CN220751793U - Semiconductor device testing apparatus - Google Patents
Semiconductor device testing apparatus Download PDFInfo
- Publication number
- CN220751793U CN220751793U CN202321366935.2U CN202321366935U CN220751793U CN 220751793 U CN220751793 U CN 220751793U CN 202321366935 U CN202321366935 U CN 202321366935U CN 220751793 U CN220751793 U CN 220751793U
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- Prior art keywords
- bottom plate
- mounting
- block
- semiconductor device
- screw rod
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- 238000012360 testing method Methods 0.000 title claims abstract description 49
- 239000004065 semiconductor Substances 0.000 title claims abstract description 21
- 230000002457 bidirectional effect Effects 0.000 claims description 17
- 238000009864 tensile test Methods 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 2
- 238000001514 detection method Methods 0.000 abstract description 5
- 238000012423 maintenance Methods 0.000 abstract description 5
- 238000001125 extrusion Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000008602 contraction Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model discloses a semiconductor element testing device, which is characterized in that two moving blocks are arranged, a tension meter is fixedly arranged at the top of one moving block, a testing block is arranged at the top of the other moving block, pins of a diode to be tested are respectively connected with the tension meter and clamping pieces of the testing block, a bottom plate is arranged at the top end of a placing table, a plurality of mounting columns are arranged on the lower surface of the bottom plate, grooves are arranged on the circumferential side walls of the mounting columns, a plurality of mounting grooves for embedding the mounting columns are arranged on the upper surface of the placing table, a containing groove is respectively arranged on two opposite inner walls of the mounting groove, a convex block corresponding to the grooves is arranged in the containing groove, and a spring is arranged between the convex block and the inner wall of the containing groove. The semiconductor element testing device is convenient to detach and install the whole detection mechanism rapidly on the basis of realizing tension test, and improves the convenience of overhaul and maintenance.
Description
Technical Field
The present disclosure relates to testing devices, and particularly to a semiconductor device testing device.
Background
Diodes and triodes are the most commonly used semiconductor elements, the biggest characteristics of the diodes and triodes are unidirectional conduction, the diodes and the triodes are acted by rectifying circuits, detecting circuits, voltage stabilizing circuits and various modulating circuits, the diodes are also widely applied to various electronic equipment, the appearance of the diodes is similar to a cylinder, the diodes and the triodes comprise a main body and pins, and the welding tension between the main body and the pins needs to be tested after the diode and the triodes are manufactured to meet the requirements. In general, the diode and triode pins are tested by tensile force as follows: the clamping tools are connected to two ends of the semiconductor element, and then the clamping tools at one end are fixed, and the clamping tools at the other end are connected with the dynamometer.
In the existing use process, the tensile testing mechanism needs to be overhauled and maintained after working for a period of time, however, the bottom plate of the semiconductor element tensile testing device is generally fixedly connected with the placing table, and the testing mechanism cannot be disassembled, so that the overhauling process is difficult.
Disclosure of Invention
The utility model aims to provide a semiconductor element testing device which is convenient for rapidly disassembling and installing a detection mechanism on the basis of realizing tension test and improves the convenience of overhaul and maintenance.
In order to achieve the above purpose, the utility model adopts the following technical scheme: a semiconductor device testing apparatus comprising: the device comprises a bottom plate, wherein a tension testing mechanism is fixedly arranged at the top of the bottom plate, the tension testing mechanism further comprises a tension meter and two moving blocks, the tension meter is fixedly arranged at the top of one moving block, a testing block is arranged at the top of the other moving block, and pins of a diode to be tested are respectively connected with the tension meter and clamping pieces of the testing blocks;
the bottom plate sets up the top at a place the platform, the lower surface of bottom plate is provided with a plurality of erection column, and is provided with the recess on the circumference lateral wall of erection column the mounting groove that a plurality of confession erection column embedding was installed is seted up to the upper surface of placing the platform, and has seted up a storage tank respectively on two inner walls that this mounting groove is relative, is provided with a lug that corresponds complex with the recess in the inside of this storage tank, be provided with a spring between lug and the storage tank inner wall.
The further improved scheme in the technical scheme is as follows:
1. in the scheme, the two ends of the top of the bottom plate are respectively provided with one mounting plate, a bidirectional screw rod is rotationally connected between the two mounting plates, the two ends of the bidirectional screw rod are respectively sleeved with the moving block, and threads at the two ends of the bidirectional screw rod are opposite in screwing direction.
2. In the scheme, the motor is fixedly arranged on the side wall of one mounting plate, and an output shaft of the motor is fixedly connected with the bidirectional screw rod.
3. In the scheme, a chute is formed in the upper surface of the bottom plate and parallel to the bidirectional screw rod, and the lower end of the moving block is embedded in the chute.
4. In the scheme, the mounting columns are arranged in four and are respectively positioned at the corners of the lower surface of the bottom plate.
Due to the application of the technical scheme, compared with the prior art, the utility model has the following advantages:
the utility model relates to a semiconductor element testing device, which is provided with two moving blocks, wherein the top of one moving block is fixedly provided with a tension meter, the top of the other moving block is provided with a testing block, pins of a diode to be tested are respectively connected with the tension meter and a clamping piece of the testing block, and the tension meter and the testing block are driven to be far away from each other by the moving blocks so as to carry out tension test on the pins of the diode; in addition, the lower surface of its bottom plate is provided with a plurality of erection column, and be provided with the recess on the circumference lateral wall of erection column, set up a plurality of and supply the erection tank of erection column embedding installation at the upper surface of placing the platform, and set up a holding tank respectively on two relative inner walls of this erection tank, be provided with one and recess correspondence complex lug in the inside of this holding tank, be provided with a spring between lug and the holding tank inner wall, through the recess of erection column and the cooperation of lug, can realize the bottom plate and place quick connect, dismantle of platform, thereby be convenient for wholly dismantle, install detection mechanism, the convenience of overhaul, maintenance has been improved.
Drawings
FIG. 1 is a schematic diagram of a semiconductor device testing apparatus according to the present utility model;
FIG. 2 is an enlarged view of the utility model at A of FIG. 1;
FIG. 3 is a schematic view showing a partial cross-sectional structure of a semiconductor device testing apparatus according to the present utility model;
fig. 4 is an enlarged view of fig. 3 at B in accordance with the present utility model.
In the above figures: 1. a bottom plate; 2. a tension testing mechanism; 3. a placement table; 4. a mounting column; 5. a mounting groove; 6. a receiving groove; 7. a spring; 8. a bump; 9. a groove; 10. a tension meter; 11. a moving block; 12. a bidirectional screw rod; 13. a mounting plate; 14. a test block; 15. a clamping member; 16. a motor; 17. and a sliding groove.
Description of the embodiments
The present patent will be further understood by the specific examples given below, which are not intended to be limiting.
Example 1: a semiconductor device testing apparatus comprising: the device comprises a bottom plate 1, wherein a tension testing mechanism 2 is fixedly arranged at the top of the bottom plate 1, the tension testing mechanism 2 further comprises a tension meter 10 and two moving blocks 11, the tension meter 10 is fixedly arranged at the top of one moving block 11, a testing block 14 is arranged at the top of the other moving block 11, and pins of a diode to be tested are respectively connected with clamping pieces 15 of the tension meter 10 and the testing block 14;
the bottom plate 1 is arranged at the top end of a placing table 3, a plurality of mounting columns 4 are arranged on the lower surface of the bottom plate 1, grooves 9 are formed in the circumferential side walls of the mounting columns 4, a plurality of mounting grooves 5 for embedding the mounting columns 4 into the placing table 3 are formed in the upper surface of the placing table 3, a containing groove 6 is formed in two opposite inner walls of the mounting groove 5 respectively, a protruding block 8 which is correspondingly matched with the grooves 9 is arranged in the containing groove 6, and a spring 7 is arranged between the protruding block 8 and the inner wall of the containing groove 6;
inserting the erection column in the mounting groove, making erection column extrusion lug shrink in to the shrink groove, the lug extrusion spring, when the tongue of erection column removes the position of lug, the erection column no longer carries out effort to the lug, and the lug inserts in the tongue under the restoring effort of spring, carries out spacingly to the erection column, and accomplishes the fixed to the bottom plate, makes things convenient for personnel to install fixedly to the bottom plate on placing the bench through this mechanism.
The two ends of the top of the bottom plate 1 are respectively provided with a mounting plate 13, a bidirectional screw rod 12 is rotatably connected between the two mounting plates 13, the two ends of the bidirectional screw rod 12 are respectively sleeved with the moving block 11, and the threads at the two ends of the bidirectional screw rod 12 are opposite in screwing direction.
A motor 16 is fixedly mounted on a side wall of one of the mounting plates 13, and an output shaft of the motor 16 is fixedly connected with the bi-directional screw 12.
The four mounting posts 4 are provided and are located at corners of the lower surface of the base plate 1.
When the protruding block 8 is embedded in the groove 9, the spring 7 is in a compressed state, the bottom plate is pulled upwards, the mounting column extrudes the protruding block to shrink in the shrinkage groove, and the protruding block extrudes the spring, so that the mounting column can slide out upwards along the mounting groove, and the bottom plate and the placing table can be separated quickly.
Example 2: a semiconductor device testing apparatus comprising: the device comprises a bottom plate 1, wherein a tension testing mechanism 2 is fixedly arranged at the top of the bottom plate 1, the tension testing mechanism 2 further comprises a tension meter 10 and two moving blocks 11, the tension meter 10 is fixedly arranged at the top of one moving block 11, a testing block 14 is arranged at the top of the other moving block 11, and pins of a diode to be tested are respectively connected with clamping pieces 15 of the tension meter 10 and the testing block 14;
the moving block drives the tension meter and the testing block to be far away from each other so as to carry out tension test on the diode pins; and the bottom plate can be quickly connected and detached with the placing table through the matching of the grooves and the convex blocks of the mounting columns, so that the detection mechanism is convenient to quickly detach and mount integrally, and the convenience of overhaul and maintenance is improved.
The bottom plate 1 sets up the top at a platform 3 of placing, the lower surface of bottom plate 1 is provided with a plurality of erection column 4, and is provided with recess 9 on the circumference lateral wall of erection column 4 the mounting groove 5 that a plurality of confession erection column 4 embedding was installed has been seted up to the upper surface of placing the platform 3, and has seted up a holding groove 6 respectively on two relative inner walls of this mounting groove 5, is provided with a lug 8 that corresponds complex with recess 9 in the inside of this holding groove 6, be provided with a spring 7 between lug 8 and the holding groove 6 inner wall.
The two ends of the top of the bottom plate 1 are respectively provided with a mounting plate 13, a bidirectional screw rod 12 is rotatably connected between the two mounting plates 13, the two ends of the bidirectional screw rod 12 are respectively sleeved with the moving block 11, and the threads at the two ends of the bidirectional screw rod 12 are opposite in screwing direction.
The upper surface of the base plate 1 is provided with a chute 17 parallel to the bi-directional screw rod 12, and the lower end of the moving block 11 is embedded in the chute 17.
The four mounting posts 4 are provided and are located at corners of the lower surface of the base plate 1.
The bump 8 has an arcuate convex surface.
The working principle is as follows:
when the mounting column is used, the mounting column is inserted into the mounting groove, the mounting column extrudes the protruding block to shrink in the shrinkage groove, the protruding block extrudes the spring, when the protruding groove of the mounting column moves to the position of the protruding block, the mounting column does not apply force to the protruding block, the protruding block is inserted into the protruding groove under the reset force of the spring, the mounting column is limited, the fixation of the bottom plate is completed, and the mounting and fixation of the bottom plate on the placing table are facilitated by personnel through the mechanism;
when the mounting column is disassembled, the bottom plate is pulled upwards, the mounting column extrusion convex block is contracted into the contraction groove, and the convex block extrudes the spring, so that the mounting column can slide out upwards along the mounting groove, and the bottom plate is quickly separated from the placing table.
When the semiconductor element testing device is adopted, the moving block drives the tension meter and the testing block to be far away from each other so as to carry out tension test on the diode pins; and the bottom plate can be quickly connected and detached with the placing table through the matching of the grooves and the convex blocks of the mounting columns, so that the detection mechanism is convenient to quickly detach and mount integrally, and the convenience of overhaul and maintenance is improved.
The above embodiments are provided to illustrate the technical concept and features of the present utility model and are intended to enable those skilled in the art to understand the content of the present utility model and implement the same, and are not intended to limit the scope of the present utility model. All equivalent changes or modifications made in accordance with the spirit of the present utility model should be construed to be included in the scope of the present utility model.
Claims (5)
1. A semiconductor device testing apparatus comprising: the bottom plate (1) the top fixed mounting of bottom plate (1) has a tensile testing mechanism (2), its characterized in that: the tension testing mechanism (2) further comprises a tension meter (10) and two moving blocks (11), wherein the tension meter (10) is fixedly arranged at the top of one moving block (11), a testing block (14) is arranged at the top of the other moving block (11), and pins of a diode to be tested are respectively connected with clamping pieces (15) of the tension meter (10) and the testing block (14);
the bottom plate (1) sets up the top of placing platform (3) in one, the lower surface of bottom plate (1) is provided with a plurality of erection column (4), and is provided with recess (9) on the circumference lateral wall of erection column (4) the mounting groove (5) of a plurality of confession erection column (4) embedding installation have been seted up to the upper surface of placing platform (3), and set up a holding groove (6) respectively on two inner walls that mounting groove (5) are relative here, be provided with one and recess (9) corresponding complex lug (8) in the inside of holding groove (6) here, be provided with a spring (7) between lug (8) and holding groove (6) inner wall.
2. The semiconductor device testing apparatus according to claim 1, wherein: two mounting plates (13) are respectively arranged at two ends of the top of the bottom plate (1), a bidirectional screw rod (12) is rotatably connected between the two mounting plates (13), the two ends of the bidirectional screw rod (12) are respectively sleeved with the moving block (11), and threads at two ends of the bidirectional screw rod (12) are opposite in rotation direction.
3. The semiconductor device testing apparatus according to claim 2, wherein: a motor (16) is fixedly arranged on the side wall of one mounting plate (13), and an output shaft of the motor (16) is fixedly connected with the bidirectional screw rod (12).
4. The semiconductor device testing apparatus according to claim 2, wherein: a chute (17) is arranged on the upper surface of the bottom plate (1) and parallel to the bidirectional screw rod (12), and the lower end of the moving block (11) is embedded in the chute (17).
5. The semiconductor device testing apparatus according to claim 1, wherein: the mounting columns (4) are arranged in four and are respectively positioned at corners of the lower surface of the bottom plate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321366935.2U CN220751793U (en) | 2023-06-01 | 2023-06-01 | Semiconductor device testing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321366935.2U CN220751793U (en) | 2023-06-01 | 2023-06-01 | Semiconductor device testing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220751793U true CN220751793U (en) | 2024-04-09 |
Family
ID=90569604
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321366935.2U Active CN220751793U (en) | 2023-06-01 | 2023-06-01 | Semiconductor device testing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220751793U (en) |
-
2023
- 2023-06-01 CN CN202321366935.2U patent/CN220751793U/en active Active
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