CN220671924U - Computer water-cooling heat exchange device - Google Patents
Computer water-cooling heat exchange device Download PDFInfo
- Publication number
- CN220671924U CN220671924U CN202322418087.1U CN202322418087U CN220671924U CN 220671924 U CN220671924 U CN 220671924U CN 202322418087 U CN202322418087 U CN 202322418087U CN 220671924 U CN220671924 U CN 220671924U
- Authority
- CN
- China
- Prior art keywords
- computer
- water
- cooling
- water tank
- cooling plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000001816 cooling Methods 0.000 title claims abstract description 72
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 65
- 238000007789 sealing Methods 0.000 claims abstract description 22
- 230000005855 radiation Effects 0.000 claims abstract description 6
- 239000007788 liquid Substances 0.000 claims description 7
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 3
- 239000000498 cooling water Substances 0.000 abstract description 15
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000000191 radiation effect Effects 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- 238000005253 cladding Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a computer water-cooling heat exchange device, which comprises a water tank and a cooling plate, wherein the bottom end of the water tank is provided with a water pump, the output end of the water pump is connected with a radiating pipe, the radiating pipe is fixed through a fixing frame, and the fixing frame corresponds to a computer radiating fan; the water outlet pipe of the radiating pipe is connected with the cooling plate, the cooling plate corresponds to the CPU of the computer, and the water outlet pipe of the cooling plate is connected with the high end of the water tank; the top surface sliding seal of the water tank has a sliding box, the sliding box is communicated with the water tank, the sliding box penetrates out of the top cover of the computer, and the top is provided with a sealing cover. The beneficial effects are that: when the heat radiation fan of the computer works, the heat radiation pipe can radiate heat, the cooling treatment to the CPU of the computer is realized through the circulation of cooling water in the cooling plate, and the heat radiation effect to the computer is good.
Description
Technical Field
The utility model relates to the field of computer accessories, in particular to a computer water-cooling heat exchange device.
Background
When the computer works, because a large amount of integrated circuits are used in the computer, when the computer is used for a long time, the integrated circuits can generate a large amount of heat, and the high temperature can not only cause unstable operation of the system, but also shorten the service life and possibly burn out certain parts.
The existing computer is mainly internally subjected to heat dissipation treatment through a radiator, the radiator is used for absorbing heat, then radiating the heat into or out of a case, and ensuring the normal temperature of computer components, but the heat dissipation mode is difficult to directly dissipate heat of a CPU, and the heat dissipation efficiency is low.
Disclosure of Invention
The present utility model aims to solve the above problems and provide a computer water-cooling heat exchange device, which is described in detail below.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
the utility model provides a computer water-cooling heat exchange device, which comprises a water tank and a cooling plate, wherein the bottom end of the water tank is provided with a water pump, the output end of the water pump is connected with a radiating pipe, the radiating pipe is fixed through a fixing frame, and the fixing frame corresponds to a computer radiating fan;
the water outlet pipe of the radiating pipe is connected with the cooling plate, the cooling plate corresponds to the CPU of the computer, and the water outlet pipe of the cooling plate is connected with the high end of the water tank;
the top surface of the water tank is slidably sealed with a sliding box, the sliding box is communicated with the water tank, the sliding box penetrates out of the top cover of the computer, and the top of the sliding box is provided with a sealing cover.
Further stated, the radiating pipe has a serpentine structure.
Further stated, a flowmeter is arranged on the pipeline between the radiating pipe and the water pump.
The heat dissipation device is characterized in that the fixing frame is of a frame-shaped structure, and a limiting groove corresponding to the heat dissipation tube is formed in the surface of the fixing frame and used for limiting the installation of the heat dissipation tube.
Further stated, the vertical projection of the said fixed mount is "U" shape, the opening of the said fixed mount corresponds to cooling fan, and its opening inner wall has magnet layers.
The cooling plate comprises two cooling half plates, guide channels are symmetrically arranged on the inner walls of the cooling half plates, liquid inlets of the guide channels extend towards the center of the cooling plate, the guide channels are in continuous annular structures on the surfaces of the cooling half plates, liquid outlets of the guide channels penetrate through the side walls of the cooling half plates, and the two cooling half plates are in sealing connection.
The water tank is further described, a sealing layer is arranged at the opening of the sliding box and covers the upper surface of the water tank, the bottom end of the sealing layer extends downwards along the inner wall of the water tank, and a raised line used for limiting the sliding box is arranged at the bottom end of the sealing layer.
The beneficial effects are that:
when the heat radiation fan of the computer works, the heat radiation pipe can radiate heat, the CPU of the computer is cooled through the circulation of cooling water in the cooling plate, the heat radiation effect of the computer is good, and the heat radiation efficiency is high;
in the preferred embodiment, the sliding box can be arranged outside the top cover of the computer case, so that cooling water can be conveniently added and replaced in the water tank, the internal capacity space of the water tank can be increased after the sliding box moves upwards, and the cooling effect of the device can be improved;
the magnet layer on the fixing frame can be utilized to realize adsorption connection with the iron computer cooling fan, so that the fixing of the fixing frame is assisted, and the operation is simple and convenient;
when cooling water flows through the cooling plate, the cooling water with lower temperature can preferentially reach the middle part of the cooling plate, and directly cools the middle part of the CPU, so that the cooling effect on the CPU is good.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a front view of the present utility model;
fig. 2 is a schematic view of the internal structure of the water tank according to the present utility model;
FIG. 3 is a schematic view showing the internal structure of the cooling plate according to the present utility model;
FIG. 4 is a schematic view of the structure of the fixing frame in the present utility model;
fig. 5 is a front view of a radiating pipe in the present utility model.
The reference numerals are explained as follows:
1. a water tank; 101. a slide box; 102. a sealing layer; 2. a cooling plate; 201. cooling the half plate; 202. a diversion channel; 3. a fixing frame; 301. a magnet layer; 302. a limit groove; 4. a water pump; 5. and a radiating pipe.
Detailed Description
In order to make the objects, technical solutions and advantages of the present utility model more apparent, the technical solutions of the present utility model will be described in detail below. It will be apparent that the described embodiments are only some, but not all, embodiments of the utility model. All other embodiments, based on the examples herein, which are within the scope of the utility model as defined by the claims, will be within the scope of the utility model as defined by the claims.
First embodiment:
referring to fig. 1-5, the utility model provides a computer water-cooling heat exchange device, which comprises a water tank 1 and a cooling plate 2, wherein cooling water of a cooling rod auxiliary water tank 1 can be installed in the water tank 1 for cooling, a water pump 4 is arranged at the bottom end of the water tank 1, the water inlet end of the water pump 4 stretches into the water tank 1, the water outlet end of the water pump 4 penetrates out of the water tank 1 and is connected with a radiating pipe 5 through a pipeline, a flowmeter is arranged on the pipeline, the radiating pipe 5 is in a serpentine structure, the radiating pipe 5 is fixed through a fixing frame 3, the fixing frame 3 corresponds to a computer radiating fan, and when the radiating fan of the computer works, the radiating pipe 5 can be subjected to radiating treatment;
the water outlet pipe of the radiating pipe 5 is connected with the cooling plate 2, the cooling plate 2 corresponds to the computer CPU, the water outlet pipe of the cooling plate 2 is connected with the high end of the water tank 1, cooling water is guided into the cooling plate 2 through the radiating pipe 5, the cooling water circulates in the cooling plate 2, and the computer CPU can be cooled through the circulation of the cooling water in the cooling plate 2;
the top surface of the water tank 1 is sealed with a sliding box 101 in a sliding manner, the sliding box 101 is communicated with the water tank 1, the sliding box 101 penetrates out of the top cover of the computer, the top of the sliding box 101 is provided with a sealing cover, after the sealing cover is opened, cooling water is conveniently added into the water tank 1, and the sliding box 101 can slide up and down at the high end of the water tank 1, so that the sliding box can adapt to the cooling treatment of more computer cases;
specifically, the opening part of water tank 1 and slip case 101 is equipped with sealing layer 102, sealing layer 102 cladding is at water tank 1 upper surface, sealing layer 102 bottom is along water tank 1 inner wall, downwardly extending, and sealing layer 102 bottom is equipped with the sand grip that is used for spacing to slip case 101, utilize the top surface of water tank 1 can spacing to the highest point of slip case 101, utilize the sand grip on sealing layer 102, can spacing to the lowest end of slip case 101, then the slip seal between slip case 101 and the sealing layer 102, realize the upper and lower direction to slip case 101, be convenient for add and change the cooling water to water tank 1 inside, and after slip case 101 upwards moves, can increase the inner capacity space of water tank 1, can improve the cooling effect of device.
The second embodiment is different from the first embodiment in that:
the mount 3 is frame-shaped structure, and the mount 3 surface is equipped with the spacing groove 302 that corresponds with cooling tube 5, can make cooling tube 5 be continuous snakelike distribution on mount 3 for realize spacing to the installation of cooling tube 5, and the vertical projection of mount 3 is "U" shape, and the opening of mount 3 corresponds with cooling fan, and its opening inner wall is equipped with magnet layer 301, utilizes magnet layer 301 and iron computer cooling fan to realize adsorbing to be connected, and the assistance is fixed to mount 3, and easy operation is more convenient.
The third embodiment is different from the first embodiment in that:
the cooling plate 2 comprises two cooling half plates 201, the inner walls of the two cooling half plates 201 are symmetrically provided with flow guide channels 202, the two cooling half plates 201 are in sealing connection, then the flow guide channels 202 on the two cooling half plates 201 form a communicated cooling channel, the liquid inlets of the flow guide channels 202 extend towards the center of the cooling plate 2, the surface of the cooling half plates 201 is in a continuous annular structure, the liquid outlets of the flow guide channels 202 penetrate through the side walls of the cooling half plates 201, when cooling water circulates, the cooling water with lower temperature can preferentially reach the middle part of the cooling plate 2, the middle part of a CPU is directly cooled, and then along with the transportation of the cooling water, the cooling water flows in the flow guide channels 202 and is guided into the water tank 1 through the liquid outlets of the flow guide channels 202.
The foregoing is merely illustrative of the present utility model, and the present utility model is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present utility model. Therefore, the protection scope of the present utility model shall be subject to the protection scope of the claims.
Claims (8)
1. The utility model provides a computer water-cooling heat transfer device, includes water tank (1), cooling plate (2), its characterized in that:
the bottom end of the water tank (1) is provided with a water pump (4), the output end of the water pump (4) is connected with a radiating pipe (5), the radiating pipe (5) is fixed through a fixing frame (3), and the fixing frame (3) corresponds to a computer radiating fan;
the water outlet pipe of the radiating pipe (5) is connected with the cooling plate (2), the cooling plate (2) corresponds to a computer CPU, and the water outlet pipeline of the cooling plate (2) is connected with the high end of the water tank (1);
the top surface of the water tank (1) is sealed with a sliding box (101) in a sliding mode, the sliding box (101) is communicated with the water tank (1), the sliding box (101) penetrates out of the top cover of the computer, and the top of the sliding box is provided with a sealing cover.
2. The computer water-cooled heat exchange device of claim 1, wherein: the radiating pipe (5) is in a bent serpentine structure.
3. A computer water-cooled heat exchange device as claimed in claim 2, wherein: and a flowmeter is arranged on a pipeline between the radiating pipe (5) and the water pump (4).
4. The computer water-cooled heat exchange device of claim 1, wherein: the fixing frame (3) is of a frame-shaped structure, and a limiting groove (302) corresponding to the radiating pipe (5) is formed in the surface of the fixing frame (3) and used for limiting the installation of the radiating pipe (5).
5. The computer water-cooled heat exchange device of claim 4, wherein: the vertical projection of the fixing frame (3) is U-shaped, an opening of the fixing frame (3) corresponds to the heat radiation fan, and a magnet layer (301) is arranged on the inner wall of the opening.
6. A computer water-cooled heat exchange device according to any one of claims 1-4, wherein: the cooling plate (2) comprises two cooling half plates (201), two guide channels (202) are symmetrically arranged on the inner walls of the cooling half plates (201), liquid inlets of the guide channels (202) extend towards the center of the cooling plate (2), the surfaces of the cooling half plates (201) are in continuous annular structures, liquid outlets of the guide channels (202) penetrate through the side walls of the cooling half plates (201), and the two cooling half plates (201) are in sealing connection.
7. The computer water-cooled heat exchange device of claim 6, wherein: the water tank (1) and the opening of the sliding box (101) are provided with sealing layers (102), and the sealing layers (102) are coated on the upper surface of the water tank (1).
8. The computer water-cooled heat exchange device of claim 7, wherein: the bottom end of the sealing layer (102) extends downwards along the inner wall of the water tank (1), and a raised line used for limiting the sliding box (101) is arranged at the bottom end of the sealing layer (102).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322418087.1U CN220671924U (en) | 2023-09-06 | 2023-09-06 | Computer water-cooling heat exchange device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322418087.1U CN220671924U (en) | 2023-09-06 | 2023-09-06 | Computer water-cooling heat exchange device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220671924U true CN220671924U (en) | 2024-03-26 |
Family
ID=90329088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322418087.1U Active CN220671924U (en) | 2023-09-06 | 2023-09-06 | Computer water-cooling heat exchange device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220671924U (en) |
-
2023
- 2023-09-06 CN CN202322418087.1U patent/CN220671924U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |