CN220690135U - Self-adaptive packaging of reflective optical encoder chip - Google Patents

Abstract

The utility model provides a self-adaptive package of a reflective optical encoder chip, and the whole system consists of a light source (201), a code disc (202), a focusing lens (203), a photodiode array chip (204), a feedback circuit (205), an MEMS chip (206) and a mechanical column (207). The utility model can be widely applied to the fields of various light measurement such as laser ranging, laser radar, grating ruler and the like.

Description

Self-adaptive packaging of reflective optical encoder chip

Technical Field

The utility model relates to a self-adaptive package of a reflective optical encoder chip, which can be used in the fields of various optical measurement such as laser ranging, laser radar, grating ruler and the like.

Background

MEMS (microelectromechanical systems) are miniaturized electronic and mechanical systems that integrate micromechanical elements, sensors, actuators, and electronic circuits on a tiny chip or substrate. The following are some key features and applications of MEMS. Micro-size: MEMS devices are typically very small, in the micrometer to millimeter range in size, which makes them well suited for embedding into small devices or systems. Integration: MEMS technology allows the integration of a variety of sensors, actuators, and electronics on the same chip, thereby enabling highly integrated multi-function devices. Sensing function: MEMS devices can be used to detect and measure various physical quantities such as pressure, acceleration, temperature, humidity, light intensity, etc. These sensors can be used in many applications, such as accelerometers and gyroscopes in smart phones. The execution functions are as follows: MEMS devices may also include micro-actuators, such as micro-motors or micro-valves, for controlling physical processes, such as liquid flow or mechanical movement. Application field: MEMS technology has wide application in a variety of fields including, but not limited to, medical diagnostics, automotive security systems, aerospace, industrial automation, consumer electronics (e.g., smart watches and smart phones), and environmental monitoring. The manufacturing process comprises the following steps: MEMS devices are typically fabricated using micromachining techniques like semiconductor fabrication processes. This includes the process steps of photolithography, thin film deposition, etching, and ion implantation. Cost effectiveness: since MEMS devices can integrate multiple functions on the same chip, they can generally provide lower manufacturing costs and smaller volumes, which makes them very attractive in mass-produced applications.

An Optical Encoder (Optical Encoder) is a sensor device for measuring the position, velocity or change in position of an object. They typically use optical principles to achieve high accuracy position measurements and convert the measurement results into digital signals for further processing by a computer or control system. The following are some key features and working principles of the optical encoder: basic principle: optical encoders typically include a light source, a grating or encoder disk, a photosensitive element, and signal processing circuitry. The light source emits a light beam that passes through the grating or code wheel and forms a light spot on the photosensitive element. Movement of the object causes the light spot to change over the photosensitive element, producing a changing photoelectric signal. Absolute encoder and incremental encoder: there are two main types of optical encoders, absolute encoders and incremental encoders. The absolute encoder can immediately provide absolute position information of the object without recalibration. They typically use multiple grating disks or encoded channels, each representing one bit of position information. The incremental encoder provides information about the relative motion of the object. They typically contain two channels, one for measuring forward motion and the other for measuring reverse motion. By counting the number of pulses of the channel, the position and velocity can be determined. Resolution ratio: resolution is a key parameter of an optical encoder and represents the number of pulses per encoder disk period. The higher the resolution, the higher the accuracy of the measurement. Accuracy and repeatability: optical encoders generally provide highly accurate position measurements, the accuracy and repeatability of which depend on manufacturing quality and environmental conditions. Application field: optical encoders are widely used in fields requiring high-precision position measurements, such as machine tool control, printing machinery, medical equipment, automation and robotics, aerospace and astronomy. Interference immunity: optical encoders typically have some immunity to external light and shock, but may require additional measures such as housing protection or noise reduction techniques in harsh environments. Optical encoders are widely used in the fields of industrial automation, robotics, numerical control machines, medical equipment, aerospace, and the like.

In recent years, methods of improving the accuracy of optical encoders have involved a number of aspects, including hardware design, calibration, environmental control, and signal processing. The following are some ways to improve the accuracy of an optical encoder: high resolution encoded disk or grating: a code wheel or grating with a greater number of lines or marks is used to increase the number of pulses per cycle, improving the measurement resolution. High quality light source and optical element: high quality light sources and optical elements are employed to ensure a stable light beam and minimal optical distortion. Environmental control: the optical encoder is placed in a stable environment to avoid light interference, vibration and temperature variations. A housing or seal design is used to protect the optical elements. And (3) calibrating: periodic calibration is performed to eliminate potential errors. This includes zero calibration (zero determination) and gain calibration (correction of the proportional error). Vibration and vibration suppression: in environments exposed to shock or vibration, measures are taken to reduce or isolate these disturbances, such as using mechanical isolators or vibration compensation techniques. External interference suppression: an optical filter is used to suppress the influence of an external light source to reduce errors. And (3) signal processing: high quality signal processing circuits and algorithms are employed to eliminate noise, filter signals and improve measurement accuracy. And (3) mechanical design: the rigidity and stability of the mechanical components are considered to reduce mechanical spurious errors. Temperature compensation: a temperature compensation algorithm is implemented to correct for the effects of dimensional changes caused by temperature changes on the measurement results. A plurality of sensors are used: the accuracy and robustness of the position measurement is improved by using multiple optical encoders or other sensors, such as accelerometers or gyroscopes, simultaneously. And (3) periodic maintenance: periodic maintenance and cleaning is performed to ensure that the equipment remains in an optimal operating condition.

The above methods for improving the accuracy of the optical encoder have the problems of excessive cost, complex method, time and labor consumption and incapability of adjusting factors affecting the accuracy in the operation process.

In order to solve the problems, the utility model discloses a self-adaptive package of a reflective optical encoder chip, which can be used in the fields of various optical measurement such as laser ranging, laser radar, grating scale and the like. The photoelectric diode array chip is used as a photosensitive device, the optical signal carrying the angle coding information is converted into an electric signal by the photoelectric diode array chip and decoded to obtain the angle information, the feedback circuit can distinguish the electric signal converted by the photoelectric diode array chip and send out an adaptive instruction to the MEMS chip, and the MEMS chip carries out lifting adjustment on four mechanical columns according to the instruction, so that the direction of the focusing lens is adaptively adjusted, the purpose of aligning the photoelectric diode array chip in real time is achieved, and the accuracy of the optical encoder is improved.

Disclosure of Invention

The utility model aims to provide a self-adaptive package of a reflective optical encoder chip.

The system consists of a light source, a code disc, a focusing lens, a photodiode array chip, a feedback circuit, an MEMS chip and four mechanical columns. The light beam generated by the light source irradiates the code channel on the code disc, reflects the light beam carrying the angle coding information, irradiates the light beam to the focusing lens for focusing, then projects the light beam onto the photodiode array chip, the photodiode array chip converts the light signal into an electric signal and decodes the angle information, the feedback circuit distinguishes the electric signal processed by the photodiode array chip and sends out self-adaptive instructions to the MEMS chip, and the MEMS chip carries out lifting adjustment on four mechanical columns according to the instructions, so that the lens carries out self-adaptive adjustment according to the direction of the transmitted light beam aiming at the photodiode chip, and the purpose of self-adaptive alignment is achieved.

In the scheme, the light source can be LEDs with different wave bands, and the LEDs are replaced according to sensitive wave bands of different photodiodes.

In the scheme, the code disc is an absolute code disc with double code channels.

In the scheme, the diameter size of the focusing lens is far larger than the diameter size of a light spot formed on the focusing lens by the light beam reflected by the code disc, so that the angle coding information carried by the light beam is ensured not to be lost.

In the scheme, the feedback circuit can distinguish the electric signals converted by the photodiode array chip and send out an adjusting self-adaptive instruction to the MEMS chip.

In the scheme, the MEMS chip can carry out lifting adjustment on the four mechanical columns according to the self-adaptive instruction sent by the feedback circuit.

The four mechanical posts 207 can be lifted and lowered under the adjustment of the MEMS, and adjust the orientation of the focusing lens 203 under the effect of physical adhesion.

The utility model utilizes the feedback circuit and the MEMS chip to carry out self-adaptive control on the lens, achieves the aim of aligning the photodiode array chip in real time, and improves the accuracy of the optical encoder.

Drawings

Fig. 1 is a schematic structural diagram of a reflective optical encoder chip adaptive package according to an embodiment of the present utility model.

FIG. 2 is a front view of a dual track code wheel of a reflective optical encoder chip adaptive package in accordance with an embodiment of the present utility model.

Fig. 3 is a left side view of a focusing lens of a reflective optical encoder chip adaptive package according to an embodiment of the present utility model.

Fig. 4 is an isometric view of a lens-out light beam receiving device of a reflective optical encoder chip adaptive package, in accordance with an embodiment of the present utility model.

Fig. 5 is a top view of a lens-out light beam receiving device of a reflective optical encoder chip adaptive package according to an embodiment of the present utility model.

Detailed Description

The utility model will be further described in detail below with reference to specific examples and with reference to the accompanying drawings, in order to make the objects, technical solutions and advantages of the utility model more apparent.

Fig. 1 shows a reflective optical encoder chip adaptive package, which is composed of a light source 201, a code wheel 202, a focusing lens 203, a photodiode array chip 204, a feedback circuit 205, a MEMS chip 206, and four mechanical posts 207. The light source 201 generates a light beam, the code wheel 202 encodes angle information and transmits the angle encoded information to the light beam through the light beam generated by the reflection light source 201, the focusing lens 203 gathers the light beam carrying the angle encoded information on the photodiode array chip 204, the four mechanical columns 207 are adhered to the focusing lens 203, the effect of fixedly adjusting the focusing lens 203 is achieved, the photodiode array chip 204 converts optical signals carrying the angle encoded information into electric signals for decoding, the feedback circuit 205 distinguishes the electric signals converted by the photodiode array chip 204 and sends out self-adaptive instructions to the MEMS chip 206, and the MEMS chip 206 carries out lifting adjustment on the four mechanical columns 207 according to the instructions of the feedback circuit 205 to adjust the direction of the focusing lens 203, so that the light beam carrying the angle encoded information is self-adaptively aligned with the photodiode array chip 204.

Wherein the LED provides a stable light beam.

The angles are encoded by the double code tracks on the code wheel, and the light beam reflected by the double code tracks carries information encoded by the angles.

The diameter size of the focusing lens is far larger than that of the light beam reflected by the code disc, so that the light spot diameter size is formed on the focusing lens, and the angle coding information carried by the light beam is ensured not to be lost.

The photosensitive element adopts a photodiode array, more optical information can be acquired, and the feedback circuit can distinguish the electric signals converted by the photodiode array chip and send out an adjustment self-adaptive instruction to the MEMS chip.

The MEMS chip can lift and adjust the four mechanical columns according to the self-adaptive instruction sent by the feedback circuit.

The four mechanical posts 207 can be lifted and lowered under the adjustment of the MEMS, and adjust the orientation of the focusing lens 203 under the effect of physical adhesion.

It should be noted that, although the examples described above are illustrative, this is not a limitation of the present utility model, and thus the present utility model is not limited to the above-described specific embodiments. Other embodiments, which are apparent to those skilled in the art from consideration of the specification and practice of the utility model disclosed herein, are considered to be within the scope of the utility model as claimed.

Claims (4)

1. A reflective optical encoder chip adaptive package, characterized by: the package is composed of a light source (201), a code disc (202), a focusing lens (203), a photodiode array chip (204), a feedback circuit (205), an MEMS chip (206) and four mechanical columns (207); the light source (201) generates a light beam, the code wheel (202) encodes angle information and transmits the angle encoded information to the light beam through the light beam generated by the reflection light source (201), the focusing lens (203) gathers the light beam carrying the angle encoded information on the photodiode array chip (204), four mechanical columns (207) are adhered to the focusing lens (203), the function of fixedly adjusting the focusing lens (203) is achieved, the photodiode array chip (204) converts an optical signal carrying the angle encoded information into an electric signal for decoding, the feedback circuit (205) distinguishes the electric signal converted by the photodiode array chip (204) and sends out an adaptive instruction to the MEMS chip (206), and the MEMS chip (206) carries out lifting adjustment on the four mechanical columns (207) according to the instruction of the feedback circuit (205) to adjust the azimuth of the focusing lens (203).

2. The reflective optical encoder chip adaptive package of claim 1, wherein: the feedback circuit (205) can distinguish the electric signals converted by the photodiode array chip (204) and send out an adjusting self-adapting instruction to the MEMS chip (206).

3. The reflective optical encoder chip adaptive package of claim 1, wherein: the MEMS chip (206) can perform lifting adjustment on the four mechanical columns (207) according to the self-adaptive instruction sent by the feedback circuit (205).

4. The reflective optical encoder chip adaptive package of claim 1, wherein: the four mechanical columns (207) can be adjusted in a lifting manner under the adjustment of MEMS, and the orientation of the focusing lens (203) is adjusted under the effect of physical adhesion.