CN220716808U

CN220716808U - A examine selection equipment for wafer

Info

Publication number: CN220716808U
Application number: CN202320819604.3U
Authority: CN
Inventors: 祝幼强; 刘兴波
Original assignee: Zhuhai Dongjin Quartz Technology Co ltd
Current assignee: Zhuhai Dongjin Quartz Technology Co ltd
Priority date: 2023-04-13
Filing date: 2023-04-13
Publication date: 2024-04-05
Anticipated expiration: 2033-04-13

Abstract

The utility model relates to the technical field of wafer inspection and selection, in particular to inspection and selection equipment for wafers, which comprises an equipment box body, wherein an inspection and selection mechanism is arranged at the upper end of the equipment box body and comprises a circular vibration disc, a first stepping motor, a detection disc, a detection part, a second stepping motor, a material distributing disc, a material receiving part and a plurality of material boxes, and the upper end of the equipment box body is provided with a detection baffle plate which is positioned at the lower end of the detection disc; the detection part comprises a detection frame, a micrometer, a moving plate, a sliding rail, a sliding block, a detection head, a third stepping motor, a driving disc and a toggle rod; the material receiving part comprises a plurality of mounting cavities, a plurality of movable shafts, a plurality of collecting boxes and a plurality of overturning motors. The utility model not only can effectively ensure the accurate distance between the detection head and the bottom end of the ceramic cup, but also can realize the sorting detection of wafers with different specifications, and can ensure the sorting detection effect of the wafers with different specifications, thereby effectively increasing the sorting efficiency of the wafers with different specifications.

Description

A examine selection equipment for wafer

Technical Field

The utility model relates to the technical field of wafer sorting, in particular to sorting equipment for wafers.

Background

Along with the increasing market demands of miniaturized 2016/1612/1008 series wafers, especially the miniaturized wafers are mostly processed through chamfering, the appearance of the wafer changes after chamfering, and the miniaturized wafers are particularly important for controlling the appearance of the wafer, and directly influence the electrical performance parameters of the quartz crystal;

when the conventional wafer inspection and selection equipment is used, the ceramic cup at the upper end of the inspection tray is replaced when the wafer of a non-passing model is inspected, so that the replacement operation is complicated, the replacement time is long, the ceramic cups of various specifications are easy to be confused, the overall inspection and selection efficiency of the wafer is affected, the quality of the processed miniaturized wafer is not effectively ensured, and the wafer inspection and selection equipment is developed by aiming at the problems.

Disclosure of Invention

The present utility model is directed to a wafer sorting apparatus for solving the above-mentioned problems of the related art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the device comprises a device box body, wherein a selection mechanism is arranged at the upper end of the device box body and comprises a circular vibration disc, a first stepping motor, a detection disc, a detection part, a second stepping motor, a material distributing disc, a material receiving part and a plurality of material boxes, and a detection baffle is arranged at the upper end of the device box body and positioned at the lower end of the detection disc; the detection part comprises a detection frame, a micrometer, a moving plate, a sliding rail, a sliding block, a detection head, a third stepping motor, a driving disc and a toggle rod; the material receiving part comprises a plurality of mounting cavities, a plurality of movable shafts, a plurality of collecting boxes and a plurality of overturning motors.

Preferably, the circular vibration disc is arranged on one side of the upper end of the equipment box body, the first stepping motor is arranged on one side of the equipment box body, the detection disc is arranged on the driving end of the first stepping motor, and the detection part is arranged at the rear end of the upper wall surface of the equipment box body.

Preferably, the detection frame is arranged at the rear end of the upper wall surface of the equipment box body, the micrometer is arranged at the upper end of the detection frame, the movable plate is arranged at the telescopic end of the micrometer, the sliding rail is arranged at the side wall surface of the movable plate, and the sliding block is sleeved at the upper end of the sliding rail in a sliding manner.

Preferably, the detection head mounting rod is arranged at the lower end of the front wall surface of the sliding block, the third stepping motor is arranged at the rear wall surface of the detection frame, the driving disc is arranged at the driving end of the third stepping motor, the center of the poking rod is movably arranged at the lower end of the moving plate through the mounting shaft, one end of the poking rod is eccentrically connected with the driving disc through the connecting rod, and the other end of the poking rod is movably embedded in the lower end of the sliding block.

Preferably, the installation cavities are all arranged on the outer sides of the material distribution plates, and two ends of the movable shafts are movably embedded in two side wall surfaces in the installation cavities respectively.

Preferably, the collecting box is respectively arranged at the upper ends of the movable shafts, the overturning motors are embedded in the distributing disc, and the telescopic ends are respectively connected with one ends of the movable shafts.

Compared with the prior art, the utility model has the beneficial effects that: this a examine equipment of selecting for wafer is through the mechanism of selecting that examines that sets up, when examining the wafer of different specifications and select, need not to change the ceramic cup, through the micrometer of setting, can be according to the wafer thickness of different specifications, adjust the height of detecting the head, can effectually guarantee the accurate distance of detecting head and ceramic cup bottom, and then can realize examining the wafer of different specifications and select the detection to can guarantee the examination of selecting the detection effect to the wafer of different specifications, the effectual increase is to the examination efficiency of different specifications wafer.

Drawings

Fig. 1 is a schematic perspective view of the present utility model.

Fig. 2 is a schematic perspective view of a detecting unit according to the present utility model.

Fig. 3 is a schematic diagram of a front view structure of the present utility model.

In the figure: 1. an equipment box; 2. a circular vibration disk; 3. a first stepping motor; 4. a detection disc; 5. a second stepping motor; 6. a material distributing disc; 7. a magazine; 8. a detection frame; 9. a micrometer; 10. a moving plate; 11. a slide rail; 12. a sliding block; 13. a detection head; 14. a third stepper motor; 15. a drive plate; 16. a toggle rod; 17. a mounting cavity; 18. a movable shaft; 19. a collection box; 20. a turnover motor; 21. a detection groove; 22. and detecting the baffle.

Detailed Description

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments, and furthermore, the terms "first", "second", "third", "up, down, left, right", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Meanwhile, in the description of the present utility model, unless explicitly stated and defined otherwise, the terms "connected", "connected" and "connected" should be interpreted broadly, and for example, may be fixedly connected, detachably connected, or integrally connected; the mechanical connection and the electrical connection can be adopted; all other embodiments, which may be directly or indirectly through intermediaries, which may be obtained by a person of ordinary skill in the art without inventive effort based on the embodiments of the present utility model are within the scope of the present utility model.

The utility model provides a structure of a wafer selecting device, as shown in fig. 1 and 3, comprising a device box 1, wherein the upper end of the device box 1 is provided with a selecting mechanism, the selecting mechanism comprises a circular vibration disc 2, a first stepping motor 3, a detecting disc 4, a detecting part, a second stepping motor 5, a distributing disc 6, a receiving part and a plurality of material boxes 7, the upper end of the device box 1 is provided with a detecting baffle 22, the detecting baffle 22 is positioned at the lower end of the detecting disc 4, the circular vibration disc 2 is arranged at one side of the upper end of the device box 1, the first stepping motor 3 is arranged at one side in the device box 1, the detecting disc 4 is arranged at the driving end of the first stepping motor 3, the detecting part is arranged at the rear end of the upper wall surface of the device box 1, the circular vibration disc 2 is arranged at one side of the upper end of the device box 1, the first stepping motor 3 is arranged at one side of the inner side of the device box 1, the detecting disc 4 is arranged at the driving end of the first stepping motor 3, and the detecting part is arranged at the rear end of the upper wall surface of the device box 1.

When the wafer inspection device is implemented, a worker firstly adjusts the detection part according to the wafer specification to be inspected and selected, then places the wafer to be inspected and selected in the circular vibration disc 2, works by driving the circular vibration disc 2, conveys the wafer into the detection disc 4 one by one, works by driving the first stepping motor 3, drives the detection disc 4 to rotate gradually, rotates the wafer falling into the detection disc 4 to the lower end of the detection part, detects the specification of the wafer by the detection part, analyzes the wafer by a computer, works again by the first stepping motor 3 after the detection is completed, when the wafer in the detection disc 4 rotates to one side of the separation disc 6, the wafer falls down at a notch on one side of the detection baffle 22 at the lower end of the detection disc 4 and falls into the separation disc 6, works by driving the second stepping motor 5, drives the separation disc 6 to rotate to a designated position, rotates the wafer in the separation disc 6 to a designated angle, and drives the material receiving part to work, and places qualified wafers and unqualified wafers into different material boxes 7 respectively.

Further, as shown in fig. 1 and 2, the detecting portion includes a detecting frame 8, a micrometer 9, a moving plate 10, a sliding rail 11, a sliding block 12, a detecting head 13, a third stepping motor 14, a driving disc 15 and a toggle rod 16, wherein the detecting frame 8 is mounted at the rear end of the upper wall surface of the device box 1, the micrometer 9 is mounted at the upper end of the detecting frame 8, the moving plate 10 is mounted at the telescopic end of the micrometer 9, the sliding rail 11 is mounted at one side wall surface of the moving plate 10, the sliding block 12 is slidably sleeved at the upper end of the sliding rail 11, the detecting head 13 is mounted at the lower end of the front wall surface of the sliding block 12, the third stepping motor 14 is mounted at the rear wall surface of the detecting frame 8, the driving disc 15 is mounted at the driving end of the third stepping motor 14, the center of the toggle rod 16 is movably mounted at the lower end of the moving plate 10 through a mounting shaft, one end of the toggle rod 16 is eccentrically connected with the driving disc 15 through a connecting rod, and the other end of the toggle rod 16 is movably embedded in the lower end of the sliding block 12.

When the wafer detection device is implemented, the height of the detection head 13 is adjusted according to wafer specifications of different specifications, the micrometer 9 at the upper end of the detection frame 8 is screwed to work, the micrometer 9 drives the movable plate 10 to adjust the height at one side of the detection frame 8 until the movable plate 10 is adjusted to a specified height, when the wafer in the detection disc 4 rotates to the lower end of the detection head 13, a worker drives the third stepping motor 14 to work, the driving disc 15 is driven to rotate step by step, the toggle rod 16 rotates at the upper end of the installation shaft through the rotation of the driving disc 15, the sliding block 12 is toggled at the upper end of the sliding rail 11 through the other end of the toggle rod 16, the wafer in the detection disc 4 is detected through the detection head 13, and full-automatic detection selection of the wafer can be realized through the cooperation of the first stepping motor 3, the second stepping motor 5 and the third stepping motor 14.

Further, as shown in fig. 1 and 2, the material receiving portion includes a plurality of mounting cavities 17, a plurality of movable shafts 18, a plurality of collecting boxes 19 and a plurality of overturning motors 20, the mounting cavities 17 are all arranged on the outer side of the material distributing disc 6, two ends of the plurality of movable shafts 18 are movably embedded in two side wall surfaces in the plurality of mounting cavities 17 respectively, the collecting boxes 19 are mounted at the upper ends of the plurality of movable shafts 18 respectively, the plurality of overturning motors 20 are embedded in the material distributing disc 6, and the telescopic ends are connected with one ends of the plurality of movable shafts 18 respectively.

During implementation, the second stepping motor 5 drives the distributing disc 6, so that the plurality of collecting boxes 19 sequentially rotate to the lower end of the detecting disc 4, the detected wafers are collected through the collecting boxes 19, when the wafers detected by the detecting parts are unqualified, the unqualified wafers and the collecting boxes 19 are rotated to a specified angle through the driving of the second stepping motor 5, the movable shaft 18 and the collecting boxes 19 are driven to rotate in the mounting cavity 17 through the working of the driving overturning motor 20, the unqualified wafers in the collecting boxes 19 are placed in the specified material boxes 7, and meanwhile, the qualified wafers are sequentially placed in the other material boxes 7, so that the purpose of detecting and selecting the wafers is achieved.

The electric device of the automatic checking and selecting system comprises the following parts: the computer host (including power supply part, interface, network tester, drive, oscillation, network tester circuit, etc.), the system software aspect, parameter setting is divided into four types:

fundamental frequency test: the frequency selection only measures the frequency value of the main peak according to the set main vibration frequency,

three harmonic overtone tests: the frequency detection and selection only measures the frequency value of the main peak according to the set main vibration frequency, and the main vibration is set: the fundamental frequency is three times 3.

Fundamental frequency + [ delta ] S test: setting two central frequencies, wherein the first is the frequency of main vibration and the second is the frequency of auxiliary vibration, analyzing and calculating a delta S value by a screening system according to measured data, giving a judging standard value to the delta S value according to a process specification, and automatically judging that the exceeding part is a NG sheet and falls into a NG file material box 7.

Fundamental frequency + [ delta ] F test: setting two central frequencies, wherein the first is the frequency of main vibration and the second is the frequency of frequency multiplication, analyzing and calculating a delta F value by a screening system according to measured data, giving a judging standard value to the delta F value according to a process specification, and automatically judging that the exceeding part is a NG sheet and falls into a NG file material box 7.

After entering the measuring system software, debugging the wafer measuring gap, setting the frequency according to the product requirement, sweeping the bandwidth, and outputting power to test; both the tested data and the graph can be exported for storage.

Working principle: when the wafers are selected, a worker firstly adjusts the detection part according to the wafer specification required to be selected, then places the wafers to be selected in the circular vibration disc 2, drives the circular vibration disc 2 to work, conveys the wafers into the detection disc 4 one by one, drives the first stepping motor 3 to work, drives the detection disc 4 to rotate step by step, rotates the wafers falling into the detection disc 4 to the lower end of the detection part, detects the specification of the wafers through the detection part, analyzes the wafers through a computer, and then the first stepping motor 3 works again after the detection is completed, when the wafers in the detection disc 4 rotate to one side of the material distribution disc 6, the wafers fall down at the notch of one side of the detection baffle 22 at the lower end of the detection disc 4 and fall into the material distribution disc 6, drives the material distribution disc 6 to rotate to a designated position through driving the second stepping motor 5, rotates the wafers in the material distribution disc 6 to a designated angle, drives the material receiving part to work, and places qualified wafers and unqualified wafers into different material boxes 7 respectively.

When the automatic wafer detection device is used, firstly, the height of the detection head 13 is adjusted according to wafer specifications of different specifications, the micrometer 9 at the upper end of the detection frame 8 is screwed to work, the moving plate 10 is driven by the micrometer 9 to adjust the height of the detection frame 8 until the moving plate 10 is adjusted to a specified height, when the wafer in the detection disc 4 rotates to the lower end of the detection head 13, the third stepping motor 14 is driven by a worker to work, the driving disc 15 is driven to rotate step by step, the toggle rod 16 rotates at the upper end of the installation shaft through the rotation of the driving disc 15, the sliding block 12 is toggled at the upper end of the sliding rail 11 through the other end of the toggle rod 16, the wafer in the detection disc 4 is detected through the detection head 13, and full-automatic detection and selection of the wafer can be realized through the cooperation of the first stepping motor 3, the second stepping motor 5 and the third stepping motor 14.

When the wafer inspection device is used, the second stepping motor 5 drives the dispensing disc 6, so that the plurality of collection boxes 19 sequentially rotate to the lower end of the inspection disc 4, the collection boxes 19 collect inspected wafers, when the wafers inspected by the inspection part are unqualified, the unqualified wafers and the collection boxes 19 are rotated to a specified angle by driving the second stepping motor 5, the movable shaft 18 and the collection boxes 19 are driven to rotate in the mounting cavity 17 by driving the overturning motor 20, the unqualified wafers in the collection boxes 19 are placed in the specified material boxes 7, and meanwhile, the qualified wafers are sequentially placed in the other material boxes 7, so that the purpose of wafer inspection and selection is realized.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The equipment for checking and selecting wafers comprises an equipment box body, and is characterized in that a checking and selecting mechanism is arranged at the upper end of the equipment box body and comprises a circular vibration disc, a first stepping motor, a detecting disc, a detecting part, a second stepping motor, a distributing disc, a receiving part and a plurality of material boxes, wherein a detecting baffle is arranged at the upper end of the equipment box body and is positioned at the lower end of the detecting disc; the detection part comprises a detection frame, a micrometer, a moving plate, a sliding rail, a sliding block, a detection head, a third stepping motor, a driving disc and a toggle rod; the material receiving part comprises a plurality of mounting cavities, a plurality of movable shafts, a plurality of collecting boxes and a plurality of overturning motors.

2. A sorting apparatus for wafers according to claim 1, wherein: the circular vibration disc is arranged on one side of the upper end of the equipment box body, the first stepping motor is arranged on one side in the equipment box body, the detection disc is arranged on the driving end of the first stepping motor, and the detection part is arranged at the rear end of the upper wall surface of the equipment box body.

3. A sorting apparatus for wafers according to claim 2, wherein: the second stepper motor is arranged on the other side of the inner lower end of the equipment box body, the material distributing disc is arranged on the driving end of the second stepper motor, the material receiving part is arranged on the upper end of the material distributing disc, and a plurality of material boxes are all arranged at the upper end of the equipment box body and are all positioned at the lower end of the material distributing disc.

4. A sorting apparatus for wafers according to claim 1, wherein: the detection frame is installed in equipment box upper wall surface rear end, the micrometer install in detection frame upper end, the movable plate install in on the micrometer flexible end, the slide rail install in movable plate one side wall surface department, the sliding block slip cap in slide rail upper end.

5. A sorting apparatus for wafers as claimed in claim 4, wherein: the detection head mounting rod is arranged at the lower end of the front wall surface of the sliding block, the third stepping motor is arranged at the rear wall surface of the detection frame, the driving disc is arranged on the driving end of the third stepping motor, the center of the poking rod is movably arranged at the lower end of the moving plate through a mounting shaft, one end of the poking rod is eccentrically connected with the driving disc through a connecting rod, and the other end of the poking rod is movably embedded in the lower end of the sliding block.

6. A sorting apparatus for wafers according to claim 1, wherein: the installation cavities are all arranged on the outer sides of the material distribution plates, and two ends of the movable shafts are movably embedded in two side wall surfaces in the installation cavities respectively.

7. A sorting apparatus for wafers as claimed in claim 6, wherein: the collecting box is respectively arranged at the upper ends of the movable shafts, the turnover motors are embedded in the material distributing disc, and the telescopic ends are respectively connected with one ends of the movable shafts.