CN220661622U - Accurate injection mold is used in production of electric pile radiator - Google Patents
Accurate injection mold is used in production of electric pile radiator Download PDFInfo
- Publication number
- CN220661622U CN220661622U CN202321770151.6U CN202321770151U CN220661622U CN 220661622 U CN220661622 U CN 220661622U CN 202321770151 U CN202321770151 U CN 202321770151U CN 220661622 U CN220661622 U CN 220661622U
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- Prior art keywords
- cooling
- heat dissipation
- injection mold
- fixedly connected
- mould
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- 238000002347 injection Methods 0.000 title claims abstract description 25
- 239000007924 injection Substances 0.000 title claims abstract description 25
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 238000001816 cooling Methods 0.000 claims abstract description 80
- 230000017525 heat dissipation Effects 0.000 claims abstract description 54
- 239000004065 semiconductor Substances 0.000 claims abstract description 28
- 238000004891 communication Methods 0.000 claims abstract description 23
- 238000005057 refrigeration Methods 0.000 claims abstract description 8
- 230000000694 effects Effects 0.000 abstract description 10
- 239000011148 porous material Substances 0.000 abstract description 3
- 239000007789 gas Substances 0.000 description 32
- 239000000110 cooling liquid Substances 0.000 description 14
- 230000005855 radiation Effects 0.000 description 8
- 239000000112 cooling gas Substances 0.000 description 7
- 239000000243 solution Substances 0.000 description 6
- 239000002826 coolant Substances 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T90/00—Enabling technologies or technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02T90/10—Technologies relating to charging of electric vehicles
- Y02T90/12—Electric charging stations
Abstract
The utility model relates to the technical field of injection molds, in particular to a precise injection mold for producing a charging pile radiator, which comprises a base, wherein a lower mold is fixedly arranged on one side of the base, a cooling cavity is arranged in the lower mold, and semiconductor refrigerating sheets are fixedly arranged on two symmetrical side surfaces of the lower mold. The utility model has the advantages that: through cooling chamber, semiconductor refrigeration piece, heat conduction rod, fin, first heat dissipation chamber, first communication hole, first heat dissipation passageway, radiator fan, cooling tube, gas-supply pipe, air inlet, shunt ports, locating hole, second heat dissipation chamber, second intercommunicating pore and second heat dissipation passageway's cooperation setting has increased on the basis of carrying out the water-cooling to the lower mould and has carried out air-cooled structure to the lower mould, and has increased to go up the structure that carries out air-cooled to the upper mould, thereby make to the cooling effect of lower mould and upper mould is better, thereby has accelerated the cooling rate to the radiator, has reached the effect that improves production efficiency.
Description
Technical Field
The utility model relates to the technical field of injection molds, in particular to a precise injection mold for production of a charging pile radiator.
Background
The injection molding method has the advantages of high production speed, high efficiency, automation of operation, multiple colors, various shapes, large size, accurate product size, easy updating of products, and capability of forming products with complex shapes, and is suitable for the field of mass production, products with complex shapes and other molding processing. In order to ensure that the charging pile can smoothly radiate heat, the charging pile needs to use a radiator, and an injection mold is needed in the process of producing the charging pile radiator.
The existing injection mold needs to be cooled in the process of processing the charging pile radiator, and the existing injection mold is generally provided with a water cooling structure in the lower mold in the cooling process, although the lower mold of the injection mold can be cooled through the water cooling structure, the cooling speed is related to the production speed, so that the faster the cooling speed is, the faster the production speed is, the cooling speed is limited by only water cooling, so that the cooling speed is fixed, and the precise injection mold for the production of the charging pile radiator is designed to solve the problems.
Disclosure of Invention
The object of the present utility model is to solve at least one of the technical drawbacks.
Therefore, an object of the present utility model is to provide a precise injection mold for producing a charging pile radiator, so as to solve the problems mentioned in the background art and overcome the defects existing in the prior art.
In order to achieve the above-mentioned purpose, the embodiment of the utility model in one aspect provides a precision injection mold for producing a charging pile radiator, which comprises a base, one side of the base is fixedly provided with a lower mold, one side of the lower mold is fixedly provided with a cooling cavity, two symmetrical sides of the lower mold are fixedly provided with semiconductor cooling fins, two cold ends of the semiconductor cooling fins are fixedly connected with a plurality of heat conducting rods, one side of the semiconductor cooling fins, far away from the heat conducting rods, is fixedly connected with a plurality of heat radiating fins, the inside of the lower mold is provided with a first heat radiating cavity, the inner wall of the first heat radiating cavity is provided with a plurality of first communication holes, the inside of the lower mold is provided with a plurality of first heat radiating channels communicated with the first communication holes, one side of the base is fixedly provided with a heat radiating fan, one side of the heat radiating fan is fixedly connected with a heat radiating pipe through a pipeline, one side of the heat radiating pipe, one side of the lower mold is provided with an air inlet, the inner wall of the air inlet is provided with a split-flow port, one side of the semiconductor cooling fins is fixedly connected with a plurality of heat radiating fins, one side of the heat conducting rods far away from the heat radiating fan is fixedly connected with a second communication hole, one side of the lower mold is fixedly provided with a second hydraulic cylinder is fixedly connected with a second communication hole, one side of the base is fixedly connected with a second hydraulic cylinder, one side of the second cylinder is fixedly connected with a hydraulic cylinder, and is fixedly connected with a second cylinder, and the second cylinder is fixedly connected with a second cylinder.
By any of the above schemes, preferably, a temperature sensor is fixedly installed in the cooling cavity, a controller is fixedly installed on one side of the lower die, the temperature sensor is electrically connected with the controller, and the controller is electrically connected with the semiconductor refrigerating sheet, so that the controller can control the opening or closing of the semiconductor refrigerating sheet according to signals of the temperature sensor.
By any of the above schemes, it is preferable that a first exhaust hole is formed in one side of the lower die, and the first exhaust hole is communicated with the first heat dissipation channel, so that gas in the first heat dissipation channel can be exhausted through the first exhaust hole.
By any of the above schemes, it is preferable that a second vent hole is provided at one side of the upper die, and the second vent hole is communicated with the second heat dissipation channel, so that the gas inside the second heat dissipation channel can be exhausted through the second vent hole.
In any of the above aspects, it is preferable that the heat conduction rod penetrates one side of the lower die and extends into the cooling chamber, so that the cooling liquid in the cooling chamber can be cooled.
By the inside that above-mentioned arbitrary scheme is preferred, the cooling tube is located the cooling chamber, the shape of cooling tube is the wave, through the inside coolant liquid of cooling chamber can cool off the inside gas of cooling tube, through the wave the inside gas of cooling tube can increase with the inside coolant liquid's of cooling chamber contact time for it is better to gaseous cooling effect.
By any of the above schemes, preferably, one end of the gas pipe far away from the radiating pipe is fixedly connected with the lower die, and the gas pipe corresponds to the gas inlet in position, so that gas can enter the gas inlet through the gas pipe.
By any of the above schemes, it is preferable that the hollow positioning rod corresponds to the positioning hole, and the hollow positioning rod is adapted to the size of the positioning hole, so that the hollow positioning rod can be smoothly inserted into the positioning hole.
By any of the above-mentioned schemes, preferably, the split-flow port corresponds to a position of a hollow positioning rod, the split-flow port is connected with the first heat dissipation channel, and the second heat dissipation channel is connected with a positioning hole, so that the gas can enter the first heat dissipation channel and the second heat dissipation channel through the split-flow port.
Compared with the prior art, the utility model has the following advantages and beneficial effects:
1. through cooling chamber, semiconductor refrigeration piece, heat conduction rod, fin, first heat dissipation chamber, first communication hole, first heat dissipation passageway, radiator fan, cooling tube, gas-supply pipe, air inlet, shunt ports, locating hole, second heat dissipation chamber, second intercommunicating pore and second heat dissipation passageway's cooperation setting has increased on the basis of carrying out the water-cooling to the lower mould and has carried out air-cooled structure to the lower mould, and has increased to go up the structure that carries out air-cooled to the upper mould, thereby make to the cooling effect of lower mould and upper mould is better, thereby has accelerated the cooling rate to the radiator, has reached the effect that improves production efficiency.
2. Through cooperation setting of semiconductor refrigeration piece, heat conduction pole, controller and temperature sensor can be in automatic cooling work when the inside coolant liquid temperature of cooling chamber is higher for the inside coolant liquid of cooling chamber keeps at lower temperature, makes follow-up right the cooling effect of lower mould is better.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic cross-sectional view of the present utility model;
FIG. 3 is a schematic cross-sectional view of a heat conducting rod and a connecting member thereof according to the present utility model;
FIG. 4 is a schematic view of a first heat dissipation channel and a connecting member thereof according to the present utility model;
fig. 5 is a schematic cross-sectional view of the upper die of the present utility model.
In the figure: the heat-dissipating device comprises a base, a lower die, a 3-cooling cavity, a 4-semiconductor refrigerating sheet, a 5-heat-conducting rod, a 6-heat-dissipating sheet, a 7-first heat-dissipating cavity, an 8-first communication hole, a 9-first heat-dissipating channel, a 10-heat-dissipating fan, an 11-heat-dissipating tube, a 12-gas pipe, a 13-gas inlet, a 14-split port, a 15-hollow positioning rod, a 16-supporting rod, a 17-supporting seat, a 18-hydraulic cylinder, a 19-moving plate, a 20-upper die, a 21-positioning hole, a 22-second heat-dissipating cavity, a 23-second communication hole, a 24-second heat-dissipating channel, a 25-temperature sensor, a 26-controller, a 27-first vent and a 28-second vent.
Detailed Description
The present utility model will be further described with reference to the accompanying drawings, but the scope of the present utility model is not limited to the following.
As shown in fig. 1 to 5, a precision injection mold for producing a charging pile radiator comprises a base 1, a lower mold 2 is fixedly arranged on one side of the base 1, a cooling cavity 3 is arranged in the lower mold 2, semiconductor refrigerating sheets 4 are fixedly arranged on two symmetrical side surfaces of the lower mold 2, a plurality of heat conducting rods 5 are fixedly connected to cold ends of the two semiconductor refrigerating sheets 4, a plurality of heat radiating sheets 6 are fixedly connected to one side of the semiconductor refrigerating sheets 4 away from the heat conducting rods 5, heat of the heat ends of the semiconductor refrigerating sheets 4 can be radiated through the heat radiating sheets 6, thereby accelerating the refrigerating efficiency of the semiconductor refrigerating sheets 4, a first heat radiating cavity 7 is formed in the lower mold 2, a plurality of first communication holes 8 are formed in the inner wall of the first heat radiating cavity 7, a plurality of first heat radiating channels 9 communicated with the first communication holes 8 are formed in the lower mold 2, the heat radiation air in the first heat radiation channel 9 can enter the first heat radiation cavity 7 through a plurality of first communication holes 8, one side of the base 1 is fixedly provided with a heat radiation fan 10, the air outlet of the heat radiation fan 10 is fixedly connected with a heat radiation pipe 11 through a pipeline, one end of the heat radiation pipe 11 far away from the heat radiation fan 10 is fixedly connected with a gas transmission pipe 12, one side of the lower die 2 is provided with an air inlet 13, the inner wall of the air inlet 13 is provided with a split-flow port 14, four corners of the top side of the lower die 2 are fixedly connected with hollow positioning rods 15, four corners of one side of the base 1 are fixedly connected with support rods 16, the top ends of the support rods 16 are fixedly connected with support bases 17, one side of each support base 17 is fixedly provided with a hydraulic cylinder 18, the output end of each hydraulic cylinder 18 is fixedly connected with a movable plate 19, each support rod 16 penetrates through the movable plate 19, each movable plate 19 is in sliding connection with each support rod 16, the movable plate 19 can only slide along the direction of the support rod 16, the upper die 20 is fixedly arranged on one side of the movable plate 19 away from the hydraulic cylinder 18, the upper die 20 corresponds to the position of the lower die 2, an injection molding hole is formed in one side of the upper die 20, positioning holes 21 are formed in four corners of one side of the upper die 20, a second heat dissipation cavity 22 is formed in the upper die 20, a plurality of second communication holes 23 are formed in the inner wall of the second heat dissipation cavity 22, a second heat dissipation channel 24 communicated with the second communication holes 23 is formed in the upper die 20, the second heat dissipation channel 24 and the first heat dissipation channel 9 are in a shape like a Chinese character 'kou', when injection molding is performed, the hydraulic cylinder 18 is started to enable the movable plate 19 to drive the upper die 20 to move, the hollow positioning rod 15 is inserted into the positioning holes 21, after the injection molding is completed, the heat dissipation fan 10 and the semiconductor cooling fin 4 are started along with the starting of the semiconductor cooling fin 4, the cooling liquid in the cooling cavity 3 is cooled by the heat conducting rod 5, the lower die 2 is cooled by the cooled cooling liquid, along with the starting of the heat radiating fan 10, the generated gas enters the inside of the heat radiating pipe 11, the gas in the inside of the heat radiating pipe 11 is cooled by the cooling liquid with lower temperature, the cooled cooling gas is conveyed to the inside of the air inlet 13 by the air conveying pipe 12, the cooling gas respectively enters the first heat radiating channel 9 and the inside of one hollow positioning rod 15 under the action of the split-flow port 14, the cooling gas entering the inside of the first heat radiating channel 9 enters the inside of the first heat radiating cavity 7 by a plurality of first communication holes 8, thereby carrying out more comprehensive air cooling heat radiating operation on the lower die 2, the cooling gas entering the inside of the hollow positioning rod 15 enters the inside of the second heat radiating channel 24 by the positioning holes 21, then enters the second heat dissipation channel 24 through the second communication holes 23, so as to perform relatively comprehensive air cooling heat dissipation operation on the upper die 20.
As an alternative technical scheme of the utility model, a temperature sensor 25 is fixedly arranged in the cooling cavity 3, a controller 26 is fixedly arranged on one side of the lower die 2, the temperature sensor 25 is electrically connected with the controller 26, the controller 26 is electrically connected with the semiconductor refrigerating sheet 4, so that the controller 26 can control the opening or closing of the semiconductor refrigerating sheet 4 according to signals of the temperature sensor 25, and when the temperature of cooling liquid in the cooling cavity 3 rises to a certain value in the cooling process, the temperature control 25 transmits signals to the controller 26, so that the controller 26 controls the semiconductor refrigerating sheet 4 to start, and the cooling liquid in the cooling cavity 3 is cooled through the heat conducting rod 5.
As an alternative solution of the present utility model, a first exhaust hole 27 is formed at one side of the lower die 2, and the first exhaust hole 27 is communicated with the first heat dissipation channel 9, so that gas inside the first heat dissipation channel 9 can be exhausted through the first exhaust hole 27.
As an alternative solution of the present utility model, a second vent hole 28 is formed at one side of the upper mold 20, and the second vent hole 28 is in communication with the second heat dissipation channel 24, so that the gas inside the second heat dissipation channel 24 can be exhausted through the second vent hole 28.
As an alternative solution of the present utility model, the heat conducting rod 5 penetrates through one side of the lower die 2 and extends to the inside of the cooling cavity 3, so that the cooling liquid inside the cooling cavity 3 can be cooled.
As an alternative technical scheme of the utility model, the radiating pipe 11 is positioned in the cooling cavity 3, the radiating pipe 11 is in a wave shape, the gas in the radiating pipe 11 can be cooled by the cooling liquid in the cooling cavity 3, and the contact time between the gas in the wave-shaped radiating pipe 11 and the cooling liquid in the cooling cavity 3 can be increased by the wavy radiating pipe 11, so that the cooling effect on the gas is better.
As an alternative solution of the present utility model, one end of the gas pipe 12 far from the radiating pipe 11 is fixedly connected with the lower die 2, and the gas pipe 12 corresponds to the gas inlet 13, so that gas can enter the gas inlet 13 through the gas pipe 12.
As an alternative solution of the present utility model, the positions of the hollow positioning rod 15 and the positioning hole 21 correspond, and the hollow positioning rod 15 is adapted to the size of the positioning hole 21, so that the hollow positioning rod 15 can be smoothly inserted into the positioning hole 21.
As an alternative solution of the present utility model, the split-flow port 14 corresponds to the position of a hollow positioning rod 15, the split-flow port 14 communicates with the first heat dissipation channel 9, and the second heat dissipation channel 24 communicates with a positioning hole 21, so that the gas can enter the inside of the first heat dissipation channel 9 and the second heat dissipation channel 24 through the split-flow port 14.
The production of charging pile radiator is with accurate injection mold, theory of operation is as follows:
when the cooling operation is performed, the heat dissipation fan 10 and the semiconductor refrigerating fin 4 are started, along with the starting of the semiconductor refrigerating fin 4, the cooling liquid in the cooling cavity 3 is cooled through the heat conducting rod 5, the lower die 2 is cooled through the cooled cooling liquid, along with the starting of the heat dissipation fan 10, the generated gas enters the inside of the heat dissipation pipe 11, the gas in the inside of the heat dissipation pipe 11 is cooled through the cooling liquid with lower temperature, the cooled cooling gas is conveyed to the inside of the air inlet 13 through the gas conveying pipe 12, the cooled gas is enabled to enter the first heat dissipation channel 9 and the inside of one hollow positioning rod 15 respectively under the action of the split-flow port 14, the cooling gas entering the inside of the first heat dissipation channel 9 enters the inside of the first heat dissipation cavity 7 through the plurality of first communication holes 8, so that the lower die 2 is subjected to comprehensive air cooling operation, the cooling gas entering the inside of the hollow positioning rod 15 enters the inside of the second heat dissipation channel 24 through the positioning holes 21, and then enters the inside of the second heat dissipation channel 24 through the plurality of second communication holes 23, so that the comprehensive heat dissipation operation is performed on the upper die 20.
In summary, this fill electric pile radiator production is with accurate injection mold, through cooling chamber 3, semiconductor refrigeration piece 4, heat conduction pole 5, fin 6, first heat dissipation chamber 7, first communication hole 8, first heat dissipation passageway 9, radiator fan 10, cooling tube 11, gas-supply pipe 12, air inlet 13, shunt ports 14, locating hole 21, second heat dissipation chamber 22, second intercommunicating pore 23 and second heat dissipation passageway 24's cooperation setting, the structure of carrying out the forced air cooling to lower mould 2 has been increased on the basis of carrying out the water-cooling to lower mould 2, and the structure of carrying out the forced air cooling to upper mould 20 has been increased, thereby make the cooling effect to lower mould 2 and upper mould 20 better, thereby accelerated the cooling rate to the radiator, the effect of improving production efficiency has been reached, through the cooperation setting of semiconductor refrigeration piece 4, heat conduction pole 5, controller 26 and temperature sensor 25, can be in the inside cooling liquid temperature of cooling chamber 3 is higher when automatic cooling work, make the inside cooling liquid keep at lower temperature, make the cooling effect to lower mould 2 better down afterwards.
Claims (9)
1. Accurate injection mold is used in production of electric pile radiator, its characterized in that: including base (1), one side fixed mounting of base (1) has lower mould (2), the inside of lower mould (2) is provided with cooling chamber (3), the equal fixed mounting of two sides of lower mould (2) symmetry has semiconductor refrigeration piece (4), two the equal fixedly connected with of cold junction of semiconductor refrigeration piece (4) a plurality of heat conduction rod (5), one side fixedly connected with fin (6) of heat conduction rod (5) are kept away from to semiconductor refrigeration piece (4), first cooling chamber (7) have been seted up to the inside of lower mould (2), a plurality of first communication hole (8) have been seted up to the inner wall of first cooling chamber (7), a plurality of first cooling channel (9) that are linked together with first communication hole (8) have been seted up to the inside of lower mould (2), one side fixedly connected with cooling fan (10) of base (1), cooling fan (10) air outlet department passes through pipeline fixedly connected with pipe (11), cooling fan (11) keep away from cooling fan (10) one side fixedly connected with fin (6), air inlet (13) of hollow mould (14) have air inlet (13) to open, one side of air inlet (13) have air inlet (13), the utility model discloses a base, including base (1), support bar (16) are all fixedly connected with in four corners department of base (1) one side, the top fixedly connected with supporting seat (17) of support bar (16), one side fixed mounting of supporting seat (17) has pneumatic cylinder (18), the output fixedly connected with movable plate (19) of pneumatic cylinder (18), one side fixed mounting that movable plate (19) kept away from pneumatic cylinder (18) has last mould (20), locating hole (21) have all been seted up in four corners department of last mould (20) one side, second heat dissipation chamber (22) have been seted up to the inside of going up mould (20), a plurality of second communication hole (23) have been seted up to the inner wall of second heat dissipation chamber (22), second heat dissipation passageway (24) that are linked together with second communication hole (23) have been seted up to the inside of going up mould (20).
2. The precise injection mold for producing the charging pile radiator according to claim 1, wherein: the inside of cooling chamber (3) is fixed mounting has temperature sensor (25), one side of lower mould (2) is fixed mounting has controller (26).
3. The precise injection mold for producing the charging pile radiator according to claim 2, wherein: a first exhaust hole (27) is formed in one side of the lower die (2), and the first exhaust hole (27) is communicated with the first heat dissipation channel (9).
4. A precision injection mold for producing a heat sink for a charging pile according to claim 3, wherein: a second exhaust hole (28) is formed in one side of the upper die (20), and the second exhaust hole (28) is communicated with the second heat dissipation channel (24).
5. The precise injection mold for producing the charging pile radiator according to claim 4, wherein: the heat conducting rod (5) penetrates through one side of the lower die (2) and extends to the inside of the cooling cavity (3).
6. The precise injection mold for producing the charging pile radiator according to claim 5, wherein: the radiating pipe (11) is positioned in the cooling cavity (3), and the radiating pipe (11) is in a wave shape.
7. The precise injection mold for producing the charging pile radiator according to claim 6, wherein: one end of the air pipe (12) far away from the radiating pipe (11) is fixedly connected with the lower die (2), and the position of the air pipe (12) corresponds to the position of the air inlet (13).
8. The precise injection mold for producing the charging pile radiator according to claim 7, wherein: the hollow positioning rod (15) corresponds to the position of the positioning hole (21), and the hollow positioning rod (15) is matched with the positioning hole (21) in size.
9. The precise injection mold for producing the charging pile radiator according to claim 8, wherein: the split-flow opening (14) corresponds to the position of a hollow positioning rod (15), the split-flow opening (14) is communicated with the first heat dissipation channel (9), and the second heat dissipation channel (24) is communicated with a positioning hole (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321770151.6U CN220661622U (en) | 2023-07-07 | 2023-07-07 | Accurate injection mold is used in production of electric pile radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321770151.6U CN220661622U (en) | 2023-07-07 | 2023-07-07 | Accurate injection mold is used in production of electric pile radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220661622U true CN220661622U (en) | 2024-03-26 |
Family
ID=90344692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321770151.6U Active CN220661622U (en) | 2023-07-07 | 2023-07-07 | Accurate injection mold is used in production of electric pile radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220661622U (en) |
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2023
- 2023-07-07 CN CN202321770151.6U patent/CN220661622U/en active Active
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