CN220700200U - Device for producing film with single-sided microstructure - Google Patents
Device for producing film with single-sided microstructure Download PDFInfo
- Publication number
- CN220700200U CN220700200U CN202321791516.3U CN202321791516U CN220700200U CN 220700200 U CN220700200 U CN 220700200U CN 202321791516 U CN202321791516 U CN 202321791516U CN 220700200 U CN220700200 U CN 220700200U
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- film
- producing
- liquid
- type heat
- mold
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- 239000007788 liquid Substances 0.000 claims abstract description 43
- 239000000155 melt Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 5
- 230000005484 gravity Effects 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000012546 transfer Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 238000007711 solidification Methods 0.000 abstract description 5
- 230000008023 solidification Effects 0.000 abstract description 5
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 239000011521 glass Substances 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 238000001816 cooling Methods 0.000 description 9
- 238000001723 curing Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 239000006060 molten glass Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 4
- 229910010271 silicon carbide Inorganic materials 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 3
- NDLPOXTZKUMGOV-UHFFFAOYSA-N oxo(oxoferriooxy)iron hydrate Chemical compound O.O=[Fe]O[Fe]=O NDLPOXTZKUMGOV-UHFFFAOYSA-N 0.000 description 3
- 238000000016 photochemical curing Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- 239000012928 buffer substance Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000005416 organic matter Substances 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000006124 Pilkington process Methods 0.000 description 1
- NCXOIRPOXSUZHL-UHFFFAOYSA-N [Si].[Ca].[Na] Chemical compound [Si].[Ca].[Na] NCXOIRPOXSUZHL-UHFFFAOYSA-N 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- UGFMBZYKVQSQFX-UHFFFAOYSA-N para-methoxy-n-methylamphetamine Chemical compound CNC(C)CC1=CC=C(OC)C=C1 UGFMBZYKVQSQFX-UHFFFAOYSA-N 0.000 description 1
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model discloses a device for producing a film with a single-sided microstructure, which comprises a movable open type heat conduction inorganic die and a liquid or/and molten body output part arranged above the movable open type heat conduction inorganic die, wherein the movable open type heat conduction inorganic die is a semi-open type die with a microstructure on the bottom surface and an open top end; the device also comprises a solidification component for solidifying the output liquid or/and melt and a height leveling component arranged above the movable open type heat conducting inorganic die. The utility model has the advantages of low cost, high reliability, high heat dissipation speed, short demolding time, easy demolding, high production speed and the like, and has a very large application market.
Description
Technical Field
The utility model belongs to the technical field of film processing, and particularly relates to a device for producing a film with a single-sided microstructure.
Background
Many film products currently have a microstructure on one side and a planar structure on the other side. At present, the single-sided planar film with the single-sided structure is manufactured by adopting a liquid resin photo-curing mode or a mode of manufacturing a double-sided planar film and then engraving or a mode of directly manufacturing a die with a full-surrounding structure.
High precision can be achieved when a liquid resin is used for photo-curing, but the resin used in this way requires photo-curing liquid which requires special materials for manufacturing, which is very costly and creates a barrier for large scale applications.
The method mainly comprises the steps of manufacturing the double-plane film and engraving the double-plane film through engraving, wherein if the film is a glass product, the manufacturing of the double-plane film can be performed through manufacturing glass through a float method, then engraving the shape of one surface through engraving, the later step is slower in time, low in precision and high in time cost.
The method directly adopts the mould manufacturing mode of the full-surrounding structure, the mode needs a special mould to manufacture, the cost of the mould is high, and then the casting is needed during production, and the time cost is high.
At present, a film is processed and produced in a rolling mode, but the curing time in the mode is longer, then a die at the lower end is generally an organic matter and has poor heat conductivity, so that the temperature control of the die is difficult, the film is cured by heating or cooling, and the defects of difficult temperature control and long curing time exist; in addition, since the organic matter is generally flexible and is relatively easy to deform and damage, the prior art has the difficult problem of difficult repeated use for large-scale production.
In summary, in order to solve the problems that the above methods have high material cost, high mold cost, difficult temperature control, long curing time, and difficult repeated use of the organic mold, an apparatus for producing a film with a single-sided microstructure is required.
Disclosure of Invention
In order to solve the problems, the utility model discloses a device for producing a film with a single-sided microstructure, which has the advantages of low cost, high reliability, high heat dissipation speed, short demolding time, easy demolding and the like, and has a very large application market.
In order to achieve the above purpose, the technical scheme of the utility model is as follows:
an apparatus for producing a film with a single-sided microstructure comprises a movable open type heat-conducting inorganic die and a liquid or/and molten body output part arranged above the movable open type heat-conducting inorganic die, wherein the movable open type heat-conducting inorganic die is a semi-open type die with a microstructure on the bottom surface and an opening at the top end;
further, the apparatus for producing a film having a single-sided microstructure further includes a solidifying means for solidifying the outputted liquid or/and melt.
Further, the apparatus for producing a film having a single-sided microstructure further includes a height leveling member disposed above the movable open-type thermally conductive inorganic mold.
The movable open type heat conduction inorganic mold is mounted on the conveying component.
Further, the conveying part is a conveying belt or/and a sliding pipe or/and a pulley, the movable open type heat conduction inorganic die is arranged on the conveying belt, and the conveying belt drives the movable open type heat conduction inorganic die to move; or the movable open type heat conduction inorganic die is arranged on a pulley or a slide tube.
Further, the thermal conductivity of the movable open type heat conducting inorganic die is more than or equal to 10 w/(m×k), and the thermal expansion coefficient is smaller than that of the liquid or/and the melt output by the liquid or/and melt output component.
Further, the linear/melt output member employs a slit coating member.
Further, the height leveling component adopts a gravity leveling component or a rolling flattening component.
Further, the cured part is a heat cured part or a cold cured part or a light cured part or a microwave cured part.
Further, relative movement between the movable open thermally conductive inorganic mold and the liquid or/and melt delivery member can occur.
Drawings
Fig. 1 is a schematic structural view of the present utility model.
Fig. 2 is a state of the movable open type heat conductive inorganic mold of the present utility model in cooling.
List of drawing identifiers:
1. a liquid or/and melt output member; 2. a movable open type heat conduction inorganic mold; 3. a height leveling component; 4. a conveyor belt; 5. solidifying the component; 6. liquid or/and melt; 7. water for cooling; 8. basin for holding water.
Description of the embodiments
The present utility model is further illustrated in the following drawings and detailed description, which are to be understood as being merely illustrative of the utility model and not limiting the scope of the utility model.
As shown in fig. 1, an apparatus for producing a film with a single-sided microstructure according to the present embodiment includes a movable open-type heat conductive inorganic mold 2 and a liquid or/and melt output member 1 disposed above the movable open-type heat conductive inorganic mold 2, which is a semi-open-type mold having a microstructure on the bottom surface and an opening at the top end; also included are a solidifying means 5 for solidifying the outgoing liquid or/and melt and a height leveling means 3 arranged above the movable open-type thermally conductive inorganic mould.
The movable open type heat conduction inorganic mold is mounted on the conveying component. In this embodiment, the conveying component may be a conveying belt, the movable open-type heat conducting inorganic mold 2 is installed on the conveying belt 4, and is driven by the conveying belt 4 to move; the removable open thermally conductive inorganic mold may be unloaded from the transfer member. Or the movable open type heat conduction inorganic die is arranged on a pulley or a slide tube.
The liquid or/and melt delivery member 1 may be fixed or movable, and if movable, the movable open heat conductive inorganic mold 2 and the liquid or/and melt delivery member 1 may be relatively movable.
By adopting the scheme, the working process of the device for producing the film with the single-sided microstructure is as follows: the movable open type heat conduction inorganic die 2 is placed on the conveyor belt 4, then liquid or/and melt 6 to be formed into a film is poured on the movable open type heat conduction inorganic die 2 through the linear liquid or/and melt output component 1, the movable open type heat conduction inorganic die 2 is placed on the conveyor belt to move when pouring, the whole large-surface movable open type heat conduction inorganic die can be poured quickly, meanwhile, the pouring film thickness can be controlled by controlling the relative moving speed of the movable open type heat conduction inorganic die and the movable open type heat conduction inorganic die, after pouring, the upper surface of the film is leveled through the subsequent height leveling component 3, then the liquid film is solidified through the subsequent solidifying component 4, after the film is solidified, the film is taken down from the die, and then the die is reused. The mold of the present utility model is a semi-open mold having a microstructure on the bottom surface and an opening at the top, for example, a flat-convex fresnel lens can be manufactured by a semi-open mold, and the mold can be manufactured by a bottom surface microstructure and a top surface mold because the mold has a flat convex structure, a flat surface and a microstructure on one side, and the thickness of the flat surface has little influence on the imaging of the lens. It is needless to say that the half-open mold requires that the upper opening be placed horizontally or at an angle to ensure that a specific angle of a plane to the microstructure is satisfied, wherein the upper opening is required to be placed horizontally in the case of a fresnel lens. The half-open die is adopted, so that the cost of half of the die is saved, and the cost is saved; meanwhile, as the mold does not need to be closed or opened, the cost of the production process is saved, namely the time cost is saved. The microstructure comprises an array form, a radial form or a plurality of annular forms, and a concave or convex structure comprising a triangular, square, trapezoid, elliptic, circular or annular geometric shape, which is determined according to the design requirement of the surface texture of a product.
Further, the thermal conductivity of the movable open type thermal conductive inorganic mold in this embodiment is greater than or equal to 10 w/(m×k), and the thermal expansion coefficient is smaller than the thermal expansion coefficient of the liquid or/and the melt output by the liquid or/and melt output component, and in this embodiment, the movable open type thermal conductive inorganic mold can float on the water surface, so that the movable open type thermal conductive inorganic mold can be placed on the water surface to dissipate heat, and the film and the mold are separated; or the movable open type heat conduction inorganic die is inverted, heat dissipation is carried out by flushing with water, the film and the die are separated by utilizing gravity, a buffer substance is placed at the lower end of the die, the film is placed to fall and damage, and the buffer substance can be a water pool or a sponge or other similar substances with a buffer effect. When the mold is a metal mold with a low thermal expansion coefficient, after the pouring and leveling of the initial mold are finished, the movable open type heat conduction inorganic mold can be floated on water and quickly cooled by water cooling, as shown in fig. 2, 7 is water for cooling in fig. 2, and 8 is a basin for containing water. Therefore, the thermal expansion coefficient of the movable open type heat conduction inorganic die is smaller than that of the film, when the temperature is reduced and solidified, the external inorganic die stretches small, and the internal glass stretches large, so that the glass and the die can be separated well and quickly. Meanwhile, the cooling speed is high due to water cooling, so that the curing time is saved, and the film and the die can be quickly separated. The die can be reused rapidly, the number of the dies is reduced, and the cost is reduced.
The movable open type heat conduction inorganic die is made of silicon carbide or aluminum oxide with low thermal expansion coefficient and high heat conduction coefficient, and the die is made of inorganic materials and can be separated from printed devices, so that the die can be reused for multiple times, and the loss is small. The melt in this example may be glass, resin, etc., and the soda-lime-silica glass has a thermal expansion coefficient of about 9X 10 -6 Silicon carbide has a thermal expansion coefficient equal to 2.39X10 -6 The thermal expansion coefficient of silicon carbide is far smaller than that of sodium-calcium-silicon glass; if the glass liquid temperature is about 330 ℃, the glass liquid is cooled to the room temperature of 30 ℃ and the shrinkage rate with the die is about 0.0012, so that the microstructure size of 10 microns can generate a spacing of 0.012 microns which is far greater than the spacing between molecules, and the distance is aboveThe molecular forces between the mold and the glass are almost negligible, making it easier to separate. Wherein the silicon carbide has a thermal expansion coefficient equal to 2.39X10 -6 /K。
Further, the linear/melt output member of the present embodiment employs a slit coating member. One type of spin coater previously used is a slot coater type coating method, which can uniformly and linearly coat a liquid or/and a molten mass on the surface of an object, and can adjust the coating thickness by controlling the relative moving speed of the object surface and the slot coater.
Further, the height leveling component in this embodiment adopts a gravity leveling component or a roll leveling component. When the viscosity of the liquid or/and the melt is relatively high, the roll pressing and flattening component is adopted, and the liquid or/and the melt which is poured into the initial die can be extruded continuously to form a plane by a smooth and uniform roll. When the viscosity of the liquid or/and the melt is small, a gravity leveling component can be adopted, the leveling component is used for adjusting the angle of the upper surface of the die, the angles indicated on the openings of the die can be adjusted by adjusting the heights of the four corners of the die through screws, the specific self-leveling mode ensures that the upper surface of the die is at a certain angle, and then the upper surface can be self-leveled.
Further, the cured part according to the present embodiment is a heat cured part or a cold cured part or a light cured part or a microwave cured part. If the silica gel is needed to be heated and cured, the curing part is a heat curing part, and the heating part can be used for realizing the heating, so that the expensive photosensitive resin can be not used, and the material cost is saved; when the film is glass, the film needs to be cooled and solidified, at the moment, the cold solidification part can adopt air conditioning refrigeration or watering refrigeration, and the cooling can be performed more quickly than the heat dissipation in the die, so that the time and the cost are saved, and the expensive photosensitive resin can be not used, so that the material cost is also saved; when the liquid or/and the melt is/are solidified by light, for example, 420nm ultraviolet light is adopted for solidification at present; when the liquid or/and the melt is solidified by microwaves, for example, the microwave oven is used for solidification, the specific microwave absorbing material can be prepared by doping ferric oxide powder into common resin or silica gel or PMMA or PDMS or other organic matters or metal, and the ferric oxide powder is very cheap, so that expensive photosensitive resin can be not used, and the material cost is greatly saved.
Further, when the curing component 5 is a thermosetting component, the device needs to be matched with thermosetting liquid or/and melt to cure silica gel; when the solidifying part is a microwave solidifying part, the device needs matched microwave solidifying liquid or/and melt, such as resin containing ferric oxide powder; when the curing component is a photocurable component, the device requires a suitable photocurable liquid or/and melt, such as a photosensitive resin.
When the device is used, molten glass or organic liquid is output onto a semi-open mold through a linear/molten body output part, then the mold levels the upper surface of the molten glass or organic liquid by moving to the lower part of a height leveling part, and then the molten glass or organic liquid is solidified through a solidifying part; or taking down the molten glass or organic liquid leveling the upper surface and the mould at the lower end, and putting the molten glass or organic liquid leveling the upper surface and the mould at the lower end into a water tank for cooling and solidification.
It should be noted that the foregoing merely illustrates the technical idea of the present utility model and is not intended to limit the scope of the present utility model, and that a person skilled in the art may make several improvements and modifications without departing from the principles of the present utility model, which fall within the scope of the claims of the present utility model.
Claims (10)
1. An apparatus for producing a film having a single-sided microstructure, comprising a movable open-type heat-conducting inorganic mold having a microstructure on the bottom surface and a semi-open mold having an open top end, and a liquid or/and melt delivery member disposed above the mold.
2. An apparatus for producing a film having a single-sided microstructure according to claim 1, further comprising a solidifying means for solidifying the outputted liquid or/and melt.
3. An apparatus for producing a film having a single-sided microstructure according to claim 2, wherein the cured part is a heat cured part or a cold cured part or a light cured part or a microwave cured part.
4. A device for producing a film having a single-sided microstructure according to claim 1 or 2 or 3, further comprising a height leveling member provided above the movable open-type heat conductive inorganic mold.
5. An apparatus for producing a film having a single-sided microstructure according to claim 4, wherein the height leveling member is a gravity leveling member or a roll leveling member.
6. An apparatus for producing a film having a single-sided microstructure according to claim 1 wherein the movable open type heat conductive inorganic mold is mounted on a transfer member.
7. The apparatus for producing a film having a single-sided microstructure according to claim 6, wherein the conveying member is a conveyor belt or/and a slide tube or/and a pulley, and the movable open type heat conductive inorganic mold is mounted on the conveyor belt and is moved by the conveyor belt; or the movable open type heat conduction inorganic die is arranged on a pulley or a slide tube.
8. An apparatus for producing a film having a single-sided microstructure according to claim 1 wherein the movable open thermally conductive inorganic die and the liquid or/and melt delivery member are capable of relative movement.
9. The apparatus for producing a film having a single-sided microstructure according to claim 1, wherein the thermal conductivity of the movable open-type thermally conductive inorganic mold is 10 w/(m x k) or more and the thermal expansion coefficient is smaller than the thermal expansion coefficient of the liquid or/and the melt outputted from the liquid or/and melt outputting means.
10. An apparatus for producing a film having a single-sided microstructure according to claim 1, wherein the liquid or/and melt outputting means is a slit coating means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321791516.3U CN220700200U (en) | 2023-07-10 | 2023-07-10 | Device for producing film with single-sided microstructure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321791516.3U CN220700200U (en) | 2023-07-10 | 2023-07-10 | Device for producing film with single-sided microstructure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220700200U true CN220700200U (en) | 2024-04-02 |
Family
ID=90439681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321791516.3U Active CN220700200U (en) | 2023-07-10 | 2023-07-10 | Device for producing film with single-sided microstructure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220700200U (en) |
-
2023
- 2023-07-10 CN CN202321791516.3U patent/CN220700200U/en active Active
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