CN220648476U

CN220648476U - Semiconductor refrigerating fan

Info

Publication number: CN220648476U
Application number: CN202322124496.0U
Authority: CN
Inventors: 刘蕙
Original assignee: Shenzhen Jinyingjia Electric Appliance Co ltd
Current assignee: Shenzhen Jinyingjia Electric Appliance Co ltd
Priority date: 2023-08-08
Filing date: 2023-08-08
Publication date: 2024-03-22
Anticipated expiration: 2033-08-08

Abstract

The application relates to the technical field of fans, especially, relate to a semiconductor refrigeration fan, including casing and fan, the air outlet has been seted up on the casing, the fan sets up in the casing and be close to the air outlet sets up, be provided with semiconductor refrigeration piece, fin and water tank in the casing respectively, the cold junction of semiconductor refrigeration piece is close to the fan sets up, the hot junction of semiconductor refrigeration piece with the fin is connected, the fin is kept away from the one end of semiconductor refrigeration piece with the water tank is contradicted, the water tank can dismantle the connection on the casing. The application has the effect of improving the use comfort of the fan.

Description

Semiconductor refrigerating fan

Technical Field

The application relates to the technical field of fans, in particular to a semiconductor refrigeration fan.

Background

At present, an electric fan is also called a fan, and is a device for accelerating air circulation by utilizing electricity to drive fan blades to rotate, and is mainly used for cooling and relieving summer heat and circulating air. When the indoor temperature is too high or the fan works for a long time, the fan can blow out hot air, and the cooling and summer-heat relieving requirements cannot be met.

At present, a water curtain type air-conditioning fan exists in the market, and the principle is that the wind of the fan passes through a water curtain, so that the water carried on the water curtain is evaporated, and a large amount of heat can be absorbed while the water is evaporated, thereby realizing the purpose of cooling the wind and meeting the requirements of cooling and relieving summer heat.

For the related art in the above: when the water curtain type air-conditioning fan works, the humidity of air can be increased, so that evaporation of sweat on human skin is easily hindered, and the using comfort of the fan is reduced.

Disclosure of Invention

In order to improve the use comfort of the fan, the application provides a semiconductor refrigeration fan.

The application provides a semiconductor refrigeration fan adopts following technical scheme:

the utility model provides a semiconductor refrigeration fan, includes casing and fan, the air outlet has been seted up on the casing, the fan sets up in the casing and be close to the air outlet sets up, be provided with semiconductor refrigeration piece, fin and water tank in the casing respectively, the cold junction of semiconductor refrigeration piece is close to the fan sets up, the hot junction of semiconductor refrigeration piece with the fin is connected, the fin is kept away from the one end of semiconductor refrigeration piece with the water tank is contradicted, the water tank can dismantle the connection and be in on the casing.

Through adopting above-mentioned technical scheme, during the fan work, outside air can contact the cold junction of semiconductor refrigeration piece earlier, blows out from the air outlet again to be convenient for the fan blow out low temperature wind, and the low temperature wind that blows out is difficult for making air humidity rise, and then is favorable to improving the use comfort of fan.

In addition, one end of semiconductor refrigeration piece is connected with the fin, and the fin is contradicted with the water tank to be convenient for utilize the fin to cool down to the semiconductor refrigeration piece, and then be favorable to reducing the semiconductor refrigeration piece because of the too high possibility that appears damaging of temperature, prolonged the life of semiconductor refrigeration piece to a certain extent.

Optionally, the water tank is close to one side of fin has seted up the grafting groove, the fin insert establish in the grafting groove and with the inner wall laminating of grafting groove, the fin with be provided with the heat conduction spare between the water tank, the heat conduction spare is kept away from the one end of fin passes the grafting groove inserts to in the water tank.

Through adopting above-mentioned technical scheme, the fin inserts and establishes in the jack-in groove to be convenient for increase area of contact between fin and the water tank, and be provided with the heat conduction spare between fin and the water tank, make the fin can carry out the heat exchange through the water in heat conduction spare and the water tank, and then be favorable to reducing the temperature of fin, make the fin can cool down the semiconductor refrigeration piece better to a certain extent.

Optionally, the holding tank has been seted up to one side that the casing kept away from the air outlet, is provided with the stopper on the inner wall of holding tank, has seted up the spacing groove on the water tank, and the water tank is inserted and is established in the holding tank, and the stopper is inserted and is established in the spacing groove.

Through adopting above-mentioned technical scheme, the water tank is inserted and is established in the holding tank, and the stopper is inserted and is established in the spacing inslot to be convenient for fix the water tank on the casing, and be convenient for dismantle the water tank from the casing, and then be convenient for change the water in the water tank, reduced the too high temperature of the water in the water tank to a certain extent, lead to unable possibility of cooling down the fin.

Optionally, an elastic sealing gasket is filled between the limiting block and the inner wall of the limiting groove.

Through adopting above-mentioned technical scheme, the setting of elastic sealing pad has improved the stopper to a certain extent and has inserted the stability of establishing in the spacing inslot to be favorable to improving the connection stability of water tank and casing.

Optionally, the air inlet has been seted up respectively to the both sides of casing, the air inlet is close to the cold junction setting of semiconductor refrigeration piece, can dismantle on the casing and be connected with dustproof subassembly, dustproof subassembly inserts and establishes in the air inlet.

Through adopting above-mentioned technical scheme, when the fan work for when outside air gets into the casing through the air inlet, dustproof subassembly can hold back the dust that carries in the air, thereby is favorable to reducing in the dust gets into the casing, causes the possibility of adverse effect to the work of fan.

Optionally, the dustproof assembly comprises a dustproof mesh cover, and the dustproof mesh cover is inserted in the air inlet and detachably connected with the shell.

Through adopting above-mentioned technical scheme, the setting of dustproof screen panel is convenient for hinder impurity such as dust that carries in the outside air to get into in the casing.

Optionally, the dust-proof component comprises a dust collecting piece, the dust collecting piece is inserted into the air inlet, and the dust collecting piece is used for adsorbing dust in the air inlet.

By adopting the technical scheme, the possibility that impurities such as dust carried in the outside air enter the shell is further reduced.

Optionally, the dust collection piece includes the mounting panel and sets up the felt on the mounting panel, the mounting panel is inserted and is established in the air inlet, the mounting panel deviates from one side of felt is provided with the elastic bulge, the draw-in groove has been seted up on the casing, the elastic bulge is inserted and is established in the draw-in groove.

Through adopting above-mentioned technical scheme, the felt can adsorb the dust to in making the dust be difficult for getting into the casing, and the mounting panel passes through the protruding joint of elasticity on the casing, make the mounting panel can dismantle from the casing, and then be convenient for wash the felt on the mounting panel, in order to reduce the too much dust of absorption on the felt, lead to the difficult possibility of adsorbing the dust again of felt.

In summary, the present application includes at least one of the following beneficial technical effects:

1. through the mutual matching of the semiconductor refrigerating sheet, the radiating sheet, the water tank and the heat conducting piece, the air blown out during the operation of the fan is low-temperature air, and the blown low-temperature air is not easy to raise the humidity of the air, so that the use comfort of the fan is improved;

2. through the mutual matching of the limiting block and the elastic sealing gasket, the water tank can be disassembled and assembled on the shell, so that the water in the water tank is convenient to replace, and the possibility that the cooling fin cannot be cooled due to overhigh temperature of the water in the water tank is reduced;

3. through mutually supporting of mounting panel, elastic bulge and felt for the mounting panel can dismantle on the casing, thereby is convenient for utilize the felt to adsorb the dust that gets into in the casing from the air inlet, in order to reduce the possibility that the dust got into in the casing, and be convenient for take out the felt from the air inlet in, in order to wash the felt, and then be favorable to reducing the too much dust of absorption on the felt, lead to the difficult possibility of adsorbing the dust again of felt.

Drawings

Fig. 1 is a schematic diagram of the overall structure of a semiconductor refrigeration fan according to an embodiment of the present application.

Fig. 2 is a cross-sectional view taken along line A-A in fig. 1.

Fig. 3 is a partial enlarged view at B in fig. 2.

Reference numerals illustrate:

1. a housing; 11. an air outlet; 12. a receiving groove; 13. a limiting block; 14. an air inlet; 15. a clamping groove; 16. a handle; 17. a support leg; 2. a fan; 3. a semiconductor refrigeration sheet; 4. a heat sink; 5. a water tank; 51. a water inlet; 52. a case cover; 53. a limit groove; 54. an elastic sealing gasket; 55. a plug-in groove; 56. a heat conductive member; 6. a dust-proof assembly; 61. a dust-proof net cover; 62. a dust collection member; 621. a mounting plate; 6211. an elastic protrusion; 622. a felt.

Detailed Description

The present application is described in further detail below in conjunction with figures 1-3.

The embodiment of the application discloses a semiconductor refrigeration fan.

It should be noted that, in the description of the present utility model, it should be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

Referring to fig. 1 and 2, the semiconductor refrigeration fan includes a cabinet 1, a fan 2, a semiconductor refrigeration sheet 3, a heat sink 4, and a water tank 5. Wherein, air outlet 11 has been seted up on casing 1, fan 2 fixed mounting just is close to air outlet 11 setting in casing 1. The water tank 5 can be dismantled and connect in the casing 1 one side of keeping away from air outlet 11, and semiconductor refrigeration piece 3, fin 4 are installed respectively in casing 1, and the cold junction of semiconductor refrigeration piece 3 is close to fan 2 setting, and the hot junction of semiconductor refrigeration piece 3 is connected with fin 4, and the one end that semiconductor refrigeration piece 3 was kept away from to fin 4 contradicts with water tank 5 to be convenient for make fan 2 blow off low temperature wind, and the low temperature wind that blows off is difficult for making air humidity rise, and then is favorable to improving the use comfort of fan 2.

Referring to fig. 2 and 3, a receiving groove 12 is formed in one side, far away from the air outlet 11, of the casing 1 along the height direction of the casing 1, limiting blocks 13 are fixedly connected to the inner wall of the receiving groove 12, two limiting blocks 13 are arranged, and the two limiting blocks 13 are symmetrically distributed on the inner wall of the receiving groove 12.

Referring to fig. 1 and 2, the shape of the water tank 5 is adapted to the shape of the accommodating groove 12, and the water tank 5 is provided with a water inlet 51, the water tank 5 is detachably connected with a tank cover 52, and the tank cover 52 is inserted into the water inlet 51 and is used for blocking the water inlet 51 so as to prevent water in the tank from flowing out of the water inlet 51. In this embodiment, the cover 52 is connected to the tank 5 by a snap fit.

Referring to fig. 2 and 3, a limit groove 53 is formed in a side wall of the water tank 5, and the number of the limit grooves 53 is matched with that of the limit blocks 13, so that when the water tank 5 is inserted into the accommodating groove 12, the limit blocks 13 are inserted into the limit grooves 53 to limit the water tank 5.

The limiting groove 53 is internally provided with an elastic sealing pad 54, and the elastic sealing pad 54 is a rubber pad in the embodiment. When stopper 13 inserts and establishes in spacing groove 53, the elastic sealing gasket 54 fills between the inner wall in stopper 13 and spacing groove 53 to the stability of stopper 13 inserting and establishing in spacing groove 53 has been improved to a certain extent, and then is favorable to improving the connection stability of water tank 5 and casing 1.

Referring to fig. 2, a plugging groove 55 is formed on one side of the water tank 5, which is close to the heat sink 4, and the shape of the plugging groove 55 is adapted to the shape of the heat sink 4. And the water tank 5 is fixedly connected with a heat conducting piece 56, one end of the heat conducting piece 56 is inserted into the water tank 5, and the other end of the heat conducting piece 56 extends to the inner wall of the inserting groove 55.

When the water tank 5 is inserted into the accommodating groove 12, the radiating fin 4 is inserted into the inserting groove 55 and is attached to the inner wall of the inserting groove 55. At this time, the heat sink 4 further abuts against one end of the heat conducting member 56 extending to the inner wall of the insertion groove 55, so that the heat sink 4 and water in the water tank 5 can exchange heat conveniently, and the temperature of the heat sink 4 can be reduced, so that the heat sink 4 can be cooled down to the semiconductor refrigerating plate 3 better to a certain extent.

Referring to fig. 2, air inlets 14 are respectively formed at two sides of the casing 1, the air inlets 14 are communicated with the inside of the casing 1, and the air inlets 14 are arranged close to the cold ends of the semiconductor refrigerating sheets 3, so that when the fan 2 works, external air can enter the casing 1 through the air inlets 14 and pass through the cold ends of the semiconductor refrigerating sheets 3, so that the temperature of the air is reduced, and the air blown out of the casing 1 is conveniently low-temperature air.

The casing 1 is detachably connected with a dust-proof component 6, and the dust-proof component 6 comprises a dust-proof net cover 61 and a dust-collecting piece 62. In this embodiment, two dust collecting members 62 are provided, the two dust collecting members 62 are respectively and fixedly connected to the same side of the dust screen 61, and the two dust collecting members 62 are symmetrically arranged.

The dust collecting member 62 includes a mounting plate 621 and a felt 622 fixedly attached to the mounting plate 621, the mounting plate 621 is fixedly attached to the dust screen 61, and the shape of the mounting plate 621 is adapted to the design of the inner wall of the air inlet 14. The felts 622 on the two mounting plates 621 are oppositely arranged, and the side of the mounting plate 621, which faces away from the felts 622, is provided with an elastic protrusion 6211, and the cross section of the elastic protrusion 6211 in the embodiment is circular arc-shaped.

The casing 1 is provided with the clamping grooves 15, the clamping grooves 15 are communicated with the air inlet 14, the number of the clamping grooves 15 is equal to that of the elastic protrusions 6211, and the shape of the clamping grooves 15 is matched with the shape of the elastic protrusions 6211.

When the mounting plate 621 is inserted into the air inlet 14, the elastic protrusions 6211 are inserted into the card slots 15, thereby facilitating the fixing of the mounting plate 621 to the casing 1. At this time, the dust screen 61 covers the air inlet 14.

When the fan 2 works, when outside air enters the casing 1 through the air inlet 14, the dust screen 61 can block impurities such as dust carried in the outside air, so that the impurities such as dust are not easy to enter the casing 1, and the felt 622 can adsorb the dust passing through the dust screen 61, so that the possibility that the dust enters the casing 1 is further reduced, and the possibility that the dust enters the casing 1 is reduced, and adverse effects are caused to the working of the refrigeration fan 2.

In addition, when the dust adsorbed on the felt 622 is excessive, a user can apply a pulling force to the mounting plate 621 through the dust screen 61, so that the elastic protrusions 6211 are separated from the clamping grooves 15, and the mounting plate 621 is conveniently pulled out of the air inlet 14, so that the felt 622 is conveniently cleaned, and the possibility that the dust adsorbed on the felt 622 is excessive, and the felt 622 is not easy to adsorb the dust is reduced.

Referring to fig. 1, a handle 16 is rotatably coupled to the top of the casing 1 to facilitate movement of the casing 1. The bottom of the casing 1 is fixedly connected with a support leg 17, thereby facilitating the stable placement of the casing 1 on the ground.

The implementation principle of the semiconductor refrigeration fan in the embodiment of the application is as follows: when the fan 2 is operated, the external air enters the air inlet 14 through the dust screen 61 and enters the casing 1 through the air inlet 14. At this time, the air will contact with the cold end of the semiconductor refrigeration piece 3, and then flow out of the casing 1 through the air outlet 11 under the action of the fan 2, so that the fan 2 blows out low-temperature air conveniently, and the use comfort of the fan 2 is improved.

The foregoing are all preferred embodiments of the present application, and are not intended to limit the scope of the present application in any way, therefore: all equivalent changes in structure, shape and principle of this application should be covered in the protection scope of this application.

Claims

1. The utility model provides a semiconductor refrigeration fan, includes casing (1) and fan (2), air outlet (11) have been seted up on casing (1), fan (2) set up in casing (1) and be close to air outlet (11) set up, its characterized in that: semiconductor refrigeration piece (3), fin (4) and water tank (5) are provided with respectively in casing (1), the cold junction of semiconductor refrigeration piece (3) is close to fan (2) setting, the hot junction of semiconductor refrigeration piece (3) with fin (4) are connected, fin (4) keep away from the one end of semiconductor refrigeration piece (3) with water tank (5) are contradicted, water tank (5) detachable connection is in on casing (1).

2. The semiconductor refrigeration fan as set forth in claim 1, wherein: the radiator is characterized in that a plugging groove (55) is formed in one side, close to the radiating fin (4), of the water tank (5), the radiating fin (4) is inserted into the plugging groove (55) and attached to the inner wall of the plugging groove (55), a heat conducting piece (56) is arranged between the radiating fin (4) and the water tank (5), and one end, away from the radiating fin (4), of the heat conducting piece (56) penetrates through the plugging groove (55) to be inserted into the water tank (5).

3. The semiconductor refrigeration fan as set forth in claim 1, wherein: one side of the shell (1) far away from the air outlet (11) is provided with a containing groove (12), the inner wall of the containing groove (12) is provided with a limiting block (13), the water tank (5) is provided with a limiting groove (53), the water tank (5) is inserted in the containing groove (12), and the limiting block (13) is inserted in the limiting groove (53).

4. A semiconductor refrigeration fan as set forth in claim 3 wherein: an elastic sealing gasket (54) is filled between the limiting block (13) and the inner wall of the limiting groove (53).

5. The semiconductor refrigeration fan as set forth in claim 1, wherein: air inlets (14) are respectively formed in two sides of the shell (1), the air inlets (14) are close to the cold ends of the semiconductor refrigerating sheets (3), the shell (1) is detachably connected with a dustproof assembly (6), and the dustproof assembly (6) is inserted into the air inlets (14).

6. The semiconductor refrigeration fan as set forth in claim 5, wherein: the dustproof assembly (6) comprises a dustproof mesh cover (61), and the dustproof mesh cover (61) is inserted into the air inlet (14) and detachably connected with the shell (1).

7. The semiconductor refrigeration fan as set forth in claim 5, wherein: the dust prevention assembly (6) comprises a dust collection piece (62), the dust collection piece (62) is inserted into the air inlet (14), and the dust collection piece (62) is used for adsorbing dust in the air inlet (14).

8. The semiconductor refrigeration fan as set forth in claim 7, wherein: the dust collection piece (62) comprises a mounting plate (621) and a felt (622) arranged on the mounting plate (621), the mounting plate (621) is inserted into the air inlet (14), one side, deviating from the felt (622), of the mounting plate (621) is provided with an elastic bulge (6211), the casing (1) is provided with a clamping groove (15), and the elastic bulge (6211) is inserted into the clamping groove (15).