to the sharing module, wherein each path of first transmission data stream comprises at least one path of service cells, and N is any integer not less than 1. For example, the first transmission data stream of the 1 st path obtained by the overhead module includes a first service cell and a second service cell. The number of service cells included in the first transmission data stream is not limited in this embodiment. In this embodiment, each first transmission data stream includes at least one service cell, and in other examples, the first transmission data stream may also include at least one service packet, for a description of a specific process, please refer to a description that the first transmission data stream includes a service cell, which is not described in detail.

The sharing module performs redundancy protection on N paths of first transmission data streams and converts the N paths of first transmission data streams into M paths of second transmission data streams, wherein M is any integer greater than N. In this embodiment, m=p+q is taken as an example, if P switching chips fail in M switching chips, it can still be ensured that the first optical module can successfully send the service to the second optical module, so as to ensure the reliability of the first optical module transmitting the service to the second optical module. In order to ensure that the first optical module successfully transmits the service to the second optical module, at least Q switching chips among the M switching chips need to be ensured to be capable of normally switching the service cells or the service packets. Specifically, the sharing module obtains the multiplied flow Y, y=x (p+q)/Q. Wherein X is the total flow of the N paths of first transmission data streams. The multiplied flow Y is the total flow of the M paths of second transmission data flows. It will be appreciated that Y > X shown in this embodiment. The sharing module may add redundant information in the traffic X. The sharing module carries out coding processing on the flow X according to a certain algorithm in advance so that the added redundant information has the signal characteristics of the N paths of first transmission data streams. The sharing module uniformly divides the flow Y into M paths of second transmission data streams. The sharing module can then send M second transport data streams to the M electrical interfaces. It will be appreciated that electrical interface 1011 sends a first second transmission data stream to switch chip 1021, electrical interface 1012 sends a second transmission data stream to switch chip 1022, and so on, and electrical interface 101M sends an mth second transmission data stream to switch chip 102M.

The first optical module structure shown in fig. 13a is an alternative example, and is not limited thereto, for example, fig. 13b is a structural example diagram of another embodiment of the first optical module shown in fig. 10. The first optical module 1001 shown in fig. 13b includes an input optical fiber 1311, an optical-to-electrical converter 1312, and a processor 1313, and details of the input optical fiber 1311, the optical-to-electrical converter 1312, and the processor 1313 are not described in detail with reference to fig. 13 a. The FIC shown in fig. 13b includes a slicing module, a sharing module, and an overhead module connected in sequence, i.e., the sharing module is located between the slicing module and the overhead module. The first optical module shown in fig. 13b, after the slicing module obtains the demapping signal, slices the demapping signal to obtain N first transmission data streams, where each first transmission data stream includes at least one slicing signal. The sharing module performs redundancy protection on the N paths of first transmission data streams to obtain M paths of second transmission data streams, and for the description of redundancy protection, please refer to fig. 13a, details are not repeated. The sharing module sends the M paths of second transmission data streams to the overhead module, the overhead module adds OH to each slice signal in the second transmission data streams, and the overhead module sends the M paths of second transmission data streams with OH added to the M paths of second transmission data streams to the M switching chips, and the specific sending process is shown in the corresponding description of fig. 10, which is not repeated.

In step 1105, the M switch chips send M paths of second transmission data streams to the second optical module.

Each of the switch chips in this embodiment switches the second transmission data stream according to the OH included in the second transmission data stream for transmission to the second optical module, and the detailed process is described with reference to step 206 corresponding to fig. 2, which is not described in detail.

Step 1106, the second optical module performs digital signal processing on the Q paths of second transmission data streams to obtain an electrical signal.

The process of digital signal processing of the Q-way second transmission data stream by the second optical module will be described with reference to fig. 14. Fig. 14 is a structural example diagram of an embodiment of the second optical module shown in fig. 10. The second optical module 1021 includes a processor 1401, a photoelectric converter 1402, and an output optical fiber 1403. The processor 1401 shown in this embodiment specifically includes an FIC, a mapping module, and a DAC. For a description of the type of the processor 1401, please refer to fig. 3, and details thereof are not described. The FIC of the second optical module 1021 in this embodiment specifically includes a recovery module, an overhead extraction module, and a combination module that are sequentially connected. The recovery module receives the Q paths of second transmission data streams. In this embodiment, if P switch chips fail among M switch chips, the M switch chips include Q switch chips capable of normal switching. And the Q switching chips transmit the Q paths of second transmission data streams to the second optical module. The recovery module of the second optical module can decode the data of the Q paths of second transmission data streams based on redundancy protection, so that even if the P paths of second transmission data streams are lost in the M paths of second transmission data streams, the recovery module of the second optical module can still recover the M paths of first transmission data streams according to the Q paths of second transmission data streams, so that the recovery module can accurately recover all service cells or service packets (namely N paths of first transmission data streams) sent by the first optical module to the second optical module from the Q paths of second transmission data streams. The description of the overhead extraction module and the combination module, and the description of the mapping module and the DAC processing to obtain the electrical signal shown in the embodiment are referred to in fig. 7, and detailed description thereof is omitted.

It should be noted that the description of the second optical module in this embodiment is an alternative example, and is not limited to this, for example, fig. 15 is a schematic diagram of another embodiment of the second optical module shown in fig. 10. The second optical module 1021 includes a processor 1401, a photoelectric converter 1402, and an output optical fiber 1403, and is shown in fig. 14, which is not described in detail. The FIC of the second optical module 1021 in this embodiment specifically includes an overhead extracting module, a recovering module, and a combining module that are sequentially connected. The overhead extracting module extracts OH in the M paths of second transmission data streams, and sends the M paths of second transmission data streams after OH extraction to the recovering module, where the recovering module performs redundancy protection on the M paths of second transmission data streams, and the process of redundancy protection is shown in fig. 14, and is not described in detail. It can be understood that the recovery module recovers M paths of first transmission data streams according to Q paths of second transmission data streams, so as to ensure that the recovery module can accurately recover all service cells or service packets (i.e., N paths of first transmission data streams) sent by the first optical module to the second optical module from the Q paths of second transmission data streams. The description of the overhead extraction module and the combination module, and the description of the mapping module and the DAC processing to obtain the electrical signal shown in the embodiment are referred to in fig. 7, and detailed description thereof is omitted.

In step 1107, the second optical module converts the electrical signal into an optical signal and emits the optical signal.

In the embodiment, step 1107 performs the process, please refer to step 208, which is not described in detail.

By adopting the method shown in the embodiment, even if the type of the service received by the first optical module is improved along with the continuous growth of fixed network, mobile and private line services, the first optical module can convert different services into service cells or service packets in a unified format. The second optical module directly receives the service cells or the service packets, and the power consumption of the second optical module for processing the service cells or the service packets is reduced because the formats of the service cells or the service packets are unified. And the FIC of the first optical module is connected with M switching chips, and even if part of the M switching chips fail, the second optical module can successfully recover the service cells or service packets sent by the first optical module to the second optical module based on redundancy protection, so that the reliability of the transmission of the service cells or service packets is improved.

In the embodiment shown in fig. 11, the first optical module converts N paths of first transmission data streams into M paths of second transmission data streams based on redundancy protection, for example, without limitation, where the sharing module receives a service cell or a service packet, and where it is determined that the first optical module includes M electrical interfaces, the sharing module performs load balancing on the received service cell or service packet, so as to obtain M paths of second transmission data streams. The M of this example is any integer greater than 1. Specifically, the sharing module obtains the total flow M1 of the service cell or the service packet, and then the sharing module determines that, among the M electrical interfaces of the first optical module, each electrical interface is used for sending out a flow M1/M. It can be understood that the flow of each path of second transmission data stream emitted by the first optical module is M1/M. In this embodiment, the flow rates of the different electrical interfaces of the first optical module are equal, and in other examples, the flow rates of the different electrical interfaces of the first optical module may be approximately equal. The first optical module in this embodiment sends the M paths of second transmission data streams to the exchange chip in a load balancing manner, so that the efficiency and flexibility of the exchange chip for exchanging the M paths of second transmission data streams are effectively improved based on load balancing, and the successful exchange of the exchange chip for the M paths of second transmission data streams is ensured.

The above example is taken as an example in which the sharing module sends N first transmission data streams based on redundancy protection or load balancing, and the sharing module shown in this example may send N first transmission data streams based on a fault event. N shown in this example is not greater than M. For example, the first optical module has N (e.g., 15) first electrical interfaces, and the sharing module of the first optical module may obtain N first transmission data flows. However, the N first electrical interfaces include a failed first electrical interface. The failure of the first electrical interface means that the data stream exiting the first electrical interface cannot be successfully transmitted to the corresponding destination port. The reason why the first interface fails may be that the first electrical interface itself fails, a transmission medium connected between the first electrical interface and the switching chip fails, the switching chip itself fails to switch a data stream from the first electrical interface, a transmission medium between the switching chip and the target port fails, etc., which is not limited in this embodiment. The first optical module determines that M (e.g. 10) first electrical interfaces work normally, and then the sharing module converts 15 paths of first transmission data streams into 10 paths of second transmission data streams, and respectively sends out 10 paths of second transmission data streams through the 10 normally working first electrical interfaces, so that successful transmission of the M paths of second transmission data streams in the switching equipment is effectively ensured. The first optical module shown in this example may receive information indicating the faulty first electrical interface from the network management device or the device board, and for example, the first optical module may periodically detect each first electrical interface to obtain the faulty first electrical interface.

The following describes a specific implementation procedure of the service transmission method in combination with a specific type of the optical module. Fig. 16 is a flowchart illustrating steps of a fourth embodiment of a method for transmitting a service provided in the present application.

Step 1601, the first optical module receives an optical signal.

In this embodiment, the first optical module is taken as an example of a coherent optical module, and is shown in fig. 17, where fig. 17 is a structural example diagram of an embodiment of the coherent optical module provided in this application. First optical module 1700 includes an input optical fiber 1720, where input optical fiber 1720 is configured to receive an optical signal that carries traffic data. For the description of the service data, please refer to step 201 corresponding to fig. 2, which is not repeated.

In step 1602, the first optical module converts the optical signal into an electrical signal.

In fig. 17, an input optical fiber 1720, a mixer 1702, and an optical-to-electrical converter 1703 of a first optical module 1700 are connected in this order. The mixer 1702 is also connected to a local laser 1701. The mixer 1702 is configured to decouple the optical signal from the input optical fiber 1720 to obtain a decoupled optical signal, and is further configured to polarization-separate the decoupled optical signal to form a first path of modulated signal and a second path of modulated signal, and is further configured to mix the optical signal from the local laser 1701 with the first path of modulated signal to restore to a first path of analog signal and a second path of analog signal of a low frequency baseband, and the mixer 1702 is further configured to mix the optical signal from the local laser 1701 with the second path of modulated signal to restore to a third path of analog signal and a fourth path of analog signal of the low frequency baseband.

In step 1603, the first optical module converts the electrical signal into a digital signal.

In fig. 17, four ADCs, that is, ADC1705, ADC1706, ADC1707, and ADC1708 are connected to the photoelectric converter 1703, respectively. The ADC1705, the ADC1706, the ADC1707, and the ADC1708 are respectively configured to perform analog-to-digital conversion on the first analog signal, the second analog signal, the third analog signal, and the fourth analog signal to obtain four digital signals, that is, the first digital signal, the second digital signal, the third digital signal, and the fourth digital signal.

In step 1604, the first optical module processes the digital signal to obtain a demapped signal.

In fig. 17, the processing module further includes a dispersion compensation module 1710 coupled to the ADC1705, the ADC1706, the ADC1707, and the ADC1708, respectively. The dynamic equalization module 1711 is connected to the dispersion compensation module and the demapping module 1712, respectively. The dispersion compensation module 1710 is configured to perform dispersion compensation on the first digital signal and the second digital signal to obtain a first dispersion compensation signal, and the dispersion compensation module 1710 is also configured to perform dispersion compensation on the third digital signal and the fourth digital signal to obtain a second dispersion compensation signal. The dynamic equalization module 1711 is used for dynamically equalizing the first path of dispersion compensation signal and the second path of dispersion compensation signal, such as polarization compensation, phase recovery, post-filtering, sequence detection, and de-interleaving, and the like, and is not limited in particular. The dynamic equalization module 1711 outputs the four-way sequence signal to the demapping module 1712. The demapping module 1712 is configured to perform constellation demapping on the four-way sequence signal to obtain a demapped signal, and for illustration of constellation demapping, please refer to step 203 corresponding to fig. 2, which is not described in detail.

In step 1605, the first optical module performs FEC decoding on the demapped signal to obtain a first decoded signal.

In fig. 17, the first optical module further includes an FEC decoding module 1713 connected to the demapping module 1712, where the FEC decoding module 1713 is configured to perform FEC decoding on the demapping signal to obtain a first decoded signal. The FEC decoding module 1713 performs FEC decoding to improve the reliability of optical signal transmission received by the first optical module, reduce the error rate of the optical signal, and effectively suppress inter-symbol interference (intersymbol interference, ISI) of the optical signal transmission path.

In step 1606, the first optical module slices the first decoded signal to obtain a service cell or a service packet.

In fig. 17, the FIC of the first optical module includes a slice module 1714, an overhead module 1715, and an FEC encoding module 1716, which are sequentially connected. The slicing module 1714 is configured to slice the first decoded signal and convert the first decoded signal into a plurality of slice signals. The overhead module 1715 adds OH to each slice signal to obtain a service cell, and the detailed process is shown in step 204 corresponding to fig. 2, which is not described in detail.

In step 1607, the first optical module performs FEC encoding on the service cell or the service packet to obtain a first encoded signal.

The FEC encoding module 1716 of the first optical module is configured to FEC encode a service cell or a service packet to obtain the first encoded signal. The FEC coding of the service cell or the service packet can improve the reliability of a channel between the first optical module and the switching chip and reduce the error rate of the transmission of the service cell or the service packet to the switching chip.

The FIC of the first optical module in this embodiment may further include a sharing module, and the description of the sharing module is shown in fig. 13a and fig. 13b, which are not repeated in detail.

In step 1608, the first optical module sends a first encoded signal to the switch chip.

Step 1609, the exchange chip sends the first encoded signal to the second optical module.

For the description of step 1608 to step 1609 in this embodiment, please refer to step 205 to step 206 corresponding to fig. 2, which is not described in detail. The second optical module is taken as a coherent optical module in this embodiment as an example.

In step 1610, the second optical module performs FEC decoding on the first encoded signal to obtain a second decoded signal.

Fig. 18 is a structural example diagram of another embodiment of a coherent optical module provided in the present application. The second optical module shown in fig. 18 includes an FIC, which specifically includes an FEC decoding module 1801, an overhead extraction module 1802, and a combining module 1803, which are connected in order. The FEC decoding module receives the first encoded signal and performs FEC decoding on the first encoded signal to obtain a second decoded signal. The FEC decoding module 1801 decodes the FEC of the first encoded signal, so that the reliability of the channel between the second optical module and the switch chip can be improved, and the error rate of the service cell or the service packet transmitted between the second optical module and the switch chip can be reduced.

The FIC of the second optical module in this embodiment may further include a recovery module, and the description of the recovery module is shown in fig. 14 and fig. 15, which are not repeated.

In step 1611, the second optical module combines the second decoded signal into a traffic stream.

The overhead extraction module 1802 receives the second decoded signal and extracts OH. The combining module 1803 composes the second decoded signal into a service flow according to OH, and the detailed process is shown in step 207 corresponding to fig. 2, which is not described in detail.

And 1612, performing FEC encoding on the service stream by the second optical module to obtain a second encoded signal.

The second optical module shown in fig. 18 further includes an FEC encoding module 1804 connected to the FIC, where the FEC encoding module 1804 is configured to FEC encode the traffic stream to obtain a second encoded signal. The FEC encoding module 1804 performs FEC encoding on the traffic flow, so that the reliability of optical signal transmission emitted from the second optical module can be improved, and the packet loss rate and the error rate of the optical signal emitted from the second optical module can be reduced.

And 1613, mapping the second coded signal by the second optical module to obtain a mapped signal.

The and FEC encoding module 1804 shown in fig. 18 may also interleave the second encoded signal to obtain an interleaved sequence. Wherein interleaving is used to maximally alter the information structure of the second encoded signal without altering the information content of the second encoded signal. The FEC encoding module 1804 transmits the second encoded signal to the mapping module 1806. The mapping module 1806 is configured to map the second encoded signal to obtain a mapped signal, for example, the mapping module 1806 performs constellation mapping on the second encoded signal to obtain a mapped signal. For the description of the mapping module, please refer to the corresponding description of fig. 7, and detailed description is omitted.

The FEC encoding module 1804 may send the mapped signal to the compensation module 1807, where the compensation module 1807 may pre-filter the mapped signal, where the pre-filtering is a finite impulse response filtering, and the pre-filtering is performed such that the filtered signal is not lost in information compared to the mapped signal before the pre-filtering, but the occupied bandwidth is narrowed. As another example, the compensation module 1807 may further perform channel compensation, MIMO equalization, and dispersion estimation on the mapped signal to output a compensated signal, which is not specifically limited.

In step 1614, the second optical module performs digital-to-analog conversion on the mapping signal to obtain an electrical signal.

DAC1812 is coupled to 1804 shown in fig. 18, and DAC1812 performs digital-to-analog conversion on the compensated signal from compensation module 1807 to output an electrical signal, which is an analog signal.

In step 1615, the second optical module converts the electrical signal into an optical signal, and emits the optical signal.

The second optical module shown in fig. 18 includes a photoelectric converter 1816 connected to the DAC1812, and for a description of the type of the photoelectric converter 1816, please refer to the corresponding description in fig. 7, which is not repeated. The optical-to-electrical converter 1816 is configured to electro-optically convert the electrical signal from the DAC1812 to output an optical signal, for example, the optical-to-electrical converter 1816 may modulate the electrical signal by coherent double offset modulation, such as quadrature phase shift keying (quadrature phase shift keying, QPSK) or quadrature amplitude modulation (quadrature amplitude modulation, QAM) to obtain an optical signal. The optoelectronic converter 1816 also transmits the optical signal to an output fiber 1818 of the second optical module.

By adopting the method shown in the embodiment, the FIC can be adapted to a coherent optical module, the first optical module can perform photoelectric conversion and channel processing by means of a coherent technology, and obtain service cells or service packets, and the first optical module can convert different services into service cells or service packets in a unified format. The second optical module directly receives the service cells or the service packets, and the power consumption of the second optical module for processing the service cells or the service packets is reduced because the formats of the service cells or the service packets are unified.

The method shown in any of the embodiments of fig. 2, 9, 11 and 15 may also be performed by using a coherent light module, and the detailed implementation process will not be repeated.

The specific type of the optical module for executing the transmission method of the service is not limited in the present application, and for example, the transmission method of the service shown in fig. 2, 9, 11, 15 and 16 may be executed by a direct optical module applied to the direct optical system. Wherein the direct alignment detection system is also referred to as an intensity modulation and direct detection system. If the first optical module and the second optical module are direct detection optical modules, the first optical module performs intensity demodulation on the optical signals to obtain electric signals. In the process that the second optical module receives the service cell or the service packet from the first optical module, the intensity modulation is performed on the electric signal to obtain an optical signal, and the code pattern of the optical signal can be non-return-to-zero (not return to zero, NRZ), four-level pulse amplitude modulation (4pulse amplitude modulation,PAM4), pulse amplitude modulation (pulse amplitude modulation, PAM) or the like. If the direct detection optical module is applied to the embodiment shown in fig. 16, the first optical module may perform FEC decoding and FEC encoding according to fig. 16, and the second optical module may perform FEC decoding and FEC encoding according to fig. 16. Alternatively, the first optical module may perform FEC decoding only once, and the second optical module may perform FEC encoding only once, so that the FEC encoding and FEC decoding processes are described with reference to fig. 16, which is not repeated.

The embodiment of the application can also execute the transmission method of the service shown in fig. 2, 9, 11, 15 and 16 through the ethernet optical module. Then, the first optical module can convert the ethernet service into a service cell or a service packet, and the second optical module can convert the service cell or the service packet from the first optical module into an optical signal and send the optical signal to the outside, which is a specific implementation process, please refer to fig. 2, 9, 11, 15 and 16, which is a transmission method of the service, and the specific implementation process is not described in detail. If the optical module in this embodiment is an ethernet optical module, the ethernet optical module may further include a network processor (network processor, NP) or a traffic management (traffic management, TM) module. The TM module performs quality of service (quality of service, qoS) control on the traffic flow mainly according to the transmission bandwidth of the network and the priority of the traffic flow. The NP is a core chip for processing Ethernet services, and mainly performs forwarding processing tasks of various Ethernet services, such as packet processing, protocol analysis, route searching and the like of Ethernet service data. It can be understood that the NP and TM modules in the first optical module perform forwarding processing and quality of service control on the ethernet data frame after receiving the ethernet data frame. The NP and TM modules in the second optical module complete the forwarding process to the output optical fiber and the quality of service control.

The embodiment of the present application further provides an optical module for executing any embodiment of fig. 2, 9, 11 and 16, and the specific execution process is shown in any embodiment of fig. 2, 9, 11 and 16, which is not repeated. The structure of the optical module is shown in fig. 3, fig. 7, fig. 13a, fig. 13b, fig. 14, fig. 15, fig. 17 and fig. 18, and detailed descriptions thereof are omitted.

The embodiment of the present application further provides a transmission device for executing any embodiment of fig. 2, 9, 11 and 16, and the specific execution process is shown in any embodiment of fig. 2, 9, 11 and 16, which is not described in detail. The transmission device includes a device board and an optical module connected to the device board, and the structure of the optical module is shown in fig. 3, fig. 7, fig. 13a, fig. 13b, fig. 14, fig. 15, fig. 17, and fig. 18, which are not described in detail.

The embodiment of the present application further provides a switching device for executing any embodiment of fig. 2, 9, 11 and 16, and the specific execution process is shown in any embodiment of fig. 2, 9, 11 and 16, which is not described in detail. The structure of the switching device is shown in fig. 1b, and will not be described in detail.

The embodiment of the present application further provides an optical network for executing any embodiment of fig. 2, fig. 9, fig. 11, and fig. 16, and the specific execution process is shown in any embodiment of fig. 2, fig. 9, fig. 11, and fig. 16, which is not repeated herein. The structure of the optical network is shown in fig. 1a, and will not be described in detail.

Embodiments of the present application also provide a computer-readable storage medium having stored therein computer instructions that, when executed on a computer, cause the computer to perform the method shown in any of the embodiments of fig. 2, 9, 11, and 16.

The structure of the optical module provided in the present application will be described below from the viewpoint of a hardware structure.

Fig. 19 is a structural example diagram of a first embodiment of an optical module provided in the present application. The optical module shown in this embodiment includes a photoelectric converter and a processor that are sequentially connected. The photoelectric converter specifically includes a first optical modulator 1901 and a first optical demodulator 1902, and the processor includes a first digital-to-analog conversion interface 1903, a mapping module 1906, and a FIC1907 sequentially connected to the first optical modulator 1901. The processor further includes a first digital to analog conversion interface 1904, a demapping module 1905, and a FIC1907, which are in turn coupled to the first optical demodulator 1902. The FIC1907 is also connected to a Medium Range (MR) interface or a Long Range (LR) interface 1908. The MR interface and the LR interface shown in this embodiment belong to the Serdes interface, which is simply called serializer (serializer)/deserializer (deserializer).

Optionally, the processor in this embodiment further includes a clock interface and/or a control interface, and the control interface is described in time Zhong Jiekou, please refer to the corresponding description of fig. 3 or fig. 7, which is not repeated.

With the structure of the optical module shown in this embodiment, the first optical module directly sends the signal after the digital signal processing by the processor to the outside through the MR interface or the LR interface 1908, and the transmission of the MR interface or the LR interface 1908 effectively reduces the insertion loss of the signal after the digital signal processing.

Several alternative structures of the optical module are specifically described below, where fig. 20 is a structural example diagram of a second embodiment of the optical module provided in the present application.

The optical module shown in this embodiment includes a first photoelectric converter and a processor that are sequentially connected. The first photoelectric converter specifically includes a first optical modulator 1901 and a first optical demodulator 1902, and the detailed description is referred to the corresponding description in fig. 19, and details are not repeated. The processor shown in this embodiment specifically includes a digital signal processor and a framer. The digital signal processor specifically includes a first digital-to-analog conversion interface 1903 and a mapping module 1906, which are sequentially connected to the first optical modulator 1901. The digital signal processor further comprises a first digital to analog conversion interface 1904 and a demapping module 1905, which are in turn connected to the first optical demodulator 1902. The first optical demodulator 1902 and the mapping module 1906 are respectively connected to an ultra short distance (XSR) interface or a very short distance (VSR) 2001. For a specific description of the first dac interface 1903, the mapping module 1906, the first dac interface 1904, and the demapping module 1905, please refer to fig. 19, and details are not repeated. The framer comprises in particular an XSR interface or a VSR interface 2002, and the XSR interface or the VSR interface 2002 of the framer is connected to the XSR interface or the VSR interface 2001 of the digital signal processor. The framer further includes a FIC1907 and an MR interface or LR interface 1908, which are sequentially connected to the XSR interface or VSR interface 2002, and detailed descriptions of the FIC1907, the MR interface or the LR interface 1908 are shown in fig. 19, which is not repeated. The XSR interface or VSR interface shown in this embodiment belongs to the Serdes interface.

In this embodiment, the optical module includes a circuit board, and the digital signal processor and the framer are independently mounted on the circuit board. Specifically, the digital signal processor is mounted on the circuit board and electrically connected to the wiring of the circuit board, and likewise, the framer is mounted on the circuit board and electrically connected to the wiring of the circuit board. The present embodiment takes a printed circuit board (printed circuit board, PCB) as an example.

Optionally, the signal processor shown in this embodiment includes a clock interface and/or a control interface, and the framer includes a clock interface and/or a control interface. For example, the clock interface and/or control interface of the signal processor, and the clock interface and/or control interface of the framer are electrically connected to the device board, so as to receive control signaling or clock information from the device board. For another example, the control interface of the framing device is connected with the control interface of the digital signal processor, the control interface of the framing device forwards the control signaling from the device single board to the control interface of the digital signal processor, the clock interface of the framing device is connected with the clock interface of the digital signal processor, and the clock interface of the framing device forwards the clock information from the device single board to the clock interface of the digital signal processor.

By adopting the structure of the optical module shown in the embodiment, the digital signal processor is connected with the framing device through the XSR interface or the VSR interface, so that the digital signal processor is not connected with the framing device through a connector of a circuit board, the length (for example, centimeter level) of an electric connection path between the digital signal processor and the framing device is effectively reduced, and the insertion loss of signals transmitted between the digital signal processor and the framing device is effectively reduced. In addition, the first optical module directly transmits the signal after the digital signal processing by the processor to the outside through the MR interface or the LR interface 1908, and the transmission of the MR interface or the LR interface 1908 effectively reduces the insertion loss of the signal after the digital signal processing.

Fig. 21 is a structural example diagram of a third embodiment of an optical module provided in the present application.

The optical module shown in this embodiment includes a first photoelectric converter and a processor that are sequentially connected. The first photoelectric converter specifically includes a first optical modulator 1901 and a first optical demodulator 1902, and the detailed description is referred to the corresponding description in fig. 19, and details are not repeated. The processor shown in this embodiment specifically includes a digital signal processor and a framer. The digital signal processor specifically includes a first digital-to-analog conversion interface 1903 and a mapping module 1906, which are sequentially connected to the first optical modulator 1901. The digital signal processor further comprises a first digital to analog conversion interface 1904 and a demapping module 1905, which are in turn connected to the first optical demodulator 1902. The first optical demodulators 1902 and the mapping modules 1906 are each connected to the pellet interconnect interface 2101. The type of die interconnect interface 2101 may be a generic die interconnect technology (universal chiplet interconnect express, uci) or a proprietary defined interface for inter-chip interconnect. For a specific description of the first dac interface 1903, the mapping module 1906, the first dac interface 1904, the demapping module 1905, the first optical demodulator 1902, and the mapping module 1906, please refer to fig. 19, and details are not repeated. The framer specifically includes a die interconnect interface 2102, and the die interconnect interface 2102 of the framer is connected to a die interconnect interface 2101 of the digital signal processor. The framer further includes a FIC1907 and an MR interface or LR interface 1908, which are sequentially connected to the die interconnect interface 2102, and detailed descriptions of the FIC1907, MR interface, or LR interface 1908 are shown in fig. 19, which is not repeated.

The digital signal processor and the framer shown in this embodiment are mounted as a unit on the circuit board of the optical module. For example, the optical module includes a circuit board and a substrate 2103 mounted on the circuit board, the traces of the substrate 2103 being electrically connected to the traces of the circuit board, the digital signal processor and the framer being mounted as a whole on the substrate 2103, thereby forming a common package. The co-package includes a substrate 2103, a signal processor, and a framer. The co-package is mounted as a whole on a circuit board of the optical module.

The digital signal processor and the framing device in this embodiment may include a control interface or a clock interface, and the detailed description is omitted herein for brevity.

By adopting the structure of the optical module shown in the embodiment, the digital signal processor is connected with the framing device through the core particle interconnection interface, and the length (for example, micron level or millimeter level) of an electric connection path between the digital signal processor and the framing device is effectively reduced by the core particle interconnection interface, so that the insertion loss of signals transmitted between the digital signal processor and the framing device is effectively reduced. In addition, the first optical module directly transmits the signal after the digital signal processing by the processor to the outside through the MR interface or the LR interface 1908, and the transmission of the MR interface or the LR interface 1908 effectively reduces the insertion loss of the signal after the digital signal processing.

Fig. 22 is a structural example diagram of a fourth embodiment of an optical module provided in the present application.

The optical module shown in this embodiment includes a first photoelectric converter and a processor that are sequentially connected. The first photoelectric converter specifically includes a first optical modulator 1901 and a first optical demodulator 1902, and the detailed description is referred to the corresponding description in fig. 19, and details are not repeated. The processor in this embodiment includes a first dac interface 1903 sequentially connected to the first optical modulator 1901, and further includes a first dac interface 1904 connected to the first optical demodulator 1902, where the descriptions of the first dac interface 1903 and the first dac interface 1904 are omitted for brevity. The processor further includes an integrated processing module 2201 connected to the first dac interface 1903 and the first dac interface 1904, respectively, and the integrated processing module 2201 is further connected to the MR interface or the LR interface 1908, and the description of the MR interface or the LR interface 1908 is omitted herein for details of the description corresponding to fig. 19. The integrated processing module 2201 shown in this embodiment is configured to integrate the digital signal processor and the framer, and specifically, the integrated processing module 2201 integrates the mapping module, the demapping module, and the FIC, and the description of specific functions of the mapping module, the demapping module, and the FIC is referred to in the description corresponding to fig. 19, which is not repeated.

With the structure of the optical module in this embodiment, the integrated processing module 2201 integrates the functions of the digital signal processor and the functions of the framer, so that the information interaction between the digital signal processor and the framer does not need to be through a physical interface, but uses an application specific integrated circuit (application specific integrated circuit, ASIC) inside the processor to perform wire connection, thereby effectively reducing the error rate of the signal transmitted by the integrated processing module 2201. In addition, the first optical module directly transmits the signal after the digital signal processing by the processor to the outside through the MR interface or the LR interface 1908, and the transmission of the MR interface or the LR interface 1908 effectively reduces the insertion loss of the signal after the digital signal processing.

In any of the embodiments of fig. 19 to 22, the MR interface or the LR interface 1908 of the optical module is directly connected to the switch chip, and for specific illustration, please refer to the corresponding illustration of fig. 5 or fig. 10, details are not repeated. In any of the embodiments of fig. 19 to 22, the MR interface or the LR interface 1908 of the optical module may also be directly connected to another optical module, and for specific illustration, please refer to the corresponding illustration of fig. 8, details are not repeated.

Fig. 23 is a structural example diagram of a fifth embodiment of an optical module provided in the present application.

The optical module shown in this embodiment includes a first photoelectric converter and a processor that are sequentially connected. The first photoelectric converter specifically includes a first optical modulator 1901 and a first optical demodulator 1902, and the detailed description is referred to the corresponding description in fig. 19, and details are not repeated. The processor in this embodiment specifically includes a first dac interface 1903, a mapping module 1906, a first dac interface 1904, a demapping module 1905, an MR interface, or an LR interface 1908, which are described in detail with reference to the corresponding description in fig. 19, and will not be described again. The processor shown in this embodiment further includes a second digital to analog conversion interface 2301 and a second digital to analog conversion interface 2302 that are in turn connected to an MR interface or LR interface 1908. The optical module further includes a second optical demodulator 2303 connected to the second digital-to-analog conversion interface 2301, and a second optical modulator 2304 connected to the second digital-to-analog conversion interface 2301. For a description of the processor structure in this embodiment, please refer to any one of fig. 19 to 22, and detailed description thereof is omitted.

The optical module shown in this embodiment may be applied to the embodiment corresponding to fig. 6, where if the optical module shown in fig. 23 is a first optical module, the MR interface or LR interface 1908 sends the signal after digital signal processing to the second digital-analog conversion interface 2302, the second digital-analog conversion interface 2302 performs digital-analog conversion on the signal after digital signal processing to obtain an analog signal, and sends the analog signal to the second optical modulator 2304, and the second optical modulator 2304 is configured to perform electro-optical conversion on the analog signal to emit an optical signal, where the optical signal can be transmitted through an optical cable. For a specific explanation of the first optical module transmitting the optical signal, please refer to the corresponding embodiment of fig. 6, which is not repeated. If the optical module shown in fig. 23 is a second optical module, the second optical demodulator 2303 receives an optical signal and performs photoelectric conversion on the optical signal to obtain an electrical signal, the second digital-to-analog conversion interface 2301 is configured to perform digital-to-analog conversion on the electrical signal to obtain an analog signal, the second digital-to-analog conversion interface 2301 sends the analog signal to the MR interface or the LR interface 1908, the processor performs digital signal processing based on the analog signal to obtain a signal after digital signal processing, and sends the signal to the first digital-to-analog conversion interface 1903, the first digital-to-analog conversion interface 1903 performs digital-to-analog conversion on the digital signal to obtain an analog signal, and sends the analog signal to the first optical modulator 1901, and the first optical modulator 1901 performs photoelectric conversion on the analog signal to emit the optical signal. For a specific explanation of the second optical module transmitting the optical signal, please refer to the corresponding embodiment of fig. 6, which is not repeated.

The description of the processor structure shown in any of the embodiments of fig. 19 to 23 may also refer to any of the embodiments of fig. 3, 7, 13a, 13b, 14, 15, 17 or 18, and is not repeated.

The embodiment of the application also provides a switching device, and fig. 24 is a structural example diagram of another embodiment of the switching device provided in the application.

The switching device shown in this embodiment includes a back plate 2411, an optical module 2401 mounted on the back plate 2411, and a switching chip 2402. For a description of the structure of the optical module 2401, please refer to any one of the embodiments shown in fig. 19 to 23. The MR interface or LR interface of the optical module 2401 is connected to the switch chip 2402 through a back plate 2411. Specifically, the optical module 2401 shown in this embodiment is mounted on the back plane 2411 through a first device board 2412, the switch chip 2402 is mounted on the back plane 2411 through a second device board 2413, and the first device board 2412 and the second device board 2413 are connected through the back plane 2411.

In the embodiment shown in fig. 2, if the optical module shown in any one of the embodiments in fig. 19 to 23 is used as the first optical module, the first optical demodulator 1902 is configured to perform step 201 and step 202. The first digital-to-analog conversion interface 1904 and the demapping module 1905 are configured to perform step 203.FIC1907 is used to perform step 204. The MR interface or LR interface 1908 is used to perform step 205, i.e., the MR interface or LR interface 1908 is used to send traffic cells or traffic packets from the FIC1907 to the switching chip. Specifically, the MR interface or LR interface 1908 shown in this embodiment is connected to the Serdes interface of the switch chip through a first transmission medium, and for the description of the first transmission medium, please refer to the corresponding description of fig. 5, details are not repeated. If the optical module shown in any of the embodiments of fig. 19 to 23 is used as the second optical module, the MR interface or LR interface 1908 is used for receiving the service cells or the service packets from the switching chip, and the switching chip sends the second optical module a description of the service cells or the service packets, please refer to step 206. Specifically, the MR interface or LR interface 1908 in this embodiment is connected to the Serdes interface of the switch chip through the second transmission medium. The FIC1907, the mapping module 1906, and the first digital-to-analog conversion interface 1903 are used to perform step 207. The first optical modulator 1901 is configured to execute the step 208, and the description of the transmission method process of the service executed by the first optical module and the second optical module is referred to in fig. 2, and details thereof are not repeated.

In the embodiment shown in fig. 9, if the optical module shown in any one of the embodiments of fig. 19 to 23 is used as the first optical module, the first optical demodulator 1902 is used to perform step 901 and step 902. The first digital-to-analog conversion interface 1904 and the demapping module 1905 are configured to perform step 903.FIC1907 is used to perform step 904. The MR interface or LR interface 1908 is used to perform step 905, i.e., the MR interface or LR interface 1908 is used to send the traffic cells or traffic packets from the FIC1907 to the switching chip. Specifically, the MR interface or LR interface 1908 shown in this embodiment is connected to the Serdes interface of the switch chip through the first transmission medium. If the optical module shown in any of the embodiments of fig. 19 to 23 is used as the second optical module, the MR interface or LR interface 1908 is used for receiving the service cells or the service packets from the switching chip, and the switching chip sends the second optical module a description of the service cells or the service packets, please refer to step 905. Specifically, the MR interface or LR interface 1908 shown in the embodiment is connected to the Serdes interface of the switch chip through a second transmission medium, and for the explanation of the first transmission medium, please refer to the corresponding explanation of fig. 5, details are not repeated. The MR interface or LR interface 1908 sends service cells or service packets to the FIC 1907. The FIC1907, the mapping module 1906, and the first digital-to-analog conversion interface 1903 are used to perform step 906. The first light modulator 1901 is used to perform step 907. For a description of the transmission method process of the service executed by the first optical module and the second optical module, please refer to the corresponding description of fig. 9, and details are not repeated.

In the embodiment shown in fig. 11, if the optical module shown in any one of the embodiments in fig. 19 to 23 is used as the first optical module, the first optical demodulator 1902 is configured to perform step 1101 and step 1102. The first digital to analog conversion interface 1904, the demapping module 1905, and the FIC1907 are configured to perform step 1103. An MR interface or LR interface 1908 is used to perform step 1104. If the optical module shown in any of the embodiments of fig. 19 to 23 is used as the second optical module, the MR interface or LR interface 1908 is used for receiving service cells or service packets from the switching chip. The MR interface or LR interface 1908 sends service cells or service packets to the FIC 1907. The FIC1907, the mapping module 1906, and the first digital-to-analog conversion interface 1903 are used to perform step 1106. The first light modulator 1901 is used to perform step 1107. For a description of the transmission method process of the service executed by the first optical module and the second optical module, please refer to the corresponding description of fig. 11, and details are not repeated.

In the embodiment shown in fig. 16, if the optical module shown in any one of the embodiments of fig. 19 to 23 is used as the first optical module, the first optical demodulator 1902 is configured to perform step 1601 and step 1602. The first digital to analog conversion interface 1904 is used to perform step 1603. The demapping module 1905 is used to perform step 1604. The processor may further include an FEC decoding module (see the corresponding embodiment of fig. 17 for specific description), where the FEC decoding module is configured to perform step 1605.FIC1907 is used to perform step 1606. The FIC1907 may further include an FEC encoding module, which is configured to perform step 1607 (see the corresponding embodiment of fig. 17 for a detailed description). An MR interface or LR interface 1908 is used to perform step 1608. If the optical module shown in any of the embodiments of fig. 19 to 23 is used as the second optical module, the MR interface or LR interface 1908 is used for receiving service cells or service packets from the switching chip. The MR interface or LR interface 1908 sends service cells or service packets to the FIC 1907. The FIC1907 further includes an FEC decoding module, which is configured to perform step 1610 (see the corresponding embodiment of fig. 18 for a specific description). FIC1907 is used to perform step 1611. The processor further includes an FEC encoding module for performing step 1612 (see the corresponding embodiment of fig. 18 for a specific description). The mapping module 1906 is used for performing step 1613, the first digital-to-analog conversion interface 1903 is used for performing step 1614, and the first optical modulator 1901 is used for performing step 1615. For a description of the transmission method process of the service executed by the first optical module and the second optical module, please refer to the corresponding description of fig. 16, which is not repeated.

It will be clear to those skilled in the art that, for convenience and brevity of description, specific working procedures of the above-described systems, apparatuses and units may refer to corresponding procedures in the foregoing method embodiments, which are not repeated herein.

In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods may be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative, e.g., the division of the units is merely a logical function division, and there may be additional divisions when actually implemented, e.g., multiple units or components may be combined or integrated into another system, or some features may be omitted or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be an indirect coupling or communication connection via some interfaces, devices or units, which may be in electrical, mechanical or other form.

The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

In addition, each functional unit in each embodiment of the present application may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit. The integrated units may be implemented in hardware or in software functional units.

Claims

1. The optical module is characterized by comprising a first photoelectric converter and a processor which are sequentially connected, wherein the processor comprises a first digital-to-analog conversion interface, the first digital-to-analog conversion interface is connected with the first photoelectric converter, and the processor comprises a middle-distance MR interface or a long-distance LR interface;

the first photoelectric converter is used for receiving an optical signal and converting the optical signal into an electric signal;

the first digital-to-analog conversion interface is used for converting the electric signal into a digital signal;

the processor is used for processing the digital signals and sending the processed signals outwards through the MR interface or the LR interface.

2. The optical module of claim 1, wherein the processor comprises a digital signal processor and a framer,

the digital signal processor is connected with the framing device through an ultra-short distance XSR interface or an ultra-short distance VSR, and the framing device comprises the MR interface or the LR interface.

3. The optical module of claim 2, wherein the optical module comprises a circuit board, and the digital signal processor and the framer are independently mounted on the circuit board.

4. The optical module of claim 1, wherein the processor comprises a digital signal processor and a framer, the digital signal processor and the framer being connected by a die interconnect interface.

5. The optical module of claim 4, wherein the digital signal processor and the framer are mounted as a unit on a circuit board of the optical module.

6. An optical module as claimed in claim 1, characterized in that the processor integrates a digital signal processor and a framer, the processor comprising a clock interface for receiving control signaling and/or a control interface for receiving clock synchronization signals.

7. An optical module according to any one of claims 1 to 6, characterized in that the MR interface or LR interface is connected to a transmission medium for connecting a switching device or another optical module.

8. The optical module of any one of claims 1 to 6, wherein the processor further comprises a second digital-to-analog conversion interface, the optical module further comprises a second photoelectric converter, the second photoelectric converter is connected to the MR interface or the LR interface, and the second digital-to-analog conversion interface is connected to the second photoelectric converter;

The second digital-analog conversion interface is used for converting the processed signal into an analog signal, and the second photoelectric converter is used for converting the analog signal into another optical signal and sending the other optical signal outwards.

9. Switching device, characterized by comprising a back plane, an optical module mounted on the back plane and a switching chip, the optical module being as claimed in any of claims 1 to 8, the MR interface or the LR interface of the optical module being connected with the switching chip via the back plane.

10. The switching device of claim 9, wherein the optical module is mounted to the backplane by a first device board, the switching chip is mounted to the backplane by a second device board, and the first device board and the second device board are connected by the backplane.