CN220690279U - Temperature acquisition circuit and flexible circuit board - Google Patents
Temperature acquisition circuit and flexible circuit board Download PDFInfo
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- CN220690279U CN220690279U CN202321816053.1U CN202321816053U CN220690279U CN 220690279 U CN220690279 U CN 220690279U CN 202321816053 U CN202321816053 U CN 202321816053U CN 220690279 U CN220690279 U CN 220690279U
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- 230000005540 biological transmission Effects 0.000 claims abstract description 62
- 230000000087 stabilizing effect Effects 0.000 claims description 98
- 239000003990 capacitor Substances 0.000 claims description 54
- 239000003351 stiffener Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 7
- 239000010410 layer Substances 0.000 description 30
- 239000000463 material Substances 0.000 description 13
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 239000011241 protective layer Substances 0.000 description 5
- 230000006641 stabilisation Effects 0.000 description 4
- 238000011105 stabilization Methods 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- IBVAQQYNSHJXBV-UHFFFAOYSA-N adipic acid dihydrazide Chemical compound NNC(=O)CCCCC(=O)NN IBVAQQYNSHJXBV-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
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Abstract
The utility model discloses a temperature acquisition circuit and a flexible circuit board, wherein the temperature acquisition circuit comprises a connector, a channel expansion chip and at least one temperature acquisition module, a first end of the connector is used for being electrically connected with a data transmission end of a BMS system, and a second end of the connector is electrically connected with an uplink data transmission end of the channel expansion chip; the downlink data transmission end of the channel expansion chip is electrically connected with the data acquisition end of the temperature acquisition module corresponding to the downlink data transmission end. The utility model can enable the channel expansion chip to upload the temperature signal acquired by the temperature acquisition module to the BMS system through the connector, reduce the occurrence of the condition that the BMS hardware architecture needs to be redesigned due to the fact that the channel expansion chip is required to be integrated in the BMS hardware architecture to increase the temperature acquisition channel of the battery system, and increase the temperature acquisition channel of the battery system while reducing the development cost of the BMS hardware architecture.
Description
Technical Field
The utility model relates to the technical field of new energy, in particular to a temperature acquisition circuit and a flexible circuit board.
Background
The power battery system is used as a key part for providing main energy for the new energy automobile, the installed amount of the power battery system is continuously increased along with the rapid development of the new energy automobile, the types of used battery cells are also increased, and in order to simultaneously meet the requirements of high specific energy, high fast charge energy and high safety performance, a large cylindrical battery system (such as a 46-system large cylindrical battery cell) is widely applied to the power battery system.
However, most of the mature BMS (Battery Management System ) hardware architecture is designed for square battery systems, and the reserved temperature collection channels are fewer, so that the full coverage of the temperature collection points cannot be realized when the system is applied to a large cylindrical battery system. In order to meet the requirement of the large cylindrical battery system on temperature acquisition, the BMS hardware architecture needs to be redesigned for the large cylindrical battery system, such as an MCU chip with more temperature acquisition interfaces. However, it is found in practice that, not only is the model of the MCU chip re-selected and the corresponding BMS hardware circuit board re-designed, resulting in a larger design workload of the BMS hardware architecture, but also the re-designed BMS hardware architecture is re-tested, resulting in a higher development cost of the BMS hardware architecture.
It is important to reduce the development cost of the BMS hardware architecture and to increase the temperature acquisition channels of the battery system.
Disclosure of Invention
The utility model aims to solve the technical problem of providing a temperature acquisition circuit and a flexible circuit board, which can reduce the development cost of a BMS hardware architecture and simultaneously meet the requirement of increasing a temperature acquisition channel of a battery system.
In order to solve the technical problem, a first aspect of the present utility model discloses a temperature acquisition circuit, which includes a connector, a channel expansion chip and at least one temperature acquisition module, wherein:
the first end of the connector is used for being electrically connected with a data transmission end of the BMS system, and the second end of the connector is electrically connected with an uplink data transmission end of the channel expansion chip; the downlink data transmission end of the channel expansion chip is electrically connected with the data acquisition end of the temperature acquisition module corresponding to the downlink data transmission end;
the channel expansion chip is used for receiving the temperature signal acquired by the temperature acquisition module and transmitting the temperature signal to the connector;
the connector is used for transmitting the temperature signal to the BMS system.
As an alternative embodiment, in the first aspect of the present utility model, the third end of the connector is used for electrically connecting the channel switching control end of the BMS system, and the fourth end of the connector is electrically connected with the channel switching control end of the channel expansion chip.
As an optional implementation manner, in the first aspect of the present utility model, the temperature acquisition circuit further includes a power supply voltage stabilizing module, where:
the power input end of the power supply voltage stabilizing module is used for being electrically connected with a power supply, and the power output end of the power supply voltage stabilizing module is electrically connected with the power input end of the temperature acquisition module.
As an alternative embodiment, in the first aspect of the present utility model, the temperature acquisition module includes a temperature sensor and a bias resistor, wherein:
the first end of the bias resistor is electrically connected with the power output end of the power supply voltage stabilizing module, the second end of the bias resistor is electrically connected with the first end of the temperature sensor and the downlink data transmission end of the channel expansion chip, and the second end of the temperature sensor is used for being grounded.
As an optional implementation manner, in the first aspect of the present utility model, the temperature acquisition module further includes a first voltage stabilizing capacitor, where:
the first end of the first voltage stabilizing capacitor is electrically connected with the second end of the bias resistor, the first end of the temperature sensor and the downlink data transmission end of the channel expansion chip, and the second end of the first voltage stabilizing capacitor is used for being grounded.
As an optional implementation manner, in the first aspect of the present utility model, the power supply voltage stabilizing module includes a voltage stabilizing chip, a second voltage stabilizing capacitor, and a third voltage stabilizing capacitor, where:
the power input end of the voltage stabilizing chip is electrically connected with the first end of the second voltage stabilizing capacitor, the power input end of the voltage stabilizing chip is also used for being electrically connected with a power supply, the power output end of the voltage stabilizing chip is electrically connected with the first end of the third voltage stabilizing capacitor and the power input end of the temperature acquisition module, and the second end of the second voltage stabilizing capacitor and the second end of the third voltage stabilizing capacitor are used for being grounded.
As an optional implementation manner, in the first aspect of the present utility model, the temperature acquisition circuit further includes a fourth voltage stabilizing capacitor, where:
the power input end of the channel expansion chip is electrically connected with the first end of the fourth voltage stabilizing capacitor, the power input end of the channel expansion chip is also used for being electrically connected with the power supply, and the second end of the fourth voltage stabilizing capacitor is used for being grounded.
The second aspect of the utility model discloses a flexible circuit board comprising the temperature acquisition circuit disclosed in the first aspect of the utility model.
As an optional implementation manner, in the second aspect of the present utility model, the flexible circuit board further includes a flexible circuit board main body, at least one wire is disposed in the flexible circuit board main body, the wire is disposed in an extending direction of the flexible circuit board main body in an extending manner, and temperature collecting modules in the temperature collecting circuit are disposed at intervals along the extending direction of the flexible circuit board main body;
one end of the wire is connected to the data acquisition end of the temperature acquisition module corresponding to the wire, and the other end of the wire is connected to the downlink data transmission end of the channel expansion chip in the temperature acquisition circuit.
In a second aspect of the present utility model, as an optional implementation manner, the flexible circuit board further includes a stiffener, the stiffener is disposed at one end of the flexible circuit board main body, and the connector and the channel expansion chip in the temperature acquisition circuit are both disposed on the stiffener.
In a second aspect of the present utility model, the flexible circuit board body includes a base material layer, a glue layer, and a circuit protection layer stacked in order, and the wires are disposed between the glue layer and the circuit protection layer.
Compared with the prior art, the embodiment of the utility model has the following beneficial effects:
in the embodiment of the utility model, the temperature acquisition circuit comprises a connector, a channel expansion chip and at least one temperature acquisition module, wherein: the first end of the connector is used for being electrically connected with the data transmission end of the BMS system, and the second end of the connector is electrically connected with the uplink data transmission end of the channel expansion chip; the downlink data transmission end of the channel expansion chip is electrically connected with the data acquisition end of the temperature acquisition module corresponding to the downlink data transmission end; the channel expansion chip is used for receiving the temperature signals acquired by the temperature acquisition module and transmitting the temperature signals to the connector; and a connector for transmitting the temperature signal to the BMS system. Therefore, by implementing the utility model, the channel expansion chip can upload the temperature signal acquired by the temperature acquisition module to the BMS system through the connector, the condition that the BMS hardware architecture needs to be redesigned due to the fact that the channel expansion chip is integrated in the BMS hardware architecture to increase the temperature acquisition channel of the battery system is reduced, the development cost of the BMS hardware architecture is reduced, the temperature acquisition channel of the battery system is increased, loose coupling between the channel expansion chip and the BMS system is realized, and the flexibility of temperature acquisition of the battery system and the reusability of a designed temperature acquisition circuit are improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a temperature acquisition structure according to an embodiment of the present utility model;
FIG. 2 is a schematic diagram of another temperature acquisition circuit according to an embodiment of the present utility model;
fig. 3 is a schematic structural view of a BMS slave unit according to an embodiment of the present utility model;
fig. 4 is a schematic structural diagram of a flexible circuit board according to an embodiment of the present utility model;
fig. 5 is a schematic structural view of another flexible circuit board according to an embodiment of the present utility model.
Detailed Description
For a better understanding and implementation, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be noted that, unless explicitly specified and limited otherwise, the term "electrically connected" in the description of the utility model and in the claims and in the above-mentioned figures should be understood in a broad sense, for example, as a fixed electrical connection, as a removable electrical connection, or as an integral electrical connection; can be mechanically and electrically connected or can be mutually communicated; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. Furthermore, the terms first, second and the like in the description and in the claims of the utility model and in the foregoing figures, are used for distinguishing between different objects and not for describing a particular sequential order, and are not intended to cover any exclusive inclusion. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
Example 1
Referring to fig. 1, fig. 1 is a schematic structural diagram of a temperature acquisition circuit according to an embodiment of the utility model. The temperature acquisition circuit described in fig. 1 may be integrated in a flexible circuit board or a rigid circuit board corresponding to a battery system to meet the temperature acquisition requirement of the battery system, for example, in a flexible circuit board corresponding to a large cylindrical battery system to meet the temperature acquisition requirement of the large cylindrical battery system, or may be integrated in a flexible circuit board or a rigid circuit board corresponding to any other device having the temperature acquisition requirement to meet the temperature acquisition requirement of the device, such as a motor, a folding mobile phone, an air conditioning system, etc., which is not limited in the embodiments of the present utility model.
As shown in fig. 1, the temperature acquisition circuit may include a connector J1, a channel expansion chip U1, and at least one temperature acquisition module M1, wherein:
the first end of the connector J1 is used for electrically connecting the data transmission end (such as GPIO0 in fig. 2) of the BMS system, and the second end of the connector J1 is electrically connected with the uplink data transmission end (such as DA in fig. 2) of the channel expansion chip U1; the downstream data transmission end of the channel expansion chip U1 is electrically connected with the data acquisition end of the temperature acquisition module M1 corresponding to the downstream data transmission end, and optionally, the downstream data transmission end of the channel expansion chip U1 corresponds to the temperature acquisition module M1 one by one;
the channel expansion chip U1 is used for receiving the temperature signal acquired by the temperature acquisition module M1 and transmitting the temperature signal to the connector J1; a connector J1 for transmitting a temperature signal to the BMS system.
Alternatively, the channel expansion chip U1 may be an I/O expansion chip, such as a TMUX4052 chip, so as to implement an I/O interface expansion of the BMS system, and transmit a temperature signal through the I/O interface.
Optionally, the first end of the connector J1 may be connected to any one or more layers of architecture in the BMS system, that is, one or more of a BMS slave unit for managing battery cells, a BMS master unit for managing a battery cluster, and a BMS master unit for managing a battery array.
Preferably, as shown in fig. 3, the first end of the connector J1 is connected to a BMS slave unit, and the BMS slave unit may include a BMS slave chip U2 and a peripheral circuit thereof, and optionally, the BMS slave chip U2 may be a multi-channel battery controller, such as a multi-channel lithium ion battery controller MC33771.
Optionally, the connector J1 may be further used to connect any other management and control system corresponding to the device with a temperature acquisition requirement, so as to upload a temperature signal corresponding to the device to the corresponding management and control system.
Therefore, the implementation of the temperature acquisition circuit described in fig. 1 enables the channel expansion chip to upload the temperature signal acquired by the temperature acquisition module to the BMS system through the connector, so that the situation that the BMS hardware architecture needs to be redesigned due to the fact that the channel expansion chip is integrated in the BMS hardware architecture to increase the temperature acquisition channel of the battery system is reduced, the development cost of the BMS hardware architecture is reduced, the temperature acquisition channel of the battery system is increased, loose coupling between the channel expansion chip and the BMS system is realized, and the flexibility of temperature acquisition of the battery system and the reusability of the designed temperature acquisition circuit are improved.
In an alternative embodiment, as shown in fig. 2, the third terminal of the connector J1 is used for electrically connecting to the channel switching control terminal (such as GPIO1 and GPIO2 in fig. 2) of the BMS system, and the fourth terminal of the connector J1 is electrically connected to the channel switching control terminal (such as A1 and A2 in fig. 2) of the channel expansion chip U1;
the connector J1 is also used for forwarding a channel switching signal issued by the BMS system to the channel expansion chip U1;
the channel expansion chip U1 is further used for selecting a target downlink data transmission end matched with the channel switching signal from all downlink data transmission ends according to the channel switching signal;
the specific manner in which the channel expansion chip U1 receives the temperature signal collected by the temperature collection module M1 and transmits the temperature signal to the connector J1 may include:
the channel expansion chip U1 receives the temperature signal acquired by the temperature acquisition module M1 corresponding to the target downlink data transmission end, and transmits the temperature signal to the connector J1.
Optionally, as shown in fig. 2, the channel expansion chip U1 includes a multi-channel electronic switch, and when the channel expansion chip U1 selects the target downstream data transmission end, the multi-channel electronic switch is controlled to perform a corresponding closing operation so as to conduct an internal channel between the target downstream data transmission end and the upstream data transmission end of the channel expansion chip U1, thereby implementing internal channel switching.
Therefore, the implementation of the temperature acquisition circuit described in fig. 2 can switch the internal channels for transmitting the temperature signals in the channel expansion chip according to the channel switching signals issued by the BMS system, so that the alternate acquisition of temperatures near a plurality of temperature acquisition points of the battery system is acquired, and the comprehensiveness and accuracy of the temperature acquisition of the battery system are improved.
In this optional embodiment, optionally, as shown in fig. 2, the number of channel switching control ends of the BMS system may be one or more, and the number of channel switching controlled ends of the channel expansion chip U1 may be one or more, where the channel switching control ends of the BMS system and the channel switching controlled ends of the channel expansion chip U1 are in one-to-one correspondence, as shown in fig. 2, GPIO1 corresponds to A0, and GPIO2 corresponds to A2.
Optionally, when a plurality of channel switching control ends and a plurality of channel switching controlled ends are provided, each channel switching controlled end of the channel expansion chip U1 may receive a channel switching signal sent by a corresponding channel switching control end, the channel expansion chip U1 may select a target downlink data transmission end from a plurality of downlink data transmission ends according to a single channel switching signal, or may select a target downlink data transmission end from all downlink data transmission ends according to a channel switching signal combination formed by combining a plurality of channel switching signals.
Specifically, if the number of channel switching controlled ends in the channel expansion chip U1 is 2 and the number of downlink data transmission ends is 4, the following two control modes exist:
1. each channel switching controlled end receives a channel switching signal for controlling the on and off of an internal channel between two downlink data transmission ends and an uplink data transmission end, when the channel switching signal can be 0 or 1, the two downlink data transmission ends are respectively corresponding to the channel switching controlled ends, the channel expansion chip U1 can select the downlink data transmission end corresponding to the channel switching controlled end as a target downlink data transmission end according to the channel switching signal, and the internal channel between the target downlink data transmission end and the uplink data transmission end is conducted through a multi-channel electronic switch, and the internal channel between the other downlink data transmission end and the uplink data transmission end is disconnected.
2. The channel switching signal combination received by the two channel switching controlled ends is used for controlling the connection and disconnection of the internal channels between the four downlink data transmission ends and the uplink data transmission end, the channel switching signal combination can be one of '00', '01', '10', '11', respectively corresponds to the four downlink data transmission ends, the channel expansion chip U1 can select the downlink data transmission end corresponding to the channel switching signal combination as the target downlink data transmission end according to the channel switching signal combination, and the internal channel connection between the target downlink data transmission end and the uplink data transmission end is realized through the multi-channel electronic switch, and the internal channels between the other downlink data transmission ends and the uplink data transmission end are disconnected.
Therefore, the temperature acquisition circuit described in fig. 2 can realize the switching between four internal channels for transmitting temperature signals in the channel expansion chip through two channel switching signals, so that the accuracy and reliability of the internal channel switching of the channel expansion chip are improved, and the accuracy and reliability of the temperature signal transmission are further improved.
In another alternative embodiment, as shown in fig. 2, the temperature acquisition circuit further includes a power supply voltage stabilizing module W1, wherein:
the power input end of the power supply voltage stabilizing module W1 is used for being electrically connected with a power supply, and the power output end of the power supply voltage stabilizing module W1 is used for outputting a voltage stabilizing power supply.
Optionally, the power output end of the power supply voltage stabilizing module W1 is electrically connected to the power input end of the temperature acquisition module M1.
Therefore, the temperature acquisition circuit described in fig. 2 can perform voltage stabilization treatment on the power supply through the power supply voltage stabilizing module, so that the temperature acquisition module is provided with the voltage stabilizing power supply, the temperature acquisition module can acquire temperature signals, the stability of the power supply voltage input to the temperature acquisition module is improved, and the occurrence of inaccurate temperature detection caused by the fact that the temperature signals acquired by the temperature acquisition module drift along with the power supply voltage is reduced.
In yet another alternative embodiment, as shown in fig. 2, the temperature acquisition module M1 includes a temperature sensor T1 and a bias resistor R1, wherein:
the first end of the bias resistor R1 is used for inputting a regulated power supply, the second end of the bias resistor R1 is electrically connected with the first end of the temperature sensor T1 and the downlink data transmission end of the channel expansion chip U1, and the second end of the temperature sensor T1 is used for being grounded.
Optionally, the first end of the bias resistor R1 is electrically connected to the power output end of the power supply voltage stabilizing module W1.
Alternatively, the temperature sensor T1 may be a thermistor, such as a negative temperature coefficient thermistor.
Therefore, the temperature acquisition circuit shown in fig. 2 can divide the voltage of the input stabilized power supply through the bias resistor, so that the voltage of the loop where the temperature sensor is located changes along with the change of the temperature nearby, and the accuracy and reliability of the temperature acquisition of the battery system are further improved.
In yet another alternative embodiment, as shown in fig. 2, the temperature acquisition module M1 further includes a first voltage stabilizing capacitor C1, wherein:
the first end of the first voltage stabilizing capacitor C1 is electrically connected with the second end of the bias resistor R1, the first end of the temperature sensor T1 and the downlink data transmission end of the channel expansion chip U1, and the second end of the first voltage stabilizing capacitor C1 is used for being grounded.
Optionally, in each temperature acquisition module M1, the number of the first voltage stabilizing capacitors C1 may be 1 or may be multiple, which is not limited in the embodiment of the present utility model.
Therefore, the temperature acquisition circuit shown in fig. 2 is implemented to perform voltage stabilizing processing on the temperature signal acquired by the temperature sensor through the first voltage stabilizing capacitor, so that the stability of the temperature signal is improved, the influence of the noise signal on the temperature signal is reduced, and the damage to the channel expansion chip caused by unstable temperature signal can be reduced.
In yet another alternative embodiment, as shown in fig. 2, the power supply voltage stabilizing module W1 may include a voltage stabilizing chip U3, where:
the power input end of the voltage stabilizing chip U3 is used for being electrically connected with a power supply, and the power output end of the voltage stabilizing chip U3 is electrically connected with the power input end of the temperature acquisition module M1.
Alternatively, the voltage regulator chip U3 may be a linear voltage regulator, such as TLV70933.
Therefore, the temperature acquisition circuit shown in fig. 2 is implemented to perform voltage stabilization treatment on the power supply through the voltage stabilizing chip, so that the accuracy and reliability of the power supply voltage stabilization treatment are improved.
In this alternative embodiment, optionally, as shown in fig. 2, the power supply voltage stabilizing module W1 may further include a second voltage stabilizing capacitor C2 and/or a third voltage stabilizing capacitor C3, where:
the power input end of the voltage stabilizing chip U3 is electrically connected with the first end of the second voltage stabilizing capacitor C2, the power output end of the voltage stabilizing chip U3 is electrically connected with the first end of the third voltage stabilizing capacitor C3, and the second end of the second voltage stabilizing capacitor C2 and the second end of the third voltage stabilizing capacitor C3 are used for grounding.
Optionally, in the power supply voltage stabilizing module W1, the number of the second voltage stabilizing capacitors C2 and the number of the third voltage stabilizing capacitors C3 may be 1 or more, which is not limited in the embodiment of the present utility model.
Therefore, the temperature acquisition circuit described in fig. 2 can perform voltage stabilizing treatment on the power supply input to the voltage stabilizing chip through the second voltage stabilizing capacitor, so that damage to the voltage stabilizing chip caused by unstable power supply is reduced, and the voltage stabilizing power supply output by the voltage stabilizing chip is further subjected to voltage stabilizing treatment through the third voltage stabilizing capacitor, so that the stability of the voltage stabilizing power supply is further improved.
In yet another alternative embodiment, as shown in fig. 2, the temperature acquisition circuit further comprises a fourth voltage stabilizing capacitor C4, wherein:
the power input end (VDD in fig. 2) of the channel expansion chip U1 is electrically connected to the first end of the fourth voltage stabilizing capacitor C4, and the power input end of the channel expansion chip U1 is further electrically connected to a power supply, where the second end of the fourth voltage stabilizing capacitor C4 is grounded.
Therefore, the temperature acquisition circuit shown in fig. 2 can drive the channel expansion chip to work according to the fact that the power supply is input into the channel expansion chip so as to supply power to the channel expansion chip, and the power supply input into the channel expansion chip is subjected to voltage stabilization treatment through the fourth voltage stabilizing capacitor, so that the stability of the power supply output to the channel expansion chip is improved, and damage to the channel expansion chip due to instability of the power supply is reduced.
In yet another alternative embodiment, as shown in fig. 2, the common connection of the channel expansion chip U1 (e.g., VSS in fig. 2) and/or the enable of the channel expansion chip U1 (e.g., EN in fig. 2) are used for grounding.
In yet another alternative embodiment, as shown in fig. 2, the connector J1 may include a fifth stabilizing capacitor C5, wherein:
the first end of the fifth voltage stabilizing capacitor C5 is electrically connected with the uplink data transmission end of the channel expansion chip U1, the first end of the fifth voltage stabilizing capacitor C5 is also used for being electrically connected with the data transmission end of the BMS system, and the second end of the fifth voltage stabilizing capacitor C5 is used for being grounded.
Therefore, the temperature acquisition circuit shown in fig. 2 is implemented to perform voltage stabilizing processing on the temperature signal transmitted between the BMS system and the channel expansion chip through the fifth voltage stabilizing capacitor, so that stability and accuracy of the temperature signal are further improved, and influence of noise signals in the transmission process is reduced.
In yet another alternative embodiment, as shown in fig. 2, the connector J1 may include at least one sixth voltage stabilizing capacitor C6, where the sixth voltage stabilizing capacitor C6 is in one-to-one correspondence with the channel switching controlled end of the channel expansion chip U1 and also in one-to-one correspondence with the channel switching controlled end of the BMS system, and where:
the first end of each sixth voltage stabilizing capacitor C6 is electrically connected with the corresponding channel switching controlled end in the channel expansion chip U1, the first end of each sixth voltage stabilizing capacitor C6 is also electrically connected with the corresponding channel switching controlled end in the BMS system, and the second end of the sixth voltage stabilizing capacitor C6 is used for being grounded.
Therefore, the implementation of the temperature acquisition circuit described in fig. 2 can also perform voltage stabilizing processing on the channel switching signal sent to the channel expansion chip by the BMS system through the sixth voltage stabilizing capacitor, so that the stability of the channel switching signal is improved, and the occurrence of the conditions that the channel switching chip is damaged and the channel switching is inaccurate due to the instability of the channel switching signal is reduced.
Example two
Referring to fig. 4, fig. 4 is a schematic structural diagram of a flexible circuit board according to an embodiment of the present utility model, where the flexible circuit board described in fig. 4 may be applied not only in a battery system to meet a temperature acquisition requirement of the battery system, such as a large cylindrical battery system, but also in any other device having a temperature acquisition requirement to meet the temperature acquisition requirement, such as a motor, a folding mobile phone, an air conditioning system, etc., and the embodiment of the present utility model is not limited.
As shown in fig. 4, the flexible circuit board may include the temperature acquisition circuit described in the first embodiment of the present utility model.
In an alternative embodiment, as shown in fig. 4, the flexible circuit board may further include a flexible circuit board main body B1, at least one wire is disposed in the flexible circuit board main body B1, the wire is disposed along an extending direction of the flexible circuit board main body B1, and temperature collecting modules M1 in the temperature collecting circuit are disposed at intervals along the extending direction of the flexible circuit board main body B1, and optionally, the temperature collecting modules M1 are disposed in one-to-one correspondence with the wires;
one end of the wire is connected to the data acquisition end of the temperature acquisition module M1 corresponding to the wire, and the other end of the wire is connected to the downlink data transmission end of the channel expansion chip U1 in the temperature acquisition circuit.
In the embodiment of the present utility model, for other descriptions of the BMS system, the connector J1, the channel expansion chip U1, the temperature acquisition module M1 and the connection relationship thereof, please refer to the detailed descriptions of the BMS system, the connector J1, the channel expansion chip U1, the temperature acquisition module M1 and the connection relationship thereof in the first embodiment, and the embodiments of the present utility model are not repeated.
Therefore, the flexible circuit board shown in fig. 4 can be implemented to integrate the channel expansion chip on the flexible circuit board, so that the channel expansion chip can upload the temperature signal acquired by the temperature acquisition module to the BMS system through the connector, the situation that the BMS hardware architecture needs to be redesigned due to the fact that the channel expansion chip is integrated in the BMS hardware architecture to increase the temperature acquisition channel of the battery system is reduced, the development cost of the BMS hardware architecture is reduced, the temperature acquisition channel of the battery system is increased, loose coupling between the channel expansion chip and the BMS system is realized, and the flexibility of temperature acquisition of the battery system and the reusability of the designed temperature acquisition circuit are improved.
In another alternative embodiment, as shown in fig. 4, the flexible circuit board may further include a stiffener B2, where the stiffener B2 is disposed at one end of the flexible circuit board body B1, and the connector J1 and the channel expansion chip U1 are disposed on the stiffener B2.
Alternatively, the reinforcing panel B2 may be constructed of a flame retardant material, such as FR-4 material.
It can be seen that implementing the flexible circuit board depicted in fig. 4 places the connectors and the channel expansion chips on the stiffener, improving the security of the flexible circuit board.
In yet another alternative embodiment, as shown in fig. 5, the flexible circuit board body B1 may include a base material layer, a glue layer, and a line protection layer stacked in this order, with the wires disposed between the glue layer and the line protection layer.
Alternatively, the substrate layer may be formed of a flexible material (e.g., polyimide), the glue layer may be formed of an adhesive (e.g., adipic acid dihydrazide), the wire may be a copper wire, and the wire protection layer may be formed of an adhesive and a flexible material. Preferably, the thickness of the substrate layer is about 25 μm, the thickness of the adhesive layer is about 20 μm, the thickness of the layer where the wires are located is about 35 μm, and the thickness of the adhesive and the flexible material in the circuit protection layer are both about 25 μm.
Therefore, the flexible circuit board described in fig. 5 can be implemented to stack the adhesive layer and the circuit protection layer on the substrate layer of the flexible circuit board, and the wires are arranged between the adhesive layer and the circuit protection layer, so that the safety and the reliability of the arrangement of the wires of the flexible circuit board are improved, and the service life of the flexible circuit board is prolonged.
In this alternative embodiment, as shown in fig. 5, the flexible circuit board body B1 may further include a first surface protection layer stacked on the circuit protection layer.
Alternatively, the first surface protective layer may be composed of an adhesive and a flexible material, preferably the adhesive in the first surface protective layer has a thickness of about 45 μm and the flexible material has a thickness of about 50 μm.
In this alternative embodiment, as shown in fig. 5, the flexible circuit board body B1 may further include a second surface protection layer stacked on the substrate layer.
Alternatively, the second surface protective layer may be composed of an adhesive and a flexible material, preferably the adhesive in the second surface protective layer has a thickness of about 45 μm and the flexible material has a thickness of about 50 μm.
In this alternative embodiment, as shown in fig. 5, the flexible circuit board body B1 may further include a reinforcing protective substrate layer stacked on the second surface protective layer.
Alternatively, the reinforcing protective substrate layer may be composed of a flame retardant material, such as FR-4 material.
Therefore, the flexible circuit board illustrated in fig. 5 can also be stacked with the first surface protection layer and the second surface protection layer on two sides of the flexible circuit board, and the reinforced protection substrate layer is stacked on the basis of the second surface protection layer, so that the use safety of the flexible circuit board is further improved, and the service life of the flexible circuit board is prolonged.
The foregoing describes in detail a temperature acquisition circuit and a flexible circuit board disclosed in the embodiments of the present utility model, and specific embodiments are applied to illustrate the principles and implementation of the present utility model, but the foregoing preferred embodiments are not intended to limit the present utility model, and the foregoing description of the embodiments is only used to help understand the method and core idea of the present utility model; also, it is apparent to those skilled in the art from this disclosure that many changes can be made in this embodiment and this application without departing from the spirit and scope of the utility model, which is set forth in the following claims.
Claims (11)
1. The utility model provides a temperature acquisition circuit which characterized in that, temperature acquisition circuit includes connector, passageway extension chip and at least one temperature acquisition module, wherein:
the first end of the connector is used for being electrically connected with a data transmission end of the BMS system, and the second end of the connector is electrically connected with an uplink data transmission end of the channel expansion chip; the downlink data transmission end of the channel expansion chip is electrically connected with the data acquisition end of the temperature acquisition module corresponding to the downlink data transmission end;
the channel expansion chip is used for receiving the temperature signal acquired by the temperature acquisition module and transmitting the temperature signal to the connector;
the connector is used for transmitting the temperature signal to the BMS system.
2. The temperature acquisition circuit of claim 1, wherein a third end of the connector is configured to electrically connect to a channel switch control end of the BMS system, and a fourth end of the connector is electrically connected to a channel switch control end of the channel expansion chip.
3. The temperature acquisition circuit of claim 1 or 2, further comprising a power supply voltage regulation module, wherein:
the power input end of the power supply voltage stabilizing module is used for being electrically connected with a power supply, and the power output end of the power supply voltage stabilizing module is electrically connected with the power input end of the temperature acquisition module.
4. A temperature acquisition circuit according to claim 3, wherein the temperature acquisition module comprises a temperature sensor and a bias resistor, wherein:
the first end of the bias resistor is electrically connected with the power output end of the power supply voltage stabilizing module, the second end of the bias resistor is electrically connected with the first end of the temperature sensor and the downlink data transmission end of the channel expansion chip, and the second end of the temperature sensor is used for being grounded.
5. The temperature acquisition circuit of claim 4 wherein the temperature acquisition module further comprises a first voltage stabilizing capacitor, wherein:
the first end of the first voltage stabilizing capacitor is electrically connected with the second end of the bias resistor, the first end of the temperature sensor and the downlink data transmission end of the channel expansion chip, and the second end of the first voltage stabilizing capacitor is used for being grounded.
6. The temperature acquisition circuit of claim 3, wherein the power supply voltage stabilizing module comprises a voltage stabilizing chip, a second voltage stabilizing capacitor and a third voltage stabilizing capacitor, wherein:
the power input end of the voltage stabilizing chip is electrically connected with the first end of the second voltage stabilizing capacitor, the power input end of the voltage stabilizing chip is also used for being electrically connected with a power supply, the power output end of the voltage stabilizing chip is electrically connected with the first end of the third voltage stabilizing capacitor and the power input end of the temperature acquisition module, and the second end of the second voltage stabilizing capacitor and the second end of the third voltage stabilizing capacitor are used for being grounded.
7. The temperature acquisition circuit of claim 3 further comprising a fourth voltage stabilizing capacitor, wherein:
the power input end of the channel expansion chip is electrically connected with the first end of the fourth voltage stabilizing capacitor, the power input end of the channel expansion chip is also used for being electrically connected with the power supply, and the second end of the fourth voltage stabilizing capacitor is used for being grounded.
8. A flexible circuit board, characterized in that it comprises a temperature acquisition circuit according to any one of claims 1-7.
9. The flexible circuit board of claim 8, further comprising a flexible circuit board body, wherein at least one wire is disposed in the flexible circuit board body, the wire extends along an extending direction of the flexible circuit board body, and temperature acquisition modules in the temperature acquisition circuit are disposed at intervals along the extending direction of the flexible circuit board body;
one end of the wire is connected to the data acquisition end of the temperature acquisition module corresponding to the wire, and the other end of the wire is connected to the downlink data transmission end of the channel expansion chip in the temperature acquisition circuit.
10. The flexible circuit board of claim 9, further comprising a stiffener disposed at one end of the flexible circuit board body, wherein the connector and the channel expansion chip in the temperature acquisition circuit are disposed on the stiffener.
11. The flexible circuit board of claim 9 or 10, wherein the flexible circuit board body comprises a substrate layer, a glue layer and a circuit protection layer stacked in sequence, and the wires are disposed between the glue layer and the circuit protection layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321816053.1U CN220690279U (en) | 2023-07-11 | 2023-07-11 | Temperature acquisition circuit and flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321816053.1U CN220690279U (en) | 2023-07-11 | 2023-07-11 | Temperature acquisition circuit and flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220690279U true CN220690279U (en) | 2024-03-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321816053.1U Active CN220690279U (en) | 2023-07-11 | 2023-07-11 | Temperature acquisition circuit and flexible circuit board |
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| Country | Link |
|---|---|
| CN (1) | CN220690279U (en) |
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2023
- 2023-07-11 CN CN202321816053.1U patent/CN220690279U/en active Active
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