CN220753001U - Display module and display device - Google Patents

Abstract

The application belongs to the display field, concretely relates to display module assembly and display device, the display module assembly includes drain pan, lamp plate, light emitting chip and heat insulating pad, the drain pan includes the bottom plate and encircles the curb plate that the bottom plate set up, the curb plate includes the supporting part, the lamp plate sets up the supporting part is kept away from bottom plate one side, a plurality of light emitting chip sets up along row direction and row direction the lamp plate is kept away from bottom plate one side, the heat insulating pad sets up the supporting part with between the lamp plate. Through the heat insulating pad thermal insulation, the side plate direct contact of the lamp panel and the bottom shell is avoided, so that the heat dissipation efficiency of the light emitting chips in the edge area of the lamp panel is the same or nearly the same as that of the light emitting chips in other areas, the problem that the display brightness of the light emitting chips in the different areas is inconsistent due to the heat dissipation efficiency is solved, and the display quality is effectively improved.

Description

Display module and display device

Technical Field

The application belongs to the field of display, and particularly relates to a display module and a display device.

Background

The LED (Lighting Emitting Diode, light emitting diode) display screen has the characteristics of high light emitting brightness, high light emitting efficiency, bright color, high contrast, short response time, wide working temperature range, low energy consumption and the like, and is widely applied to commercial display equipment such as stage display equipment, advertisement display equipment, data visualization display equipment and the like.

The LED display screen comprises a display module, wherein the display module is a core of the LED display screen and directly affects the display quality of the LED display screen. The display module assembly includes lamp plate, light emitting chip and drain pan, and a plurality of light emitting chips set up on the lamp plate along row direction and row direction interval, and the lamp plate sets up in the drain pan. The peripheral area of the lamp panel contacts the bottom shell.

The existing display module, the drain pan is die-casting metal drain pan, the lamp plate is PCBA (Printed Circuit Board Assembly) base plate. The heat dissipation speed of the die-casting metal bottom shell is high, the heat dissipation speed of the contact area of the PCBA substrate and the die-casting metal bottom shell is relatively low, the temperature of the PCBA substrate in different areas is different, and the display color of the light-emitting chips in different areas is inconsistent. A circle of white frame is displayed around the display module, and the display quality of the display module and the LED display screen is affected.

Disclosure of Invention

An object of the present utility model is to provide a display module and a display device, so as to improve the display quality of the display module.

In order to achieve the above object, the present application provides a display module, including:

a bottom chassis including a bottom plate and a side plate disposed around the bottom plate, the side plate including a supporting portion;

the lamp panel is arranged on one side of the supporting part far away from the bottom plate;

the light emitting chips are arranged on one side, far away from the bottom plate, of the lamp panel along the row direction and the column direction;

and the heat insulation pad is arranged between the supporting part and the lamp panel.

Optionally, the display module assembly further includes a bracket assembly, the bracket assembly is disposed between the lamp panel and the bottom plate, the bracket assembly is located in an area surrounded by the side plates, and the heat insulation pad is integrally connected with the bracket assembly.

Optionally, the support assembly includes a plurality of support units, the heat insulating mattress is a plurality of and one-to-one with the support unit is connected.

Optionally, the heat insulation pad includes main part and connecting portion, the main part encircles the support unit sets up, the orthographic projection of support unit on the lamp plate is located the main part is in the orthographic projection on the lamp plate, connecting portion connect the main part with the support unit, at least the main part is thermal-insulated structure.

Optionally, the supporting portion and the main body portion are both ring structures, and the ring width of one side of the supporting portion far away from the bottom plate is smaller than that of the main body portion.

Optionally, the side plate further includes a positioning table, the positioning table is disposed on one side of the support portion away from the bottom plate, and the positioning table is located between adjacent heat insulation pads.

Optionally, the display module further includes an encapsulating layer, where the encapsulating layer is disposed on a side of the lamp panel away from the bottom plate, the encapsulating layer is located in a peripheral area of the light emitting chip, and at least a light emitting surface of the light emitting chip is exposed out of the encapsulating layer;

the positioning table is in contact with the main body of the heat insulation pad.

Optionally, the side plate further includes a frame portion, the frame portion with the supporting portion is connected, the frame portion encircles the lamp plate sets up, the frame portion with the interval sets up between the lamp plate.

Optionally, the display module assembly further includes a potting layer, the potting layer is disposed on one side of the lamp panel away from the bottom plate and in a gap between the frame portion and the lamp panel, the potting layer is located in a peripheral area of the light emitting chip, and at least a light emitting surface of the light emitting chip is exposed out of the potting layer.

The application also provides a display device, comprising:

the display module;

and the driving module is connected with the display module.

The display module and the display device disclosed by the application have the following beneficial effects:

in this application, the display module assembly includes: the bottom shell comprises a bottom plate and side plates surrounding the bottom plate, the side plates comprise supporting portions, the lamp plates are arranged on one side, far away from the bottom plate, of the supporting portions, the plurality of light-emitting chips are arranged on one side, far away from the bottom plate, of the lamp plates along the row direction and the column direction, and the heat insulation pad is arranged between the supporting face of the supporting portions and the lamp plates. Through the heat insulating pad thermal insulation, the side plate direct contact of the lamp panel and the bottom shell is avoided, so that the heat dissipation efficiency of the light emitting chips in the edge area of the lamp panel is the same or nearly the same as that of the light emitting chips in other areas, the problem that the display brightness of the light emitting chips in the different areas is inconsistent due to the heat dissipation efficiency is solved, and the display quality is effectively improved. Other features and advantages of the present application will be apparent from the following detailed description, or may be learned in part by the practice of the application.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application. It is apparent that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained from these drawings without inventive effort for a person of ordinary skill in the art.

Fig. 1 is a schematic structural diagram of a display module according to an embodiment of the disclosure.

Fig. 2 is an enlarged view of the display module at the position a in fig. 1.

Fig. 3 is a schematic structural view of a bracket assembly according to an embodiment of the present application.

Fig. 4 is a schematic structural view of a rack unit in the embodiment of the present application.

Fig. 5 is a schematic structural view of another bracket assembly according to an embodiment of the present application.

Fig. 6 is a schematic view of the positional relationship of the stand unit and the positioning table in the embodiment of the present application.

Reference numerals illustrate:

100. a bottom case; 110. a bottom plate; 111. a second positioning column; 120. a side plate; 121. a support part; 122. a positioning table; 123. a frame portion; 130. reinforcing ribs;

200. a lamp panel; 210. a first via;

300. a light emitting chip;

400. a heat insulating mat; 410. a main body portion; 411. a relief groove; 420. a connection part;

500. a bracket assembly; 510. a stand unit; 511. a first positioning column.

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments may be embodied in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art.

Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the present application. One skilled in the relevant art will recognize, however, that the aspects of the application can be practiced without one or more of the specific details, or with other methods, components, devices, steps, etc. In other instances, well-known methods, devices, implementations, or operations are not shown or described in detail to avoid obscuring aspects of the application.

The present application is further described in detail below with reference to the drawings and specific examples. It should be noted that the technical features of the embodiments of the present application described below may be combined with each other as long as they do not collide with each other. The embodiments described below by referring to the drawings are exemplary and intended for the purpose of explaining the present application and are not to be construed as limiting the present application.

Referring to fig. 1 and 2, the display module in this embodiment includes: the light emitting device includes a bottom chassis 100, a lamp panel 200, a light emitting chip 300, and a heat insulating pad 400. The bottom chassis 100 includes a bottom plate 110 and side plates 120 disposed around the bottom plate 110. The bottom plate 110 is of a rectangular structure, and the side plates 120 are of a rectangular frame structure surrounding the bottom plate 110, for example. The side plate 120 includes a supporting portion 121, and a side of the supporting portion 121 away from the bottom plate 110 is a supporting surface. The bottom shell 100 can be formed by die casting a metal material, and the bottom shell 100 formed by die casting the metal material has the advantages of good heat dissipation, high flatness, high strength and the like.

The lamp panel 200 is disposed on a side of the support portion 121 away from the base plate 110, and the lamp panel 200 includes a PCBA substrate, a glass substrate, and the like. The plurality of light emitting chips 300 are disposed at a side of the lamp panel 200 remote from the base plate 110 in the row and column directions. The light emitting chip 300 includes an LED chip. The heat insulating mat 400 is disposed between the support surface of the support portion 121 and the lamp panel 200. In addition, the display module may further include a driving unit disposed on a side of the lamp panel 200 away from the light emitting chip 300, for driving the light emitting chip 300 to display a picture.

It should be noted that, the bottom case 100 may be formed by die casting a metal material, but the present utility model is not limited thereto, and the bottom case 100 may be made of other materials and other processes, as the case may be. The light emitting chip 300 may include an LED chip, but is not limited thereto, and the light emitting chip 300 may also include a Mini/Micro LED chip, etc., as the case may be.

The display module includes a bottom case 100, and there is a certain difference between the heat conduction speed of the bottom case 100 and the heat conduction speed of the air made of different materials. The contact area between the lamp panel 200 and the bottom shell 100 can dissipate heat by the bottom shell 100, the heat dissipation is relatively fast, the heat dissipation between the lamp panel 200 and the contact area not contacting the bottom shell 100 is realized through air, the heat dissipation is relatively slow, the temperatures of the lamp panels 200 in different areas are different, and the brightness of the light emitting chips 300 in different areas is further inconsistent. A circle of white frame is displayed around the display module, and the display quality of the display module and the LED display screen is affected.

In this embodiment, the display module includes: the bottom case 100 includes a bottom plate 110 and a side plate 120 disposed around the bottom plate 110, the side plate 120 includes a supporting portion 121, the lamp plate 200 is disposed at a side of the supporting portion 121 away from the bottom plate 110, the plurality of light emitting chips 300 are disposed at a side of the lamp plate 200 away from the bottom plate 110 in a row direction and a column direction, and the heat insulation pad 400 is disposed between a supporting surface of the supporting portion 121 and the lamp plate 200. Through the heat insulation of the heat insulation pad 400, the direct contact between the lamp panel 200 and the side plate 120 of the bottom shell 100 is avoided through the heat insulation of the heat insulation pad 400, so that the heat dissipation efficiency of the edge area of the lamp panel 200 is the same or nearly the same as that of the light emitting chips 300 in other areas, the problem that the display brightness of the light emitting chips 300 in the different areas is inconsistent due to the heat dissipation efficiency is solved, and the display quality is effectively improved.

Referring to fig. 2 to 3, the display module further includes a bracket assembly 500, and the bracket assembly 500 is disposed between the lamp panel 200 and the base plate 110. The bracket assembly 500 is located in the area surrounded by the side plates 120, and the heat insulation pad 400 is integrally connected with the bracket assembly 500. The bracket assembly 500 can be made of engineering plastics, the heat insulation pad 400 is integrally connected with the bracket assembly 500, and the heat insulation pad 400 can also be made of engineering plastics.

The bracket assembly 500 is disposed in the bottom case 100 and is used for supporting the lamp panel 200, the heat insulation pad 400 is integrally connected with the bracket assembly 500, and the heat insulation pad 400 and the bracket assembly 500 can be synchronously manufactured by adopting the same process, so that the manufacturing cost of the heat insulation pad 400 and the bracket assembly 500 is reduced.

It should be noted that, the heat insulation pad 400 and the bracket assembly 500 may be integrally connected, but not limited thereto, the heat insulation pad 400 and the bracket assembly 500 may be assembled and connected, i.e. the heat insulation pad 400 and the bracket assembly 500 may be manufactured separately and assembled together, as the case may be. The heat insulation pad 400 and the bracket assembly 500 are assembled and connected, and the heat insulation pad 400 and the bracket assembly 500 may be made of different materials.

Referring to fig. 2 to 4, the bracket assembly 500 includes a plurality of bracket units 510, and the insulation pads 400 are connected to the bracket units 510 in a one-to-one correspondence. That is, the bracket assembly 500 can be split into a plurality of bracket units 510 to be manufactured respectively, and the plurality of bracket units 510 are assembled into the bracket assembly 500. The heat insulation pad 400 is integrally connected with the holder unit 510. The support unit 510 may be made of engineering plastic, the heat insulation pad 400 is integrally connected with the support unit 510, and the heat insulation pad 400 may also be made of engineering plastic.

The bottom plate 110 may be provided with a plurality of reinforcing ribs 130 near one side of the lamp panel 200, the reinforcing ribs 130 are connected with the opposite side plates 120, and the bracket unit 510 may be disposed in an area surrounded by the reinforcing ribs 130 and the side plates 120. The reinforcing ribs 130 may enhance the structural strength of the bottom chassis 100 on one hand, and may serve as a stopper of the stand unit 510 on the other hand.

The bracket unit 510 includes first positioning columns 511, the first positioning columns 511 are arranged at intervals along the row direction and the column direction, the lamp panel 200 includes first through holes 210, the first positioning columns 511 are inserted into the first through holes 210, and the number and positions of the first through holes 210 and the first positioning columns 511 are set according to the spacing between the light emitting chips 300 on the lamp panel 200. For example, for a lamp panel 200 having a pitch of 10mm for both the row-direction and column-direction light emitting chips 300, the holder unit 510 includes 5 rows and 4 columns of first positioning posts 511 arranged in an array.

The bracket assembly 500 is a rectangular frame and is a plastic piece, and when the bracket assembly 500 adopts an integrated structure, the bracket assembly 500 is difficult to manufacture and easy to deform, so that the display module assembly is difficult. The bracket assembly 500 is designed into a split structure, the manufacturing difficulty of a single bracket unit 510 is low, the deformation is small, and the assembly difficulty of the display module and the manufacturing cost of the display module can be reduced.

It should be noted that, the bracket assembly 500 may be split into a plurality of bracket units 510, but the bracket assembly 500 is not limited thereto, and the bracket assembly 500 may also be in an integral structure, i.e. the plurality of bracket units 510 are integrally connected, as the case may be.

Referring to fig. 5, for a lamp panel 200 having a pitch of 4.4mm for both the row-direction and column-direction light emitting chips 300, the holder unit 510 includes 7 rows and 6 columns of first positioning posts 511 arranged in an array. That is, the bottom chassis 100 may mount different types of bracket assemblies 500 to adapt to the lamp panels 200 of different pitches of the light emitting chips 300.

The bottom shell 100 is an integral body and is manufactured by adopting metal material die-casting forming and other modes, and the bracket component 500 can be split into a plurality of bracket units 510 to be manufactured respectively, so that the manufacturing cost of the bottom shell 100 is higher than that of the bracket component 500, and the bottom shell 100 can be adapted to different bracket components 500, thereby being beneficial to improving the universality of the bottom shell 100 and reducing the manufacturing cost of the display module.

Referring to fig. 2 to 4, the heat insulation pad 400 includes a body portion 410 and a connection portion 420, the body portion 410 is disposed around a bracket unit 510, and an orthographic projection of the bracket unit 510 on the lamp panel 200 is located within an orthographic projection of the body portion 410 on the lamp panel 200. The connection part 420 connects the body part 410 and the holder unit 510. At least the body portion 410 is an insulating structure, that is, at least the body portion 410 is made of plastic that can insulate heat. When the heat insulating mat 400 and the holder unit 510 are integrally connected, both the heat insulating mat 400 and the holder unit 510 are made of plastic capable of insulating heat.

The heat insulation pad 400 includes a main body portion 410 and a connection portion 420, the main body portion 410 is disposed around the bracket unit 510, the connection portion 420 connects the main body portion 410 and the bracket unit 510, when the bracket unit 510 is disposed in an area surrounded by the side plates 120, the main body portion 410 is located on the supporting portion 121 of the side plate 120, and separates the bottom shell 100 from the light panel 200, so that the temperatures of the light panel 200 and the light emitting chip 300 in different areas are equal or close to each other, the problem of inconsistent display colors of the light emitting chips 300 in different areas is improved, and further the display quality of the display module is improved.

Referring to fig. 2 to 4, the supporting portion 121 and the body portion 410 are both ring structures, and the ring width of the supporting portion 121 on the side away from the bottom plate 110 is smaller than that of the body portion 410.

The ring width of the support portion 121 at the side far away from the bottom plate 110 is smaller than that of the main body portion 410, so that the main body portion 410 can better separate the support portion 121 and the lamp panel 200 of the side plate 120, heat dissipation of the lamp panel 200 through the support portion 121 is reduced or avoided, and the temperatures of the lamp panel 200 and the light emitting chip 300 in different areas are equal or close.

Referring to fig. 6, the side plate 120 further includes a positioning table 122, and the positioning table 122 is disposed on a side of the supporting portion 121 away from the bottom plate 110. The positioning stage 122 is positioned between adjacent insulation pads 400.

The positioning table 122 is located between adjacent heat insulation pads 400, and the heat insulation pads 400 are integrally connected with the support unit 510, that is, the heat insulation pads 400 and the support unit 510 can be limited by the positioning table 122.

Referring to fig. 6, the display module further includes an encapsulating layer disposed on a side of the lamp panel 200 away from the bottom plate 110. The encapsulating layer is located in the peripheral area of the light emitting chip 300, the side surface of the light emitting chip 300 is contacted with the encapsulating layer, and at least the light emitting surface of the light emitting chip 300 is exposed out of the encapsulating layer. That is, the light emitting chip 300 is buried in the potting layer, and the light emitting surface of the light emitting chip 300 is exposed to the potting layer. The positioning table 122 is in contact with the body portion 410 of the insulation blanket 400. The potting layer is made of black potting adhesive so as to realize an integral black effect.

The positioning table 122 is located between the adjacent heat insulation pads 400, and the positioning table 122 is in contact with the main body portion 410 of the heat insulation pad 400, so that the black pouring sealant can be prevented from penetrating to the side, away from the light emitting chip 300, of the lamp panel 200 through the gap between the adjacent heat insulation pads 400.

It should be noted that, the positioning table 122 is located between adjacent heat insulation pads 400, and the positioning table 122 is in contact with the main body portion 410 of the heat insulation pad 400, but not limited thereto, and the positioning table 122 and the main body portion 410 of the heat insulation pad 400 may be in a small clearance fit, as the case may be. Since the black potting adhesive has a certain viscosity, the viscous resistance can also prevent the black potting adhesive from penetrating to the side of the lamp panel 200 away from the light emitting chip 300 when the positioning table 122 is matched with the main body portion 410 of the heat insulation pad 400 with a small gap. Meanwhile, the positioning table 122 is in small clearance fit with the main body portion 410 of the heat insulation pad 400, so that the assembly difficulty of the heat insulation pad 400 and the bracket unit 510 is smaller, and the manufacturing cost of the display module can be reduced.

Referring to fig. 2 to 6, the base plate 110 is provided with second positioning columns 111, and the second positioning columns 111 are disposed between adjacent heat insulation mats 400. The second positioning column 111 is a cylinder with a threaded hole in the middle. The outer side of the main body portion 410 of the heat insulation pad 400 is provided with an arc-shaped abdication groove 411, and the second positioning column 111 is located in an area surrounded by the abdication grooves 411 of two adjacent heat insulation pads 400. The lamp panel 200 is provided with a second via hole, and the lamp panel 200 and the second positioning column 111 are connected through a fastener.

The outer side of the main body portion 410 of the heat insulation pad 400 is provided with an arc-shaped abdication groove 411, the abdication groove 411 is matched with the second positioning column 111, and the distance between two adjacent heat insulation pads 400 can be set smaller.

Referring to fig. 2, the side plate 120 further includes a frame portion 123, the frame portion 123 is connected to the supporting portion 121, the frame portion 123 is disposed around the lamp panel 200, and a space is provided between the frame portion 123 and the lamp panel 200.

The frame 123 is disposed around the lamp panel 200, and the lamp panel 200 can be protected by the frame 123. The space between the frame portion 123 and the light panel 200 is designed in such a way that the light panel 200 is prevented from contacting the frame portion 123, and heat dissipation of the light panel 200 through the frame portion 123 is reduced or avoided, so that the temperatures of the light panel 200 and the light emitting chip 300 in different areas are equal or close.

Referring to fig. 2, the display module further includes an encapsulating layer disposed on a side of the lamp panel 200 away from the bottom plate 110. The encapsulating layer is located in the peripheral area of the light emitting chip 300, the side surface of the light emitting chip 300 is contacted with the encapsulating layer, and at least the light emitting surface of the light emitting chip 300 is exposed out of the encapsulating layer. In addition, a potting layer is also provided in the gap between the bezel portion 123 and the lamp panel 200.

The gap between the frame 123 and the lamp panel 200 is filled with the encapsulating layer, so that hard contact between the frame 123 and the lamp panel 200 can be avoided, and meanwhile, the manufacturing difficulty of an encapsulating and gluing process can be reduced.

The application also provides a display device, and the display device includes display module assembly and drive module, and drive module is connected with the display module assembly. The display module further comprises a driving unit, the driving unit is arranged on one side, away from the light emitting chip 300, of the lamp panel 200, and the driving module is connected with the driving unit of the display module.

The display device includes display module assembly, and display module assembly includes: the bottom case 100 includes a bottom plate 110 and a side plate 120 disposed around the bottom plate 110, the side plate 120 includes a supporting portion 121, the lamp plate 200 is disposed at a side of the supporting portion 121 away from the bottom plate 110, the plurality of light emitting chips 300 are disposed at a side of the lamp plate 200 away from the bottom plate 110 in a row direction and a column direction, and the heat insulation pad 400 is disposed between a supporting surface of the supporting portion 121 and the lamp plate 200. Through the thermal insulation of the thermal insulation pad 400, the lamp panel 200 and the light emitting chip 300 are subjected to air heat dissipation, the temperatures of the lamp panel 200 and the light emitting chip 300 in different areas are equal or close, the problem that the display colors of the light emitting chips 300 in different areas are inconsistent can be solved, and the display module is used in a display device and can improve the display quality of the display device.

The terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In this application, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and the like are to be construed broadly, and may be, for example, fixedly attached, detachably attached, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

In the description of the present specification, reference to the terms "some embodiments," "exemplary," and the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

While embodiments of the present application have been shown and described, it should be understood that the above embodiments are illustrative and not to be construed as limiting the application, and that variations, modifications, alternatives and variations may be made to the embodiments by one of ordinary skill in the art within the scope of the application, and therefore all changes and modifications that fall within the spirit and scope of the utility model as defined by the claims and the specification of the application are intended to be covered thereby.

Claims (10)

1. A display module, comprising:

a bottom chassis including a bottom plate and a side plate disposed around the bottom plate, the side plate including a supporting portion;

the lamp panel is arranged on one side of the supporting part far away from the bottom plate;

the light emitting chips are arranged on one side, far away from the bottom plate, of the lamp panel along the row direction and the column direction;

and the heat insulation pad is arranged between the supporting part and the lamp panel.

2. The display module of claim 1, further comprising a bracket assembly disposed between the light panel and the bottom panel, the bracket assembly being positioned within the area enclosed by the side panels, the heat insulating mat being integrally connected with the bracket assembly.

3. The display module of claim 2, wherein the bracket assembly comprises a plurality of bracket units, and the heat insulation pads are connected with the bracket units in a one-to-one correspondence.

4. A display module according to claim 3, wherein the heat insulating pad comprises a main body portion and a connecting portion, the main body portion is disposed around the stand unit, the orthographic projection of the stand unit on the lamp panel is located in the orthographic projection of the main body portion on the lamp panel, the connecting portion connects the main body portion and the stand unit, and at least the main body portion is a heat insulating structural member.

5. The display module assembly of claim 4, wherein the support portion and the main body portion are both ring structures, and a ring width of a side of the support portion away from the bottom plate is smaller than a ring width of the main body portion.

6. The display module assembly of claim 4, wherein the side panels further comprise a positioning table disposed on a side of the support portion remote from the base panel, the positioning table being positioned between adjacent ones of the insulation pads.

7. The display module of claim 6, further comprising a potting layer disposed on a side of the lamp panel away from the base plate, the potting layer being located in a peripheral region of the light emitting chip, at least a light exit surface of the light emitting chip being exposed to the potting layer;

the positioning table is in contact with the main body of the heat insulation pad.

8. The display module assembly of claim 1, wherein the side panel further comprises a frame portion, the frame portion is connected to the support portion, the frame portion is disposed around the light panel, and the frame portion is disposed at an interval from the light panel.

9. The display module of claim 8, further comprising a potting layer disposed in a gap between the bezel and on a side of the bezel facing away from the base plate, the potting layer being located in a peripheral region of the light emitting chip, at least a light exit surface of the light emitting chip exposing the potting layer.

10. A display device, comprising:

the display module of any one of claims 1-9;

and the driving module is connected with the display module.