CN220701872U - Chip embedded device for packaging box - Google Patents
Chip embedded device for packaging box Download PDFInfo
- Publication number
- CN220701872U CN220701872U CN202321792505.7U CN202321792505U CN220701872U CN 220701872 U CN220701872 U CN 220701872U CN 202321792505 U CN202321792505 U CN 202321792505U CN 220701872 U CN220701872 U CN 220701872U
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- base plate
- waterproof
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 12
- 230000003139 buffering effect Effects 0.000 claims abstract description 11
- 239000010410 layer Substances 0.000 claims description 113
- 238000007789 sealing Methods 0.000 claims description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 25
- 239000012790 adhesive layer Substances 0.000 claims description 13
- 230000000903 blocking effect Effects 0.000 claims description 12
- 238000004078 waterproofing Methods 0.000 claims description 7
- 238000012856 packing Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 17
- 238000001125 extrusion Methods 0.000 abstract description 7
- 230000001681 protective effect Effects 0.000 description 17
- 238000009434 installation Methods 0.000 description 5
- 238000004026 adhesive bonding Methods 0.000 description 4
- 230000002265 prevention Effects 0.000 description 4
- 230000002035 prolonged effect Effects 0.000 description 3
- 230000004075 alteration Effects 0.000 description 2
- 238000010367 cloning Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
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Abstract
The utility model relates to the technical field of packaging boxes, in particular to a chip embedding device for a packaging box, which comprises a base plate, wherein a buffer protection mechanism is arranged on the surface of the top position of the base plate, a moisture-proof and waterproof mechanism is arranged on the surface of the bottom position of the base plate, and a convenient tearing mechanism is arranged on the surface of the base plate. The utility model not only can integrally protect the surface of the anti-counterfeiting chip when the chip device is used, but also can realize the protection and buffering of a plurality of conditions, can protect the surface of the anti-counterfeiting chip in multiple aspects when the chip device is used, can realize the normal transportation and display of various environments, including a wet environment, or an extrusion environment, and the like, and the phenomenon of influencing the anti-counterfeiting effect occurs when the wet environment is wetted, and can facilitate the use experience of a client after verifying the authenticity of commodities when the easy-tearing structure is used, so that the chip device is better in use experience.
Description
Technical Field
The utility model relates to the technical field of packaging boxes, in particular to a chip embedded device for a packaging box.
Background
The anti-counterfeiting is a technical means for identifying authenticity, preventing counterfeiting, alteration and cloning actions for enterprise products through verification of consumer anti-counterfeiting code query centers, and the anti-counterfeiting characteristics are used for preventing illegal actions such as counterfeiting, alteration and cloning.
Firstly, the surface of an anti-counterfeiting chip needs to be protected when the anti-counterfeiting chip is used, the surface of the anti-counterfeiting chip cannot be protected usually when the traditional chip device is used, so that the surface of the anti-counterfeiting chip cannot be integrally protected when the chip device is used, meanwhile, protection and buffering of a plurality of conditions cannot be realized, and extrusion, collision, pressing and the like cannot be well protected; secondly, the service life of the chip device is shorter when the chip device is used in a humid environment, and the existing chip device is poor in dampproof and waterproof performances when the chip device is used, so that the surface of an anti-counterfeiting chip cannot be protected in multiple aspects when the chip device is used, collision damage generated during transportation is easy to cause, the humid environment is wetted, and the phenomenon of influencing the anti-counterfeiting effect occurs; again, the chip device need tear the chip device according to user's user demand when using, and current chip device is inconvenient when tearing the chip device, and this just makes the use experience of chip device worsen, influences pleasing to the eye, inconvenient tear the chip device.
Disclosure of Invention
The utility model aims to provide an embedded chip device for a packaging box, which solves the problems that the chip device cannot integrally protect the surface of an anti-counterfeiting chip when in use, cannot realize protection and buffering under a plurality of conditions, has poor dampproof and waterproof performances and is inconvenient to tear off the chip device in the prior art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a be used for embedded chip device of packing carton, includes the base plate, the surface mounting of base plate has commodity two-dimensional code, the surface mounting of base plate has commodity number, the surface mounting of base plate has commodity bar code, the fixed slot has all been seted up on the surface of base plate, the internally mounted of fixed slot has anti-fake chip, the pin body is all installed on the surface of base plate both sides, the surface of base plate top position department is provided with buffering protection machanism, buffering protection machanism's inside includes positioning card groove, positioning fixture block, protection casing, paster layer and gasket layer, the surface of base plate bottom position department is provided with dampproofing and waterproofing mechanism, dampproofing and waterproofing mechanism comprises water blocking layer, standing groove and dampproofing and waterproofing portion, the surface of base plate is provided with convenient tear mechanism, convenient tear mechanism's inside includes pull ring, connecting plate and convenient tear down portion.
Preferably, the surface of basic unit board top position department is provided with the protection casing that is used for protecting the surface of anti-fake chip, the location fixture block that is used for carrying out the location to the position of protection casing is all installed to the bottom of protection casing, the location draw-in groove has all been seted up to the surface of basic unit board, the mutual joint cooperation of location draw-in groove and the surface of location fixture block.
Preferably, the inner wall of the protective cover is covered with a patch layer, the surface of the patch layer is adhered to the inner wall of the protective cover, a gasket layer is arranged in the protective cover, and the surface of the gasket layer is adhered to the surface of the patch layer.
Preferably, the dampproof and waterproof part is arranged on the surface of the bottom part of the base layer board and consists of a waterproof layer, a waterproof layer and a water baffle, the surface of the bottom part of the base layer board is provided with a placing groove, and the inner wall of the placing groove is provided with the waterproof layer.
Preferably, the surface at the bottom of the water-resistant layer is covered with a water-resistant layer, the surface of the water-resistant layer is adhered to the surface at the bottom of the water-resistant layer, a waterproof layer is arranged at the bottom of the water-resistant layer, and the surface of the waterproof layer is adhered to the surface at the bottom of the water-resistant layer.
Preferably, the surface at the bottom of the waterproof layer is covered with a water baffle, and the surface of the water baffle is adhered to the surface at the bottom of the waterproof layer.
Preferably, the convenient tearing part is arranged on the surface of the base plate, the convenient tearing part is composed of an adhesive layer, an easy tearing layer and a sealing strip, pull rings are arranged on the surface of the base plate, connecting plates are arranged on the surface of the bottom position of the base plate, the surface of the bottom position of the connecting plates is covered with the adhesive layer, and the surface of the top position of the adhesive layer is adhered to the surface of the bottom position of the connecting plates.
Preferably, the bonding layer is provided with the sealing strip far away from connecting plate one side, the surface of sealing strip bonds with bonding layer bottom position department's surface mutually, the below of sealing strip is provided with easily tears the layer, easily tear the surface on layer and the surface of sealing strip bottom position department mutually bond.
Compared with the prior art, the utility model has the beneficial effects that: the embedded chip device for the packaging box not only can integrally protect the surface of the anti-counterfeiting chip when the chip device is used, but also can realize protection and buffering of a plurality of conditions, can better protect the surface of the anti-counterfeiting chip when the chip device is used by extrusion, collision, pinching and the like, can realize multi-aspect protection of the surface of the anti-counterfeiting chip, can realize normal transportation and display of various environments, including a humid environment or extrusion environment and the like, avoid collision damage generated during transportation and damp of the humid environment, influence the anti-counterfeiting effect, and can facilitate customers to use the chip device after verifying the authenticity of commodities when the easy-tearing structure is used, so that the use experience of the chip device is better, the attractiveness cannot be influenced, and the chip device is convenient to tear off;
1. through being provided with buffering protection machanism, the user places the protection casing on the surface of basic unit's board for the protection casing drives the inside of positioning fixture block card to positioning fixture groove, fix a position the mounted position of protective cover under the card effect of positioning fixture block with the positioning fixture groove, guaranteed that the protection casing can not produce the displacement at the surface of basic unit's board, afterwards, protect the surface of basic unit's board and anti-fake chip under the effect of protection casing, protect the inner wall of protection casing under the combined action of paster layer and gasket layer, strengthen the protection effect to basic unit's board and anti-fake chip, realized the chip device and protected the function to anti-fake chip's surface, thereby can carry out holistic protection to anti-fake chip's surface when making the chip device use, simultaneously, can realize protection and buffering of a plurality of circumstances, can all obtain better protection to extrusion, collide with and press pinching etc.;
2. through being provided with dampproofing and waterproofing mechanism, the combined action of waterproof layer and water-blocking layer in the standing groove is dampproofing to the surface of basic unit's board and anti-fake chip, the combined action of waterproof layer and breakwater is waterproof to the surface of basic unit's board and anti-fake chip, avoid moist environment to influence the life of basic unit's board and anti-fake chip, thereby prolonged the life of basic unit's board and anti-fake chip in moist environment, realized the dampproofing waterproof function of chip device, thereby can carry out the manifold protection to the surface of anti-fake chip when making the chip device use, can realize normal transportation and the display of multiple environment, including moist environment, perhaps squeeze environment etc. the collision damage that produces when avoiding transportation, and moist environment's the phenomenon that influences anti-fake effect appears;
3. through being provided with convenient tearing mechanism, the pull ring on user pulling basic unit's board surface for the pull ring drives and easily tears layer and sealing strip motion, makes sealing strip and easily tears the layer and keep away from the surface of mounted position department, makes between connecting plate and the sealing strip gluing more firm under the effect of gluing the layer, is difficult for appearing the phenomenon of fracture, strengthens the gluey effect of gluing of basic unit board and installation department under the effect of connecting plate, has realized the function that chip device conveniently torn, thereby make easy tearing structure convenient for the customer when verifying the true and false of commodity after, make chip device's use experience better, can not influence pleasing to the eye, conveniently tear chip device.
Drawings
FIG. 1 is a schematic three-dimensional perspective view of the present utility model;
FIG. 2 is a schematic view of a front cross-sectional structure of the present utility model;
FIG. 3 is a schematic top view of the present utility model;
FIG. 4 is an enlarged schematic view of the buffer protection mechanism of FIG. 2 according to the present utility model;
fig. 5 is an enlarged schematic view of the moisture and water proof mechanism of fig. 2 according to the present utility model.
Fig. 6 is an enlarged schematic view of the tear-off mechanism according to the present utility model.
In the figure: 1. a base plate; 101. an anti-counterfeiting chip; 102. a commodity bar code; 103. commodity numbers; 104. a commodity two-dimensional code; 105. a pin body; 106. a fixing groove; 2. a buffer protection mechanism; 201. positioning clamping grooves; 202. positioning a clamping block; 203. a protective cover; 204. a patch layer; 205. a gasket layer; 3. a dampproof and waterproof mechanism; 301. a water blocking layer; 302. a placement groove; 303. a moisture-proof and water-proof part; 3031. a water-resistant layer; 3032. a waterproof layer; 3033. a water baffle; 4. the tearing mechanism is convenient; 401. a pull ring; 402. a connecting plate; 403. the tearing part is convenient; 4031. an adhesive layer; 4032. an easy-to-tear layer; 4033. and (5) a sealing strip.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
The utility model provides a structure for a chip embedded device of a packaging box, as shown in fig. 1 and 2, which comprises a base plate 1, wherein a commodity two-dimensional code 104 is arranged on the surface of the base plate 1, a commodity number 103 is arranged on the surface of the base plate 1, a commodity bar code 102 is arranged on the surface of the base plate 1, fixing grooves 106 are formed in the surface of the base plate 1, an anti-counterfeiting chip 101 is arranged in each fixing groove 106, and pin bodies 105 are arranged on the surfaces of two sides of the base plate 1.
Further, as shown in fig. 2 and fig. 4, the surface at the top position of the base plate 1 is provided with a buffer protection mechanism 2, the inside of the buffer protection mechanism 2 includes a positioning clamping groove 201, a positioning clamping block 202, a protection cover 203, a patch layer 204 and a gasket layer 205, the surface at the top position of the base plate 1 is provided with a protection cover 203 for protecting the surface of the anti-counterfeiting chip 101, the bottom of the protection cover 203 is provided with a positioning clamping block 202 for positioning the position of the protection cover 203, the surface of the base plate 1 is provided with the positioning clamping groove 201, the positioning clamping groove 201 is matched with the surface of the positioning clamping block 202 in a mutually clamping manner, the inner wall of the protection cover 203 is covered with the patch layer 204, the surface of the patch layer 204 is adhered to the inner wall of the protection cover 203, the inside of the protection cover 203 is provided with the gasket layer 205, and the surface of the gasket layer 205 is adhered to the surface of the patch layer 204.
During implementation, a user places the protective cover 203 on the surface of the base plate 1, so that the protective cover 203 drives the positioning clamping blocks 202 to be clamped in the positioning clamping grooves 201, the installation positions of the protective cover 203 are positioned under the clamping action of the positioning clamping grooves 201 and the positioning clamping blocks 202, the protective cover 203 is prevented from generating displacement on the surface of the base plate 1, then the surface of the base plate 1 and the surface of the anti-counterfeiting chip 101 are protected under the action of the protective cover 203, the inner wall of the protective cover 203 is protected under the combined action of the patch layer 204 and the gasket layer 205, and the protection effect on the base plate 1 and the anti-counterfeiting chip 101 is enhanced, so that the chip device can protect the surface of the anti-counterfeiting chip 101.
Further, as shown in fig. 2 and 5, the surface at the bottom position of the base layer 1 is provided with a dampproof and waterproof mechanism 3, the dampproof and waterproof mechanism 3 is composed of a water blocking layer 301, a placing groove 302 and a dampproof and waterproof part 303, the dampproof and waterproof part 303 is arranged on the surface at the bottom position of the base layer 1, the dampproof and waterproof part 303 is composed of a water blocking layer 3031, a waterproof layer 3032 and a water blocking plate 3033, the placing groove 302 is formed on the surface at the bottom position of the base layer 1, the water blocking layer 3031 is mounted on the inner wall of the placing groove 302, the surface at the bottom position of the water blocking layer 3031 is covered with the water blocking layer 301, the surface of the water blocking layer 301 is adhered to the surface at the bottom position of the water blocking layer 301, the surface at the bottom position of the waterproof layer 3032 is covered with the water blocking plate 3033, and the surface at the bottom position of the waterproof layer 3032 is adhered to the surface at the bottom position of the waterproof layer 3032.
During implementation, the surface of the base layer board 1 and the anti-counterfeiting chip 101 are subjected to moisture prevention under the combined action of the water-resisting layer 3031 and the water-resisting layer 301 in the placing groove 302, and the surface of the base layer board 1 and the anti-counterfeiting chip 101 are subjected to moisture prevention under the combined action of the waterproof layer 3032 and the water-resisting plate 3033, so that the service lives of the base layer board 1 and the anti-counterfeiting chip 101 are prevented from being influenced by a humid environment, and the service lives of the base layer board 1 and the anti-counterfeiting chip 101 in the humid environment are prolonged, so that the moisture prevention and water prevention functions of the chip device are realized.
Further, as shown in fig. 2 and 6, the surface of the base plate 1 is provided with a convenient tearing mechanism 4, the interior of the convenient tearing mechanism 4 comprises a pull ring 401, a connecting plate 402 and a convenient tearing portion 403, the convenient tearing portion 403 is arranged on the surface of the base plate 1, the convenient tearing portion 403 is composed of an adhesive layer 4031, an easy tearing layer 4032 and a sealing strip 4033, the pull ring 401 is installed on the surface of the base plate 1, the connecting plate 402 is installed on the surface of the bottom of the base plate 1, the adhesive layer 4031 is covered on the surface of the bottom of the connecting plate 402, the surface of the top of the adhesive layer 4031 is adhered to the surface of the bottom of the connecting plate 402, the sealing strip 4033 is arranged on one side away from the connecting plate 402, the surface of the sealing strip 4033 is adhered to the surface of the bottom of the adhesive layer 4031, the easy tearing layer 4032 is arranged below the sealing strip 4033, and the surface of the easy tearing layer 4032 is adhered to the surface of the bottom of the sealing strip 4033.
During implementation, a user pulls the pull ring 401 on the surface of the base plate 1, so that the pull ring 401 drives the easy-tearing layer 4032 and the sealing strip 4033 to move, the sealing strip 4033 and the easy-tearing layer 4032 are far away from the surface of the installation position, the adhesion between the connecting plate 402 and the sealing strip 4033 is firmer under the action of the adhesion layer 4031, the phenomenon of cracking is not easy to occur, the adhesion effect of the base plate 1 and the installation position is enhanced under the action of the connecting plate 402, and the function of conveniently tearing off the chip device is realized.
Working principle: when the anti-fake chip device is used, firstly, the base plate 1 is placed at a specified position, then, a user places the protective cover 203 on the surface of the base plate 1, the protective cover 203 drives the positioning clamping blocks 202 to be clamped in the positioning clamping grooves 201, the installation positions of the protective cover 203 are positioned under the clamping action of the positioning clamping grooves 201 and the positioning clamping blocks 202, the protective cover 203 is prevented from displacing on the surface of the base plate 1, then, the surface of the base plate 1 and the anti-fake chip 101 are protected under the action of the protective cover 203, the inner wall of the protective cover 203 is protected under the combined action of the patch layer 204 and the gasket layer 205, the protection effect of the base plate 1 and the anti-fake chip 101 is enhanced, the function of protecting the surface of the anti-fake chip 101 by the chip device is achieved, and meanwhile, the surface of the anti-fake chip 101 can be protected integrally when the chip device is used, protection and buffering under multiple conditions can be achieved, and better protection can be obtained by extrusion, collision, pressing and the like.
Then, when the base layer board 1 and the anti-counterfeiting chip 101 are used in a wet environment, at this time, the surfaces of the base layer board 1 and the anti-counterfeiting chip 101 are dampproof under the combined action of the waterproof layer 3031 and the waterproof layer 301 in the placing groove 302, the surfaces of the base layer board 1 and the anti-counterfeiting chip 101 are waterproof and dampproof under the combined action of the waterproof layer 3032 and the waterproof layer 3033, the service lives of the base layer board 1 and the anti-counterfeiting chip 101 are prevented from being influenced by the wet environment, so that the service lives of the base layer board 1 and the anti-counterfeiting chip 101 in the wet environment are prolonged, the function of preventing the chip device from being dampproof and waterproof is realized, the surfaces of the anti-counterfeiting chip 101 can be protected in multiple aspects when the chip device is used, normal transportation and display of various environments including the wet environment, or extrusion environment and the like are avoided from collision damage generated during transportation, and the phenomenon of influencing the anti-counterfeiting effect occurs.
When the user needs to take down basic unit board 1 from mounted position, at this moment, the pull ring 401 on the surface of basic unit board 1 is pulled to the user for pull ring 401 drives easy tear layer 4032 and sealing strip 4033 motion, make sealing strip 4033 keep away from the surface of mounted position department with easy tear layer 4032, make between connecting plate 402 and sealing strip 4033 sticky more firm under the effect of gluing layer 4031, be difficult for appearing the phenomenon of fracture, strengthen the gluey effect of basic unit board 1 and mounted position under the effect of connecting plate 402, in order to realize the function that chip device conveniently tears, thereby make easy tear the structure be convenient for the customer when verifying the true and false of commodity after, make the use experience of chip device better, can not influence pleasing to the eye, the convenience tears chip device. And finally, finishing the use work of the chip device.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof.
Claims (8)
1. The utility model provides a be used for embedded chip device of packing carton, includes basic board (1), its characterized in that: the surface mounting of basic unit board (1) has commodity two-dimensional code (104), the surface mounting of basic unit board (1) has commodity number (103), the surface mounting of basic unit board (1) has commodity bar code (102), fixed slot (106) have all been seted up on the surface of basic unit board (1), the internally mounted of fixed slot (106) has anti-fake chip (101), pin body (105) are all installed on the surface of basic unit board (1) both sides, the surface of basic unit board (1) top position department is provided with buffering protection machanism (2), the inside of buffering protection machanism (2) contains positioning card slot (201), fixture block (202), protection casing (203), paster layer (204) and gasket layer (205), the surface of basic unit board (1) bottom position department is provided with dampproofing waterproofing mechanism (3), dampproofing waterproofing mechanism (3) are by water blocking layer (301), standing groove (302) and dampproofing waterproofing portion (303) constitution, the surface of basic unit board (1) is provided with and conveniently tears mechanism (4), conveniently tear mechanism (403) inside, and connection plate (401) have convenient tearing mechanism (402).
2. A chip-on-package device according to claim 1, wherein: the surface of basic unit board (1) top position department is provided with protection casing (203) that are used for protecting the surface of anti-fake chip (101), location fixture block (202) that are used for carrying out the location to the position of protection casing (203) are all installed to the bottom of protection casing (203), location draw-in groove (201) have all been seted up to the surface of basic unit board (1), the mutual joint cooperation of the surface of location draw-in groove (201) and location fixture block (202).
3. A chip-on-package device according to claim 2, wherein: the inner wall of protection casing (203) is covered with paster layer (204), the surface on paster layer (204) is bonded with the inner wall of protection casing (203), the inside of protection casing (203) is provided with gasket layer (205), the surface on gasket layer (205) is bonded with the surface on paster layer (204).
4. A chip-on-package device according to claim 1, wherein: dampproofing waterproof portion (303) set up the surface in basic unit's board (1) bottom position department, dampproofing waterproof portion (303) are by waterproof layer (3031), waterproof layer (3032) and breakwater (3033) constitution, standing groove (302) have been seted up on the surface of basic unit's board (1) bottom position department, waterproof layer (3031) are installed to the inner wall of standing groove (302).
5. The embedded chip device for packaging as recited in claim 4, wherein: the waterproof layer (3032) is arranged at the bottom of the waterproof layer (3031), and the surface of the waterproof layer (3032) is adhered to the surface of the bottom of the waterproof layer (301).
6. The embedded chip device for packaging as recited in claim 5, wherein: the surface of waterproof layer (3032) bottom position department is covered with breakwater (3033), the surface of breakwater (3033) is glued with the surface of waterproof layer (3032) bottom position department.
7. A chip-on-package device according to claim 1, wherein: the utility model discloses a base plate (1) is provided with a plurality of layers, and is characterized in that a convenient tearing part (403) is arranged on the surface of the base plate (1), the convenient tearing part (403) is composed of an adhesive layer (4031), an easy tearing layer (4032) and a sealing strip (4033), pull rings (401) are all installed on the surface of the base plate (1), a connecting plate (402) is installed on the surface of the bottom position of the base plate (1), the adhesive layer (4031) is covered on the surface of the bottom position of the connecting plate (402), and the surface of the top position of the adhesive layer (4031) is adhered with the surface of the bottom position of the connecting plate (402).
8. The embedded chip device for packaging as recited in claim 7, wherein: the sealing strip is characterized in that a sealing strip (4033) is arranged on one side, far away from the connecting plate (402), of the adhesive layer (4031), the surface of the sealing strip (4033) is adhered to the surface of the bottom position of the adhesive layer (4031), an easy-tearing layer (4032) is arranged below the sealing strip (4033), and the surface of the easy-tearing layer (4032) is adhered to the surface of the bottom position of the sealing strip (4033).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321792505.7U CN220701872U (en) | 2023-07-10 | 2023-07-10 | Chip embedded device for packaging box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321792505.7U CN220701872U (en) | 2023-07-10 | 2023-07-10 | Chip embedded device for packaging box |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220701872U true CN220701872U (en) | 2024-04-02 |
Family
ID=90442090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321792505.7U Active CN220701872U (en) | 2023-07-10 | 2023-07-10 | Chip embedded device for packaging box |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220701872U (en) |
-
2023
- 2023-07-10 CN CN202321792505.7U patent/CN220701872U/en active Active
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