CN220658923U - Perforating device for producing aluminum wafer - Google Patents
Perforating device for producing aluminum wafer Download PDFInfo
- Publication number
- CN220658923U CN220658923U CN202322238625.9U CN202322238625U CN220658923U CN 220658923 U CN220658923 U CN 220658923U CN 202322238625 U CN202322238625 U CN 202322238625U CN 220658923 U CN220658923 U CN 220658923U
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- Prior art keywords
- movable
- grooves
- limiting
- sliding
- mounting
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 51
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 51
- 235000012431 wafers Nutrition 0.000 claims abstract description 49
- 238000004080 punching Methods 0.000 claims abstract description 35
- 230000000149 penetrating effect Effects 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000001105 regulatory effect Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
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- Punching Or Piercing (AREA)
Abstract
The utility model discloses a punching device for producing aluminum wafers, which relates to the technical field of aluminum wafer production and processing and comprises a base, wherein the upper surface of the base is connected with two mounting plates, the top surfaces of the two mounting plates are connected with supporting plates, a driving cylinder is arranged between the two supporting plates, and two limiting units are connected between the two mounting plates.
Description
Technical Field
The utility model relates to the technical field of aluminum wafer production and processing, in particular to a punching device for producing aluminum wafers.
Background
The aluminum wafer is a spare and accessory part that can be applied to multiple trade, and the aluminum wafer need punch the punching press to the surface of aluminum wafer according to the use in production and processing process, for example chinese patent discloses an aluminum wafer perforating device (bulletin number CN 216065108U), and the device is spacing fixed although can be to the aluminum wafer, conveniently punch the punching press to its surface, but when processing a large amount of aluminum wafer, the device only can punch to single aluminum wafer once for the machining efficiency of aluminum wafer is comparatively low, can't mass production and processing.
Disclosure of Invention
Aiming at the defects of the prior art, the utility model provides a punching device for producing aluminum wafers, which solves the problem that the aluminum wafers cannot be punched in a large scale.
In order to achieve the above purpose, the utility model is realized by the following technical scheme: the punching device for producing the aluminum wafer comprises a base, wherein the upper surface of the base is connected with two mounting plates, the top surfaces of the two mounting plates are connected with supporting plates, a driving cylinder is arranged between the two supporting plates, and two limiting units are connected between the two mounting plates;
the limiting unit comprises a limiting plate, connectors are connected to two ends of the limiting plate, a plurality of adjusting blocks are connected to the outer surface of the limiting plate, mounting grooves are formed in the bottom surfaces of the adjusting blocks, two limiting strips are connected to the inner side walls of the mounting grooves, and a plurality of slots are formed in the positions, corresponding to the sliding paths of the mounting grooves and the limiting strips, of the outer surface of the limiting plate.
As a further technical scheme of the utility model, the driving end of the driving cylinder is connected with a stamping seat, the bottom surface of the stamping seat is provided with a plurality of stamping heads, the corresponding parts of the sliding paths of the two supporting plates and the stamping seat are provided with notches, two ends of the stamping seat are respectively connected with a sliding rod in a penetrating way, and the bottom surface of the sliding rod is connected with the top surface of the mounting plate.
As a further technical scheme of the utility model, sliding grooves are formed in the positions, corresponding to the sliding paths of the two mounting plates and the connector, of the surfaces of the two mounting plates, a movable groove is formed in the upper surface of the base and between the two limiting units, the inner side wall of the movable groove is connected with a movable plate, the inner bottom side of the movable groove is connected with a plurality of reset springs, and the top ends of the reset springs are connected to the bottom surface of the movable plate.
As a further technical scheme of the utility model, a first screw rod is connected between the two groups of connectors in a penetrating way, regulating grooves are formed in two sides of the regulating block, clamping pieces are connected to the inner side walls of the regulating grooves, a second screw rod is connected to the top surface of the regulating block in a penetrating way, and the bottom end of the second screw rod penetrates through the top surface of the clamping pieces and is connected to the inner bottom side of the regulating grooves.
As a further technical scheme of the utility model, the movable groove and the movable plate are positioned on the bottom surface of the limiting unit, the movable plate is connected with the inner bottom side of the movable groove through the reset spring, the inner diameter size of the movable groove is matched with the sliding path of the movable plate, and the inner diameter size of the sliding groove is matched with the sliding path of the connector.
As a further technical scheme of the utility model, the outer diameter of the limiting plate is matched with the inner diameter of the mounting groove, the inner diameter of the slot is matched with the sliding path of the limiting strip, the inner diameter of the adjusting groove is matched with the sliding path of the clamping piece, and the clamping piece is connected with the adjusting block through the second screw rod.
Advantageous effects
The utility model provides a perforating device for producing aluminum wafers. Compared with the prior art, the method has the following beneficial effects:
1. a perforating device for producing aluminum wafers can conveniently limit and fix a plurality of aluminum wafers through cooperation between a limiting plate and a plurality of adjusting blocks and a first screw rod and a second screw rod, and simultaneously perforates the plurality of aluminum wafers through a stamping seat, so that the perforating processing efficiency of the aluminum wafers is improved, and the device is suitable for processing and using a large number of aluminum wafers.
2. A punching device for producing aluminum wafers can adjust limiting positions according to the outer diameter sizes of the processed aluminum wafers through the matching between a plurality of slots on the surface of a limiting plate and limiting strips on the inner side walls of mounting grooves of a plurality of adjusting blocks, so that punching processing of aluminum wafers with different specifications is adapted, and a movable plate and the movable slots are matched with a plurality of reset springs, so that punching and punching can be conveniently carried out, and feeding of the aluminum wafers is fixed.
Drawings
FIG. 1 is a schematic structural view of a perforating apparatus for producing aluminum wafers;
FIG. 2 is a front view of a perforating apparatus for producing aluminum wafers;
FIG. 3 is a schematic exploded view of a perforating apparatus for producing aluminum wafers;
fig. 4 is an exploded view of a limiting unit of a punch device for producing aluminum wafers.
In the figure: 1. a base; 11. a movable groove; 12. a movable plate; 13. a return spring; 2. a mounting plate; 21. a chute; 3. a support plate; 4. a driving cylinder; 41. stamping a base; 42. a slide bar; 5. a limit unit; 51. a limiting plate; 52. a connector; 53. an adjusting block; 54. a first screw rod; 55. a mounting groove; 56. a limit bar; 57. a slot; 58. an adjustment tank; 59. a second screw rod; 501. and (5) clamping the sheet.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, the present utility model provides a punching device for producing aluminum wafers, which comprises: the utility model provides a perforating device of production aluminium disk, including base 1, the upper surface of base 1 is connected with two mounting panels 2, the top surface of two mounting panels 2 all is connected with backup pad 3, be provided with driving cylinder 4 between two backup pads 3, be connected with two spacing units 5 between two mounting panels 2, spacing unit 5 includes limiting plate 51, the both ends of limiting plate 51 all are connected with connector 52, the surface of limiting plate 51 is connected with a plurality of regulating block 53, mounting groove 55 has been seted up to the bottom surface of regulating block 53, the inside wall of mounting groove 55 is connected with two spacing strips 56, a plurality of slot 57 have all been seted up to the surface of limiting plate 51 and the corresponding department of the sliding path of mounting groove 55 and spacing strip 56.
As shown in fig. 1-2, the driving end of the driving cylinder 4 is connected with a punching seat 41, a plurality of punching heads are arranged on the bottom surface of the punching seat 41, notches are formed at corresponding positions of sliding paths of the two support plates 3 and the punching seat 41, two ends of the punching seat 41 are connected with sliding rods 42 in a penetrating manner, the bottom surface of each sliding rod 42 is connected to the top surface of the mounting plate 2, the driving cylinder can drive the punching seat 41 to slide downwards along the outer surfaces of the two sliding rods 42, and an aluminum wafer is just fixed under the punching seat 41, so that the punching effect on the fixed aluminum wafer is achieved.
As shown in fig. 1-3, the corresponding positions of the surfaces of the two mounting plates 2 and the sliding path of the connector 52 are provided with sliding grooves 21, the upper surface of the base 1 and the sliding path of the connector 52 are provided with movable grooves 11, the inner side walls of the movable grooves 11 are connected with movable plates 12, the inner bottoms of the movable grooves 11 are connected with a plurality of return springs 13, the tops of the return springs 13 are connected to the bottom surface of the movable plates 12, the movable grooves 11 and the movable plates 12 are positioned on the bottom surface of the limiting units 5, the movable plates 12 are connected with the inner bottoms of the movable grooves 11 through the return springs 13, the inner diameter of the movable grooves 11 is matched with the sliding path of the movable plates 12, and the inner diameter of the sliding grooves 21 is matched with the sliding path of the connector 52.
As shown in fig. 3-4, the first screw rod 54 is connected between the two groups of connectors 52 in a penetrating manner, the adjusting grooves 58 are formed in two sides of the adjusting block 53, the clamping pieces 501 are connected to the inner side walls of the adjusting grooves 58, the second screw rod 59 is connected to the top surface of the adjusting block 53 in a penetrating manner, the bottom ends of the second screw rods 59 penetrate through the top surfaces of the clamping pieces 501 and are connected to the inner bottom sides of the adjusting grooves 58, the outer diameter dimension of the limiting plates 51 is matched with the inner diameter dimension of the mounting grooves 55, the inner diameter dimension of the inserting grooves 57 is matched with the sliding path of the limiting strips 56, the inner diameter dimension of the adjusting grooves 58 is matched with the sliding path of the clamping pieces 501, the clamping pieces 501 are connected with the adjusting blocks 53 through the second screw rods 59, it is required that the plurality of inserting grooves 57 are matched with the mounting grooves 55 and the limiting strips 56 of the adjusting block 53, the limiting of aluminum wafers with different dimensions can be adjusted according to the specification of the aluminum wafers, and the matching of the first screw rods 54 and the second screw rods 59 can fixedly limit the outer surfaces and the top surfaces of the aluminum wafers.
The working principle of the utility model is as follows: when in use, according to the specification and the size of the aluminum wafers, a proper amount of limiting strips 56 in the mounting grooves 55 of the adjusting blocks 53 are inserted along the slots 57 on the surfaces of the limiting plates 51, then a corresponding amount of aluminum wafers are placed on the upper surface of the movable plate 12 and positioned on the inner sides of the two adjusting blocks 53 at corresponding positions, then the first screw rod 54 is rotated to enable the two limiting plates 51 to slide along the inner side walls of the sliding grooves 21 and fix the outer surfaces of the aluminum wafers, and then the second screw rod 59 is rotated to enable the clamping pieces 501 to slide downwards along the adjusting grooves 58 to compress the upper surfaces of the aluminum wafers, so that the fixing and limiting of the aluminum wafers can be completed;
starting the driving cylinder 4 to drive the punching seat 41 to punch downwards along the outer surfaces of the two sliding rods 42, punching the fixed aluminum wafer, wherein when punching is performed, the movable plate 12 is stressed to slide downwards along the movable groove 11 and extrude the plurality of reset springs 13, and after punching is completed, the reset springs 13 drive the movable plate 12 to reset along the movable groove 11, so that the punching processing of the aluminum wafer can be completed.
Claims (6)
1. The punching device for producing the aluminum wafer comprises a base (1) and is characterized in that the upper surface of the base (1) is connected with two mounting plates (2), the top surfaces of the two mounting plates (2) are connected with supporting plates (3), a driving cylinder (4) is arranged between the two supporting plates (3), and two limiting units (5) are connected between the two mounting plates (2);
the limiting unit (5) comprises a limiting plate (51), connectors (52) are connected to two ends of the limiting plate (51), a plurality of adjusting blocks (53) are connected to the outer surface of the limiting plate (51), mounting grooves (55) are formed in the bottom surfaces of the adjusting blocks (53), two limiting strips (56) are connected to the inner side walls of the mounting grooves (55), and a plurality of slots (57) are formed in the corresponding positions of the outer surface of the limiting plate (51) and the sliding paths of the mounting grooves (55) and the limiting strips (56).
2. The punching device for producing aluminum wafers according to claim 1, characterized in that the driving end of the driving cylinder (4) is connected with a punching seat (41), the bottom surface of the punching seat (41) is provided with a plurality of punching heads, the corresponding parts of the sliding paths of the two supporting plates (3) and the punching seat (41) are provided with notches, two ends of the punching seat (41) are connected with sliding rods (42) in a penetrating manner, and the bottom surface of the sliding rods (42) is connected with the top surface of the mounting plate (2).
3. The punching device for producing aluminum wafers according to claim 1, characterized in that sliding grooves (21) are formed in the positions, corresponding to sliding paths of the connectors (52), of the surfaces of the two mounting plates (2), movable grooves (11) are formed in the upper surface of the base (1) and between the two limiting units (5), movable plates (12) are connected to the inner side walls of the movable grooves (11), a plurality of reset springs (13) are connected to the inner bottom sides of the movable grooves (11), and the top ends of the reset springs (13) are connected to the bottom surfaces of the movable plates (12).
4. The punching device for producing aluminum wafers according to claim 1, wherein a first screw rod (54) is connected between two groups of connectors (52) in a penetrating manner, adjusting grooves (58) are formed in two sides of each adjusting block (53), clamping pieces (501) are connected to inner side walls of the adjusting grooves (58), a second screw rod (59) is connected to the top surface of each adjusting block (53) in a penetrating manner, and the bottom end of each second screw rod (59) is connected to the inner bottom side of each adjusting groove (58) in a penetrating manner through the top surface of each clamping piece (501).
5. A punching device for producing aluminum wafers according to claim 3, characterized in that the movable groove (11) and the movable plate (12) are positioned on the bottom surface of the limiting unit (5), the movable plate (12) is connected with the inner bottom side of the movable groove (11) through a return spring (13), the inner diameter size of the movable groove (11) is matched with the sliding path of the movable plate (12), and the inner diameter size of the sliding groove (21) is matched with the sliding path of the connecting head (52).
6. The punching device for producing aluminum wafers according to claim 4, wherein the outer diameter of the limiting plate (51) is matched with the inner diameter of the mounting groove (55), the inner diameter of the slot (57) is matched with the sliding path of the limiting bar (56), the inner diameter of the adjusting groove (58) is matched with the sliding path of the clamping piece (501), and the clamping piece (501) is connected with the adjusting block (53) through the second screw rod (59).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322238625.9U CN220658923U (en) | 2023-08-21 | 2023-08-21 | Perforating device for producing aluminum wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322238625.9U CN220658923U (en) | 2023-08-21 | 2023-08-21 | Perforating device for producing aluminum wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220658923U true CN220658923U (en) | 2024-03-26 |
Family
ID=90334271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322238625.9U Active CN220658923U (en) | 2023-08-21 | 2023-08-21 | Perforating device for producing aluminum wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220658923U (en) |
-
2023
- 2023-08-21 CN CN202322238625.9U patent/CN220658923U/en active Active
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