CN220751503U - Leakage detection device for thin silicon wafer - Google Patents
Leakage detection device for thin silicon wafer Download PDFInfo
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- CN220751503U CN220751503U CN202322630837.1U CN202322630837U CN220751503U CN 220751503 U CN220751503 U CN 220751503U CN 202322630837 U CN202322630837 U CN 202322630837U CN 220751503 U CN220751503 U CN 220751503U
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- helium
- silicon wafer
- leak
- plate
- assembly
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- 238000001514 detection method Methods 0.000 title claims abstract description 50
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 45
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 45
- 239000010703 silicon Substances 0.000 title claims abstract description 45
- 239000001307 helium Substances 0.000 claims abstract description 64
- 229910052734 helium Inorganic materials 0.000 claims abstract description 64
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims abstract description 64
- 238000007789 sealing Methods 0.000 claims abstract description 50
- 238000005507 spraying Methods 0.000 claims abstract description 25
- 238000009423 ventilation Methods 0.000 claims description 6
- 239000007789 gas Substances 0.000 claims description 4
- 239000007921 spray Substances 0.000 abstract description 3
- 238000001819 mass spectrum Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000007847 structural defect Effects 0.000 description 1
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- Examining Or Testing Airtightness (AREA)
Abstract
The utility model discloses a leak detection device of a thin silicon wafer, which relates to the technical field of silicon wafer detection and comprises a helium mass spectrometer leak detector, an evacuating leak detection assembly, a helium spraying assembly and telescopic equipment which are sequentially arranged from bottom to top; the evacuating and leak detecting assembly is used for positioning the silicon wafer, and is communicated with the helium mass spectrometer leak detector, the telescopic equipment is used for pushing the helium spraying assembly to move vertically, when the helium spraying assembly moves downwards to be in sealing fit with the silicon wafer fixed on the evacuating and leak detecting assembly, the sealed silicon wafer is pressed, the helium spraying assembly sprays helium for leak detection, and whether the helium is detected by the helium mass spectrometer leak detector or not is used for judging whether the silicon wafer has a leak hole or not; the utility model can detect whether the leak points exist on the silicon wafer or not quickly and accurately by the helium detection system, and does not damage the performance of the workpiece.
Description
Technical Field
The utility model relates to the technical field of silicon wafer detection, in particular to a leak detection device for a thin silicon wafer.
Background
Solar energy is a clean, efficient and continuously renewable resource that is attractive in replacing traditional energy sources. Solar cells are the fundamental component in solar power generation systems, commonly made of crystalline silicon. In crystalline silicon devices, cell breakage due to microcracking, deterioration on the cell, and shunt areas can cause significant problems and significantly impact the performance of the module. These structural defects may result from challenges encountered in silicon processing, the quality of the crystal lattice, or other external influences. The detection of the traditional imaging method is difficult to detect some tiny leak holes, if the tiny leak holes are not detected, the tiny leak holes flow into the market, and the quality of products is affected.
Disclosure of Invention
The utility model aims to provide a leak detection device for a thin silicon wafer, which solves the problem that a plurality of tiny leak holes are difficult to detect by using a traditional imaging method.
The utility model solves the technical problems by the following technical proposal that the utility model comprises a helium mass spectrometer leak detector, an evacuating leak detection assembly, a helium spraying assembly and a telescopic device which are sequentially arranged from bottom to top; the evacuation leak detection assembly is used for positioning the silicon wafer, the evacuation leak detection assembly is communicated with the helium mass spectrometer leak detector, the telescopic equipment is used for pushing the helium spraying assembly to move vertically, the helium spraying assembly is used for pressing the sealed silicon wafer when being in sealing fit with the silicon wafer fixed on the evacuation leak detection assembly, the helium spraying assembly is used for spraying helium for leak detection, and whether the helium mass spectrometer leak detector detects helium or not to judge whether the silicon wafer has a leak hole or not.
Preferably, the evacuating and leak detecting assembly comprises a detecting base, a supporting plate, a plurality of supporting ribs and a first sealing ring; the supporting plate is arranged in the detecting base, corresponding through holes are formed in the detecting base and the supporting plate, the supporting ribs are arranged on the upper surface of the supporting plate, and the first sealing ring is arranged on the upper surface of the detecting base on the periphery of the supporting plate.
Preferably, the upper surface of the detection base is provided with a sealing groove, and the first sealing ring is arranged in the sealing groove.
Preferably, a connecting pipe corresponding to the through hole is arranged on the lower side of the detection base, and the lower end of the connecting pipe is connected with the helium mass spectrometer leak detector.
Preferably, the helium spraying component comprises a pressing plate, an upper sealing plate and a second sealing ring, wherein the pressing plate is arranged at the telescopic end of the telescopic equipment, the upper sealing plate is arranged at the lower side of the pressing plate, the second sealing ring is arranged on the lower surface of the upper sealing plate, a circular groove is formed in the lower surface of the upper sealing plate, a ventilation channel communicated with the circular groove is formed in the side wall of the upper sealing plate, and a gas pipe joint is arranged at the outer side of the ventilation channel and used for being connected with an external helium device.
Preferably, the telescopic device is an air cylinder or a straight rod motor.
Preferably, the device comprises a device frame, wherein the device frame comprises a bottom plate and a mounting plate which are arranged up and down, a plurality of guide shafts are fixed between the bottom plate and the mounting plate, the telescopic device is arranged on the upper side of the mounting plate, the helium spraying component is slidably arranged on the guide shafts, and the evacuation leakage detection component is arranged on the upper side of the bottom plate.
Compared with the prior art, the utility model has the beneficial effects that: by the helium detection system, whether leakage points exist on the silicon wafer or not can be detected rapidly and accurately, and the performance of a workpiece is not damaged.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic diagram of an exploded view of an evacuated leak detection assembly in accordance with the present utility model;
FIG. 3 is a schematic diagram of an exploded view of a helium spray assembly according to the present utility model;
fig. 4 is a schematic diagram of the front cross-sectional structure of fig. 1.
The figures represent the numbers:
1-evacuating the leak detection assembly; 11-through holes; 12-detecting a base; 13-sealing the groove; 14-a first sealing ring; 15-supporting plates; 16-supporting fillets; 2-a bottom plate; 3-mounting plates; 4-a guide shaft; 51-pressing plate; 52-a linear bearing; 53-upper sealing plate; 54-a second sealing ring; 6-connecting pipes; 7-telescoping device.
Detailed Description
The above and further technical features and advantages of the present utility model are described in more detail below with reference to the accompanying drawings.
Example 1
The embodiment provides a technical scheme: the leak detection device of the thin silicon wafer comprises a helium mass spectrometer leak detector (not shown in the figure), an evacuating leak detection assembly 1, a helium spraying assembly and a telescopic device 7 which are sequentially arranged from bottom to top as shown in figures 1, 3 and 4; the evacuating and leak detecting assembly, the helium spraying assembly and the telescopic equipment 7 are arranged on the upper side of the helium mass spectrum leak detector through the equipment frame, the evacuating and leak detecting assembly 1 is used for positioning a silicon wafer, the evacuating and leak detecting assembly 1 is communicated with the helium mass spectrum leak detector, the telescopic equipment 7 is used for pushing the helium spraying assembly to vertically move, the telescopic equipment 7 is a cylinder or a straight rod motor, and the helium mass spectrum leak detector has the effects of evacuating and detecting helium.
The equipment rack comprises a bottom plate 2 and a mounting plate 3 which are arranged up and down, a plurality of guide shafts 4 are fixed between the bottom plate 2 and the mounting plate 3, telescopic equipment 7 is arranged on the upper side of the mounting plate 3, a helium spraying component is slidably arranged on the guide shafts 4, an evacuating leakage detecting component 1 is arranged on the upper side of the bottom plate 2, and a silicon wafer is fixed on the evacuating leakage detecting component 1 in a vacuumizing mode.
When the helium spraying component moves downwards to be in sealing fit with a silicon wafer fixed on the evacuating and leakage detecting component, the helium spraying component sprays helium to detect leakage, whether the silicon wafer has leakage holes is judged by judging whether the helium is detected by the helium mass spectrometer leakage detector, if the silicon wafer has the leakage holes, the helium can be detected by the helium mass spectrometer leakage detector through the through holes, so that the workpiece is judged to have leakage, otherwise, the workpiece does not have leakage holes.
The helium spraying component comprises a pressing plate 51, an upper sealing plate 53 and a second sealing ring 54, wherein the pressing plate 51 is arranged at the telescopic end of the telescopic equipment 7, the pressing plate 51 is slidably arranged on the guide shaft 4 through a linear bearing 52, the upper sealing plate 53 is arranged at the lower side of the pressing plate 51, a circular groove is formed in the lower surface of the upper sealing plate 53, a ventilation channel communicated with the circular groove is formed in the side wall of the upper sealing plate 53, a gas pipe joint is arranged at the outer side of the ventilation channel and is used for being connected with an external helium device, and the helium device can inject helium into the circular groove;
the second sealing ring 54 is mounted on the lower surface of the upper sealing plate 53, and the second sealing ring 54 protrudes out of the lower side of the upper sealing plate 53 and is located outside the circular groove, and the second sealing ring 54 can ensure tightness between the upper sealing plate 53 and the silicon wafer, so that no air leakage occurs when helium is filled.
Example two
The present embodiment is further optimized based on the foregoing embodiment, and the same parts as the foregoing technical solutions will not be described herein, as shown in fig. 2, further in order to better implement the present utility model, particularly, the following setting manner is adopted: the evacuation leak detection assembly in this embodiment comprises a detection base 12, a support plate 15, a plurality of support ribs 16 and a first sealing ring 14; the detection base 12 is arranged in the detection base 12, the supporting plate 15 is arranged in the detection base 12, the detection base 12 and the supporting plate 15 are provided with corresponding through holes 11, a connecting pipe 6 corresponding to the through holes 11 is arranged on the lower side of the detection base 12, the lower end of the connecting pipe 6 is connected with a helium mass spectrum leak detector, the helium mass spectrum leak detector is used for evacuating and detecting leak, helium is sprayed above a silicon wafer, if the silicon wafer has leak holes, the helium enters the lower side of the silicon wafer through the leak holes, and therefore the silicon wafer is detected by the helium mass spectrum leak detector, namely the silicon wafer is judged to have leak holes;
the support fillets 16 are arranged on the upper surface of the support plate 15, so that the support plate 15 is positioned below the silicon wafer to prevent the silicon wafer from being broken in the process of evacuating, and the whole silicon wafer is supported so as not to be broken due to evacuating;
the first sealing ring 14 is arranged on the upper surface of the detection base 12 on the periphery of the supporting plate 15, the sealing groove 13 is formed in the upper surface of the detection base 12, the first sealing ring 14 is arranged in the sealing groove 13, the sealing property between the silicon wafer and the detection base 12 is ensured by the first sealing ring 14, and the vacuumizing operation can be effectively performed.
The foregoing description of the preferred embodiment of the utility model is merely illustrative of the utility model and is not intended to be limiting. It will be appreciated by persons skilled in the art that many variations, modifications, and even equivalents may be made thereto without departing from the spirit and scope of the utility model as defined in the appended claims.
Claims (7)
1. The utility model provides a thin silicon chip's leak hunting device which characterized in that: the helium mass spectrometer leak detector, the evacuating leak detection assembly, the helium spraying assembly and the telescopic equipment are sequentially arranged from bottom to top; the evacuation leak detection assembly is used for positioning the silicon wafer, the evacuation leak detection assembly is communicated with the helium mass spectrometer leak detector, the telescopic equipment is used for pushing the helium spraying assembly to move vertically, the helium spraying assembly is used for pressing the sealed silicon wafer when being in sealing fit with the silicon wafer fixed on the evacuation leak detection assembly, the helium spraying assembly is used for spraying helium for leak detection, and whether the helium mass spectrometer leak detector detects helium or not to judge whether the silicon wafer has a leak hole or not.
2. The thin silicon wafer leakage detection device according to claim 1, wherein the evacuation leakage detection assembly comprises a detection base, a support plate, a plurality of support fillets and a first sealing ring; the supporting plate is arranged in the detecting base, corresponding through holes are formed in the detecting base and the supporting plate, the supporting ribs are arranged on the upper surface of the supporting plate, and the first sealing ring is arranged on the upper surface of the detecting base on the periphery of the supporting plate.
3. The leak detection device for the thin silicon wafer according to claim 2, wherein a sealing groove is formed in the upper surface of the detection base, and the first sealing ring is arranged in the sealing groove.
4. The leak detection device for the thin silicon wafer according to claim 2, wherein a connecting pipe corresponding to the through hole is arranged on the lower side of the detection base, and the lower end of the connecting pipe is connected with a helium mass spectrometer leak detector.
5. The leak detection device for a thin silicon wafer according to claim 1, wherein the helium spraying component comprises a pressing plate, an upper sealing plate and a second sealing ring, the pressing plate is arranged at the telescopic end of the telescopic equipment, the upper sealing plate is arranged at the lower side of the pressing plate, the second sealing ring is arranged on the lower surface of the upper sealing plate, a circular groove is formed in the lower surface of the upper sealing plate, a ventilation channel communicated with the circular groove is formed in the side wall of the upper sealing plate, a gas pipe joint is arranged at the outer side of the ventilation channel, and the gas pipe joint is used for being connected with an external helium device.
6. The leak detection apparatus for a thin silicon wafer according to claim 1, wherein the telescopic device is a cylinder or a straight rod motor.
7. The thin silicon wafer leakage detection device according to claim 1, further comprising an equipment rack, wherein the equipment rack comprises a bottom plate and a mounting plate which are arranged up and down, a plurality of guide shafts are fixed between the bottom plate and the mounting plate, the telescopic equipment is arranged on the upper side of the mounting plate, the helium spraying assembly is slidably arranged on the guide shafts, and the evacuation leakage detection assembly is arranged on the upper side of the bottom plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322630837.1U CN220751503U (en) | 2023-09-27 | 2023-09-27 | Leakage detection device for thin silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322630837.1U CN220751503U (en) | 2023-09-27 | 2023-09-27 | Leakage detection device for thin silicon wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220751503U true CN220751503U (en) | 2024-04-09 |
Family
ID=90564003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322630837.1U Active CN220751503U (en) | 2023-09-27 | 2023-09-27 | Leakage detection device for thin silicon wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220751503U (en) |
-
2023
- 2023-09-27 CN CN202322630837.1U patent/CN220751503U/en active Active
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