CN220773220U - Chip fixture and chip failure analysis system - Google Patents

Chip fixture and chip failure analysis system Download PDF

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Publication number
CN220773220U
CN220773220U CN202322319933.4U CN202322319933U CN220773220U CN 220773220 U CN220773220 U CN 220773220U CN 202322319933 U CN202322319933 U CN 202322319933U CN 220773220 U CN220773220 U CN 220773220U
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clamping plate
unit
chip
clamping
chip holder
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CN202322319933.4U
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Chinese (zh)
Inventor
张慧妍
田浩然
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GTA Semiconductor Co Ltd
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GTA Semiconductor Co Ltd
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Priority to CN202322319933.4U priority Critical patent/CN220773220U/en
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Abstract

The utility model discloses a chip clamp, which comprises a box unit and two clamping plate units. Wherein, the box unit is a hollow structure with an opening at the upper end, and mounting holes are respectively arranged on the two side walls of the box unit; the first ends of the two clamping plate units are arranged in the box unit, the second ends of the clamping plate units penetrate through the corresponding mounting holes and are positioned outside the box unit, and the second ends of the clamping plate units are movably arranged in the corresponding mounting holes. The utility model solves the problem that in the prior art, a plurality of uncertain factors are easily introduced in the process of clamping a small sample to cause sample loss.

Description

Chip fixture and chip failure analysis system
Technical Field
The utility model relates to the technical field of chip failure analysis equipment, in particular to a chip clamp and a chip failure analysis system.
Background
Failure of integrated circuits in the processes of development, production and use is unavoidable, and as the size of chips becomes smaller, the capability of gate control current decreases and the requirements of people on product quality and reliability are continuously increased, so that failure analysis work is becoming more important. Through failure analysis work, a designer can be helped to find defects in design, mismatch of technological parameters and the like. For wafers, the nondestructivity of EMMI (electromagnetic wave based microscopy) and OBIRCH (testing technique using laser beam induced resistance change) can accurately and efficiently locate the failure location.
As shown in fig. 1, in the conventional hot spot test, the cracked sample chip 1 'is placed on a glass carrier to be directly inserted into the needle for testing, or the sample chip 1' is fixed in an ineffective area by using an adhesive tape for testing. However, since the sample chip 1 'returned after the failure of the FT test (functional test) and the CP test (contact test) is small, the sample chip 1' is difficult to clamp or directly insert a needle test, for example, the BCD product (the product digitally represented and processed by BCD coding) has a size of about 0.38mm by 0.38mm to 2.5mm by 1.1 mm. In the case of clamping the sample chip 1 'with forceps, the sample chip 1' is easily clamped by the clamping force and the clamping angle; second, for smaller sample chips 1', it is also difficult to fix with tape due to the lack of redundant areas. If the sample chip 1' is not fixed and the needle is directly spotted, the sample chip 1' may be damaged or even lost due to the too small sample chip 1 '. It follows that the existing tools are not capable of performing EMMI tests safely and efficiently for small sample chips 1', and multiple uncertainties are easily introduced to cause sample loss.
Based on this, a new solution is needed.
Disclosure of Invention
In view of the above, the embodiments of the present utility model provide a chip fixture and a chip failure analysis system, so as to at least solve the problem in the prior art that a plurality of uncertain factors are easily introduced in the process of clamping a small sample, so that the sample is lost.
The embodiment of the utility model provides the following technical scheme:
the embodiment of the utility model provides a chip clamp, which comprises:
the box unit is of a hollow structure with an opening at the upper end, and mounting holes are respectively formed in the two side walls of the box unit;
the first ends of the two clamping plate units are arranged in the box unit, the second ends of the clamping plate units penetrate through the corresponding mounting holes to be located outside the box unit, and the second ends of the clamping plate units are movably arranged in the corresponding mounting holes.
Further, the cartridge unit is made of a glass material or a light-transmitting material.
Further, the first end of the clamping plate unit is arranged in a right-angle structure so as to clamp the right-angle edge of the chip.
Further, the first ends of the two clamping plate units are arranged in an oblique symmetry mode.
Further, the first end of the splint unit is made of PVC material.
Further, the second end of the clamping plate unit is screw-coupled with the mounting hole to adjust the position of the clamping plate unit.
Further, the splint unit includes:
a clamping plate provided inside the cartridge unit;
and the first end of the screw is connected with the side part of the clamping plate, and the second end of the screw is in threaded arrangement with the mounting hole and is positioned outside the box unit.
Further, the chip holder further includes:
the support plate unit is of a hollow structure with an opening at the upper part, grooves corresponding to the second ends of the clamping plate units are formed in the side walls of the support plate unit, and the inside of the support plate unit is used for placing the box unit and the two clamping plate units.
Further, the carrier plate unit is made of glass.
The chip failure analysis system comprises the chip clamp.
Compared with the prior art, the beneficial effects achieved by the at least one technical scheme adopted by the embodiment of the utility model at least comprise:
according to the chip clamp, the two clamping plate units move on the side wall of the box unit to clamp the sample chip, so that the sample is fixed, clamping fixation, needle insertion fixation or fixation by using an adhesive tape is not needed, and the problem that a plurality of uncertain factors are easily introduced in the process of clamping a small sample to cause sample loss in the prior art is solved;
further, through setting the first end of splint unit to right angle formula structure, also increased splint unit centre gripping sample chip's area and dynamics, improved the stability of centre gripping sample chip.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a conventional chip failure analysis system;
FIG. 2 is a top view of a chip holder according to the present utility model;
FIG. 3 is a side view of a chip holder of the present utility model;
FIG. 4 is a perspective view of a chip holder according to the present utility model;
FIG. 5 is a schematic diagram of a chip failure analysis system according to the present utility model;
the reference numerals of the present utility model are as follows:
1', chip;
1. a chip clamp;
10. a cartridge unit; 11. a mounting hole; 20. a clamping plate unit; 21. a clamping plate; 22. a screw; 30. and a carrier plate unit.
Detailed Description
Embodiments of the present application are described in detail below with reference to the accompanying drawings.
Other advantages and effects of the present application will become apparent to those skilled in the art from the present disclosure, when the following description of the embodiments is taken in conjunction with the accompanying drawings. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. The present application may be embodied or carried out in other specific embodiments, and the details of the present application may be modified or changed from various points of view and applications without departing from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
It is noted that various aspects of the embodiments are described below within the scope of the following claims. It should be apparent that the aspects described herein may be embodied in a wide variety of forms and that any specific structure and/or function described herein is merely illustrative. Based on the present application, one skilled in the art will appreciate that one aspect described herein may be implemented independently of any other aspect, and that two or more of these aspects may be combined in various ways. For example, apparatus may be implemented and/or methods practiced using any number and aspects set forth herein. In addition, such apparatus may be implemented and/or such methods practiced using other structure and/or functionality in addition to one or more of the aspects set forth herein.
It should also be noted that the illustrations provided in the following embodiments merely illustrate the basic concepts of the application by way of illustration, and only the components related to the application are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complicated.
In addition, in the following description, specific details are provided in order to provide a thorough understanding of the examples. However, it will be understood by those skilled in the art that the present utility model may be practiced without these specific details.
Aiming at the problem that a small sample is clamped by tweezers in the prior art, and a small sample chip is easy to be clamped and flown because of the problems of strength and clamping angle and is difficult to be fixed by using an adhesive tape, the utility model provides a chip clamp for a very small sample in the failure analysis hot spot positioning process, and solves the defects in the prior art by adopting the following technical scheme.
The following describes the technical solutions provided by the embodiments of the present application with reference to the accompanying drawings.
Example 1
As shown in fig. 2, an embodiment of the present utility model provides a chip holder including a case unit 10 and two clamping plate units 20. Wherein, the box unit 10 is a hollow structure with an opening at the upper end, and mounting holes 11 are respectively arranged on the two side walls of the box unit 10; the first ends of the two clamping plate units 20 are disposed inside the box unit 10, the second ends of the clamping plate units 20 pass through the corresponding mounting holes 11 to be located outside the box unit 10, and the second ends of the clamping plate units 20 are movably disposed in the corresponding mounting holes 11.
Wherein the cartridge unit 10 is made of a glass material or a light-transmitting material so as to perform EMMI test on a sample chip placed inside the cartridge unit 10.
Preferably, mounting holes 11 are respectively formed on both opposite sidewalls of the cartridge unit 10 so as to allow the two clamping plate units 20 to clamp the chip.
The two clamping plate units 20 can move along the axial direction of the mounting hole 11 to enter the box unit 10 or be far away from the box unit 10, so that sample chips with different sizes can be clamped.
Specifically, in the case of clamping a sample chip of a smaller size, a worker may move the clamping plate unit 20 into the cartridge unit 10 to clamp the sample chip; in the case of clamping a sample chip having a large size, a worker may move the clamping plate unit 20 to the outside of the cartridge unit 10 to clamp the sample chip having a large size.
In some of these embodiments, there is a large friction force between the second end of the clamping plate unit 20 and the mounting hole 11, so that in the case that the clamping plate unit 20 clamps the sample chip, the clamping plate unit 20 does not move arbitrarily due to the friction force of the mounting hole 11, and the sample chip is prevented from moving when the chip test is performed, thereby achieving the fixation of the sample chip.
Specifically, after placing the sample chip inside the cartridge unit 10, the worker operates the clamping plate unit 20 to move the clamping plate unit 20 like the inside of the cartridge unit 10 to clamp the sample chip; in the case where clamping of the sample chip is not required, the worker operates the clamping plate unit 20 to move the clamping plate unit 20 to the outside of the cartridge unit 10 to release the sample chip.
In some of these embodiments, the first end of the clamping plate unit 20 is arranged in a linear configuration to clamp the sample chip.
Preferably, the first end of the clamping plate unit 20 is provided in a right-angle configuration so as to clamp the right-angle edge of the chip, thereby facilitating clamping and fixing of the sample chip.
More preferably, the first ends of the two clamping plate units 20 are disposed in an oblique symmetry manner so as to clamp the two right-angle sides of the sample chip in an oblique symmetry manner, so as to fix the sample chip.
In some of these embodiments, the first end of the clamping plate unit 20 is removably disposed so that different sized clamping plate units 20 may be replaced for different sized sample chips.
Where the first end of the cleat unit 20 is detachably disposed, the first end of the cleat unit 20 may be connected to the cleat unit 20 by, but not limited to, a threaded connection, a snap-fit connection, or a plug-and-socket connection.
In some of these embodiments, the thickness of the first end of the clamping plate unit 20 is the same as or slightly greater than the thickness of the sample chip to facilitate clamping of the sample chip.
In some of these embodiments, the first end of the cleat unit 20 is made of a PVC material.
Specifically, since the first end of the splint unit 20 is made of PVC material (polyvinyl chloride), and the antistatic polyvinyl chloride has characteristics of acid resistance, alkali resistance, corrosion resistance, aging resistance, tensile resistance, etc., the service life of the splint unit 20 can be prolonged.
In addition, the PVC material can be selected to be suitable in hardness by adjusting the plasticizer.
The friction force of the PVC material is larger than that of other light-transmitting materials, so that the probability of sample loss caused by improper clamping force is definitely reduced greatly.
In some of these embodiments, the second end of the cleat unit 20 is threadably coupled with the mounting hole 11 for adjusting the position of the cleat unit 20.
Wherein, the second end of splint unit 20 can rotate with the first end of splint unit 20 and be connected, and the second end of splint unit 20 is provided with the external screw thread, be provided with the internal screw thread in the mounting hole 11, thereby the second end of splint unit 20 can rotate in mounting hole 11, and because the second end of splint unit 20 rotates with the first end of splint unit 20 to be connected, thereby the second end of splint unit 20 rotates and can not drive the first end of splint unit 20 and rotate, then the second end of splint unit 20 can drive the first end of splint unit 20 and remove.
Specifically, the clamping plate unit 20 includes a clamping plate 21 and a screw 22. Wherein the clamping plate 21 is provided inside the cartridge unit 10; the screw 22 is provided at a side portion of the clamping plate 21 and is screw-coupled with the mounting hole 11.
Preferably, the clamping plate 21 is provided in a right angle configuration.
In some embodiments, the screw 22 is rotatably connected to the clamping plate 21, so that the screw 22 does not rotate the clamping plate 21 and can drive the clamping plate 21 to move when the screw 22 rotates.
In the case that the sample chip is placed inside the cartridge unit 10 and between the two clamping plates 21, if the sample chip needs to be clamped, a worker can use a screwdriver to rotate the screw 22, and the screw 22 is in threaded connection with the mounting hole 11, so that the clamping plates 21 can be driven to move towards the inner side of the cartridge unit 10 until the clamping plates 21 clamp the sample chip; in the case of releasing the sample chip, the worker can use the screw to reversely rotate the screw 22 to move the clamping plate 21 away from the sample chip.
In some of these embodiments, the mounting hole 11 is provided in a long bar shape, and the mounting hole 11 is provided along the circumferential direction of the cartridge unit 10, and the second end of the cleat unit 20 is snap-coupled with the cartridge unit 10.
Specifically, in the case that the clamping plate unit 20 is in snap connection with the mounting hole 11, a first snap is provided on the clamping plate unit 20, and a plurality of second snap is provided on the inner wall of the mounting hole 11, so that in the case that the clamping plate unit 20 moves along the length direction of the mounting hole 11, the first snap on the clamping plate unit 20 is connected with the corresponding second snap on the inner wall of the mounting hole 11, so as to limit and fix the clamping plate unit 20.
In some embodiments, the chip fixture 1 further includes a hollow structure with a carrier plate unit 30 opened at the upper side, a groove corresponding to the second end of the clamping plate unit 20 is formed on the side wall of the carrier plate unit 30, and the interior of the carrier plate unit 30 is used for placing the box unit 10 and the two clamping plate units 20.
Further, the carrier plate unit 30 is made of glass.
Specifically, the carrier plate unit 30 may be a groove suitable for the main body portion in a thicker glass center, the device is fixed in the groove, glue is optionally used to fix around, and grooves suitable for the size of the screw 22 and the sliding groove of the screw 22 are simultaneously dug, so as to facilitate the fixing of the clamping plate 21 by the screwdriver.
The operation flow of this embodiment is as follows:
placing the sample chip inside the cartridge unit 10 between the two clamping plate units 20;
the two clamping units 20 are moved so that the two clamping units 20 clamp the sample chip and fix the two clamping units 20.
The technical problem to be solved by the embodiment is to provide a clamp for the failure positioning analysis process of the small chip, so as to solve the problems that the small sample is easy to lose and difficult to fix in the EMMI test process, and meanwhile, the small sample is easy to generate electrostatic adsorption, so that the damage of static electricity to the sample can be avoided by optimizing the clamp material, and the clamping stability of the sample chip is improved.
Example 2
The utility model also provides a chip failure analysis system, which comprises the chip clamp 1.
In some of these embodiments, the chip failure analysis system further comprises a glass stage, an EMMI probe lens, an imaging lens. The chip clamp 1 is arranged on the glass carrier, and the inside of the chip clamp is used for placing chips; the RMMI detection lens is arranged below the glass carrier; the imaging lens is arranged above the glass carrying platform.
The utility model can greatly reduce the risks of sample damage and loss of small-sized IC chips (0.38 mm is between 0.38 and 2.5mm is between 1.1) in the failure positioning analysis process, and the fixed samples can support the damage caused by sample sliding in the multi-needle test lattice process.
In this specification, identical and similar parts of the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the product embodiments described later, since they correspond to the methods, the description is relatively simple, and reference is made to the description of parts of the system embodiments.
The foregoing is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions easily conceivable by those skilled in the art within the technical scope of the present application should be covered in the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (10)

1. A chip clamp, comprising:
the box unit is of a hollow structure with an opening at the upper end, and mounting holes are respectively formed in the two side walls of the box unit;
the first ends of the two clamping plate units are arranged in the box unit, the second ends of the clamping plate units penetrate through the corresponding mounting holes to be located outside the box unit, and the second ends of the clamping plate units are movably arranged in the corresponding mounting holes.
2. The chip holder according to claim 1, wherein the cartridge unit is made of a glass material or a light-transmitting material.
3. The chip holder of claim 1, wherein the first end of the clamping plate unit is configured in a right angle configuration to facilitate clamping the right angle edge of the chip.
4. A chip holder according to claim 3, wherein the first ends of the two clamping units are arranged diagonally symmetrically.
5. The chip holder of claim 1, wherein the first end of the clamping plate unit is made of PVC material.
6. The chip holder of claim 1, wherein the second end of the clamping plate unit is threadedly coupled to the mounting hole to adjust the position of the clamping plate unit.
7. The chip holder according to claim 6, wherein the clamping plate unit comprises:
a clamping plate provided inside the cartridge unit;
and the first end of the screw is connected with the side part of the clamping plate, and the second end of the screw is in threaded arrangement with the mounting hole and is positioned outside the box unit.
8. The chip holder of claim 1, further comprising:
the support plate unit is of a hollow structure with an opening at the upper part, grooves corresponding to the second ends of the clamping plate units are formed in the side walls of the support plate unit, and the inside of the support plate unit is used for placing the box unit and the two clamping plate units.
9. The chip holder of claim 8, wherein the carrier plate unit is made of glass.
10. A chip failure analysis system comprising a chip holder according to any one of claims 1 to 9.
CN202322319933.4U 2023-08-28 2023-08-28 Chip fixture and chip failure analysis system Active CN220773220U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202322319933.4U CN220773220U (en) 2023-08-28 2023-08-28 Chip fixture and chip failure analysis system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202322319933.4U CN220773220U (en) 2023-08-28 2023-08-28 Chip fixture and chip failure analysis system

Publications (1)

Publication Number Publication Date
CN220773220U true CN220773220U (en) 2024-04-12

Family

ID=90620054

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202322319933.4U Active CN220773220U (en) 2023-08-28 2023-08-28 Chip fixture and chip failure analysis system

Country Status (1)

Country Link
CN (1) CN220773220U (en)

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