CN220672769U - Battery pack mold protecting structure and battery module - Google Patents
Battery pack mold protecting structure and battery module Download PDFInfo
- Publication number
- CN220672769U CN220672769U CN202322064326.8U CN202322064326U CN220672769U CN 220672769 U CN220672769 U CN 220672769U CN 202322064326 U CN202322064326 U CN 202322064326U CN 220672769 U CN220672769 U CN 220672769U
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- Prior art keywords
- wire
- battery
- circuit board
- mold
- battery pack
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Links
- 238000003466 welding Methods 0.000 claims abstract description 41
- 239000003292 glue Substances 0.000 claims abstract description 33
- 230000014759 maintenance of location Effects 0.000 claims description 19
- 238000005538 encapsulation Methods 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 12
- 238000004806 packaging method and process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Abstract
The application provides a battery pack die-protecting structure and a battery module. The battery pack mold-protecting structure comprises a mold-protecting rubber shell and a battery component; the mold-protecting rubber shell is provided with a plurality of battery accommodating spaces; the battery assembly comprises a connecting circuit board and a plurality of electric cores, the connecting circuit board is connected with the die-retention rubber shell, the connecting circuit board is provided with a plurality of electric core welding areas, each electric core welding area is positioned between any two adjacent battery accommodating spaces, and the adjacent two electric core welding areas are separated by at least one battery accommodating space. Each cell welding area is located between any two adjacent cells, a connecting circuit board is placed through a gap between the cells, and cell interval spaces on the die-protecting glue shell are fully utilized, so that the connecting circuit board welds the cells together, serial-parallel connection between the cells is realized, occupied space of the connecting circuit board is reduced, and miniaturization of the die-protecting structure of the battery pack is facilitated.
Description
Technical Field
The utility model relates to the technical field of batteries, in particular to a battery pack mold-protecting structure and a battery module.
Background
At present, various complete machines, such as mobile phones and notebooks, are light and thin, the whole space of a battery is smaller, but the functions to be realized are complex, more components exist, the problems of heat dissipation, serial-parallel connection of battery cells and the like are also required to be considered, the space of the PCM is smaller, the traditional PCM structure is more at present in a lengthening and widening mode to realize component ornament, the space occupation is larger, and the whole structure of a battery module is overlarge, for example, the application number of China patent application with CN201621464887.0 is caused.
Disclosure of Invention
The utility model aims to overcome the defects in the prior art and provides a battery pack mold-protecting structure and a battery module, wherein the battery pack mold-protecting structure and the battery module effectively reduce the volume of the whole battery pack.
The aim of the utility model is realized by the following technical scheme:
a battery pack mold retention structure comprising: a mold-protecting gel shell and a battery component; the die-retention rubber shell is provided with a plurality of battery accommodating spaces which are mutually arranged at intervals; the battery assembly comprises a connecting circuit board and a plurality of battery cells, wherein each battery cell is positioned in one battery accommodating space, the connecting circuit board is connected with the die-protecting rubber shell, the connecting circuit board is provided with a plurality of battery cell welding areas, each battery cell welding area is positioned between any two adjacent battery accommodating spaces, two adjacent battery cell welding areas are spaced apart by at least one battery accommodating space, and each battery cell welding area is used for welding with at least one tab of each battery cell so as to enable a plurality of battery cells to be connected in series-parallel.
In one embodiment, the mold-protecting glue shell is provided with a plurality of wire board mounting grooves, and each cell welding area is positioned in one wire board mounting groove.
In one embodiment, the connection circuit board includes a connection wire and a plurality of wire boards, the wire boards are respectively electrically connected with the connection wire, and each wire board is clamped in one wire board mounting groove.
In one embodiment, the mold-protecting glue shell is further provided with a wire groove communicated with each wire board mounting groove, and the connecting wire is clamped in the wire groove.
In one embodiment, the connecting wire comprises a plurality of electrically connected connecting sub-wires, and the plurality of connecting sub-wires are clamped in the wire grooves.
In one embodiment, the battery pack die-retention structure further comprises a wire limiting plate, the wire limiting plate is connected with the die-retention rubber shell, the wire limiting plate is located in the wire groove, and the wire limiting plate and the bottom of the wire groove jointly clamp the connecting wires.
In one embodiment, the battery assembly further comprises a wire board fixing adhesive, and the wire board fixing adhesive is respectively connected with the connecting circuit board and the mold-protecting adhesive shell.
In one embodiment, the battery assembly further comprises a packaging cover plate, wherein the packaging cover plate is connected with the mold-preserving rubber shell, and the packaging cover plate is used for sealing the battery accommodating space.
In one embodiment, the battery assembly further includes a wire board cushion pad connected to the connection circuit board and the encapsulation cover plate, respectively.
A battery module comprising the battery pack mold-retaining structure of any of the above embodiments.
Compared with the prior art, the utility model has at least the following advantages:
each cell welding area is located between any two adjacent cells, a connecting circuit board is placed through a gap between the cells, and cell interval spaces on the die-protecting glue shell are fully utilized, so that the connecting circuit board welds the cells together, serial-parallel connection between the cells is realized, occupied space of the connecting circuit board is reduced, and miniaturization of the die-protecting structure of the battery pack is facilitated.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a battery pack mold retention structure according to an embodiment;
FIG. 2 is a schematic view of the internal structure of the battery pack mold-retaining structure of FIG. 1;
FIG. 3 is an exploded schematic view of the battery pack mold retention structure of FIG. 1;
fig. 4 is an enlarged schematic view of the battery pack mold retention structure of fig. 3 at A1.
Detailed Description
In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. The drawings illustrate preferred embodiments of the utility model. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
The utility model relates to a battery pack die-protecting structure. In one embodiment, the battery pack mold retention structure comprises a mold retention gel shell and a battery assembly; the die-retention rubber shell is provided with a plurality of battery accommodating spaces which are mutually arranged at intervals; the battery assembly comprises a connecting circuit board and a plurality of battery cells, wherein each battery cell is positioned in one battery accommodating space, the connecting circuit board is connected with the die-protecting rubber shell, the connecting circuit board is provided with a plurality of battery cell welding areas, each battery cell welding area is positioned between any two adjacent battery accommodating spaces, two adjacent battery cell welding areas are spaced apart by at least one battery accommodating space, and each battery cell welding area is used for welding with at least one tab of each battery cell so as to enable a plurality of battery cells to be connected in series-parallel. Each cell welding area is located between any two adjacent cells, a connecting circuit board is placed through a gap between the cells, and cell interval spaces on the die-protecting glue shell are fully utilized, so that the connecting circuit board welds the cells together, serial-parallel connection between the cells is realized, occupied space of the connecting circuit board is reduced, and miniaturization of the die-protecting structure of the battery pack is facilitated.
Fig. 1 is a schematic structural diagram of a battery pack mold-protecting structure according to an embodiment of the utility model.
The battery pack mold retention structure 10 of an embodiment includes a mold retention gel case 100. Referring to fig. 2, the battery pack mold-protecting structure 10 further includes a battery assembly 200. The mold-retaining adhesive shell 100 is provided with a plurality of battery accommodating spaces 102, and the battery accommodating spaces 102 are arranged at intervals. The battery assembly 200 includes a connection circuit board 210 and a plurality of battery cells 220. Each of the battery cells 220 is located in one of the battery accommodating spaces 102. The connection circuit board 210 is connected with the mold-preserving glue shell 100, the connection circuit board 210 has a plurality of cell welding areas 202, each cell welding area 202 is located between any two adjacent cell accommodating spaces 102, and two adjacent cell welding areas 202 are separated by at least one cell accommodating space 102. Each of the cell welding areas 202 is configured to be welded to a tab of at least one of the cells 220, so as to connect a plurality of the cells 220 in series-parallel.
In this embodiment, each cell welding area 202 is located between any two adjacent cells 220, and the connection circuit board 210 is placed through a gap between the cells 220, so that the space between the cells 220 on the die-protecting glue shell 100 is fully utilized, the connection circuit board 210 welds the cells 220 together, and serial-parallel connection between the cells 220 is realized, so that the occupied space of the connection circuit board 210 is reduced, and miniaturization of the die-protecting structure of the battery pack is facilitated.
Moreover, the plurality of the die bonding pads 202 dispersedly arrange the solder joints of the connection circuit board 210, thereby not only fully utilizing the gap positions on the die-protecting glue shell 100 and reducing the production cost, but also dispersing the heat of the solder joints of the connection circuit board 210 during electric conduction, effectively reducing the probability of local overheating of the connection circuit board 210 and improving the overall heat dissipation effect of the die-protecting structure of the battery pack.
In one embodiment, referring to fig. 3, the mold compound housing 100 is provided with a plurality of wire board mounting slots 104, and each of the die bonding areas 202 is located in one of the wire board mounting slots 104. In this embodiment, the wire board mounting groove 104 is located on the mold-protecting glue shell 100, specifically, the wire board mounting groove 104 is located in a gap between a plurality of the battery accommodating spaces 102 of the mold-protecting glue shell 100, for example, each wire board mounting groove 104 is located between two adjacent battery accommodating spaces 102, the electric core welding area 202 is located on the connecting circuit board 210, and at least part of the connecting circuit board 210 is placed in the wire board mounting groove 104, so that the electric core welding area 202 on the connecting circuit board 210 is located in the corresponding wire board mounting groove 104, and welding between the electric core welding area 202 and the tab of the corresponding electric core 220 is facilitated, thereby facilitating serial-parallel connection of the electric energy output ends of the electric cores 220.
Further, referring to fig. 3, the connection circuit board 210 includes a connection wire 212 and a plurality of wire boards 214, and the plurality of wire boards 214 are electrically connected to the connection wire 212, and each wire board 214 is clamped in one of the wire board mounting slots 104. In this embodiment, the connecting wires 212 connect a plurality of the wire boards 214 in series, so that the current between the wire boards 214 is conducted. The wire plates 214 serve as receiving plates of the cell welding areas 202, that is, the cell welding areas 202 are located on the corresponding wire plates 214, the wire plates 214 are disposed in the corresponding wire plate mounting grooves 104, and specifically, the wire plates 214 are in one-to-one correspondence with the wire plate mounting grooves 104. In this way, the wire board 214 welds the tab of each of the electrical cores 220 in the electrical core welding area 202, and electrically connects the tab of each of the electrical cores 220 in series through the connecting wire 212, so as to realize serial-parallel connection of the electrical cores 220.
In another embodiment, the plurality of circuit boards of the connecting wire are a main board, the other circuit boards are auxiliary boards, the main board is provided with a die bonding area and a corresponding control circuit besides a die bonding area, and the auxiliary board is provided with a die bonding area and a corresponding connecting circuit.
Still further, referring to fig. 4, the mold-preserving glue case 100 is further provided with a wire groove 106 that is communicated with each of the wire board mounting grooves 104, and the connecting wires 212 are clamped in the wire groove 106. In this embodiment, the wire grooves 106 are formed in the mold-protecting glue shell 100, the opening direction of the wire grooves 106 is the same as the opening direction of the wire board mounting groove 104, the wire grooves 106 accommodate the connecting wires 212, so that the connecting circuit boards 210 are conveniently embedded into the mold-protecting glue shell 100 together, and the connecting circuit boards 210 are located in the gaps of the mold-protecting glue shell 100, so that the space of the mold-protecting glue shell 100 is fully utilized.
Still further, the connecting wire includes a plurality of electrically connected connection sub-lines, and a plurality of connection sub-lines are all blocked and located in the wire groove. In this embodiment, the connection sub-line is a unit line of the connection wire, and a plurality of connection sub-lines are distributed in the wire groove, and at least two wire boards of each connection sub-line are connected together, so as to facilitate current conduction on each wire board. In another embodiment, a plurality of the connection sub-lines are sequentially connected to form a linear conductive line. In another embodiment, one end of the plurality of connection sub-lines is commonly connected such that the connection wires form divergent wires, for example, the plurality of connection sub-lines have a star structure after being connected.
Still further, referring to fig. 4, the battery pack mold-protecting structure 10 further includes a wire limiting plate 300, the wire limiting plate 300 is connected with the mold-protecting glue shell 100, the wire limiting plate 300 is located in the wire slot 106, and the wire limiting plate 300 and the bottom of the wire slot 106 jointly clamp the connecting wire 212. In this embodiment, the wire limiting plate 300 is disposed in the wire groove 106, and specifically, the wire limiting plate 300 is connected to an inner wall of the wire groove 106. The wire limiting plate 300 is abutted with the connecting wire 212, the wire limiting plate 300 abuts against the connecting wire 212 at the bottom of the wire groove 106, so that the connecting wire 212 is clamped by the wire limiting plate 300 and the bottom of the wire groove 106, and the connecting wire 212 is stably fixed in the wire groove 106, and then the connecting wire 212 is more stably installed in the wire groove 106.
In one embodiment, referring to fig. 3, the battery assembly 200 further includes a wire board fixing adhesive 230, and the wire board fixing adhesive 230 is connected to the connection circuit board 210 and the mold-protecting adhesive case 100, respectively. In this embodiment, the wire board fixing glue 230 is located between the connection circuit board 210 and the mold-retaining glue case 100, specifically, the wire board fixing glue 230 is located at the bottom of the wire board mounting groove 104, and the wire board fixing glue 230 has a double-sided adhesive function, for example, the wire board fixing glue 230 is a white double-sided adhesive. The connection circuit board 210 is connected to the bottom of the wire board mounting groove 104 through the wire board fixing adhesive 230, so that the connection circuit board 210 is bonded to the mold-protecting adhesive shell 100, and the connection circuit board 210 is stably disposed on the mold-protecting adhesive shell 100.
In one embodiment, referring to fig. 3, the battery assembly 200 further includes a packaging cover 240, the packaging cover 240 is connected to the mold-preserving glue case 100, and the packaging cover 240 is used for sealing the battery accommodating space 102. In this embodiment, the package cover 240 is used as a sealing cover of the battery accommodating space 102, the battery accommodating space 102 accommodates the battery cell 220, after the tab of the battery cell 220 is welded to the battery cell welding area 202 of the connection circuit board 210, the package cover 240 is clamped with the mold-preserving glue shell 100, and the package cover 240 shields the opening of the battery accommodating space 102 to seal the battery accommodating space 102, so as to reduce corrosion of dust and moisture in the external environment to the battery cell 220.
In another embodiment, the battery accommodating space 102 is a through hole on the mold-protecting glue shell 100, so that the mold-protecting glue shell 100 has a hollow structure, the hollow area of the mold-protecting glue shell 100 is the area where the battery accommodating space 102 is located, and after the battery cells 220 are installed in the battery accommodating space 102, two package cover plates 240 are respectively located at two sides of the mold-protecting glue shell 100, so as to seal each battery cell 220 on the mold-protecting glue shell 100.
Further, referring to fig. 3, the battery assembly 200 further includes a wire board cushion 250, and the wire board cushion 250 is connected to the connection circuit board 210 and the package cover 240, respectively. In this embodiment, the wire board buffer pad 250 is located between the connection circuit board 210 and the encapsulation cover 240, specifically, one surface of the wire board buffer pad 250 abuts against the connection circuit board 210, the other surface of the wire board buffer pad 250 abuts against the encapsulation cover 240, and the wire board buffer pad 250 serves as a buffer member between the connection circuit board 210 and the encapsulation cover 240. In this way, when the package cover 240 seals each of the electrical cores 220 on the mold-protecting glue case 100, the wire board buffer pad 250 provides a buffer force for the package cover 240, so that the package cover 240 is prevented from damaging the connection circuit board 210, and normal use of the soldering points and other electronic components on the connection circuit board 210 is ensured.
In one embodiment, the application further provides a battery module, including the battery pack mold-protecting structure according to any one of the embodiments. In this embodiment, the battery pack mold-protecting structure includes a mold-protecting gel case and a battery assembly; the die-retention rubber shell is provided with a plurality of battery accommodating spaces which are mutually arranged at intervals; the battery assembly comprises a connecting circuit board and a plurality of battery cells, wherein each battery cell is positioned in one battery accommodating space, the connecting circuit board is connected with the die-protecting rubber shell, the connecting circuit board is provided with a plurality of battery cell welding areas, each battery cell welding area is positioned between any two adjacent battery accommodating spaces, two adjacent battery cell welding areas are spaced apart by at least one battery accommodating space, and each battery cell welding area is used for welding with at least one tab of each battery cell so as to enable a plurality of battery cells to be connected in series-parallel. Each cell welding area is located between any two adjacent cells, a connecting circuit board is placed through a gap between the cells, and cell interval spaces on the die-protecting rubber shell are fully utilized, so that the connecting circuit board welds the cells together, serial-parallel connection between the cells is realized, occupied space of the connecting circuit board is reduced, and miniaturization of a battery module is facilitated.
The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.
Claims (10)
1. A battery pack mold retention structure, comprising:
the die-retention rubber shell is provided with a plurality of battery accommodating spaces which are arranged at intervals;
the battery assembly comprises a connecting circuit board and a plurality of battery cells, wherein each battery cell is positioned in one battery accommodating space, the connecting circuit board is connected with the die-protecting rubber shell, the connecting circuit board is provided with a plurality of battery cell welding areas, each battery cell welding area is positioned between any two adjacent battery accommodating spaces, the adjacent two battery cell welding areas are spaced apart by at least one battery accommodating space, and each battery cell welding area is used for welding with at least one tab of each battery cell so as to enable a plurality of battery cells to be connected in series-parallel.
2. The battery pack mold retention structure of claim 1, wherein the mold retention gel housing defines a plurality of wire plate mounting slots, each of the die bond pads being located within one of the wire plate mounting slots.
3. The battery pack mold-protecting structure according to claim 2, wherein the connecting circuit board comprises connecting wires and a plurality of wire boards, the plurality of wire boards are respectively and electrically connected with the connecting wires, and each wire board is clamped in one wire board mounting groove.
4. The battery pack mold-protecting structure according to claim 3, wherein the mold-protecting rubber shell is further provided with wire grooves communicated with the wire board mounting grooves, and the connecting wires are clamped in the wire grooves.
5. The battery pack mold retention structure of claim 4, wherein the connecting wire comprises a plurality of electrically connected connecting sub-wires, the plurality of connecting sub-wires being each snapped into the wire slot.
6. The battery pack mold retention structure of claim 4, further comprising a wire limiting plate, wherein the wire limiting plate is connected with the mold retention rubber shell, wherein the wire limiting plate is positioned in the wire groove, and wherein the wire limiting plate and the bottom of the wire groove jointly clamp the connecting wire.
7. The battery pack mold retention structure of claim 1, wherein the battery assembly further comprises a wire plate fixing glue, the wire plate fixing glue being connected with the connection circuit board and the mold retention glue shell, respectively.
8. The battery pack mold retention structure of claim 1, wherein the battery assembly further comprises a package cover plate, the package cover plate is connected with the mold retention glue shell, and the package cover plate is used for sealing the battery accommodating space.
9. The battery pack mold retention structure of claim 8, wherein the battery assembly further comprises a wire plate cushion coupled to the connection circuit board and the encapsulation cover, respectively.
10. A battery module comprising the battery pack mold-retaining structure according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322064326.8U CN220672769U (en) | 2023-08-02 | 2023-08-02 | Battery pack mold protecting structure and battery module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322064326.8U CN220672769U (en) | 2023-08-02 | 2023-08-02 | Battery pack mold protecting structure and battery module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220672769U true CN220672769U (en) | 2024-03-26 |
Family
ID=90336840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322064326.8U Active CN220672769U (en) | 2023-08-02 | 2023-08-02 | Battery pack mold protecting structure and battery module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220672769U (en) |
-
2023
- 2023-08-02 CN CN202322064326.8U patent/CN220672769U/en active Active
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