CN220672517U

CN220672517U - Monitoring device of semiconductor process chamber and semiconductor process equipment

Info

Publication number: CN220672517U
Application number: CN202321602348.9U
Authority: CN
Inventors: 孙国正; 王家祥; 赵梓含
Original assignee: Beijing Naura Microelectronics Equipment Co Ltd
Current assignee: Beijing Naura Microelectronics Equipment Co Ltd
Priority date: 2023-06-21
Filing date: 2023-06-21
Publication date: 2024-03-26
Anticipated expiration: 2033-06-21

Abstract

The utility model discloses a monitoring device of a semiconductor process chamber and semiconductor process equipment, wherein the monitoring device comprises: the telescopic driving mechanism is arranged on the chamber wall and is in sealing butt joint with the open hole; the guide piece is tubular and is arranged in the opening, one end of the guide piece is connected with the telescopic driving mechanism, the other end of the guide piece is closed and transparent, and a monitor for monitoring the internal state of the semiconductor process chamber is arranged in the other end of the guide piece; the driving mechanism is used for driving the guide piece to carry the monitor to extend into the semiconductor process chamber along the axial direction of the opening hole, or driving the guide piece to carry the monitor to retract into the opening hole along the axial direction of the opening hole. The utility model can realize the monitoring of the internal state of the semiconductor process chamber.

Description

Monitoring device of semiconductor process chamber and semiconductor process equipment

Technical Field

The utility model belongs to the field of semiconductor equipment, and particularly relates to a monitoring device of a semiconductor process chamber and semiconductor process equipment.

Background

In semiconductor processing equipment, the internal state of a process chamber is often difficult to observe and perceive, and factors such as the hardware attitude inside the chamber, the physical distribution state of plasma inside the chamber, and the spectral characteristics of the central edge during the process inside the chamber often affect the process.

At present, the monitoring of the internal state of the chamber is mainly completed through an observation window structure of the process chamber, wherein the observation window structure is an indispensable structure in semiconductor equipment, and the main effect of the observation window structure is as follows: before the process, namely in the process that the manipulator transmits the wafer in the transmission chamber to the process chamber, the internal state of the chamber is observed through the observation window structure of the process chamber, and the three-needle lifting condition and the wafer positioning condition are checked; in the process, the process chamber observation window structure is used for observing the starting condition; after the process, the process chamber observation window structure is used for observing the desorption condition of the electrostatic chuck and observing whether the wafer deviates from the center of the electrostatic chuck due to incomplete electrostatic discharge of the electrostatic chuck or overlarge back He flow. The existing observation window structure is limited to have an observation effect and cannot detect the physical state inside the process chamber.

Disclosure of Invention

The utility model aims to provide a monitoring device of a semiconductor process chamber and semiconductor process equipment, which realize the monitoring of the internal state of the process chamber.

To achieve the above object, in a first aspect, the present utility model provides a monitoring device for a semiconductor process chamber, where an opening is provided on a chamber wall of the semiconductor process chamber, the monitoring device includes:

the telescopic driving mechanism is arranged on the chamber wall and is in sealing butt joint with the open hole;

the guide piece is tubular, the guide piece is arranged in the opening, one end of the guide piece is connected with the telescopic driving mechanism, the other end of the guide piece is closed and transparent, and a monitor for observing the internal state of the reaction chamber is arranged in the other end of the guide piece;

the telescopic driving mechanism is used for driving the guide piece to carry the monitor to extend into the semiconductor process chamber along the axial direction of the opening hole or driving the guide piece to carry the monitor to retract into the opening hole along the axial direction of the opening hole.

Optionally, the telescopic driving mechanism comprises a cylindrical mounting seat, and the mounting seat and the open hole are coaxially arranged;

one end of the mounting seat is in sealing connection with the chamber wall at the opening, an air cylinder is arranged on the end face of the other end of the mounting seat, and a telescopic rod of the air cylinder extends into the mounting seat;

the installation seat is internally provided with a sliding connection assembly, and the guide piece is connected with the telescopic rod through the sliding connection piece.

Optionally, the sliding connector comprises a sliding tube shaft and a corrugated tube, the corrugated tube is arranged at one end, close to the opening, in the mounting seat, the corrugated tube is coaxially arranged with the opening, one end of the corrugated tube is in sealing connection with the opening, and the sliding tube shaft is sleeved in the corrugated tube and is in sliding sealing connection with the corrugated tube;

one end of the sliding tube shaft is connected with one end of the guide piece, and the other end of the sliding tube shaft is connected with the telescopic rod of the air cylinder.

Optionally, the telescopic rod of the cylinder is connected with one end of the sliding tube shaft through a coupling.

Optionally, the guide is coaxially disposed with the aperture;

one end of the guide piece, which is close to the telescopic driving mechanism, is an open end, and the open end is in sealing connection with one end of the sliding tube shaft.

Optionally, the monitor is provided with a communication cable, a cable through hole is formed in a pipe wall of the sliding pipe shaft, which is close to one end of the air cylinder, and the communication cable is led out from the cable through hole to communicate with the outside.

Optionally, the open end of guide is equipped with first flange, the slip tube axle is close to the one end of guide is equipped with the second flange, first flange with be equipped with first sealing washer between the second flange, first flange with be equipped with the screw hole on the second flange, first flange with connect through fastening screw between the second flange.

Optionally, a threaded protective cap for shielding the fastening screw is arranged in the threaded hole on the first flange.

Optionally, a gap of 0.5-1mm is provided between the outer edges of the first flange and the second flange and the inner wall of the opening.

Optionally, the bellows is close to the one end of trompil is equipped with the third flange, trompil department the cavity wall surface be equipped with third flange complex mounting groove, the third flange is fixed in the mounting groove, the third flange with be equipped with the second sealing washer between the mounting groove.

Optionally, the material of the guide is a transparent, high temperature resistant and corrosion resistant material.

Optionally, the transparent, high temperature resistant and corrosion resistant material includes quartz and transparent resin.

Optionally, the monitor includes a camera and a plasma sensor.

In a second aspect, the utility model provides a semiconductor processing apparatus comprising a process chamber provided with at least one monitoring device for a semiconductor process chamber according to any one of the first aspects.

The utility model has the beneficial effects that:

the device is provided with the tubular guide piece and the telescopic driving mechanism at the opening position of the chamber wall of the process chamber, one end of the guide piece far away from the telescopic driving mechanism is transparent, the inside of the guide piece is provided with the monitor for monitoring the internal state of the process chamber, the telescopic driving mechanism drives the guide piece to move in a telescopic manner, the monitor can be driven to extend into the process chamber to monitor when monitoring is needed, the guide piece can be driven to retract into the opening of the chamber wall to avoid influencing the process when monitoring is not needed, and the observation and measurement of different states inside the process chamber can be realized by arranging different monitors, so that the problems that the internal state is not clear when the observation window structure of the existing process chamber is used for observing, the observation angle is one-sided, and the internal physical state of the process chamber cannot be perceived are solved.

The system of the present utility model has other features and advantages which will be apparent from or are set forth in detail in the accompanying drawings and the following detailed description, which are incorporated herein, and which together serve to explain certain principles of the utility model.

Drawings

The foregoing and other objects, features and advantages of the utility model will be apparent from the following more particular descriptions of exemplary embodiments of the utility model as illustrated in the accompanying drawings wherein like reference numbers generally represent like parts throughout the exemplary embodiments of the utility model.

Fig. 1 shows a schematic structural diagram of a conventional semiconductor process chamber monitoring apparatus.

Fig. 2 is a schematic diagram showing the structure of a monitoring apparatus for a semiconductor process chamber according to embodiment 1 of the present utility model.

Fig. 3 is a schematic view showing an extended state of a monitoring device of a semiconductor process chamber according to embodiment 1 of the present utility model.

Fig. 4 is a plan view showing a mounting position of a monitoring device in a semiconductor processing apparatus according to embodiment 2 of the present utility model.

Fig. 5 shows a side view of the mounting position of a monitoring device in a semiconductor processing apparatus according to embodiment 2 of the present utility model.

Fig. 6 shows a side view of another mounting position of a monitoring device in a semiconductor processing apparatus according to embodiment 2 of the present utility model.

Fig. 7 shows a top view of still another mounting position of a monitoring device in a semiconductor processing apparatus according to embodiment 2 of the present utility model.

Detailed Description

As shown in fig. 1, the existing process chamber monitoring device mainly adopts an observation window structure to observe the internal condition of a process chamber 7, an opening 6 is formed in the side wall of the process chamber, the internal condition of the process chamber is observed through a reaction chamber quartz cover 4, a sealing ring 5 is arranged between the process chamber quartz cover 4 and the process chamber 7 to ensure sealing, a shielding net 2 and a quartz cover resin pad 3 for preventing radio frequency radiation are arranged between the quartz cover 4 and a quartz cover plate 1, and the quartz cover 4 is not damaged when the quartz cover plate 1 is pressed against the quartz cover 4 through screws.

When the existing observation structure observes the internal state of the process chamber 7, as the shielding net 2 is used for shielding, and after the cavity is closed, the internal part of the process chamber 7 is not provided with a visible light source except for starting, the external light source is required to be used for illumination, the condition of unclear observation exists, in addition, when the external light source is started, the internal part of the process chamber 7 is observed through the observation window, the risk of radio frequency radiation and high temperature exists, and the structure cannot sense the physical state of the internal part of the process chamber.

The utility model provides a monitoring device of a semiconductor process chamber and semiconductor process equipment, which can solve the problems that the internal state of the observation window of the existing process chamber is unclear and the observation angle is on one side. In addition, the monitoring device can be used for solving the problem that the physical state inside the process chamber cannot be perceived.

The utility model will be described in more detail below with reference to the accompanying drawings. While the preferred embodiments of the present utility model are illustrated in the drawings, it should be understood that the present utility model may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the utility model to those skilled in the art.

Example 1

The embodiment provides a monitoring device of a semiconductor process chamber, wherein an opening is arranged on a chamber wall of a process chamber 1, and the monitoring device comprises:

the telescopic driving mechanism 3 is arranged on the wall of the cavity and is in sealing butt joint with the open hole;

the guide piece 2 is tubular, the guide piece 2 is arranged in the opening, one end of the guide piece 2 is connected with the telescopic driving mechanism 3, the other end of the guide piece 2 is closed and transparent, and a monitor 4 for monitoring the internal state of the process chamber 1 is arranged in the other end of the guide piece 2;

the telescopic driving mechanism 3 is used for driving the guide 2 to carry the monitor 4 to extend into the process chamber 1 along the axial direction of the opening hole, or driving the guide 2 to carry the monitor 4 to retract into the opening hole along the axial direction of the opening hole.

Specifically, this scheme adopts a novel guide 2, and this guide 2 is tubular, and guide 2 one end is connected with flexible actuating mechanism 3, and the other end of guide 2 is sealed, and the other end of guide 2 has transparent thin wall at least, is used for placing different monitors 4 in the guide and gets into process chamber 1, observes the monitoring to process chamber 1 internal state. The guide piece 2 is connected with the guide piece 2 by using a telescopic driving mechanism 3, and the telescopic driving mechanism 3 drives the guide piece 2 to move, so that the monitor 4 in the guide piece 2 is driven by the guide piece 2, and the observation and measurement of the interior of the process chamber 1 are realized.

Preferably, the guide member 2 in this embodiment is entirely transparent and tubular, and the material of the guide member 2 is transparent, high temperature resistant and corrosion resistant. Transparent, high temperature resistant and corrosion resistant materials include quartz, transparent resins, and the like. In this embodiment, the material of the guide 2 is a transparent quartz material.

Specifically, since the interior of the process chamber 1 is a high-vacuum, high-temperature and high-voltage plasma environment, the material of the guide member 2 should be selected from a high-temperature resistant, etching resistant and transparent quartz material or a transparent resin PC material when the interior of the process chamber 1 is observed and monitored.

The monitoring device of the present embodiment is disposed on the chamber wall of the process chamber 1, and the specific position is not limited, and may be disposed on the side wall, the top wall (cover plate) and other positions of the process chamber 1, and the present embodiment is described by taking the side wall disposed on the process chamber 1 as an example.

As shown in fig. 2-5, in this embodiment, the opening is located on the side wall of the process chamber 1, and the telescopic driving mechanism 3 includes a cylindrical mounting seat 5, where the mounting seat 5 and the opening are coaxially arranged;

one end of the mounting seat 5 is in sealing connection with the side wall of the cavity at the position of the opening, the end face of the other end of the mounting seat 5 is provided with an air cylinder 6, and a telescopic rod of the air cylinder 6 extends into the mounting seat 5;

the installation seat 5 is internally provided with a sliding connection component, and the guide piece 2 is connected with the telescopic rod through the sliding connection component.

The sliding connecting piece comprises a sliding pipe shaft 8 and a corrugated pipe 7, the corrugated pipe 7 is arranged at one end, close to the opening, in the mounting seat 5, the corrugated pipe 7 is coaxially arranged with the opening, one end of the corrugated pipe 7 is in sealing connection with the opening, and the sliding pipe shaft 8 is sleeved in the corrugated pipe 7 and is in sliding sealing connection with the corrugated pipe 7; one end of the sliding tube shaft 8 is connected with one end of the guide piece 2, and the other end of the sliding tube shaft 8 is connected with a telescopic rod of the air cylinder 6. Preferably, the telescopic rod of the cylinder 6 is connected to one end of the sliding tube shaft 8 by a coupling 9.

The bellows 7 is close to the one end of trompil and is equipped with the third flange, and the cavity wall surface of trompil department is equipped with the mounting groove with third flange complex, and the third flange is fixed in the mounting groove, is equipped with second sealing washer 12 between third flange and the mounting groove.

The guide piece 2 is coaxially arranged with the opening; one end of the guide piece 2 close to the telescopic driving mechanism 3 is an open end, and the open end is in sealing connection with one end of the sliding tube shaft 8.

The open end of the guide piece 2 is provided with a first flange, one end of the sliding tube shaft 8, which is close to the guide piece 2, is provided with a second flange, a first sealing ring 10 is arranged between the first flange and the second flange, threaded holes are formed in the first flange and the second flange, and the first flange is connected with the second flange through fastening screws.

Specifically, the guide member 2 of the embodiment uses the air cylinder 6 as power driving, the telescopic rod of the air cylinder 6 is connected with the sliding tube shaft 8 in the corrugated tube 7, the air cylinder 6 drives the sliding tube shaft 8 to stretch and retract, the guide member 2 is driven to move, and then the inside of the process chamber 1 is observed and measured through the monitor 4 in the end part of the guide member 2. In other embodiments, instead of the cylinder 6, an electric telescopic rod or a hydraulic drive may be used. Meanwhile, in order to ensure the vacuum sealing inside the process chamber 1, the guide piece 2 is in sealing connection with the sliding tube shaft 8 through a second sealing ring 12, and the corrugated tube 7 is in sealing connection with the side wall of the opening position of the process chamber 1 through a first sealing ring 10.

In this embodiment, preferably, a threaded protective cap for shielding the fastening screw is provided in the threaded hole on the first flange. At the same time, a gap of 0.5-1mm is arranged between the edge of the first flange and the edge of the second flange and the inner wall of the opening.

In particular, in order to prevent the problem of particles at the connection position of the fastening screw between the guide 2 and the sliding tube shaft 8 in the process chamber 1, a screw thread resin protective cap is designed to shield the fastening screw. The minimum distance between the guide piece 2 and the inner wall of the cavity opening is kept between 0.5 and 1mm, so that the transmission allowance is ensured and the plasma is prevented from entering the telescopic driving mechanism 3.

In this embodiment, the monitor 4 may include a camera, a plasma sensor, or the like. The monitor 4 is provided with a communication cable 13, a cable through hole is arranged on the pipe wall of one end of the sliding pipe shaft 8, which is close to the air cylinder 6, and the communication cable 13 is led out through the cable through hole to communicate with the outside.

Specifically, a camera or a plasma sensor (OES sensor 4) is placed in the guide 2, and a communication cable 13 communicates with the outside through the opening of the transmission shaft of the bellows 7. When the interior of the chamber needs to be observed, a camera can be placed in the guide piece 2 to observe the position deviation of the wafer 15, particles on the surface of the wafer 15, abnormal discharge sparking phenomenon and the like in the process chamber 1; when the fact distribution of the plasma in the sensing chamber needs to be detected, a plasma sensor can be placed in the guide member 2, and the plasma sensor 4 is used for detecting the spectrum of the central edge in the process so as to obtain the components of the process product, and the components extend into the chamber, so that the existing OES monitoring precision is improved.

The movement of the guide 2 is illustrated in figures 2 and 3. As shown in fig. 3, the cylinder 6 pushes the guide member 2 to move, so that the guide member 2 reaches the outer circumferential boundary of the lower electrode 14, and observation and measurement of the surface of the wafer 15 are realized. As shown in fig. 2, during the process, the flow field is retracted to the initial position inside the opening so as not to affect the process effect and the flow field uniformity.

Example 2

The embodiment provides a semiconductor process device, which comprises a process chamber, wherein at least one monitoring device of the semiconductor process chamber of the embodiment 1 is arranged on the chamber wall of the process chamber.

In this embodiment, the monitoring device is arranged on the process chamber 1 to realize multiple functions, and the number of the monitoring devices is not limited.

In one example, as shown in fig. 4 and 5, the monitoring device may be disposed on a sidewall of the process chamber 1 to enable monitoring within the process chamber 1. The position of the wafer 15 can be rectified and the process chamber 1 can be monitored by arranging the camera in the guide piece 2, and the OES sensor 4 can be arranged in the guide piece 2 and used for reducing the distance of the existing OES monitoring process chamber 1 and improving the monitoring precision of OES.

In another example, where there is insufficient space for installing the guide 2 on the side wall of the process chamber 1, as shown in fig. 6, the monitoring device may be installed on the process chamber cover plate 16 perpendicular to the surface of the lower electrode 14, and the same monitoring purpose may be achieved as well.

In yet another example, to more fully monitor the internal state of the process chamber 1, multiple monitoring devices may be mounted at different locations on the process chamber cover plate 16, each of which may employ a respective set of telescoping drive mechanisms 3. In order to save installation space, the plurality of guide members 2 may also share one air cylinder 6 for driving, as shown in fig. 7, when three guide members 2 need to be simultaneously disposed on the process chamber cover plate 16, one air cylinder 6 may be disposed on the process chamber cover plate 16, and the telescopic rod of the air cylinder 6 is respectively connected with the sliding tube shafts 8 of the plurality of bellows 7 through the plurality of air cylinder supporting members 17, so that the plurality of guide members 2 are driven by one air cylinder 6.

The process chamber of the embodiment may be an etching process chamber of an etching machine, or may be a process chamber of other semiconductor devices.

In summary, the monitoring device of the semiconductor process chamber of the utility model has the following advantages:

1. the monitoring device can be provided with the camera, so that the problems that the traditional observation window is unclear in observation and the observation view angle is remote are solved;

2. the monitoring device can display the picture inside the process chamber in real time, can observe the state inside the process chamber in time, can judge in time abnormal conditions inside the chamber, such as wafer offset, abnormal discharge ignition phenomenon, is convenient for accurately judging the state inside the chamber, and improves the safety of a process system;

3. the monitoring device can be provided with an OES sensor, can survey the actual distribution state of plasma in the chamber in the process, can analyze the spectrum in the process, and is convenient for optimizing the process formula.

The foregoing description of embodiments of the utility model has been presented for purposes of illustration and description, and is not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the various embodiments described.

Claims

1. A monitoring device for a semiconductor process chamber, wherein an opening is formed in a chamber wall of the semiconductor process chamber, the monitoring device comprising:

the guide piece is tubular, the guide piece is arranged in the opening, one end of the guide piece is connected with the telescopic driving mechanism, the other end of the guide piece is closed and transparent, and a monitor for observing the internal state of the semiconductor process chamber is arranged in the other end of the guide piece;

2. The apparatus of claim 1, wherein the telescoping drive mechanism comprises a cylindrical mount coaxially disposed with the aperture;

the installation seat is internally provided with a sliding connecting piece, and the guide piece is connected with the telescopic rod through the sliding connecting piece.

3. The apparatus according to claim 2, wherein the sliding connector comprises a sliding tube shaft and a bellows, the bellows is disposed at one end of the mounting base near the opening, the bellows is disposed coaxially with the opening, one end of the bellows is in sealing connection with the opening, and the sliding tube shaft is sleeved in the bellows and is in sliding sealing connection with the bellows;

4. A semiconductor process chamber monitoring device according to claim 3, wherein the telescopic rod of the cylinder is coupled to one end of the sliding tube shaft by a coupling.

5. A semiconductor process chamber monitoring device according to claim 3, wherein the guide is coaxially arranged with the aperture;

6. The apparatus according to claim 5, wherein the monitor has a communication cable, a cable through hole is provided in a wall of the sliding tube near one end of the cylinder, and the communication cable is led out through the cable through hole to communicate with the outside.

7. The apparatus according to claim 5, wherein the open end of the guide member is provided with a first flange, the end of the sliding tube shaft adjacent to the guide member is provided with a second flange, a first sealing ring is arranged between the first flange and the second flange, threaded holes are formed in the first flange and the second flange, and the first flange and the second flange are connected by fastening screws.

8. The apparatus of claim 7, wherein a threaded cap is disposed within the threaded bore of the first flange for shielding the fastening screw.

9. The apparatus of claim 7, wherein a gap of 0.5-1mm is provided between the outer edges of the first and second flanges and the inner wall of the opening.

10. A monitoring device for a semiconductor process chamber according to claim 3, wherein,

the corrugated pipe is characterized in that a third flange is arranged at one end, close to the opening, of the corrugated pipe, a mounting groove matched with the third flange is formed in the surface of the chamber wall at the opening, the third flange is fixed in the mounting groove, and a second sealing ring is arranged between the third flange and the mounting groove.

11. The apparatus of claim 1, wherein the guide member is a transparent, high temperature and corrosion resistant material.

12. The apparatus of claim 11, wherein the transparent, high temperature and corrosion resistant material comprises quartz and transparent resin.

13. The apparatus of claim 1, wherein the monitor comprises a camera and a plasma sensor.

14. A semiconductor processing apparatus comprising a process chamber provided with at least one monitoring device according to any one of claims 1-13.