CN220673852U

CN220673852U - Camera module

Info

Publication number: CN220673852U
Application number: CN202322263454.5U
Authority: CN
Inventors: 王亚坤
Original assignee: Kunshan Q Technology Co Ltd
Current assignee: Kunshan Q Technology Co Ltd
Priority date: 2023-08-22
Filing date: 2023-08-22
Publication date: 2024-03-26
Anticipated expiration: 2033-08-22

Abstract

The application provides a camera module, which comprises a lens, a voice coil motor, a circuit board and a reinforcing plate; the camera lens is arranged at the middle position of the voice coil motor, the circuit board is arranged at the lower end surface of the voice coil motor, the reinforcing plate is arranged at the lower end surface of the circuit board, one side of the reinforcing plate is provided with a latent heat structure, and a phase change material layer is arranged in the latent heat structure; in this application, prevent the inside high temperature of camera module and influence interior element's life through the phase change material layer, simultaneously, when the outside ambient temperature of camera module descends, release the heat gradually through the phase change material layer of latent heat structure to this delay the reduction of camera module inside temperature, thereby form cushioning effect, make the circuit board adapt to temperature variation gradually, prevent that temperature variation from too fast leading to the circuit board to appear expending with heat and contract with cold and produce stress deformation's condition, and then protection circuit board and electronic components and improvement life.

Description

Camera module

Technical Field

The utility model relates to the technical field of production of camera modules, in particular to a camera module.

Background

Along with the continuous improvement of the requirements of consumers on mobile phone shooting pixels, the components in the mobile phone camera module become more and more, and the power of the photosensitive chip is also continuously increased, so that the heating power consumption in the camera module is also increased, and the internal temperature and the temperature rise of the camera module are also increased when the camera module is heated during working.

In the prior art, a sinking plate structure is generally used for the camera module with larger heating power, and steel sheets or copper sheets are added at the bottom, so that the inside of the camera module is cooled, but the cooling effect is limited, and if the temperature of the camera module is too high for a long time, the service life of each part inside the camera module can be seriously influenced, meanwhile, the temperature rise of the camera module is too large, when the temperature of the use environment changes too fast, such as in winter, the mobile phone is arranged indoors, the indoor temperature is high, but the outdoor temperature is low when the mobile phone suddenly moves outdoors, therefore, the use environment of the camera module suddenly changes rapidly, and when the temperature difference changes greatly, the temperature in the camera module also changes instantaneously, so that certain thermal expansion and cold contraction deformation impact can be caused on the circuit board, the problems of appearance, desoldering and the like of the circuit board are easily caused, and the service life of the camera module is seriously influenced for a long time.

As shown in fig. 1-2 of the drawings, a camera module in the prior art generally comprises a lens 1, a voice coil motor 2, a bracket 3, a circuit board 4 and a reinforcing plate 5; the camera lens 1 is arranged at the middle position of the voice coil motor 2, the circuit board 4 is arranged at the lower end face of the voice coil motor 2, the support 3 is arranged at the upper end face of the circuit board 4 and is accommodated in the voice coil motor 2, a chip is arranged at the middle hole position of the circuit board 4, the reinforcing plate 5 is arranged at the lower end face of the circuit board 4, wherein the reinforcing plate 5 is a steel sheet or a copper sheet, the inside of the camera module is radiated through the reinforcing plate 5, because the existing camera module has more internal components and high heating power, the radiating effect of the reinforcing plate is limited, if the camera module has too high temperature for a long time, the service life of each component in the camera module can be seriously influenced, meanwhile, the temperature in the camera module can be changed instantly when the external environment of the camera module is changed quickly and the temperature difference is changed greatly, and when the temperature is changed instantly, the circuit board is easy to expand due to heat and the situation of stress deformation is easy to occur, and therefore the service life of the circuit board and electronic components on the circuit board is easy to influence the service life of the camera module.

Therefore, it is necessary to provide a technical scheme capable of optimizing the structure of the camera module and preventing the reduction of the service life of the circuit board and the camera module caused by too fast temperature change in the camera module.

Disclosure of Invention

The utility model provides a camera module, which aims to solve the problems that when the temperature of the use environment of the existing camera module is too fast, the temperature in the camera module is also fast, so that the circuit board is easy to expand with heat and contract with cold to deform, and the service lives of the circuit board and the camera module are reduced.

The technical scheme adopted by the utility model is as follows: a camera module, a lens, a voice coil motor, a circuit board and a reinforcing plate; the camera lens is arranged at the middle position of the voice coil motor, the circuit board is arranged at the lower end face of the voice coil motor, the reinforcing plate is arranged at the lower end face of the circuit board, a latent heat structure is arranged on one side of the reinforcing plate, a phase change material layer is arranged in the latent heat structure, and the phase change material layer is used for absorbing heat or releasing heat when the temperature of the camera module changes too fast so as to relieve the temperature change speed in the camera module.

In an embodiment, when the temperature inside the camera module rises and reaches the phase change temperature, the phase change material layer can absorb heat inside the camera module to delay the change speed of the temperature inside the camera module; when the temperature of the phase change material layer in the camera module is reduced, the phase change material layer can release heat to delay the change speed of the temperature in the camera module.

In one embodiment, the device further comprises a bracket, an optical filter and a chip; the bracket is arranged at the upper end face of the circuit board and is accommodated in the voice coil motor; the optical filter is arranged on the bracket and is positioned below the lens; the chip is arranged at the middle position of the circuit board and is positioned below the optical filter.

In one embodiment, a positioning groove is formed in the upper end face of the circuit board, and the positioning groove is used for positioning and mounting the support.

In one embodiment, the circuit board is provided with a containing hole penetrating through the upper end face and the lower end face of the circuit board, the containing hole is communicated with the positioning groove, and the cross section size of the positioning groove is larger than that of the containing hole; the chip is fixed on the reinforcing plate and is accommodated in the accommodating hole;

the chip is connected with the circuit board through gold wires, the circuit board substrate at the position of the locating slot is divided into an upper substrate and a lower substrate, the upper substrate and the lower substrate are mutually connected, the lower substrate is positioned close to one side of the chip, the upper substrate is positioned far away from one side of the chip, one end of the gold wires is connected with the upper surface of one side of the chip, and the other end of the gold wires is connected with the upper surface of the lower substrate so as to realize the electric connection of the chip and the circuit board.

In one embodiment, the latent heat structure is disposed external to the voice coil motor.

In an embodiment, a clamping groove is formed in the lower end face of the support, and the clamping groove is used for accommodating electronic components on the circuit board.

In one embodiment, the latent heat structure is a hollow square structure, and the middle space is a latent heat chamber; a phase change material layer is disposed within the latent heat chamber.

In an embodiment, the phase change material layer is provided as a solid phase change material layer; or, the phase change material layer is configured as grafted neoprene.

In an embodiment, two latent heat structures are arranged at intervals on the side edges of the reinforcing plate, and the circuit board passes through the space between the two latent heat structures.

The beneficial effects of the utility model are as follows:

the camera module comprises a lens, a voice coil motor, a circuit board and a reinforcing plate; the camera lens is arranged at the middle position of the voice coil motor, the circuit board is arranged at the lower end face of the voice coil motor, the reinforcing plate is arranged at the lower end face of the circuit board, a latent heat structure is arranged on one side of the reinforcing plate, a phase change material layer is arranged in the latent heat structure, when the temperature in the camera module reaches the phase change temperature of the phase change material layer, the phase change material layer can absorb heat in the camera module to delay the change speed of the temperature in the camera module, so that the service life of an internal element is prevented from being influenced due to the fact that the temperature in the camera module is too high, meanwhile, when the external environment temperature of the camera module is reduced, the heat is gradually released through the phase change material layer of the latent heat structure, so that the reduction speed of the temperature in the camera module is delayed, a buffer effect is formed, the circuit board is gradually adapted to temperature change, the condition that the circuit board expands with heat and contracts with cold is prevented from being caused due to the fact that the temperature change is too fast, and the service life of the circuit board is further protected.

Drawings

The accompanying drawings are included to provide a further understanding of the utility model, and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the description serve to explain the utility model. In the drawings:

FIG. 1 is an exploded view of a prior art camera module;

FIG. 2 is a schematic diagram of a prior art camera module;

FIG. 3 is an exploded view of an embodiment of the present utility model;

FIG. 4 is a schematic diagram of an embodiment of the present utility model;

fig. 5 is a cross-sectional view of an embodiment of the present utility model.

The drawings are marked with the following description: 1. a lens; 2. a voice coil motor; 21. a connection hole; 3. a bracket; 31. a clamping groove; 4. a circuit board; 41. a positioning groove; 42. an accommodation hole; 43. an electronic component; 5. a reinforcing plate; 6. a light filter; 7. a latent heat structure; 8. a chip; 9. a phase change material layer.

Detailed Description

The following describes specific embodiments of the present utility model in detail with reference to the drawings. It should be understood that the detailed description and specific examples, while indicating and illustrating the utility model, are not intended to limit the utility model.

Referring to fig. 3-5, the present embodiment provides a camera module, which includes a lens 1, a voice coil motor 2, a circuit board 4 and a stiffener 5; the camera lens 1 is arranged at the middle position of the voice coil motor 2, the circuit board 4 is arranged at the lower end face of the voice coil motor 2, the reinforcing plate 5 is arranged at the lower end face of the circuit board 4, one side of the reinforcing plate 5 is provided with a latent heat structure 7, a phase change material layer 9 is arranged in the latent heat structure 7, wherein when the temperature in the camera module reaches the phase change temperature of the phase change material layer 9, the phase change material layer 9 can absorb heat in the camera module so as to delay the change speed of the internal temperature of the camera module, thereby preventing the internal temperature of the camera module from being too high to influence the service life of internal elements, and simultaneously, when the external environment temperature of the camera module is reduced, the heat is gradually released through the phase change material layer 9 of the latent heat structure 7 so as to delay the reduction speed of the internal temperature of the camera module, thereby forming a buffer effect, enabling the circuit board 4 and the internal elements to be gradually adapted to temperature change, preventing the situation that the circuit board 4 expands due to heat and contracts due to heat, thereby protecting the circuit board 4 and the camera module, and prolonging the service life of the camera module.

Further, referring to fig. 3 to 5, the camera module further includes a bracket 3, an optical filter 6, and a chip 8; the bracket 3 is arranged at the upper end surface of the circuit board 4 and is accommodated in the voice coil motor 2; the optical filter 6 is arranged on the bracket 3 and is positioned below the lens 1; the chip 8 is arranged at the middle position of the circuit board 4 and is positioned below the optical filter 6; in this embodiment, when the camera module works, the lens 1 converges and transmits the light of the observed object to the optical filter 6, the light is filtered at the optical filter 6, then the light is projected to the chip 8 after passing through the optical filter 6, and the light is calculated and imaged at the chip 8, so as to complete the image pickup work; and the voice coil motor 2 is used for driving the lens 1 to move so as to perform focusing operation, and the circuit board 4 is used for providing power for each component.

Further, referring to fig. 3 and 5, the bracket 3 is provided with a through hole penetrating through the upper and lower end surfaces thereof along the center line, the optical filter 6 is mounted in the through hole, specifically, the optical filter 6 is fixedly connected with the bracket 3 through glue, and the optical filter 6 is accommodated in the through hole of the bracket 3, so that the assembled structural height of the optical filter and the bracket is reduced, and the structural height of the camera module is correspondingly reduced.

Further, referring to fig. 3 and 5, a positioning groove 41 is provided on the upper end surface of the circuit board 4, the shape of the positioning groove 41 corresponds to that of the bracket 3, and the bracket 3 is mounted thereon, wherein the bracket 3 can be quickly assembled to the positioning groove 41 of the circuit board 4 through the positioning action of the positioning groove 41.

Further, referring to fig. 3-5, the circuit board 4 is provided with a receiving hole 42 penetrating through the upper and lower end surfaces thereof, the receiving hole 42 is communicated with the positioning slot 41, and the receiving hole 42 is used for receiving the chip 8, so that the light passing through the lens 1 and the optical filter 6 can be projected onto the upper surface of the chip 8 in the receiving hole 42 through the positioning slot 41; meanwhile, the cross section size of the positioning groove 41 is larger than that of the accommodating hole 42, so that the positioning groove 41 and the inner wall of the accommodating groove 42 form a step-like structure, and the support 3 is supported and placed in the positioning groove 41, and in fact, part of the structure at the bottom of the support 3 is supported on the positioning groove 41 and the upper surface of the circuit board 4; in another embodiment, when the circuit board 4 is only provided with the accommodation hole 42 penetrating the upper and lower end surfaces thereof and the positioning groove 41 is not provided, the whole structure of the bracket 3 is supportingly provided on the upper surface of the circuit board 4; the chip 8 is accommodated in the accommodating hole 42 and fixed on the reinforcing plate 5, so that the chip 8 is attached to the upper surface of the reinforcing plate 5 in a sinking manner, and the chip 8 is connected with the circuit board 4 through gold wires to realize the electric connection of the chip 8 and the circuit board, thereby reducing the assembled structural height of the chip 8 and the circuit board, further correspondingly reducing the structural height of the camera module, and realizing the miniaturization design of the camera module; in addition, the reinforcing plate 5 is arranged to be a steel sheet, a copper sheet and the like, and can play a role in supporting, and meanwhile, a radiating effect is achieved on the inner space of the camera module, and the chip 8 is fixed on the reinforcing plate 5, so that the chip 8 can be conveniently radiated. In this embodiment, the chip 8 and the circuit board 4 are connected by gold wires to achieve electrical connection of the two, the circuit board 4 substrate at the position of the positioning slot 4 is divided into an upper substrate and a lower substrate, the upper substrate and the lower substrate are connected with each other, the lower substrate is located at one side close to the chip 8, the upper substrate is located at one side far away from the chip 8, the upper surface of the lower substrate is used for connection of the gold wires, i.e. one end of the gold wires is connected to the upper surface of one side of the chip 8, the other end of the gold wires is connected to the upper surface of the lower substrate, so as to achieve electrical connection of the chip 8 and the circuit board 4, and the upper surface of the lower substrate is also used for supporting the fixing bracket 3, the bracket 3 does not interfere with connection of the gold wires with the chip 8 and the circuit board 4, i.e. the connection of the gold wires is located at the upper surface of the lower substrate, the upper surface of one side close to the chip 8, and the connection of the fixing bracket 3 is located at the same upper surface of the lower substrate, but located at one side far away from the chip 8. In another embodiment, since the circuit board 4 is only provided with the accommodating hole 42 penetrating the upper and lower end surfaces thereof, and the positioning groove 41 is not provided, the whole structure of the bracket 3 is supported and arranged on the upper surface of the circuit board 4, so that one end of the gold wire is connected to the upper surface of the chip 8, the other end is connected to the upper surface of the circuit board 4, and the bracket 33 does not interfere with the connection of the gold wire with the chip 8 and the circuit board 4, thereby realizing the electrical connection between the chip 8 and the circuit board 4.

Further, referring to fig. 3 and 5, a plurality of electronic components 43 are disposed on the upper end surface of the circuit board 4, a clamping groove 31 is disposed on the lower end surface of the bracket 3, and the electronic components 43 can be accommodated in the clamping groove 31, so that the structural design is further optimized, and the height dimension of the camera module is reduced.

Further, referring to fig. 3-5, the latent heat structure 7 is disposed outside the voice coil motor 2, the latent heat structure 7 is configured as a hollow square structure, and the middle space is a latent heat chamber; a phase change material layer 9 is arranged in the latent heat chamber; the latent heat structure 7 may be disposed on one side of the stiffening plate 5 by cementing, welding, assembling or integrally stamping, so that the phase change material layer 9 in the latent heat cavity can effectively transfer heat with the circuit board 4, thereby slowing down the temperature reduction speed when the temperature of the phase change material layer is too high for heat dissipation or temperature reduction, and of course, since the heat generation in the camera module mainly originates from the chip 8, the phase change material layer 9 can effectively transfer heat to the circuit board 4, and simultaneously can also play the same role on the chip 8, namely slowing down the temperature reduction speed when the temperature of the phase change material layer is too high for heat dissipation or temperature reduction, wherein the heat transfer modes include heat conduction, heat radiation, heat convection and the like; meanwhile, the latent heat chamber is a closed space, can absorb and store certain heat to a certain extent, and releases the heat when the temperature is reduced, so that the latent heat chamber is matched with the phase change material layer 9 to delay the reduction speed of the internal temperature of the camera module. Preferably, in the present embodiment, two latent heat structures 7 are disposed at a side of the reinforcing plate 5 at intervals, the circuit board 4 passes through between the two latent heat structures 7, and the two latent heat structures 7 are both provided with a phase change material layer 9, so as to provide two heat absorption points, thereby further preventing the temperature from being too high, and the two latent heat structures 7 can release heat when the external temperature is reduced, so that the reduction speed of the internal temperature of the camera module can be further delayed.

Of course, in other embodiments, the shape of the latent heat structure 7 may be provided in other forms, such as circular, prismatic, irregular, etc.; as long as the latent heat structure 7 can be ensured to achieve the corresponding effect; meanwhile, the installation positions and the number of the latent heat structures 7 can also be changed according to specific use conditions, such as a plurality of the latent heat structures are arranged and are surrounded on the side wall of the voice coil motor 2; as long as the corresponding use effect can be ensured.

Further, in this embodiment, the phase change material layer 9 is provided as a solid phase change material layer 9, or the phase change material layer 9 may be grafted neoprene, SBS graft copolymer, or the like, and meanwhile, the phase change material layer 9 may select a material with a corresponding phase change temperature according to the temperature of the environmental change, for example, a material with a phase change temperature of about 80 ℃.

In other embodiments, the phase change material layer 9 may also be semi-solid, and specific materials may also be in other forms, so long as the phase change material layer can be stably arranged in the latent heat structure 7, and the use effect is not affected, and the use of the camera module is not affected.

Compared with the prior art: the camera module comprises a lens 1, a voice coil motor 2, a circuit board 4 and a reinforcing plate 5; the camera lens 1 is arranged at the middle position of the voice coil motor 2, the circuit board 4 is arranged at the lower end face of the voice coil motor 2, the reinforcing plate 5 is arranged at the lower end face of the circuit board 4, one side of the reinforcing plate 5 is provided with a latent heat structure 7, a phase change material layer 9 is arranged in the latent heat structure 7, wherein when the temperature in the camera module reaches the phase change temperature of the phase change material layer 9, the phase change material layer 9 can absorb heat in the camera module so as to delay the change speed of the temperature in the camera module, thereby preventing the service life of the internal element from being influenced by the excessively high temperature in the camera module, and simultaneously, when the external environment temperature of the camera module is reduced, the heat is gradually released through the phase change material layer 9 of the latent heat structure 7 so as to delay the reduction speed of the temperature in the camera module, thereby forming a buffer effect, enabling the circuit board 4 to gradually adapt to temperature change, preventing the circuit board 4 from being deformed due to thermal expansion and contraction caused by the too fast, and further protecting the circuit board 4 and prolonging the service life thereof.

It should be noted that the latent heat structure 7 of the present application is not limited to be used in a mobile phone camera module, but may be used in an intelligent device such as a vehicle-mounted intelligent device or an unmanned aerial vehicle.

Any combination of the various embodiments of the utility model should be considered as being within the scope of the present disclosure, as long as the inventive concept is not violated; within the scope of the technical idea of the utility model, any combination of various simple modifications and different embodiments of the technical proposal without departing from the inventive idea of the utility model should be within the scope of the utility model.

Claims

1. A camera module, its characterized in that: lens, voice coil motor, circuit board and reinforcing plate; the camera lens is arranged at the middle position of the voice coil motor, the circuit board is arranged at the lower end face of the voice coil motor, the reinforcing plate is arranged at the lower end face of the circuit board, a latent heat structure is arranged on one side of the reinforcing plate, a phase change material layer is arranged in the latent heat structure, and the phase change material layer is used for absorbing heat or releasing heat when the temperature of the camera module changes too fast so as to relieve the temperature change speed in the camera module.

2. The camera module of claim 1, wherein: when the temperature of the phase change material layer in the camera module rises and reaches the phase change temperature, the phase change material layer can absorb heat in the camera module to delay the change speed of the temperature in the camera module; when the temperature of the phase change material layer in the camera module is reduced, the phase change material layer can release heat to delay the change speed of the temperature in the camera module.

3. The camera module of claim 1, wherein: the device also comprises a bracket, an optical filter and a chip; the bracket is arranged at the upper end face of the circuit board and is accommodated in the voice coil motor; the optical filter is arranged on the bracket and is positioned below the lens; the chip is arranged at the middle position of the circuit board and is positioned below the optical filter.

4. A camera module according to claim 3, wherein: the upper end face of the circuit board is provided with a positioning groove, and the positioning groove is used for positioning and mounting the bracket.

5. The camera module of claim 4, wherein: the circuit board is provided with a containing hole penetrating through the upper end face and the lower end face of the circuit board, the containing hole is communicated with the positioning groove, and the cross section size of the positioning groove is larger than that of the containing hole; the chip is fixed on the reinforcing plate and is accommodated in the accommodating hole;

6. The camera module of claim 1, wherein: the latent heat structure is disposed outside the voice coil motor.

7. A camera module according to claim 3, wherein: the lower end face of the support is provided with a clamping groove which is used for accommodating electronic components on the circuit board.

8. The camera module of claim 1, wherein: the latent heat structure is a hollow square structure, and the middle space is a latent heat chamber; the phase change material layer is arranged in the latent heat cavity.

9. The camera module of claim 1, wherein: the phase change material layer is arranged as a solid phase change material layer; or, the phase change material layer is configured as grafted neoprene.

10. The camera module of claim 1, wherein: two latent heat structures are arranged on the side edges of the reinforcing plate at intervals, and the circuit board passes through the space between the two latent heat structures.