CN220739732U - Device is changed to solder paste dish for laser welding - Google Patents
Device is changed to solder paste dish for laser welding Download PDFInfo
- Publication number
- CN220739732U CN220739732U CN202322339454.9U CN202322339454U CN220739732U CN 220739732 U CN220739732 U CN 220739732U CN 202322339454 U CN202322339454 U CN 202322339454U CN 220739732 U CN220739732 U CN 220739732U
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- solder paste
- mounting frame
- mounting
- flushing
- plate
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 120
- 238000003466 welding Methods 0.000 title claims abstract description 25
- 238000011010 flushing procedure Methods 0.000 claims abstract description 43
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 18
- 238000002347 injection Methods 0.000 claims description 8
- 239000007924 injection Substances 0.000 claims description 8
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 abstract description 4
- 230000003749 cleanliness Effects 0.000 abstract description 3
- 238000006243 chemical reaction Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 25
- 230000033001 locomotion Effects 0.000 description 7
- 238000005406 washing Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004093 laser heating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model provides a solder paste disc replacing device for laser welding, which comprises a mounting frame, wherein an operation groove is formed in the mounting frame, a rotating assembly is arranged in the mounting frame, a solder paste disc is arranged on the rotating assembly, a flushing and wiping assembly is arranged in the mounting frame, and a control assembly is arranged in the mounting frame. According to the utility model, the solder paste discs can be automatically cleaned in operation, a plurality of solder paste discs can be controlled to be recycled, the rotating assembly drives the plurality of solder paste discs to carry out the circulating conversion between different stations, the solder paste discs can be automatically cleaned, the cleanliness of the solder paste discs can be ensured in a flushing and wiping mode, and the opening of the solder paste discs at the flushing station and the wiping station is turned downwards, so that the cleaning and wiping convenience is improved.
Description
Technical Field
The utility model relates to the technical field related to laser welding, in particular to a solder paste disc replacement device for laser welding.
Background
The MiniLED display screen is required to be detected according to the regulation in the production and use process, a damaged chip is required to be removed from a bonding pad for the LED display screen with faults, the damaged chip is required to be replaced, the chip can be quickly and accurately welded on the bonding pad through the technical means of laser welding, after the damaged chip is removed in operation by adopting the laser welding means, solder paste is dispensed on the position of a welding point when the damaged chip is removed, then the replaced chip is placed on the solder paste of the welding point, and the chip is fixed on the bonding pad through laser heating.
At present, in the process of laser welding restoration, solder paste is poured into a solder paste tray, the solder paste is sucked and discharged through the conventional dispensing assembly to finish the process of dispensing, and when the solder paste is used up, the solder paste is directly added into the solder paste tray, but the solder paste tray is developed, the solder paste is exposed in the air for a long time and is easy to solidify, so that mixed particle impurities in the solder paste are unfavorable for laser welding, the solder paste tray needs to be cleaned in order to ensure the smooth performance of the laser welding restoration operation, the laser welding operation needs to be suspended, the working efficiency is influenced, and the operation cost can be increased.
Disclosure of Invention
In order to solve the technical problem of the solder paste tray in the using process, the utility model provides a solder paste tray replacing device for laser welding.
The solder paste disc replacing device for laser welding comprises a mounting frame, wherein an operation groove is formed in the mounting frame, a rotating assembly is arranged in the mounting frame, solder paste discs are uniformly arranged on the rotating assembly along the circumferential direction of the rotating assembly, a flushing and wiping assembly is arranged in the mounting frame and used for flushing the solder paste discs and wiping the flushed solder paste discs to absorb water on the surfaces of the solder paste discs, a control assembly is arranged at a position corresponding to the operation groove in the mounting frame, and the control assembly can drive the solder paste discs to move upwards into the operation groove in operation;
the rotating assembly comprises a first motor arranged on the outer wall of the mounting frame through a motor seat, an output shaft of the first motor extends to the inside of the mounting frame through a bearing, a mounting block is arranged on the output shaft of the first motor, a placing piece is arranged on the mounting block through the bearing, and the solder paste disc is arranged inside the placing piece.
Preferably, the placing part comprises a mounting column arranged on the mounting block through a bearing, a mounting ring is arranged on the mounting column through the bearing, a rotating column is arranged on the mounting ring opposite to the mounting column through the bearing, a placing ring is arranged between the mounting column and the rotating column, an adjusting groove is uniformly formed in the inner wall of the placing ring along the circumferential direction of the inner wall of the placing ring, an adjusting spring rod is arranged in the adjusting groove, a connecting plate is arranged at the lower end of the adjusting spring rod, a rotating groove is formed in the solder paste disc, and the connecting plate is slidably arranged in the rotating groove.
Preferably, the inner walls at the upper end and the lower end of the mounting frame are respectively provided with an auxiliary ring, and a gap between the upper auxiliary ring and the lower auxiliary ring is used for limiting the rotary column.
Preferably, the rotary column is provided with a rotary gear, the rotary column is provided with a limit groove, the inner wall of the lower end of the mounting frame is provided with racks meshed with the rotary gear, the side wall of the inside of the mounting frame is provided with limiting blocks, and the limiting blocks are staggered with the racks.
Preferably, the control assembly comprises a control cylinder arranged on the inner wall of the mounting frame, a control board is arranged on the control cylinder, a control motor is arranged on the control board, a rectangular block is arranged on an output shaft of the control motor, a connecting block is arranged on the back end face of the solder paste disc, and a rectangular groove which is in sliding fit with the rectangular block is formed in the connecting block.
Preferably, the flushing and wiping component comprises a lifting cylinder arranged on the inner wall of the mounting frame, a lifting execution plate is arranged on the lifting cylinder, a lifting spring rod is arranged between the lifting execution plate and the inner wall of the mounting frame, and a flushing piece and a wiping piece are sequentially arranged on the lifting execution plate along the clockwise direction of the mounting frame.
Preferably, the flushing part comprises a flushing plate arranged on the lifting execution plate, the flushing plate is of a cavity structure, a spray head communicated with the cavity is arranged on the flushing plate, a water injection pipe is arranged on the cavity of the flushing plate, a pipe penetrating hole is formed in the mounting frame, the water injection pipe extends to the outer side of the mounting frame through the pipe penetrating hole, a collecting frame is arranged in the mounting frame, and a water outlet pipe is arranged at the lower end of the collecting frame and extends to the outer side of the mounting frame.
Preferably, the wiping piece comprises a second motor arranged on the lifting execution plate, a rotating plate is arranged on the second motor, and a sponge block is arranged on the rotating plate.
In summary, the present application includes at least one of the following beneficial technical effects:
the solder paste disc replacing device for laser welding provided by the utility model can automatically clean the solder paste discs in operation, can control a plurality of solder paste discs to be recycled, can automatically clean the solder paste discs by driving the plurality of solder paste discs to be recycled between different stations through the rotating assembly, can ensure the cleanliness of the solder paste discs in a flushing and wiping mode, and improves the cleaning and wiping convenience by overturning the solder paste discs downwards at the flushing station and the wiping station.
Drawings
Fig. 1 is a schematic perspective view of the present utility model.
Fig. 2 is a transverse cross-sectional view of the present utility model.
Fig. 3 is a longitudinal cross-sectional view of the present utility model.
Fig. 4 is a schematic structural diagram between the rotating assembly and the solder paste tray.
Fig. 5 is a schematic view of the structure of the placement member of the present utility model.
Fig. 6 is a cross-sectional view between the placement member and the solder paste tray of the present utility model.
Fig. 7 is a schematic view of the structure between the lifting cylinder, the lifting execution plate and the lifting spring rod of the present utility model.
Fig. 8 is a top view of the present utility model between the rotating assembly, solder paste tray and mounting frame.
Fig. 9 is a schematic view of the structure among the mounting frame, the limiting block and the rack.
Detailed Description
The present application is described in further detail below in conjunction with figures 1-9.
The embodiment of the application discloses device is changed to solder paste dish for laser welding, including installing frame 1, set up operation groove and throw the feed tank along its anticlockwise direction on the installing frame 1, be provided with rotating assembly 2 in the installing frame 1, evenly be provided with solder paste dish 3 along its circumference on the rotating assembly 2, wash and wipe subassembly 4 setting and be used for washing solder paste dish 3 in the installing frame 1 and wipe the moisture of adsorbing its surface to solder paste dish 3 after washing, control assembly 5 sets up with the position department that the operation groove corresponds in the installing frame 1, and control assembly 5 can drive solder paste dish 3 upwards to the operation inslot in the operation.
Through adopting above-mentioned technical scheme, when the solder paste in the solder paste tray that needs more in operation position department uses up and need change, control assembly 5 resets, the solder paste tray 3 that is in the operational position this moment resets to initial condition, then the rotation subassembly 2 starts work and drives the solder paste tray 3 that is equipped with the solder paste and adjust to the operation under the groove, and control assembly 5 work is with the push of the solder paste tray that is new and is equipped with the solder paste to the operation in the groove wait for work, and clean its inside through washing wiping assembly 4 to the solder paste tray that changes in the in-process of motion, the in-process of circulation operation is through clean solder paste tray 3 adjusting to the below of throwing the groove, can pour into the solder paste into in the solder paste tray 3 through staff or current equipment under this state, can guarantee through above-mentioned scheme that the solder paste in the solder paste tray 3 can supply continuous operation in continuous operation, can guarantee the cleanliness of solder paste tray 3 moreover, guarantee that granule and the solder paste that can not appear in the solder paste in the operation and the normal operation of supplying of LED repair solder paste in the operation of curing.
The control assembly 5 comprises a control cylinder 51 arranged on the inner wall of the mounting frame 1, a control board is arranged on the control cylinder 51, a control motor 52 is arranged on the control board, a rectangular block 53 is arranged on an output shaft of the control motor 52, a connecting block 54 is arranged on the back end face of the solder paste disc 3, and a rectangular groove which is in sliding fit with the rectangular block 53 is formed in the connecting block 54.
Through adopting above-mentioned technical scheme at first, drive the control panel through control cylinder 51 from down upward movement in this in-process makes rectangular piece 53 insert the rectangle inslot, control cylinder 51 is in the in-process of continuous upward movement synchronous drive solder paste dish 3 upward movement, until the up end of solder paste dish 3 is located the coplanar with the up end of installing frame 1, control motor 52 begins to work under this state and drives rectangular piece 53 and rotate, rectangular piece 53 drives solder paste dish 3 in the in-process of rotation synchronous and rotates, solder paste dish 3 in the operation in-process rotation can guarantee that its inside solder paste can even distribution, guarantee that the solder paste in the solder paste dish 3 can concentrate towards the middle part of solder paste dish 3 in the in-process of being continuously extracted, thereby make the solder paste in the solder paste dish 3 can make full use of.
The rotating assembly 2 comprises a first motor 21 arranged on the outer wall of the mounting frame 1 through a motor base, an output shaft of the first motor 21 extends to the inside of the mounting frame 1 through a bearing, a mounting block 22 is arranged on the output shaft of the first motor 21, a placing piece 23 is arranged on the mounting block 22 through a bearing, the solder paste disc 3 is arranged inside the placing piece 23, and the solder paste disc 3 is provided with a working station, a flushing station, a wiping station and a pouring station in the process of following the rotation of the mounting block 22.
The placing part 23 comprises a mounting column 231 arranged on the mounting block 22 through a bearing, a mounting ring 232 is arranged on the mounting column 231 through the bearing, a rotating column 233 is arranged on the surface, opposite to the mounting column 231, of the mounting ring 232 through the bearing, a placing ring 234 is arranged between the mounting column 231 and the rotating column 233, the placing ring 234 can rotate along with the rotating column 233 in operation, an adjusting groove is uniformly formed in the inner wall of the placing ring 234 along the circumferential direction of the inner wall, an adjusting spring rod 235 is arranged in the adjusting groove, a connecting plate 236 is arranged at the lower end of the adjusting spring rod 235, a rotating groove is formed in the solder paste disc 3, and the connecting plate 236 is slidably arranged in the rotating groove.
The inner walls at the upper end and the lower end of the mounting frame 1 are respectively provided with an auxiliary ring 237, and a gap between the upper auxiliary ring 237 and the lower auxiliary ring 237 is used for limiting the rotating column 233.
By adopting the technical scheme, after the solder paste in the solder paste tray 3 at the working position is used up, the control assembly 5 is reset, in the process, the regulating spring rod 235 synchronously controls the solder paste tray 3 to move downwards to restore to the initial state through the connecting plate 236, then the first motor 21 is started to drive the mounting block 22 to rotate, the mounting block 22 synchronously controls the placing piece 23 to move along with the mounting block 22 in the rotating process, and the used solder paste tray 3 is removed from the position right below the working groove and the solder paste tray 3 at the filling station in the anticlockwise direction is moved to the working station.
The rotary column 233 is provided with a rotary gear 238, the rotary column 233 is provided with a limiting groove, the inner wall of the lower end of the mounting frame 1 is provided with a rack 239 meshed with the rotary gear 238, the side wall of the inside of the mounting frame 1 is provided with a limiting block 2310, and the limiting block 2310 and the rack 239 are arranged in a staggered mode.
By adopting the technical scheme, the mounting block 22 is in the process of driving the placing piece 23 to rotate and adjust, the solder paste disc 3 which is moved out from the operation position in the process can be overturned, the rotating gear 238 on the specific rotating column 233 is matched with the rack 239 to drive the rotating column 233 to rotate in the moving process, the placing ring 234 is controlled to overturn 180 degrees through the rotating column 233, the solder paste disc 3 synchronously follows rotation in the process, after the solder paste disc 3 overturns and in the continuous moving process of the mounting block 22, the limiting groove on the rotating column 233 is in sliding fit with the limiting block 2310, the opening of the solder paste disc 3 is downwards stably moved to the flushing station through the mutual matching between the limiting groove and the limiting block 2310, the solder paste disc 3 is continuously moved to the flushing station through the flushing piece 44 on the flushing wiping component 4 in the station, after the cleaning operation is finished, the mounting block 22 continuously controls the solder paste disc 3 to move to the wiping station through the flushing station, the inner wall of the solder paste disc 3 is synchronously driven by the wiping piece 45, after the cleaning operation is finished, the mounting block 22 continuously moves to the limiting groove 23 to move to the position 2310, the solder paste disc 3 is continuously in the filling station is continuously moved to the filling station, and the solder paste disc 3 is continuously in the filling station is separated from the rotating position of the rotating block 23 to the rotating block 3 through the mutual matching with the rotating block 2310, and the rotating block 3 is in the filling station is continuously in the filling station, and the filling station is continuously in the filling station is in the filling process.
The flushing and wiping component 4 comprises a lifting cylinder 41 arranged on the inner wall of the mounting frame 1, a lifting execution plate 42 is arranged on the lifting cylinder 41, a lifting spring rod 43 is arranged between the lifting execution plate 42 and the inner wall of the mounting frame 1, and a flushing piece 44 and a wiping piece 45 are sequentially arranged on the lifting execution plate 42 along the clockwise direction of the mounting frame 1.
The solder paste tray 3 is adjusted in position between different stations in the process of following the movement of the mounting block 22, the flushing wiping component 4 starts the lifting cylinder 41 to control the lifting execution plate 42 to move upwards in the working process of working, the lifting spring rod 43 plays a role in supporting and guiding in the process of moving the lifting execution plate 42, the lifting execution plate 42 drives the flushing piece 44 and the wiping piece 45 to move to the working position in the moving process, the flushing piece 44 flushes the inner wall of the solder paste tray 3, and the wiping piece 45 wipes the flushed solder paste tray 3.
The flushing member 44 comprises a flushing plate 441 arranged on the lifting execution plate 42, the flushing plate 441 is of a cavity structure, a nozzle communicated with the cavity is arranged on the flushing plate 441, a water injection pipe 442 is arranged on the cavity of the flushing plate 441, a pipe penetrating hole is formed in the mounting frame 1, the water injection pipe 442 extends to the outer side of the mounting frame 1 through the pipe penetrating hole, a collecting frame 443 is arranged in the mounting frame 1, a water outlet pipe is arranged at the lower end of the collecting frame 443, and the water outlet pipe extends to the outer side of the mounting frame 1.
With the above technical solution, the lifting execution plate 42 drives the flushing plate 441 to be attached to the solder paste tray 3 in the upward movement process, the water injection pipe 442 is externally connected with a water pump, the water pump extracts water source in operation to flush the solder paste tray 3 through the mutual cooperation between the flushing plate 441 and the spray head of the water injection pipe 442, after the flushing operation is completed, the lifting cylinder 41 is reset, the waste water for flushing the solder paste tray 3 flows into the collecting frame 443, and is discharged out of the mounting frame 1 through the water outlet pipe.
The wiper 45 includes a second motor 451 provided on the lifting/lowering execution plate 42, a rotation plate 452 is mounted on the second motor 451, and a sponge 453 is mounted on the rotation plate 452.
By adopting the above technical scheme, the lifting execution plate 42 drives the sponge block 453 to move into the solder paste tray 3 in the upward movement process and enables the sponge block 453 to be fully contacted with the inner wall of the solder paste tray 3, and the motor II 451 drives the rotation plate 452 to rotate in the state, so that the sponge block 453 is controlled to wipe the inner wall of the solder paste tray 3 and adsorb moisture in the solder paste tray.
While certain exemplary embodiments of the present utility model have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that modifications may be made to the described embodiments in various different ways without departing from the spirit and scope of the utility model. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive of the scope of the utility model, which is defined by the appended claims.
Claims (8)
1. A solder paste disk replacement device for laser welding is characterized by comprising
The device comprises a mounting frame (1), wherein an operation groove and a feeding groove are formed in the mounting frame (1) along the anticlockwise direction of the mounting frame;
the rotating assembly (2) is arranged in the mounting frame (1), and solder paste discs (3) are uniformly arranged on the rotating assembly (2) along the circumferential direction of the rotating assembly;
the flushing wiping component (4) is arranged in the mounting frame (1) and used for flushing the solder paste tray (3) and wiping the flushed solder paste tray (3) to absorb water on the surface of the solder paste tray;
the control component (5) is arranged at a position corresponding to the operation groove in the mounting frame (1), and the control component (5) can drive the solder paste disc (3) to move upwards into the operation groove in operation;
the rotating assembly (2) comprises a first motor (21) arranged on the outer wall of the mounting frame (1) through a motor base, an output shaft of the first motor (21) extends to the inside of the mounting frame (1) through a bearing, a mounting block (22) is arranged on the output shaft of the first motor (21), a placing piece (23) is arranged on the mounting block (22) through a bearing, and the solder paste disc (3) is arranged inside the placing piece (23).
2. The solder paste disc replacing device for laser welding according to claim 1, wherein the placing member (23) comprises a mounting column (231) arranged on the mounting block (22) through a bearing, a mounting ring (232) is arranged on the mounting column (231) through a bearing, a rotating column (233) is arranged on the surface, opposite to the mounting column (231), of the mounting ring (232) through a bearing, a placing ring (234) is arranged between the mounting column (231) and the rotating column (233), an adjusting groove is uniformly formed in the inner wall of the placing ring (234) along the circumferential direction of the inner wall, an adjusting spring rod (235) is arranged in the adjusting groove, a connecting plate (236) is arranged at the lower end of the adjusting spring rod (235), a rotating groove is formed in the solder paste disc (3), and the connecting plate (236) is slidably arranged in the rotating groove.
3. The solder paste tray replacing device for laser welding according to claim 2, wherein auxiliary rings (237) are arranged on inner walls of the upper end and the lower end of the mounting frame (1), and a gap between the upper auxiliary ring (237) and the lower auxiliary ring (237) is used for limiting the rotating column (233).
4. The solder paste tray replacing device for laser welding according to claim 3, wherein a rotating gear (238) is arranged on the rotating column (233), a limiting groove is formed in the rotating column (233), a rack (239) meshed with the rotating gear (238) is arranged on the inner wall of the lower end of the mounting frame (1), a limiting block (2310) is arranged on the side wall inside the mounting frame (1), and the limiting block (2310) and the rack (239) are arranged in a staggered mode.
5. The solder paste disc replacing device for laser welding according to claim 4, wherein the control assembly (5) comprises a control cylinder (51) arranged on the inner wall of the mounting frame (1), a control board is arranged on the control cylinder (51), a control motor (52) is arranged on the control board, a rectangular block (53) is arranged on an output shaft of the control motor (52), a connecting block (54) is arranged on the back end face of the solder paste disc (3), and a rectangular groove which is in sliding fit with the rectangular block (53) is formed in the connecting block (54).
6. The solder paste tray replacing device for laser welding according to claim 5, wherein the flushing wiping component (4) comprises a lifting cylinder (41) arranged on the inner wall of the mounting frame (1), a lifting execution plate (42) is arranged on the lifting cylinder (41), a lifting spring rod (43) is arranged between the lifting execution plate (42) and the inner wall of the mounting frame (1), and flushing pieces (44) and wiping pieces (45) are sequentially arranged on the lifting execution plate (42) along the clockwise direction of the mounting frame (1).
7. The solder paste tray replacing device for laser welding according to claim 6, wherein the flushing member (44) comprises a flushing plate (441) arranged on the lifting execution plate (42), the flushing plate (441) is of a cavity structure, a nozzle communicated with the cavity is arranged on the flushing plate (441), a water injection pipe (442) is arranged on the cavity of the flushing plate (441), a pipe penetrating hole is formed in the mounting frame (1), the water injection pipe (442) extends to the outer side of the mounting frame (1) through the pipe penetrating hole, a collecting frame (443) is arranged in the mounting frame (1), and a water outlet pipe is arranged at the lower end of the collecting frame (443) and extends to the outer side of the mounting frame (1).
8. The solder paste tray exchange apparatus for laser welding according to claim 7, wherein said wiper (45) includes a second motor (451) provided on said lifting/lowering execution plate (42), a rotation plate (452) is mounted on said second motor (451), and a sponge block (453) is mounted on said rotation plate (452).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322339454.9U CN220739732U (en) | 2023-08-30 | 2023-08-30 | Device is changed to solder paste dish for laser welding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322339454.9U CN220739732U (en) | 2023-08-30 | 2023-08-30 | Device is changed to solder paste dish for laser welding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220739732U true CN220739732U (en) | 2024-04-09 |
Family
ID=90561746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322339454.9U Active CN220739732U (en) | 2023-08-30 | 2023-08-30 | Device is changed to solder paste dish for laser welding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220739732U (en) |
-
2023
- 2023-08-30 CN CN202322339454.9U patent/CN220739732U/en active Active
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