CN220691973U - Novel bonding tool for semiconductor - Google Patents
Novel bonding tool for semiconductor Download PDFInfo
- Publication number
- CN220691973U CN220691973U CN202322199872.2U CN202322199872U CN220691973U CN 220691973 U CN220691973 U CN 220691973U CN 202322199872 U CN202322199872 U CN 202322199872U CN 220691973 U CN220691973 U CN 220691973U
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- China
- Prior art keywords
- circular boss
- fixing seat
- semiconductor
- cylinder
- workpiece
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 64
- 239000012790 adhesive layer Substances 0.000 claims abstract description 21
- 239000003292 glue Substances 0.000 claims description 20
- 239000010410 layer Substances 0.000 claims description 8
- 239000013078 crystal Substances 0.000 abstract description 11
- 239000000853 adhesive Substances 0.000 abstract description 9
- 230000001070 adhesive effect Effects 0.000 abstract description 9
- 239000011248 coating agent Substances 0.000 abstract description 5
- 238000000576 coating method Methods 0.000 abstract description 5
- 230000006355 external stress Effects 0.000 abstract description 5
- 238000005520 cutting process Methods 0.000 description 7
- 238000010030 laminating Methods 0.000 description 6
- 238000003754 machining Methods 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 238000010073 coating (rubber) Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Abstract
The application relates to the field of semiconductor processing, in particular to a novel bonding tool for a semiconductor. The fixing seat is characterized in that the fixing seat is provided with a circular boss, the outer side face of the circular boss is a datum plane propped against the end face of the semiconductor workpiece, the semiconductor workpiece is propped against the outer side face of the circular boss, a gap is reserved between the semiconductor workpiece and the fixing seat, an adhesive layer is reserved in the gap, and a gap is reserved between the adhesive layer and the circular boss. The round boss is arranged on the end face of the fixing seat, the adhesive is coated around the round boss, a plane is provided for fixing the workpiece as a bonding reference when the semiconductor workpiece is bonded with the tool, and the workpiece is bonded with the reference plane, so that the workpiece can be ensured to be in a flat bonding state. And only the adhesive layer is coated in the gap between the annular boss and the fixed seat, and the distance is reserved between the adhesive layer and the circular boss, so that the coating quantity is greatly reduced, the generation of external stress on the bonding plane is reduced, the bonding quality of the semiconductor crystal and the bonding tool is ensured, and huge economic loss is avoided.
Description
Technical Field
The application relates to the field of semiconductor processing, in particular to a novel bonding tool for a semiconductor.
Background
When the semiconductor industry processes semiconductor crystals, the semiconductor crystals are required to be fixed on metal tools, the semiconductor crystals are processed by adopting a method of directly fixing the sections, and manual operation is required to glue the semiconductor crystals and the metal tools.
However, the surface of the conventional semiconductor crystal and the surface of the bonding tool are smooth planes, and the adhesive is extruded unevenly by directly butting and bonding the two surfaces, so that the semiconductor crystal is not placed flatly. If the glue is unevenly spread in a large area, external stress is generated on the bonding plane of the semiconductor crystal, and under the condition, the heat is uneven due to the continuous degumming, so that the semiconductor crystal is finally cracked, and huge economic loss is caused.
Disclosure of Invention
The utility model provides a novel bonding tool for a semiconductor, which provides the following technical scheme for realizing better bonding effect:
the utility model relates to a novel bonding tool for a semiconductor, which comprises a fixed seat and is characterized in that the fixed seat is provided with a circular boss, the outer side surface of the circular boss is a datum plane propped against the end surface of a semiconductor workpiece, the semiconductor workpiece is propped against the outer side surface of the circular boss, a gap is reserved between the semiconductor workpiece and the fixed seat, a glue layer is reserved in the gap, and a space is reserved between the glue layer and the circular boss.
Through adopting above-mentioned technical scheme, circular boss locates on the terminal surface of fixing base, and the viscose is scribbled around circular boss, and when the semiconductor workpiece laminating frock, for the work piece is fixed to provide a plane as laminating benchmark, work piece and reference surface laminating can guarantee that the work piece is in smooth bonding state. And only the adhesive layer is coated in the gap between the annular boss and the fixing seat, and the distance is reserved between the adhesive layer and the circular boss, so that the coating quantity is reduced, the generation of external stress on the bonding plane is reduced, the bonding quality of the semiconductor crystal and the bonding tool is ensured, and huge economic loss is avoided.
Further, the fixing seat is a flat cylinder, the round boss is located on one end face of the fixing seat, a centering hole for positioning the semiconductor workpiece is formed in the center of the round boss, the end face of the round boss is a reference face, the adhesive layer is located around the round boss, and the distance is located between the adhesive layer and the side surface of the round boss.
Through adopting above-mentioned technical scheme, the fixing base is the oblate cylinder, and the size is great, and work piece excircle size is less than the fixing base diameter, and after semiconductor work piece and this bonding frock laminating, more be fit for cutting the terminal surface of work piece. The centering hole can better determine the center position of the semiconductor workpiece adhered to the circular boss, and the workpiece adhesion bias is prevented. The glue film is scribbled around circular boss, and is higher than the fixing base terminal surface, and the semiconductor work piece of being convenient for is firm with this bonding frock laminating. And a space is reserved between the adhesive layer on the surface of the fixing seat and the circular boss, and the steel wire cutting part is placed after the machining is finished.
Further, the fixing seat is in a ring shape, a cylinder serving as a support is concentrically arranged in the fixing seat, and the cylinder is in sliding fit with the fixing seat. The glue film is located the one end of cylinder, under operating condition, and the one end of cylinder that the glue film corresponds is sunken in the corresponding terminal surface of fixing base for this end of fixing base is circular boss promptly, and this terminal surface of fixing base is the reference surface promptly, and there is annular groove the fixing base one end inboard that circular boss corresponds, and annular groove one side is linked together with the fixing base inner chamber, and this annular groove is the clearance promptly.
Through adopting above-mentioned technical scheme, the fixing base is the ring shape, and the size is less, and work piece excircle size is greater than the fixing base diameter, and after semiconductor work piece and this bonding frock laminating worker, more be fit for cutting the terminal surface of semiconductor work piece. The fixing seat is in sliding fit with the cylinder, so that the workpiece can be conveniently installed and removed before and after machining. The adhesive is coated at one end of the cylinder, and the adhesive layer is higher than the end face of the fixing seat, so that the adhesive is convenient to adhere. And a space is reserved between the circular boss and the adhesive layer in the inner cavity of the fixing seat, and the circular boss is used for placing steel wire cutting parts after the machining is finished.
Further, the thickness of the cylinder is smaller than the thickness of the fixed seat and larger than the thickness of the fixed seat minus the annular groove.
By adopting the technical scheme, the cylindrical end face is lower than the end face of the circular boss and is positioned on the annular groove, and a gap for gluing can be formed.
Further, the cylinder one end that keeps away from the glue film is provided with the spliced pole with one heart, and the spliced pole one end that keeps away from the cylinder passes the fixing base and stretches out outside.
Through adopting above-mentioned technical scheme, the cylinder still contains the spliced pole that stretches out, more conveniently fixes this bonding frock on processing equipment, the processing of being convenient for.
In summary, the beneficial effects of the application are as follows:
the round boss is arranged on the end face of the fixing seat, the adhesive is coated around the round boss, a plane is provided for fixing the workpiece as a bonding reference when the semiconductor workpiece is bonded with the tool, and the workpiece is bonded with the reference plane, so that the workpiece can be ensured to be in a flat bonding state. And the adhesive layer is only coated in the gap between the annular boss and the fixing seat, and the distance is reserved between the adhesive layer and the circular boss, so that the coating quantity is greatly reduced, the generation of external stress on the bonding plane is reduced, the bonding quality of the semiconductor crystal and the bonding tool is ensured, and huge economic loss is avoided.
Drawings
FIG. 1 is a schematic diagram of the structure of an embodiment 1 of the present utility model;
FIG. 2 is a schematic structural diagram of embodiment 2 of the present utility model;
fig. 3 is a cross-sectional view of embodiment 2 of the present utility model.
In the figure: 1. a fixing seat; 2. a circular boss; 3. a centering hole; 4. a cylinder; 5. a connecting column; 6. an annular groove.
Detailed Description
The present application is described in further detail below in conjunction with fig. 1-3.
The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.
Example 1
Referring to fig. 1, the novel bonding fixture for the semiconductor comprises a fixing base 1, wherein the fixing base 1 is provided with a circular boss 2, the outer side surface of the circular boss 2 is a reference surface propped against the end surface of a semiconductor workpiece, the fixing base 1 is a flat cylinder, the circular boss 2 is positioned on one end surface of the fixing base 1, the center of the circular boss 2 is provided with a centering hole 3 for positioning the semiconductor workpiece, the end surface of the circular boss 2 is the reference surface, and an adhesive layer is positioned around the circular boss 2. The round boss is arranged on the end face of the fixing seat, the adhesive is coated around the round boss, a plane is provided for fixing the workpiece as a bonding reference when the semiconductor workpiece is bonded with the tool, and the workpiece is bonded with the reference plane, so that the workpiece can be ensured to be in a flat bonding state.
The semiconductor workpiece is abutted against the outer side face of the circular boss 2, a gap is formed between the semiconductor workpiece and the fixing seat 1, a glue layer is arranged in the gap, and a space is formed between the glue layer and the circular boss 2. The distance is between the glue layer and the side surface of the circular boss 2. The adhesive layer is only coated in the gap between the annular boss and the fixing seat, and the distance is reserved between the adhesive layer and the circular boss, so that the amount of paint is greatly reduced, and the generation of external stress on the bonding plane is reduced.
The centering hole 3 can better determine the center position of the semiconductor workpiece adhered to the circular boss 2, and the adhesion offset is prevented. The glue film is around circular boss 2, and is higher than circular boss 2, so semiconductor workpiece contacts the rubber coating earlier when this bonding frock is laminated, extrudees the rubber coating to all around, and the interval between the rubber coating that leaves in advance and circular boss 2 can be convenient for cut the work piece. The fixing base 1 is a flat cylinder, the size is larger, the size of the outer circle of the workpiece is smaller than the diameter of the fixing base 1, and after the semiconductor workpiece is attached to the bonding tool of the embodiment, the end face of the workpiece can be machined.
The working principle of the embodiment is as follows: when the bonding tool of the embodiment is used for processing a semiconductor workpiece, the fixing seat 1 made of metal is selected. Fixing the end face of the fixing base 1 far away from the circular boss 2 on processing equipment, coating adhesive on the periphery of the circular boss 2 of the fixing base 1, and attaching a semiconductor workpiece to the end face of the circular boss 2 until the semiconductor workpiece is abutted against the circular boss 2. Waiting for the glue to solidify, the end face of the semiconductor workpiece can be cut. After cutting, the steel wires are stretched into the reserved space between the adhesive layer and the circular boss 2, and the semiconductor workpiece is cut.
Example 2
This embodiment differs from embodiment 1 in that: the fixing seat 1 of this embodiment is in a circular ring shape, the inside of which is sleeved with a cylinder 4, and the end face of the fixing seat with an annular groove is a circular boss, namely a reference surface.
Referring to fig. 2-3, a cylinder 4 serving as a support is concentrically arranged in the fixing base 1, and the cylinder 4 is in sliding fit with the fixing base 1. The glue film is located the one end of cylinder 4, under operating condition, the one end of cylinder 4 that scribbles the glue film correspondence is concave in fixing base 1's corresponding terminal surface for fixing base 1's this end is circular boss 2 promptly, and fixing base 1's this terminal surface is the reference surface promptly, and circular boss 2 corresponds fixing base 1 one end inboard has annular groove 6, and annular groove 6 one side is linked together with fixing base 1 inner chamber, and this annular groove 6 is the clearance promptly.
The thickness of the cylinder 4 is smaller than the thickness of the fixing seat 1 and is larger than the thickness of the annular groove 6 subtracted from the fixing seat 1. One end of the cylinder 4 far away from the adhesive layer is concentrically provided with a connecting column 5, and one end of the connecting column 5 far away from the cylinder 4 penetrates through the fixing seat 1 to extend outwards. The fixing seat 1 is in a circular ring shape, the size is smaller, the size of the outer circle of the workpiece is larger than the diameter of the fixing seat 1, and the outer circle of the workpiece can be processed after the semiconductor workpiece is bonded with the bonding tool.
The working principle of the embodiment is as follows: when the bonding tool of the embodiment is used for processing a semiconductor workpiece, the 1 position of the fixing seat made of nylon material is selected to be in sliding fit with the cylinder 4 made of metal material, and the bonding tool is assembled. Before machining, fixing the connecting column 5 on machining equipment, coating the surface of the cylinder 4 with adhesive, and attaching the semiconductor workpiece to be machined to the end face of the adhesive until the semiconductor workpiece abuts against the circular boss 2. And waiting for the gluing and solidification, and cutting the excircle of the semiconductor workpiece. After cutting, the steel wires are stretched into the reserved space between the adhesive layer and the circular boss 2, and the semiconductor workpiece is cut.
In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to specific circumstances.
While the utility model has been described in connection with specific embodiments, it will be apparent to those skilled in the art that the description is intended to be illustrative and not limiting in scope. Various modifications and alterations of this utility model will occur to those skilled in the art in light of the spirit and principles of this utility model, and such modifications and alterations are also within the scope of this utility model.
Claims (5)
1. A novel bonding tool for semiconductors comprises a fixed seat (1); the fixing seat (1) is provided with a circular boss (2), the outer side surface of the circular boss (2) is a reference surface propped against the end surface of a semiconductor workpiece, the semiconductor workpiece is propped against the outer side surface of the circular boss (2), a gap is reserved between the semiconductor workpiece and the fixing seat (1), a glue layer is reserved in the gap, and a space is reserved between the glue layer and the circular boss (2).
2. The novel bonding tool for semiconductors according to claim 1, wherein the fixing base (1) is a flat cylinder, the circular boss (2) is located on one end face of the fixing base (1), a centering hole (3) for positioning a semiconductor workpiece is formed in the center of the circular boss (2), the end face of the circular boss (2) is a reference surface, and the adhesive layer is located around the circular boss (2); the distance is between the glue layer and the side surface of the circular boss (2).
3. The novel bonding tool for the semiconductor according to claim 1, wherein the fixing seat (1) is in a circular ring shape, a cylinder (4) serving as a support is concentrically arranged in the fixing seat (1), and the cylinder (4) is in sliding fit with the fixing seat (1); the glue film is located one end of cylinder (4), and under operating condition, the one end of cylinder (4) that the glue film corresponds is sunken in the corresponding terminal surface of fixing base (1), makes this end of fixing base (1) just be circular boss (2), and this terminal surface of fixing base (1) just be the reference surface, and there is annular groove (6) fixing base (1) one end inboard that circular boss (2) corresponds, and annular groove (6) one side is linked together with fixing base (1) inner chamber, and this annular groove (6) just be the clearance.
4. The novel bonding tool for semiconductors according to claim 3, wherein the thickness of the cylinder (4) is smaller than the thickness of the fixing seat (1) and larger than the thickness of the annular groove subtracted from the fixing seat (1).
5. The novel bonding tool for semiconductors according to claim 4, wherein one end of the cylinder (4) far away from the adhesive layer is concentrically provided with a connecting column (5), and one end of the connecting column (5) far away from the cylinder (4) penetrates through the fixing seat (1) to extend out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322199872.2U CN220691973U (en) | 2023-08-16 | 2023-08-16 | Novel bonding tool for semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322199872.2U CN220691973U (en) | 2023-08-16 | 2023-08-16 | Novel bonding tool for semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220691973U true CN220691973U (en) | 2024-03-29 |
Family
ID=90371543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322199872.2U Active CN220691973U (en) | 2023-08-16 | 2023-08-16 | Novel bonding tool for semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220691973U (en) |
-
2023
- 2023-08-16 CN CN202322199872.2U patent/CN220691973U/en active Active
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| GR01 | Patent grant |