CN220763220U - Crystal packaging mould with cooling structure - Google Patents
Crystal packaging mould with cooling structure Download PDFInfo
- Publication number
- CN220763220U CN220763220U CN202322047078.6U CN202322047078U CN220763220U CN 220763220 U CN220763220 U CN 220763220U CN 202322047078 U CN202322047078 U CN 202322047078U CN 220763220 U CN220763220 U CN 220763220U
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- China
- Prior art keywords
- cooling
- water
- tank
- die
- crystal
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- 238000001816 cooling Methods 0.000 title claims abstract description 91
- 239000013078 crystal Substances 0.000 title claims abstract description 57
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 41
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 97
- 239000000872 buffer Substances 0.000 claims abstract description 19
- 238000005538 encapsulation Methods 0.000 claims abstract description 11
- 238000005507 spraying Methods 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 10
- 239000000498 cooling water Substances 0.000 description 9
- 230000008569 process Effects 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000002386 leaching Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 239000012945 sealing adhesive Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model relates to the technical field of crystal packaging and discloses a crystal packaging die with a cooling structure, which comprises a base, wherein a cooling component is arranged above the base, a die component is arranged above the cooling component, a buffer component is arranged above the cooling component, the cooling component comprises a cooling tank fixedly arranged at the top of the base, a water collecting cavity is formed in the cooling tank, a water tank positioned at the right side of the cooling tank is fixedly arranged at the top of the base, a filter plate is movably arranged in the water tank, and a refrigerating pipe positioned at the right side of the filter plate is fixedly arranged in the water tank. This crystal packaging mould with cooling structure can make crystal encapsulation after quick cooling through cooling module, can make encapsulation simple operation convenient through the mould subassembly, can prevent through buffer unit that the crystal from damaging at the encapsulation in-process, has greatly increased crystal packaging mould's practicality.
Description
Technical Field
The utility model relates to the technical field of crystal packaging, in particular to a crystal packaging die with a cooling structure.
Background
The packaging of the crystal is generally carried out by assembling the crystal into a wafer and then packaging the wafer, and the packaging of the wafer is generally carried out by a packaging mold, and the packaging process is carried out by placing the wafer inside the mold and then introducing a sealing adhesive for packaging.
The traditional crystal packaging mold does not have a cooling mechanism, a great amount of time is needed to wait for cooling the crystal after packaging, the production efficiency of the crystal packaging mold is reduced, meanwhile, if the demolding is not thoroughly performed by manual cooling, the crystal packaging is damaged, a great amount of resources are wasted, secondly, the traditional crystal packaging mold is complex in operation, workers are required to manually perform mold clamping, the great inconvenience is caused, in addition, the crystal has errors in the assembly process, the height of the crystal is caused to have certain difference after the crystal is assembled into a wafer group, and the crystal is crushed if the height difference of the crystal is overlarge during packaging of the traditional crystal packaging mold, so the crystal packaging mold with the cooling structure is provided to solve the problems.
Disclosure of Invention
(one) solving the technical problems
Aiming at the defects of the prior art, the utility model provides the crystal packaging die with the cooling structure, which has the advantages of rapid cooling and the like, and solves the problems that the existing crystal packaging die is not provided with the cooling mechanism and is complex in operation and the like.
(II) technical scheme
In order to achieve the purpose of rapid cooling, the utility model provides the following technical scheme: the utility model provides a crystal packaging mould with cooling structure, includes the base, the top of base is provided with cooling module, cooling module's top is provided with the mould subassembly, cooling module's top is provided with buffer assembly.
The cooling assembly comprises a cooling tank fixedly mounted at the top of a base, a water collecting cavity is formed in the cooling tank, a water tank located at the right side of the cooling tank is fixedly mounted at the top of the base, a filter plate is movably mounted in the water tank, a refrigerating pipe located at the right side of the filter plate is fixedly mounted in the water tank, a water pump located at the right side of the water tank is fixedly mounted at the top of the base, a water outlet pipe is communicated with the right side of the cooling tank, a water inlet pipe penetrating through and extending to the left side of the cooling tank is communicated with the left side of the water collecting cavity, and a plurality of evenly distributed water spraying pipes are fixedly mounted on the inner side wall of the cooling tank.
Further, the mould subassembly is including the pole setting of respectively fixed mounting in cooling tank top left and right sides, two fixed mounting has the roof between the top of pole setting, the bottom fixed mounting of roof has the cylinder, the piston rod fixed mounting of cylinder has last mould, the inside movable mounting of cooling tank has the bed die.
Further, the buffer assembly comprises two dampers fixedly arranged on the inner bottom wall of the cooling tank, a spring positioned on the outer side of the damper is fixedly arranged on the inner bottom wall of the cooling tank, and a buffer pad is fixedly arranged at the bottom of the upper die.
Further, the top of the water tank is hinged with a box door through a pin shaft, the front and the back of the filter plate are fixedly provided with sliding blocks, and the front and the back side walls of the inner cavity of the water tank are provided with sliding grooves which are in sliding connection with the sliding blocks.
Further, the right end of the water outlet pipe is communicated with the left side of the water tank, and a connecting pipe with one end communicated with the water inlet of the water pump is communicated with the right side of the water tank.
Further, one end of the water inlet pipe, which is far away from the water collecting cavity, is communicated with the water outlet of the water pump, and one end of the water spray pipe, which is far away from the inner side of the cooling groove, is communicated with the water collecting cavity.
Further, the standing groove is all offered to the opposite side of last mould and bed die, blotter fixed connection is in the interior roof of last mould bottom standing groove, the top of spring and the bottom fixed connection of bed die.
(III) beneficial effects
Compared with the prior art, the utility model provides the crystal packaging die with the cooling structure, which has the following beneficial effects:
this crystal packaging mould with cooling structure can make crystal encapsulation after quick cooling through cooling module, has improved crystal encapsulation's efficiency, can make encapsulation easy operation convenient through the mould subassembly, makes crystal packaging mould operation get up simpler, can prevent through buffer unit that the crystal from damaging at encapsulation in-process, has saved a large amount of resources, has greatly increased crystal packaging mould's practicality.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a top view of a cooling trough in the structure of the present utility model;
figure 3 is a right side view of the filter plate in the construction of the utility model.
In the figure: 1 base, 201 cooling tank, 202 water collecting cavity, 203 water tank, 204 filter board, 205 refrigeration pipe, 206 water pump, 207 outlet pipe, 208 inlet pipe, 209 spray pipe, 301 pole setting, 302 roof, 303 cylinder, 304 upper mould, 305 lower mould, 401 damper, 402 spring, 403 blotter.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-3, the present utility model provides a technical solution: the utility model provides a crystal packaging mould with cooling structure, includes base 1, and base 1's top is provided with cooling module, and cooling module's top is provided with the mould subassembly, and cooling module's top is provided with buffer unit, can make quick cooling after the crystal encapsulation through cooling module, can make encapsulation simple operation convenient through the mould subassembly, can prevent through buffer unit that the crystal from damaging at encapsulation in-process, greatly increased crystal packaging mould's practicality.
In this embodiment, the cooling component is a component for rapidly cooling the crystal packaging mold.
As shown in fig. 1, fig. 2 and fig. 3, the cooling assembly comprises a cooling tank 201 fixedly installed at the top of a base 1, a water collecting cavity 202 is formed in the cooling tank 201, a water tank 203 located at the right side of the cooling tank 201 is fixedly installed at the top of the base 1, a filter plate 204 is movably installed in the water tank 203, a refrigerating pipe 205 located at the right side of the filter plate 204 is fixedly installed in the water tank 203, a water pump 206 located at the right side of the water tank 203 is fixedly installed at the top of the base 1, a water outlet pipe 207 is communicated with the right side of the cooling tank 201, a water inlet pipe 208 penetrating through and extending to the left side of the cooling tank 201 is communicated with the left side of the water collecting cavity 202, and a plurality of evenly distributed water spraying pipes 209 are fixedly installed on the inner side wall of the cooling tank 201.
The top of the water tank 203 is hinged with a box door through a pin shaft, so that the inside of the water tank 203 can be cleaned and maintained through the box door, and meanwhile, cooling water in the water tank 203 can be added through the box door.
In addition, the front and the back of the filter plate 204 are fixedly provided with sliding blocks, the front and the back side walls of the inner cavity of the water tank 203 are provided with sliding grooves which are in sliding connection with the sliding blocks, the filter plate 204 can be quickly detached and installed through the sliding blocks and the sliding grooves, and the filter plate 204 is convenient to clean and replace.
The right end of the water outlet pipe 207 is connected to the left side of the water tank 203, so that the cooling water in the cooling tank 201 can flow into the water tank 203 through the water outlet pipe 207.
In addition, a connecting pipe with one end communicated with the water inlet of the water pump 206 is communicated with the right side of the water tank 203, so that the cooled cooling water of the water tank 203 can enter the water pump 206 through the connecting pipe.
Wherein, the end of the water inlet pipe 208 far away from the water collecting cavity 202 is communicated with the water outlet of the water pump 206, so that the water pump 206 can send the cooling water inside the water pump into the water collecting cavity 202 through the water inlet pipe 208.
In addition, one end of the water spray pipe 209 far away from the inner side of the cooling tank 201 is communicated with the water collecting cavity 202, so that cooling water in the water collecting cavity 202 can enter the cooling tank 201 through the water spray pipe 209, and the crystal packaging die is cooled.
In this embodiment, the die assembly is an assembly that encapsulates the leaching.
As shown in fig. 1, the mold assembly includes upright rods 301 fixedly installed on the left and right sides of the top of the cooling tank 201, a top plate 302 is fixedly installed between the tops of the two upright rods 301, an air cylinder 303 is fixedly installed at the bottom of the top plate 302, an upper mold 304 is fixedly installed on a piston rod of the air cylinder 303, and a lower mold 305 is movably installed inside the cooling tank 201.
Wherein, the opposite sides of the upper mold 304 and the lower mold 305 are provided with placing grooves for placing the crystal.
It should be noted that, the top of the upper mold 304 is provided with a through hole penetrating into the placing groove, and the sealing compound can enter into the placing groove through the through hole.
In this embodiment, the buffer component is a component that buffers the crystal packaging mold.
As shown in fig. 1, the buffer assembly includes two dampers 401 fixedly installed at the inner bottom wall of the cooling tank 201, a spring 402 positioned at the outer side of the dampers 401 is fixedly installed at the inner bottom wall of the cooling tank 201, and a buffer pad 403 is fixedly installed at the bottom of the upper mold 304.
Wherein, the buffer pad 403 is fixedly connected to the inner top wall of the bottom placement groove of the upper mold 304, and when leaching is packaged, the buffer pad 403 can buffer the top of the crystal, so as to prevent the crystal from being damaged due to different heights of the crystal.
In addition, the top of the spring 402 is fixedly connected with the bottom of the lower die 305, when the crystal height is higher than the sum of the heights of the two placing grooves in packaging, the lower die 305 is pressed downwards when the upper die 304 moves downwards, the lower die 305 presses the damper 401 and the spring 402, and the crystal inside the placing grooves can be prevented from being damaged by pressing.
The working principle of the embodiment is as follows:
when the crystal packaging die with the cooling structure is used, crystals are placed in the placing groove, the air cylinder 303 is started, a piston rod of the air cylinder 303 drives the upper die 304 to move downwards until the bottom of the upper die 304 is abutted against the top of the lower die 305, sealing glue is poured into the placing groove from the through hole, at the moment, the water pump 206 is started, the water pump 206 sends cooling water in the water tank 203 into the water inlet pipe 208 through the connecting pipe, the cooling water in the water inlet pipe 208 enters the water collecting cavity 202 and is sprayed out through the water spraying pipe 209, the upper die 304 and the lower die 305 are cooled, the packaged crystals are cooled, then the cooling water subjected to heat exchange enters the water tank 203 again through the water outlet pipe 207, and the cooling water is filtered by the filter plate 204 and cooled by the cooling pipe 205 for recycling.
The electrical components appearing herein are all electrically connected with the master controller and the power supply, the master controller can be a conventional known device for controlling a computer and the like, and the prior art of power connection is not described in detail herein.
It should be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. Crystal packaging mould with cooling structure, including base (1), its characterized in that: a cooling assembly is arranged above the base (1), a die assembly is arranged above the cooling assembly, and a buffer assembly is arranged above the cooling assembly;
the cooling assembly comprises a cooling tank (201) fixedly mounted at the top of a base (1), a water collecting cavity (202) is formed in the cooling tank (201), a water tank (203) located at the right side of the cooling tank (201) is fixedly mounted at the top of the base (1), a filter plate (204) is movably mounted in the water tank (203), a cooling pipe (205) located at the right side of the filter plate (204) is fixedly mounted in the water tank (203), a water pump (206) located at the right side of the water tank (203) is fixedly mounted at the top of the base (1), a water outlet pipe (207) is communicated at the right side of the cooling tank (201), a water inlet pipe (208) penetrating through and extending to the left side of the cooling tank (201) is communicated at the left side of the water collecting cavity (202), and a plurality of evenly distributed water spraying pipes (209) are fixedly mounted on the inner side wall of the cooling tank (201).
2. The die for crystal packaging with cooling structure according to claim 1, wherein: the mold assembly comprises upright rods (301) fixedly installed on the left side and the right side of the top of the cooling groove (201), a top plate (302) is fixedly installed between the tops of the two upright rods (301), an air cylinder (303) is fixedly installed at the bottom of the top plate (302), an upper mold (304) is fixedly installed on a piston rod of the air cylinder (303), and a lower mold (305) is movably installed in the cooling groove (201).
3. The die for crystal packaging with cooling structure according to claim 2, wherein: the buffer assembly comprises two dampers (401) fixedly arranged on the inner bottom wall of the cooling groove (201), a spring (402) positioned on the outer side of the damper (401) is fixedly arranged on the inner bottom wall of the cooling groove (201), and a buffer pad (403) is fixedly arranged at the bottom of the upper die (304).
4. The die for crystal packaging with cooling structure according to claim 1, wherein: the top of the water tank (203) is hinged with a box door through a pin shaft, the front and the back of the filter plate (204) are fixedly provided with sliding blocks, and the front and the back side walls of the inner cavity of the water tank (203) are provided with sliding grooves which are in sliding connection with the sliding blocks.
5. The die for crystal packaging with cooling structure according to claim 1, wherein: the right end of the water outlet pipe (207) is communicated with the left side of the water tank (203), and a connecting pipe with one end communicated with the water inlet of the water pump (206) is communicated with the right side of the water tank (203).
6. The die for crystal packaging with cooling structure according to claim 1, wherein: one end of the water inlet pipe (208) far away from the water collecting cavity (202) is communicated with a water outlet of the water pump (206), and one end of the water spraying pipe (209) far away from the inner side of the cooling groove (201) is communicated with the water collecting cavity (202).
7. A die for crystal encapsulation having a cooling structure according to claim 3, wherein: the opposite sides of the upper die (304) and the lower die (305) are respectively provided with a placing groove, the buffer pad (403) is fixedly connected to the inner top wall of the placing groove at the bottom of the upper die (304), and the top of the spring (402) is fixedly connected with the bottom of the lower die (305).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322047078.6U CN220763220U (en) | 2023-08-01 | 2023-08-01 | Crystal packaging mould with cooling structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322047078.6U CN220763220U (en) | 2023-08-01 | 2023-08-01 | Crystal packaging mould with cooling structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220763220U true CN220763220U (en) | 2024-04-12 |
Family
ID=90616082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322047078.6U Active CN220763220U (en) | 2023-08-01 | 2023-08-01 | Crystal packaging mould with cooling structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220763220U (en) |
-
2023
- 2023-08-01 CN CN202322047078.6U patent/CN220763220U/en active Active
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| GR01 | Patent grant |