CN220710242U - Die flow balance structure of semiconductor plastic package die - Google Patents

Abstract

The utility model belongs to the technical field of plastic packaging molds, and particularly relates to a mold flow regulating structure of a semiconductor plastic packaging mold, which comprises a base, wherein the upper end surface of the base is fixedly connected with a mold plate through a plurality of fixing rods, the middle part of the mold plate is provided with a flow retarding groove, a plurality of cavities are distributed outside the flow retarding groove, the upper end surface of the mold plate is provided with a plurality of runner grooves communicated with a first flow retarding groove, and a communicating runner groove is arranged between the runner grooves and the corresponding cavities.

Description

Die flow balance structure of semiconductor plastic package die

Technical Field

The utility model relates to the technical field of plastic packaging molds, in particular to a mold flow balance structure of a semiconductor plastic packaging mold.

Background

The semiconductor plastic package mold is a mold which is used for extruding and filling the thermal melted plastic package material into a cavity and then wrapping a product to be plastic packaged. The injection part structure of the existing semiconductor plastic package mold is generally of a bilateral symmetry structure, and plastic package of two products to be molded can be completed by one-time injection. The injection molding part structure specifically comprises: the upper die frame comprises a runner plate and upper die cavities symmetrically arranged on two sides of the runner plate; the lower die frame comprises a charging barrel, an injection molding part and lower die cavities symmetrically arranged at two sides of the charging barrel; the lower mold cavity is arranged at a position corresponding to the upper mold cavity, the charging barrel is arranged at a position corresponding to the runner plate, and the runner plate is in a trapezoid groove shape; the injection molding part comprises an injection molding rod and an injection molding head, which are connected up and down and are arranged in a charging barrel, and the inner wall of the charging barrel can be used for melting plastic packaging materials in a hot melting way; and placing a product to be molded in the lower mold cavity.

The injection molding process of the plastic package mold comprises the following steps:

1. firstly, placing a product to be molded into a lower mold cavity by a mechanical arm, and placing a molding material into a charging barrel;

2. the lower die carrier is driven by the press to vertically rise and is tightly adhered and sealed with the upper die carrier, and the top of the charging barrel and the runner plate form a closed cavity;

3. the plastic package material is melted by high-temperature hot melting of a charging barrel, the melted plastic package material is vertically and upwards extruded into the runner plate by the injection molding rod and the injection molding head, after the runner plate is filled, the plastic package material flows into the upper mold cavities at two sides of the runner plate through the pouring gate, and then the product to be plastic packaged is plastic packaged.

The injection molding process has the following problems:

in order to enable the manipulator to smoothly transfer the plastic package material into the material cylinder (the material cylinder and the plastic package material are cylindrical), the inner diameter of the existing material cylinder is set to be larger than the diameter of the plastic package material, for example, the inner diameter of the material cylinder is set to be 16.6mm, and then the diameter of the plastic package material is set to be 16mm. Thus, it cannot be guaranteed that the molding compound is located at a central position in the barrel, for example: after the plastic package material close to the right side of the inner wall of the charging barrel is melted, the plastic package material is extruded into the runner plate by the injection molding head preferentially and is guided into the upper mold cavity on the right side preferentially, so that the mold flow speeds of the upper mold cavity on the left side and the upper mold cavity on the right side are different. And the die flow speed exceeds the normal die flow speed, so that the wire arc of the product to be molded is bent, and the product molding quality is affected.

Therefore, a new die-level structure of a semiconductor plastic package die is needed to overcome the above-mentioned shortcomings in the prior art.

Disclosure of Invention

Aiming at the defects of the prior art, the utility model provides a die flow balance structure of a semiconductor plastic package die, which solves the problem of the background.

In order to achieve the above purpose, the utility model is realized by the following technical scheme:

the die plate balance structure of the semiconductor plastic package die comprises a base, wherein the upper end face of the base is fixedly connected with a die plate through a plurality of fixing rods, a slow flow groove is formed in the middle of the die plate, a plurality of cavities are distributed in the outer portion of the slow flow groove, a plurality of runner grooves communicated with a first slow flow groove are formed in the upper end face of the die plate, and a communicating runner groove is formed between the runner groove and the corresponding cavity.

Preferably, the depth of the slow flow groove is deeper than that of the runner groove, and the feeding height of the runner groove is higher than that of the runner groove.

Preferably, the internally mounted of runner groove has level sensor, the bottom sliding assembly of template has the block piece, block the inside that the block piece slided and stretch into the runner groove, electric putter is installed to the bottom of base, electric putter's output fixedly connected with lifter plate, lifter plate and block piece fixed connection.

Preferably, the outer surface sliding sleeve of dead lever is equipped with the sliding sleeve, sliding sleeve and lifter plate fixed connection.

Preferably, the chute is slope-shaped.

Preferably, a controller is arranged on the base and is electrically connected with the signal output end of the liquid level sensor and the signal input end of the electric push rod through leads respectively.

Preferably, the base is provided with a plurality of mounting holes.

Advantageous effects

The utility model provides a die flow balance structure of a semiconductor plastic package die. Compared with the prior art, the method has the following beneficial effects:

1. this mould balance structure of semiconductor plastic envelope mould can guarantee through the slow down groove that the material of moulding plastics enters into a plurality of runner grooves simultaneously, and rethread level sensor detects the material of moulding plastics of guaranteeing in the runner groove and enters into the die cavity again simultaneously, and then can avoid leading to certain die cavity to be full of the moulding plastics because of the velocity of flow difference, realizes that the mould flows is balanced.

Drawings

FIG. 1 is a schematic elevational view of the main body of the present utility model;

FIG. 2 is a schematic side view of the main body of the present utility model;

FIG. 3 is a schematic top view of the main body of the present utility model;

fig. 4 is an enlarged schematic view of the structure a in fig. 1 according to the present utility model.

In the figure: 1. a base; 2. a chute; 3. a cavity; 4. a flow channel groove; 5. a slow flow groove; 6. a liquid level sensor; 7. a fixed rod; 8. a sliding sleeve; 9. a lifting plate; 10. an electric push rod; 11. a mounting hole; 12. a blocking piece; 13. and (5) a template.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-4, the present utility model provides a technical solution: the die plate balance structure of the semiconductor plastic package die comprises a base 1, wherein the upper end face of the base 1 is fixedly connected with a die plate 13 through a plurality of fixing rods 7, a slow flow groove 5 is formed in the middle of the die plate 13, a plurality of cavities 3 are distributed outside the slow flow groove 5, a plurality of runner grooves 4 communicated with the first slow flow groove 5 are formed in the upper end face of the die plate 13, and a communicating runner groove 2 is formed between the runner grooves 4 and the corresponding cavities 3.

The depth of the slow flow groove 5 is deeper than that of the runner groove 4, and the feeding height of the runner groove 2 is higher than that of the runner groove 4.

The internally mounted of runner groove 4 has level sensor 6, and the bottom sliding fit of template 13 has a block piece 12, blocks the inside that the piece 12 slided and stretches into runner groove 2, and electric putter 10 is installed to the bottom of base 1, and electric putter 10's output fixedly connected with lifter plate 9, lifter plate 9 and block piece 12 fixed connection.

When the injection molding device is used, the upper and lower molds are assembled, after the molds are assembled, the injection molding materials are continuously injected into the slow flow grooves 5 as the depths of the slow flow grooves 5 are deeper than the depths of the runner grooves 4, the injection molding materials are simultaneously injected into the four groups of runner grooves 4, when the four groups of liquid level sensors 6 simultaneously detect that the liquid level reaches the specified height, the electric push rod 10 drives the lifting plate 9 to move downwards, the blocking block 12 is separated from the runner grooves 2 when the lifting plate 9 moves downwards, the injection molding materials in the runner grooves 4 are simultaneously injected into the corresponding runner grooves 2, finally the injection molding materials are simultaneously filled into the corresponding cavities 3, the injection molding materials can be ensured to be simultaneously injected into the runner grooves 4 through the slow flow grooves 5, and the injection molding materials in the runner grooves 4 are simultaneously detected and ensured to be simultaneously injected into the cavities 3 through the liquid level sensors 6, so that the balance of the mold flow is avoided because of different mold flow rates.

The outer surface sliding sleeve of dead lever 7 is equipped with sliding sleeve 8, and sliding sleeve 8 and lifter plate 9 fixed connection will pull sliding sleeve 8 and slide from top to bottom along dead lever 7 when lifter plate 9 up-and-down motion, and then can improve the stability of lifter plate 9 in-process that goes up and down.

The chute 2 is sloping, so that the injection molding material in the mold chute 4 can flow into the chute 2 conveniently.

The base 1 is provided with a controller which is respectively and electrically connected with the signal output end of the liquid level sensor 6 and the signal input end of the electric push rod 10 through leads.

A plurality of mounting holes 11 are formed in the base 1, so that the die is convenient to fix.

Working principle: when the injection molding device is used, the upper and lower molds are assembled, after the molds are assembled, the injection molding materials are continuously injected into the slow flow grooves 5 as the depths of the slow flow grooves 5 are deeper than the depths of the runner grooves 4, the injection molding materials are simultaneously injected into the four groups of runner grooves 4, when the four groups of liquid level sensors 6 simultaneously detect that the liquid level reaches the specified height, the electric push rod 10 drives the lifting plate 9 to move downwards, the blocking block 12 is separated from the runner grooves 2 when the lifting plate 9 moves downwards, the injection molding materials in the runner grooves 4 are simultaneously injected into the corresponding runner grooves 2, finally the injection molding materials are simultaneously filled into the corresponding cavities 3, the injection molding materials can be ensured to be simultaneously injected into the runner grooves 4 through the slow flow grooves 5, and the injection molding materials in the runner grooves 4 are simultaneously detected and ensured to be simultaneously injected into the cavities 3 through the liquid level sensors 6, so that the balance of the mold flow is avoided because of different mold flow rates.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. The utility model provides a mould balance structure of semiconductor plastic envelope mould, includes base (1), its characterized in that: the upper end face of base (1) is through a plurality of dead levers (7) fixedly connected with template (13), the chute (5) have been seted up at the middle part of template (13), the outside distribution of chute (5) has a plurality of die cavities (3), a plurality of communicating runner groove (4) with first chute (5) have been seted up to the up end of template (13), communicating runner groove (2) have been seted up between runner groove (4) and corresponding die cavity (3).

2. The die-level flow structure of a semiconductor plastic package die according to claim 1, wherein: the depth of the slow flow groove (5) is deeper than that of the flow channel groove (4), and the feeding height of the flow channel groove (2) is higher than that of the flow channel groove (4).

3. The die-level flow structure of a semiconductor plastic package die according to claim 2, wherein: the inside of runner groove (4) has level sensor (6), the bottom sliding fit of template (13) has block piece (12), block piece (12) slip stretches into the inside of runner groove (2), electric putter (10) are installed to the bottom of base (1), the output fixedly connected with lifter plate (9) of electric putter (10), lifter plate (9) and block piece (12) fixed connection.

4. A die flow control structure of a semiconductor plastic package die as recited in claim 3, wherein: the outer surface sliding sleeve of dead lever (7) is equipped with sliding sleeve (8), sliding sleeve (8) and lifter plate (9) fixed connection.

5. The die-level flow structure of a semiconductor plastic package die as recited in claim 4, wherein: the chute (2) is sloping.

6. The die-level flow structure of a semiconductor plastic package die as recited in claim 5, wherein: the base (1) is provided with a controller which is electrically connected with the signal output end of the liquid level sensor (6) and the signal input end of the electric push rod (10) through leads respectively.

7. The die-level flow structure of a semiconductor plastic package die according to claim 1, wherein: a plurality of mounting holes (11) are formed in the base (1).