CN220739401U

CN220739401U - Mould with multiple heat dissipation parts

Info

Publication number: CN220739401U
Application number: CN202322062500.5U
Authority: CN
Inventors: 何建光; 洪军平; 余忠全; 陈志毅; 余盛楠
Original assignee: Zhejiang Heshi Mold Co ltd
Current assignee: Zhejiang Heshi Mold Co ltd
Priority date: 2023-08-02
Filing date: 2023-08-02
Publication date: 2024-04-09
Anticipated expiration: 2033-08-02

Abstract

The utility model relates to the technical field of motor shell production, in particular to a die with multiple heat dissipation parts, which comprises a die with ribs embedded inside, wherein a shell is sleeved outside the die, a refrigerating cavity is formed between the inner wall and the outer wall of the shell, a semiconductor refrigerating sheet is arranged in the refrigerating cavity, a heat conduction column is embedded inside the die, a plurality of heat conduction sheets which are arranged in a matrix are arranged at the bottom of the die, and the bottom ends of the heat conduction sheets penetrate through the inner wall of the bottom end of the shell and extend into the refrigerating cavity. According to the utility model, the heat-conducting columns are embedded in the mold, the heat-conducting sheets are arranged at the bottom of the mold and used for transmitting the temperature on the mold, and then the semiconductor refrigerating sheets are used for refrigerating the inside of the refrigerating cavity, so that the temperature of the heat-conducting sheets and the heat exchange of the heat-conducting columns are realized, and the heat dissipation efficiency of the mold is improved; the motor drives the rotating shaft and the fan blades to rotate so as to accelerate the flow velocity of gas in the refrigerating cavity, so that cold air in the refrigerating cavity is uniformly distributed, and the phenomenon that the heat dissipation effect of the die is influenced due to the fact that the cold air in the refrigerating cavity sinks and hot air rises is avoided.

Description

Mould with multiple heat dissipation parts

Technical Field

The utility model relates to the technical field of motor shell production, in particular to a die with multiple heat dissipation parts.

Background

The lost foam mould is a mould made of meltable or combustible materials and is used for casting castings with complex shapes such as motor shells, and the lost foam mould can realize castings with high precision, high smoothness, high strength and high heat dissipation performance, simultaneously saves materials and energy sources, and reduces waste products and pollution.

The utility model provides a novel motor housing lost foam mould that publication No. CN210848210U, is including being the live piece casing of quarter circle, live piece casing splice buckling parts and be located the rib reinforcing part in the middle of being located both sides including the both sides that are located, be equipped with many rib grooves that set up side by side on the rib reinforcing part, the rib reinforcing part at every rib groove both ends all is provided with the wire hole, and is equipped with the wire through seam between two wire holes that correspond, and the wire through seam is linked together two wire through holes that correspond.

Although the utility model has simple structure, reduces the operation difficulty of workers and the loss of tools in the production process, improves the appearance quality of products, in the specific use process, only realizes heat dissipation by taking a threading slot as an exhaust heat conduction channel, so that the area of a heat dissipation channel of a die is too small, the heat dissipation efficiency is too low to influence the whole heat dissipation performance of the die, and the use is inconvenient.

Disclosure of Invention

In order to overcome the defects, the utility model provides a die with a plurality of heat dissipation components.

The technical scheme of the utility model is as follows:

the utility model provides a take mould of many radiating parts, includes that the inside inlays the mould that is equipped with the rib, the outside cover of mould is equipped with the shell, the refrigeration chamber has been seted up between the inner wall and the outer wall of shell, the inside in refrigeration chamber is equipped with the semiconductor refrigeration piece, the inside of mould still inlays and is equipped with the heat conduction post, the bottom of mould is equipped with a plurality of conducting strips that are the matrix and arrange, the bottom inner wall of shell is passed to the bottom of conducting strip and is extended to the refrigeration intracavity.

As the preferable technical scheme, the ribs and the heat-conducting columns are all provided with a plurality of groups and are arranged in a staggered manner, the ribs of a single group are formed by arranging a plurality of ribs in an annular array, and the heat-conducting columns of a single group are formed by arranging a plurality of heat-conducting columns in an annular array.

As an optimized technical scheme, the radiating surface of the semiconductor refrigerating plate is provided with a plurality of radiating fins which are arranged in a matrix manner, and one end of each radiating fin, which is far away from the semiconductor refrigerating plate, passes through the outer inner wall of the refrigerating cavity and extends to the outside.

As the preferable technical scheme, the outer walls of the left side and the right side of the shell are respectively provided with rectangular plates which are symmetrically distributed near the front end and the rear end, and the corresponding sides of the front rectangular plate and the rear rectangular plate are detachably connected with fans through bolts.

As the preferable technical scheme, the center department that the refrigeration chamber is close to the bottom is equipped with the flabellum that accelerates the inside gas velocity of flow of refrigeration chamber, the flabellum is connected with the bottom inner wall rotation of refrigeration chamber through the pivot.

As the preferable technical scheme, the bottom outer wall of the shell and the corresponding position of the center of the rotating shaft are provided with motors, and the bottom end of the rotating shaft penetrates through the bottom end inner wall of the shell and is coaxially connected with the output shaft of the motors.

As the preferable technical scheme, the bottom of shell just is close to both ends about all vertically be equipped with the backup pad that is used for supporting the shell, the inner wall of shell all is equipped with heat conduction silicone grease layer.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the utility model, the heat-conducting columns are embedded in the mold, the heat-conducting sheets are arranged at the bottom of the mold and used for transmitting the temperature on the mold, and then the semiconductor refrigerating sheets are used for refrigerating the inside of the refrigerating cavity, so that the temperature of the heat-conducting sheets and the heat exchange of the heat-conducting columns are realized, and the heat dissipation efficiency of the mold is improved;

2. according to the utility model, the motor drives the rotating shaft and the fan blades to rotate so as to accelerate the flow rate of gas in the refrigerating cavity, so that cold air in the refrigerating cavity is uniformly distributed, and the phenomenon that the heat dissipation effect of the die is influenced due to the fact that the cold air in the refrigerating cavity sinks and the hot air rises is avoided;

3. according to the utility model, the plurality of radiating fins are arranged on the radiating surface of the semiconductor refrigerating plate, and then the air flow speed around the radiating fins is accelerated by the fan to improve the radiating effect of the radiating fins, so that the working efficiency of the refrigerating surface of the semiconductor refrigerating plate is improved conveniently.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a schematic view of a part of the structure of the shell of the present utility model;

FIG. 3 is a second schematic view of a part of the structure of the shell of the present utility model;

FIG. 4 is a third schematic view of a part of the housing of the present utility model;

fig. 5 is a cross-sectional view of a mold in accordance with the present utility model.

The meaning of each reference numeral in the figures is:

1. a mold; 11. ribs; 12. a heat conducting column; 13. a heat conductive sheet;

2. a housing; 21. a support plate; 22. a refrigerating chamber; 23. a motor;

3. a rectangular plate; 31. a fan;

4. a semiconductor refrigeration sheet; 41. a heat radiation fin;

5. and (3) a fan blade.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-5, the present utility model provides a technical solution:

the mold with multiple heat dissipation parts comprises a mold 1, wherein ribs 11 are embedded in the mold 1, heat conduction columns 12 are embedded in the mold 1, multiple groups of ribs 11 and heat conduction columns 12 are arranged in a staggered mode, a single group of ribs 11 are formed by arranging a plurality of ribs 11 in an annular array, a single group of heat conduction columns 12 are formed by arranging a plurality of heat conduction columns 12 in an annular array, so that the mechanical strength of the mold 1 is enhanced through the ribs 11, and heat of the mold 1 is transferred by the heat conduction columns 12;

the outer part of the die 1 is sleeved with a shell 2, the inner wall of the shell 2 is provided with a heat conduction silicone grease layer, the bottom of the shell 2 is vertically provided with a supporting plate 21 for supporting the shell 2 near the left end and the right end, the outer wall of the die 1 is attached to the inner wall of the shell 2, one end of a heat conduction column 12 far away from the die 1 is attached to the inner wall of the shell 2, a refrigerating cavity 22 is arranged between the inner wall and the outer wall of the shell 2, so that the temperature in the refrigerating cavity 22 can exchange with the heat on the heat conduction column 12 to improve the heat dissipation efficiency of the die 1, a semiconductor refrigerating sheet 4 is arranged in the refrigerating cavity 22, and the refrigerating surface of the semiconductor refrigerating sheet 4 is refrigerated in the refrigerating cavity 22;

the radiating surface of the semiconductor refrigerating plate 4 is provided with a plurality of radiating fins 41 which are arranged in a matrix, one end of the radiating fins 41 far away from the semiconductor refrigerating plate 4 passes through the outer inner wall of the refrigerating cavity 22 and extends to the outside so as to radiate the radiating fins 41 through the flow of outside air, thereby being convenient for improving the radiating speed of the radiating surface of the semiconductor refrigerating plate 4 and improving the working efficiency of the refrigerating surface of the semiconductor refrigerating plate 4;

as the preference of this embodiment, the outer walls of the left and right sides of the housing 2 and the rectangular plates 3 close to the front and rear ends are all provided with symmetrically distributed rectangular plates 3, the rectangular plates 3 adopt hollow structures, and the corresponding sides of the front and rear rectangular plates 3 are all detachably connected with the fan 31 through bolts, so that the fan 31 and the rectangular plates 3 are disassembled and assembled to improve the maintenance convenience, and in addition, the flow speed of the air on the side edge of the housing 2 is accelerated through the fan 31 to improve the heat dissipation efficiency of the heat dissipation fins 41.

The bottom of mould 1 is equipped with a plurality of conducting strips 13 that are the matrix and arrange, and the bottom of conducting strip 13 passes the bottom inner wall of shell 2 and extends to in the refrigeration chamber 22 for the conducting strip 13 realizes heat exchange and cools down mould 1 with the temperature transfer of mould 1 in refrigeration chamber 22.

As a preference of this embodiment, the center of the cooling chamber 22 near the bottom end is provided with a fan blade 5 for accelerating the flow rate of the air in the cooling chamber 22, the fan blade 5 is rotationally connected with the bottom end inner wall of the cooling chamber 22 through a rotating shaft, the bottom end outer wall of the housing 2 and the corresponding position of the center of the rotating shaft are provided with a motor 23, the bottom end of the rotating shaft passes through the bottom end inner wall of the housing 2 and is coaxially connected with the output shaft of the motor 23, as is well known to those skilled in the art, after the motor 23 is powered, the rotating shaft and the fan blade 5 are driven to rotate so as to improve the flow rate of the air in the cooling chamber 22, so that the cool air in the cooling chamber 22 is uniformly distributed.

When the die with multiple heat dissipation parts is used, the semiconductor refrigerating sheet 4 refrigerates into the refrigerating cavity 22, then the motor 23 drives the rotating shaft and the fan blades 5 to rotate so as to improve the flow rate of air in the refrigerating cavity 22, so that cold air in the refrigerating cavity 22 is uniformly distributed, and then the temperature in the refrigerating cavity 22 is transmitted to the die 1 through the inner wall of the shell 2, thereby realizing heat exchange between the heat conduction column 12 and the heat conduction sheet 13 and the shell 2, and improving the heat dissipation efficiency of the die 1;

in the working process of the semiconductor refrigeration piece 4, the heat radiating fins 41 transfer the temperature of the heat radiating surface of the semiconductor refrigeration piece 4 outwards, and then the heat radiating effect of the heat radiating fins 41 is improved by accelerating the air flow velocity around the heat radiating fins 41 through the fan 31, so that the heat radiating speed of the heat radiating surface of the semiconductor refrigeration piece 4 is improved, and meanwhile, the working efficiency of the refrigeration surface of the semiconductor refrigeration piece 4 is improved.

The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the above-described embodiments, and that the above-described embodiments and descriptions are only preferred embodiments of the present utility model, and are not intended to limit the utility model, and that various changes and modifications may be made therein without departing from the spirit and scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a take mould of many radiating parts, includes mould (1) that inside inlays has rib (11), its characterized in that: the outside cover of mould (1) is equipped with shell (2), refrigerating chamber (22) have been seted up between the inner wall and the outer wall of shell (2), the inside in refrigerating chamber (22) is equipped with semiconductor refrigeration piece (4), the inside of mould (1) still is inlayed and is equipped with heat conduction post (12), the bottom of mould (1) is equipped with a plurality of conducting strips (13) that are the matrix and arrange, the bottom inner wall of shell (2) is passed to the bottom of conducting strip (13) and is extended to in refrigerating chamber (22).

2. The mold with multiple heat sink elements as recited in claim 1, wherein: the ribs (11) and the heat conducting columns (12) are all provided with a plurality of groups and are arranged in a staggered mode, the ribs (11) of a single group are formed by arranging a plurality of ribs (11) in an annular array mode, and the heat conducting columns (12) of a single group are formed by arranging a plurality of heat conducting columns (12) in an annular array mode.

3. The mold with multiple heat sink elements as recited in claim 1, wherein: the radiating surface of the semiconductor refrigerating sheet (4) is provided with a plurality of radiating fins (41) which are arranged in a matrix, and one end, far away from the semiconductor refrigerating sheet (4), of each radiating fin (41) penetrates through the outer inner wall of the refrigerating cavity (22) and extends to the outside.

4. The mold with multiple heat sink elements as recited in claim 1, wherein: rectangular plates (3) which are symmetrically distributed are arranged on the outer walls of the left side and the right side of the shell (2) and close to the front end and the rear end, and fans (31) are detachably connected to the corresponding sides of the rectangular plates (3) through bolts.

5. The mold with multiple heat sink elements as recited in claim 1, wherein: the center department that refrigeration chamber (22) is close to the bottom is equipped with the flabellum (5) that accelerates the inside gas velocity of flow of refrigeration chamber (22), flabellum (5) are connected through the pivot and are rotated with the bottom inner wall of refrigeration chamber (22).

6. The mold with multiple heat sink elements as defined in claim 5, wherein: the bottom outer wall of the shell (2) and the corresponding position of the center of the rotating shaft are provided with motors (23), and the bottom end of the rotating shaft penetrates through the bottom end inner wall of the shell (2) and is coaxially connected with the output shafts of the motors (23).

7. The mold with multiple heat sink elements as recited in claim 1, wherein: the bottom of shell (2) and be close to both ends about all vertically be equipped with backup pad (21) that are used for supporting shell (2), the inner wall of shell (2) all is equipped with heat conduction silicone grease layer.