CN220646076U - Data acquisition device for engine - Google Patents
Data acquisition device for engine Download PDFInfo
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- CN220646076U CN220646076U CN202322342999.5U CN202322342999U CN220646076U CN 220646076 U CN220646076 U CN 220646076U CN 202322342999 U CN202322342999 U CN 202322342999U CN 220646076 U CN220646076 U CN 220646076U
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Abstract
The utility model relates to a data acquisition device for an engine, belongs to the technical field of engine management, and solves the problems of unstable engine operation data acquisition and high cost in the prior art. The collecting end of the cylinder temperature collecting device is placed at the position of an engine cylinder, the collecting end of the exhaust temperature collecting device is placed at the position of an engine exhaust pipe, the collecting end of the oil quantity collecting device is placed at the bottom of the oil tank, and the collecting end of the pressure collecting device is placed at the side part of the oil tank; in the data acquisition device, a cylinder temperature acquisition device, an exhaust temperature acquisition device, an oil quantity acquisition device, a pressure acquisition device and a rotating speed acquisition device are all provided with corresponding redundant devices, and output ends are all connected with an MCU processing circuit to transmit acquired data to the MCU processing circuit. The stable acquisition of the engine operation data is realized, and the cost is low.
Description
Technical Field
The utility model relates to the technical field of engine management, in particular to a data acquisition device for an engine.
Background
With the development of technology, engines are becoming more and more popular in various fields, and in order to better control the engines, monitoring the engines during the running state is also becoming more and more important.
In the prior art, when engine operation data are collected, different collecting devices are required to be designed according to different application scenes, the design cost is high, time and labor are consumed, and the collected data are unstable and are difficult to meet the requirements for engine control.
Therefore, a new technical solution for collecting engine operation data is needed.
Disclosure of Invention
In view of the above analysis, the present utility model aims to provide a data acquisition device for an engine, which is used for solving the problems of unstable engine operation data acquisition and high cost in the prior art.
The aim of the utility model is mainly realized by the following technical scheme:
the data acquisition device comprises a cylinder temperature acquisition device, an exhaust temperature acquisition device, an oil quantity acquisition device, a pressure acquisition device, a rotating speed acquisition device and an MCU processing circuit;
the cylinder temperature acquisition device, the exhaust temperature acquisition device, the oil quantity acquisition device, the pressure acquisition device and the rotating speed acquisition device are all provided with corresponding redundant devices; the collecting end of the cylinder temperature collecting device is placed at the position of an engine cylinder, the collecting end of the exhaust temperature collecting device is placed at the position of an engine exhaust pipe, the collecting end of the oil quantity collecting device is placed at the bottom of the oil tank, and the collecting end of the pressure collecting device is placed at the side part of the oil tank; the acquisition end of the rotating speed acquisition device is arranged at the position of the engine gear;
the output ends of the cylinder temperature acquisition device, the exhaust temperature acquisition device, the oil quantity acquisition device, the pressure acquisition device and the rotating speed acquisition device are all connected with the MCU processing circuit, and the acquired data are transmitted to the MCU processing circuit.
Based on the further improvement of the scheme, the cylinder temperature acquisition device comprises a thermal resistance temperature sensor and a thermal resistance conditioning circuit; the acquisition end of the thermal resistance temperature sensor is arranged at the position of an engine cylinder, and the output end of the thermal resistance temperature sensor is connected with the input end of the thermal resistance conditioning circuit; the output end of the thermal resistance conditioning circuit is connected with the MCU processing circuit;
the exhaust temperature acquisition device comprises a thermocouple temperature sensor and a thermocouple conditioning circuit; the acquisition end of the thermocouple temperature sensor is arranged at the position of the engine exhaust pipe, and the output end of the thermocouple temperature sensor is connected with the input end of the thermocouple conditioning circuit; the output end of the thermocouple conditioning circuit is connected with the MCU processing circuit.
Based on the further improvement of the scheme, the thermal resistance conditioning circuit comprises a resistance conversion circuit and a signal amplifying circuit;
the resistance conversion circuit comprises an adjustable amplification ratio resistor R5 and a first operational amplifier A1; the non-inverting input end of the first operational amplifier A1 is grounded;
the inverting input end of the first operational amplifier A1 is simultaneously connected with one end of the amplification proportion adjusting resistor R5 and the output end of the thermal resistance temperature sensor; the other end of the amplifying proportion adjusting resistor R5 is connected with a power supply;
the output end of the first operational amplifier A1 is connected with the input end of the signal amplifying circuit and the output end of the thermal resistance temperature sensor.
Based on the further improvement of the scheme, the signal amplifying circuit comprises an input positive-end current limiting resistor R1, an input negative-end current limiting resistor R4, a first amplification factor adjusting resistor R3, a first output current limiting resistor R2, a first instrumentation amplifier D1 and a bidirectional diode V1;
the sampling input positive end of the first instrument amplifier D1 is simultaneously connected with one end of the input positive end current limiting resistor R1 and one end of the bidirectional diode V1; the other end of the input positive end current limiting resistor R1 is grounded;
the sampling input negative end of the first instrument amplifier D1 is simultaneously connected with one end of the input negative end current limiting resistor R4 and the other end of the bidirectional diode V1; the other end of the input negative end current limiting resistor R4 is used as the input end of the signal amplifying circuit;
a first amplification factor adjusting resistor R3 is connected between the gain setting positive end and the gain setting negative end of the first instrumentation amplifier D1;
the output end of the first instrumentation amplifier D1 is connected with one end of a first output current limiting resistor R2, and the other end of the first output current limiting resistor R2 is used as the output end of the signal amplifying circuit.
Based on the further improvement of the scheme, the thermocouple conditioning circuit comprises an input positive end protection resistor R6, an input negative end protection resistor R9, a second amplification factor adjusting resistor R8, a second output current limiting resistor R7 and a second instrumentation amplifier D2;
the sampling input positive end of the second instrument amplifier D2 is used as a first input end of the thermocouple conditioning circuit, and is simultaneously connected with one end of the input positive end protection resistor R6 and the output positive end of the thermocouple temperature sensor; the other end of the input positive end protection resistor R6 is grounded;
the sampling input negative end of the second instrument amplifier D2 is used as a second input end of the thermocouple conditioning circuit, and one end of the input negative end protection resistor R9 and the output negative end of the thermocouple temperature sensor are connected at the same time; the other end of the input negative terminal protection resistor R9 is grounded;
a second amplification factor adjusting resistor R8 is connected between the gain setting positive end and the gain setting negative end of the second instrumentation amplifier D2;
the output end of the second instrumentation amplifier D2 is connected with one end of a second output current-limiting resistor R7, and the other end of the second output current-limiting resistor R7 is used as the output end of the thermocouple conditioning circuit.
Based on the further improvement of the scheme, the oil quantity acquisition device comprises an oil quantity sensor and a first signal conditioning circuit; the pressure acquisition device comprises a pressure sensor and a second signal conditioning circuit;
the acquisition end of the oil quantity sensor is arranged at the bottom of the fuel tank or the lubricating oil tank, and the output end of the oil quantity sensor is connected with the input end of the first signal conditioning circuit; the output end of the first signal conditioning circuit is connected with the MCU processing circuit;
the acquisition end of the pressure sensor is arranged at the side part of the oil tank, and the output end of the pressure sensor is connected with the input end of the second signal conditioning circuit; the output end of the second signal conditioning circuit is connected with the MCU processing circuit.
Based on the further improvement of the scheme, the first signal conditioning circuit and the second signal conditioning circuit have the same structure and comprise a first amplification proportion adjusting resistor, a second amplification proportion adjusting resistor and a second operational amplifier;
the non-inverting input end of the second operational amplifier is connected with one end of the first amplification proportion adjusting resistor; the other end of the first amplification proportion adjusting resistor is used as an input end of the first signal conditioning circuit or the second signal conditioning circuit and is connected with one end of the second amplification proportion adjusting resistor; the other end of the second amplification proportion adjusting resistor is grounded;
the output end of the second operational amplifier is used as the output end of the first signal conditioning circuit or the second signal conditioning circuit and is simultaneously connected with the inverting input end of the second operational amplifier.
Based on the further improvement of the scheme, the rotating speed acquisition device comprises a rotating speed sensor and a rotating speed conditioning circuit;
the acquisition end of the rotation speed sensor is arranged at the position of the engine gear, the output end of the rotation speed conditioning circuit is connected with one end of the rotation speed conditioning circuit, and the other end of the rotation speed conditioning circuit is used as the output end of the rotation speed acquisition device and is connected with the MCU processing circuit.
Based on a further improvement of the scheme, the rotating speed conditioning circuit comprises a first threshold value adjusting resistor R14, a second threshold value adjusting resistor R15, a third threshold value adjusting resistor R16, a fourth threshold value adjusting resistor R17 and a third operational amplifier D5;
the non-inverting input end of the third operational amplifier D5 is simultaneously connected with one end of the first threshold adjusting resistor R14 and one end of the second threshold adjusting resistor R15; the other end of the second threshold value adjusting resistor R15 is used as an input end of the rotating speed conditioning circuit;
an inverting input terminal of the third operational amplifier D5 is simultaneously connected to one end of the third threshold adjustment resistor R16 and one end of the fourth threshold adjustment resistor R17; the other end of the third threshold value adjusting resistor R16 is connected with a power supply; the other end of the fourth threshold adjusting resistor R17 is grounded;
the output end of the third operational amplifier D5 is used as the output end of the rotating speed conditioning circuit, and is simultaneously connected with the other end of the first threshold value adjusting resistor R14 and the MCU processing circuit.
Based on the further improvement of the scheme, the data acquisition device comprises a CAN communication circuit; the CAN communication circuit comprises a CAN transceiver chip D6, a CAN bus communication rate adjusting resistor R18 and a CAN bus matching resistor R19;
the TXD port and the RXD port of the CAN transceiver chip D6 are connected with the CAN_TX port and the CAN_RX port of the MCU processing circuit;
the RS port of the CAN transceiver chip D6 is grounded through a CAN bus communication rate adjusting resistor R18;
and a CAN bus matching resistor R19 is connected between a CANH port and a CANL port of the CAN transceiver chip D6, and simultaneously the CAN_H port and the CAN_L port of the upper computer are connected.
Compared with the prior art, the utility model has at least one of the following beneficial effects:
through placing the collection end of cylinder temperature acquisition device, exhaust temperature acquisition device, oil mass acquisition device, pressure acquisition device and rotational speed acquisition device in the acquisition point, the output is connected with MCU processing circuit, handles the operation data of the engine that gathers, can be stable obtain the operation data of engine.
In the utility model, the technical schemes can be mutually combined to realize more preferable combination schemes. Additional features and advantages of the utility model will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the utility model. The objectives and other advantages of the utility model may be realized and attained by the structure particularly pointed out in the written description and drawings.
Drawings
The drawings are only for purposes of illustrating particular embodiments and are not to be construed as limiting the utility model, like reference numerals being used to refer to like parts throughout the several views.
Fig. 1 is a schematic structural diagram of a data acquisition device for an engine according to an embodiment of the present utility model;
FIG. 2 is a schematic diagram of a thermal resistance conditioning circuit according to an embodiment of the present utility model;
FIG. 3 is a schematic diagram of a thermocouple conditioning circuit according to an embodiment of the present utility model;
fig. 4 is a schematic structural diagram of a first signal conditioning circuit according to an embodiment of the present utility model;
fig. 5 is a schematic structural diagram of a second signal conditioning circuit according to an embodiment of the present utility model;
fig. 6 is a schematic structural diagram of a rotational speed conditioning circuit according to an embodiment of the present utility model;
fig. 7 is a schematic structural diagram of a CAN communication circuit according to an embodiment of the present utility model.
Detailed Description
Preferred embodiments of the present utility model will now be described in detail with reference to the accompanying drawings, which form a part hereof, and together with the description serve to explain the principles of the utility model, and are not intended to limit the scope of the utility model.
In one embodiment of the utility model, a data acquisition device for an engine is disclosed, as shown in fig. 1, wherein the data acquisition device comprises a cylinder temperature acquisition device, an exhaust temperature acquisition device, an oil quantity acquisition device, a pressure acquisition device, a rotating speed acquisition device and an MCU processing circuit;
the cylinder temperature acquisition device, the exhaust temperature acquisition device, the oil quantity acquisition device, the pressure acquisition device and the rotating speed acquisition device are all provided with corresponding redundant devices; the collecting end of the cylinder temperature collecting device is placed at the position of an engine cylinder, the collecting end of the exhaust temperature collecting device is placed at the position of an engine exhaust pipe, the collecting end of the oil quantity collecting device is placed at the bottom of the oil tank, and the collecting end of the pressure collecting device is placed at the side part of the oil tank; the acquisition end of the rotating speed acquisition device is arranged at the position of the engine gear;
the output ends of the cylinder temperature acquisition device, the exhaust temperature acquisition device, the oil quantity acquisition device, the pressure acquisition device and the rotating speed acquisition device are all connected with the MCU processing circuit, and the acquired data are transmitted to the MCU processing circuit.
Specifically, as shown in fig. 1, a data acquisition device for an engine comprises a cylinder temperature acquisition device, an exhaust temperature acquisition device, an oil mass acquisition device, a pressure acquisition device, a rotating speed acquisition device and an MCU processing circuit, and corresponding redundant devices are arranged for the cylinder temperature acquisition device, the exhaust temperature acquisition device, the oil mass acquisition device, the pressure acquisition device and the rotating speed acquisition device, namely, each device is provided with a secondary device, when main device acquisition data in work is unstable or fails, the secondary devices can be switched at any time to perform data acquisition, the main device and the secondary devices have the same composition structure, acquisition ends are all placed at preset acquisition points, and acquired operation data are all transmitted to the MCU processing circuit.
Specifically, as shown in fig. 1, the collection end of the cylinder temperature collection device is placed at the position of the cylinder of the engine, the collection end of the exhaust temperature collection device is placed at the position of the exhaust pipe of the engine, the collection end of the oil quantity collection device is placed at the bottom of the oil tank, the collection end of the pressure collection device is placed at the side part of the oil tank, the collection end of the rotation speed collection device is placed at the position of the gear of the engine, and the operation data of the engine are collected in all aspects.
Preferably, as shown in fig. 1, the cylinder temperature acquisition device comprises a thermal resistance temperature sensor and a thermal resistance conditioning circuit; the acquisition end of the thermal resistance temperature sensor is arranged at the position of an engine cylinder, and the output end of the thermal resistance temperature sensor is connected with the input end of the thermal resistance conditioning circuit; the output end of the thermal resistance conditioning circuit is connected with the MCU processing circuit;
the exhaust temperature acquisition device comprises a thermocouple temperature sensor and a thermocouple conditioning circuit; the acquisition end of the thermocouple temperature sensor is arranged at the position of the engine exhaust pipe, and the output end of the thermocouple temperature sensor is connected with the input end of the thermocouple conditioning circuit; the output end of the thermocouple conditioning circuit is connected with the MCU processing circuit.
Specifically, as shown in fig. 1, in the cylinder temperature acquisition device, the acquisition end of the thermal resistance temperature sensor is placed at the position of the engine cylinder and is used for acquiring a signal of the temperature of the engine cylinder, the acquired signal is conditioned by the thermal resistance conditioning circuit, so that the acquired signal is more stable, and finally the acquired signal is output to the MCU processing circuit.
Specifically, as shown in fig. 1, in the exhaust temperature acquisition device, the acquisition end of the thermocouple temperature sensor is placed at the position of the engine exhaust pipe and is used for acquiring a signal of the temperature of the engine exhaust pipe, the acquired signal is conditioned by the thermocouple conditioning circuit, so that the acquired signal is more stable, and finally the acquired signal is output to the MCU processing circuit.
Preferably, as shown in fig. 2, the thermal resistance conditioning circuit includes a resistance conversion circuit and a signal amplification circuit;
the resistance conversion circuit comprises an adjustable amplification ratio resistor R5 and a first operational amplifier A1; the non-inverting input end of the first operational amplifier A1 is grounded;
the inverting input end of the first operational amplifier A1 is simultaneously connected with one end of the amplification proportion adjusting resistor R5 and the output end of the thermal resistance temperature sensor; the other end of the amplifying proportion adjusting resistor R5 is connected with a power supply;
the output end of the first operational amplifier A1 is connected with the input end of the signal amplifying circuit and the output end of the thermal resistance temperature sensor.
Specifically, as shown in fig. 2, the output end of the thermal resistance temperature sensor includes an a end and a B end, the a end and the B end are connected to the resistance conversion circuit, and the thermal resistance temperature sensor is used as a resistor. Preferably, the thermal resistance temperature sensor uses STT-T series platinum resistance temperature sensor to collect the temperature of the engine cylinder, the temperature range is-50-250 ℃, the resistance value is 1000 omega at 0 ℃, and the resistance is 1385 omega at 100 ℃.
Specifically, as shown in fig. 2, the resistance conversion circuit converts the resistance signals at the two ends of the AB of the thermal resistance temperature sensor into voltage signals at the C end by combining the regulation and amplification ratio resistor R5 and the first operational amplifier A1; the signal amplifying circuit amplifies the voltage signal of the C terminal into a voltage signal of the D point. It should be noted that, by changing the resistance value of the amplifying ratio resistor R5, the first operational amplifier A1 amplifies the signal at both ends of the AB.
Preferably, as shown in fig. 2, the signal amplifying circuit includes an input positive-side current limiting resistor R1, an input negative-side current limiting resistor R4, a first amplification factor adjusting resistor R3, a first output current limiting resistor R2, a first instrumentation amplifier D1, and a bidirectional diode V1;
the sampling input positive end of the first instrument amplifier D1 is simultaneously connected with one end of the input positive end current limiting resistor R1 and one end of the bidirectional diode V1; the other end of the input positive end current limiting resistor R1 is grounded;
the sampling input negative end of the first instrument amplifier D1 is simultaneously connected with one end of the input negative end current limiting resistor R4 and the other end of the bidirectional diode V1; the other end of the input negative end current limiting resistor R4 is used as the input end of the signal amplifying circuit;
a first amplification factor adjusting resistor R3 is connected between the gain setting positive end and the gain setting negative end of the first instrumentation amplifier D1;
the output end of the first instrumentation amplifier D1 is connected with one end of a first output current limiting resistor R2, and the other end of the first output current limiting resistor R2 is used as the output end of the signal amplifying circuit.
Specifically, as shown in fig. 2, a voltage signal at the C terminal is connected to the sampling input negative terminal of the first instrumentation amplifier D1 through the input negative terminal current limiting resistor R4, and the bidirectional diode V1 performs current limiting on the voltage signal input at the C point; the input positive end current limiting resistor R1 and the input negative end current limiting resistor R4 are matched with each other, and current limiting is carried out on the sampling input positive end and the sampling input negative end of the first instrument amplifier D1 respectively; the voltage signal at the C end is subjected to amplification factor adjustment by adjusting the resistance value of the first amplification factor adjusting resistor R3; the first output current limiting resistor R2 limits the current of the signal at the output end of the first instrument amplifier D1, and finally the obtained signal at the D end is amplified by a preset multiple of the signal at the C end, so that the signal at the D end is more stably output to the MCU processing circuit.
Preferably, as shown in fig. 3, the thermocouple conditioning circuit includes an input positive terminal protection resistor R6, an input negative terminal protection resistor R9, a second amplification factor adjustment resistor R8, a second output current limiting resistor R7, and a second instrumentation amplifier D2;
the sampling input positive end of the second instrument amplifier D2 is used as a first input end of the thermocouple conditioning circuit, and is simultaneously connected with one end of the input positive end protection resistor R6 and the output positive end of the thermocouple temperature sensor; the other end of the input positive end protection resistor R6 is grounded;
the sampling input negative end of the second instrument amplifier D2 is used as a second input end of the thermocouple conditioning circuit, and one end of the input negative end protection resistor R9 and the output negative end of the thermocouple temperature sensor are connected at the same time; the other end of the input negative terminal protection resistor R9 is grounded;
a second amplification factor adjusting resistor R8 is connected between the gain setting positive end and the gain setting negative end of the second instrumentation amplifier D2;
the output end of the second instrumentation amplifier D2 is connected with one end of a second output current-limiting resistor R7, and the other end of the second output current-limiting resistor R7 is used as the output end of the thermocouple conditioning circuit.
Specifically, as shown in fig. 3, the positive terminal and the negative terminal of the signal of the thermocouple temperature sensor are connected to the E terminal and the F terminal of the thermocouple conditioning circuit, respectively. Preferably, the thermocouple temperature sensor collects the engine exhaust temperature by using an STTT-H series thermocouple temperature sensor, wherein the temperature range is 0-1000 ℃, the thermal electromotive force is 0mV at 0 ℃, and the thermal electromotive force is 41.269mV at 1000 ℃.
Specifically, as shown in fig. 3, the input positive-side protection resistor R6 and the input negative-side protection resistor R9 are matched with each other, and current limiting is performed on the sampling input positive side and the sampling input negative side of the second instrumentation amplifier D2; the resistance value of the second amplification factor adjusting resistor R8 is adjusted and changed, signals input by the E end and the F end are amplified by a set multiple by combining with the second instrumentation amplifier D2, and finally the output G end signal is limited by the second output current limiting resistor R7 and is finally output to the MCU processing circuit.
Preferably, as shown in fig. 1, the oil quantity acquisition device comprises an oil quantity sensor and a first signal conditioning circuit; the pressure acquisition device comprises a pressure sensor and a second signal conditioning circuit;
the acquisition end of the oil quantity sensor is arranged at the bottom of the fuel tank or the lubricating oil tank, and the output end of the oil quantity sensor is connected with the input end of the first signal conditioning circuit; the output end of the first signal conditioning circuit is connected with the MCU processing circuit;
the acquisition end of the pressure sensor is arranged at the side part of the oil tank, and the output end of the pressure sensor is connected with the input end of the second signal conditioning circuit; the output end of the second signal conditioning circuit is connected with the MCU processing circuit.
Specifically, the collection end of the oil quantity sensor is placed at the bottom of the fuel tank or the lubricating oil tank and used for detecting the residual quantity of the fuel oil or the lubricating oil, and the residual quantity signal is output to the MCU processing circuit through the first signal conditioning circuit.
Specifically, the collection end of the pressure sensor is arranged at the side part of the oil tank and used for detecting the pressure of the oil tank, and then the oil tank pressure signal is output to the MCU processing circuit through the second signal conditioning circuit.
Preferably, as shown in fig. 4 and fig. 5, the first signal conditioning circuit and the second signal conditioning circuit have the same structure and each include a first amplification ratio adjusting resistor, a second amplification ratio adjusting resistor and a second operational amplifier;
the non-inverting input end of the second operational amplifier is connected with one end of the first amplification proportion adjusting resistor; the other end of the first amplification proportion adjusting resistor is used as an input end of the first signal conditioning circuit or the second signal conditioning circuit and is connected with one end of the second amplification proportion adjusting resistor; the other end of the second amplification proportion adjusting resistor is grounded;
the output end of the second operational amplifier is used as the output end of the first signal conditioning circuit or the second signal conditioning circuit and is simultaneously connected with the inverting input end of the second operational amplifier.
Specifically, as shown in fig. 4, in the first signal conditioning circuit, the first amplification degree adjustment resistor is R10, the second amplification degree adjustment resistor is R11, and the second operational amplifier is D3. The signal of the oil quantity sensor is input to the H end, the signal input to the H end is amplified by combining the second operational amplifier D3 through adjusting the first amplification proportion adjusting resistor R10 and the second amplification proportion adjusting resistor R11, and then the signal of the I end is output to the MCU processing circuit through the second operational amplifier D3; and, the I-terminal signal is fed back to the inverting input terminal of the second operational amplifier D3. Preferably, the oil quantity sensor is 15-900 mm in measuring range and outputs 4-20 mA or 0-5V.
Specifically, as shown in fig. 5, in the second signal conditioning circuit, the first amplification degree adjustment resistor is R12, the second amplification degree adjustment resistor is R13, and the second operational amplifier is D4. The signal of the pressure sensor is input to the J end, the signal input to the J end is amplified by combining the second operational amplifier D4 through adjusting the first amplification proportion adjusting resistor R12 and the second amplification proportion adjusting resistor R13, and then the signal of the K end is output to the MCU processing circuit through the second operational amplifier D4; and, the K terminal signal is fed back to the inverting input terminal of the second operational amplifier D4. Preferably, the pressure sensor selects the measuring range of 0-10 bar and outputs 4 mA-20 mA.
Preferably, as shown in fig. 1, the rotation speed acquisition device comprises a rotation speed sensor and a rotation speed conditioning circuit;
the acquisition end of the rotation speed sensor is arranged at the position of the engine gear, the output end of the rotation speed conditioning circuit is connected with one end of the rotation speed conditioning circuit, and the other end of the rotation speed conditioning circuit is used as the output end of the rotation speed acquisition device and is connected with the MCU processing circuit.
Specifically, the acquisition end of the rotation speed sensor is arranged at the position of the engine gear and is used for acquiring the rotation speed signal of the engine, and then the rotation speed signal is input into the MCU processing circuit through the rotation speed conditioning circuit.
Preferably, as shown in fig. 6, the rotation speed conditioning circuit includes a first threshold adjustment resistor R14, a second threshold adjustment resistor R15, a third threshold adjustment resistor R16, a fourth threshold adjustment resistor R17, and a third operational amplifier D5;
the non-inverting input end of the third operational amplifier D5 is simultaneously connected with one end of the first threshold adjusting resistor R14 and one end of the second threshold adjusting resistor R15; the other end of the second threshold value adjusting resistor R15 is used as an input end of the rotating speed conditioning circuit;
an inverting input terminal of the third operational amplifier D5 is simultaneously connected to one end of the third threshold adjustment resistor R16 and one end of the fourth threshold adjustment resistor R17; the other end of the third threshold value adjusting resistor R16 is connected with a power supply; the other end of the fourth threshold adjusting resistor R17 is grounded;
the output end of the third operational amplifier D5 is used as the output end of the rotating speed conditioning circuit, and is simultaneously connected with the other end of the first threshold value adjusting resistor R14 and the MCU processing circuit.
Specifically, in fig. 6, an output signal of the rotation speed sensor is input to the rotation speed conditioning circuit through the L end, the resistance values of the first threshold adjusting resistor R14, the second threshold adjusting resistor R15, the third threshold adjusting resistor R16 and the fourth threshold adjusting resistor R17 are changed through adjustment, the comparison resistance threshold is further changed, and an M-end signal is obtained through the output end of the third operational amplifier D5 in combination with the third operational amplifier D5 and finally output to the MCU processing circuit.
Preferably, as shown in fig. 1 and 7, the data acquisition device includes a CAN communication circuit; the CAN communication circuit comprises a CAN transceiver chip D6, a CAN bus communication rate adjusting resistor R18 and a CAN bus matching resistor R19;
the TXD port and the RXD port of the CAN transceiver chip D6 are connected with the CAN_TX port and the CAN_RX port of the MCU processing circuit;
the RS port of the CAN transceiver chip D6 is grounded through a CAN bus communication rate adjusting resistor R18;
and a CAN bus matching resistor R19 is connected between a CANH port and a CANL port of the CAN transceiver chip D6, and simultaneously the CAN_H port and the CAN_L port of the upper computer are connected.
Specifically, as shown in fig. 1, the CAN communication circuit is connected to the upper computer and the MCU processing circuit, and is used for communicating with the upper computer for the MCU processing circuit.
Specifically, as shown in fig. 7, the MCU processing circuit is connected to the TXD port and the RXD port of the CAN transceiver chip D6 through the can_tx port and the can_rx port, and the CAN bus matching resistor R19 is connected between the CANH port and the CANL port of the CAN transceiver chip D6, and is simultaneously connected to the can_h port and the can_l port of the upper computer, so as to implement communication between the MCU processing circuit and the upper computer.
Specifically, the CAN communication circuit adjusts the resistance value of the CAN bus communication rate adjusting resistor R18 through adjustment, so that the data transmission rate of the upper computer and the MCU processing circuit is changed; the CAN bus matching resistor R19 is matched with the CAN bus.
Preferably, the MCU processing circuit adopts an STM32F103 chip or a GD32F103 chip.
Preferably, the CAN transceiver chip D6 adopts a MAX3507 model or a MAX3051 model.
Compared with the prior art, the data acquisition device for the engine provided by the embodiment is characterized in that the acquisition ends of the cylinder temperature acquisition device, the exhaust temperature acquisition device, the oil quantity acquisition device, the pressure acquisition device and the rotating speed acquisition device are placed at the acquisition points, the output end is connected with the MCU processing circuit, the acquired operation data of the engine are processed, and the operation data of the engine can be obtained stably.
It will be appreciated by those skilled in the art that the programs/software involved in the MCU processing circuits in the above embodiments are methods common in the art, and the present utility model does not involve any software improvements. The utility model only needs to connect the devices with corresponding functions through the connection relation provided by the embodiment of the utility model, and the utility model does not relate to any improvement of program software. The connection between the hardware devices with the respective functions is realized by those skilled in the art using the prior art, and will not be described in detail herein.
The present utility model is not limited to the above-mentioned embodiments, and any changes or substitutions that can be easily understood by those skilled in the art within the technical scope of the present utility model are intended to be included in the scope of the present utility model.
Claims (10)
1. The data acquisition device for the engine is characterized by comprising a cylinder temperature acquisition device, an exhaust temperature acquisition device, an oil quantity acquisition device, a pressure acquisition device, a rotating speed acquisition device and an MCU processing circuit;
the cylinder temperature acquisition device, the exhaust temperature acquisition device, the oil quantity acquisition device, the pressure acquisition device and the rotating speed acquisition device are all provided with corresponding redundant devices; the collecting end of the cylinder temperature collecting device is placed at the position of an engine cylinder, the collecting end of the exhaust temperature collecting device is placed at the position of an engine exhaust pipe, the collecting end of the oil quantity collecting device is placed at the bottom of the oil tank, and the collecting end of the pressure collecting device is placed at the side part of the oil tank; the acquisition end of the rotating speed acquisition device is arranged at the position of the engine gear;
the output ends of the cylinder temperature acquisition device, the exhaust temperature acquisition device, the oil quantity acquisition device, the pressure acquisition device and the rotating speed acquisition device are all connected with the MCU processing circuit, and the acquired data are transmitted to the MCU processing circuit.
2. The data acquisition device of claim 1, wherein the cylinder temperature acquisition device comprises a thermal resistance temperature sensor and a thermal resistance conditioning circuit; the acquisition end of the thermal resistance temperature sensor is arranged at the position of an engine cylinder, and the output end of the thermal resistance temperature sensor is connected with the input end of the thermal resistance conditioning circuit; the output end of the thermal resistance conditioning circuit is connected with the MCU processing circuit;
the exhaust temperature acquisition device comprises a thermocouple temperature sensor and a thermocouple conditioning circuit; the acquisition end of the thermocouple temperature sensor is arranged at the position of the engine exhaust pipe, and the output end of the thermocouple temperature sensor is connected with the input end of the thermocouple conditioning circuit; the output end of the thermocouple conditioning circuit is connected with the MCU processing circuit.
3. The data acquisition device of claim 2, wherein the thermal resistance conditioning circuit comprises a resistance conversion circuit and a signal amplification circuit;
the resistance conversion circuit comprises an adjustable amplification ratio resistor R5 and a first operational amplifier A1; the non-inverting input end of the first operational amplifier A1 is grounded;
the inverting input end of the first operational amplifier A1 is simultaneously connected with one end of the amplification proportion adjusting resistor R5 and the output end of the thermal resistance temperature sensor; the other end of the amplifying proportion adjusting resistor R5 is connected with a power supply;
the output end of the first operational amplifier A1 is connected with the input end of the signal amplifying circuit and the output end of the thermal resistance temperature sensor.
4. The data acquisition device of claim 3, wherein the signal amplification circuit comprises an input positive side current limiting resistor R1, an input negative side current limiting resistor R4, a first amplification factor adjusting resistor R3, a first output current limiting resistor R2, a first instrumentation amplifier D1, and a bidirectional diode V1;
the sampling input positive end of the first instrument amplifier D1 is simultaneously connected with one end of the input positive end current limiting resistor R1 and one end of the bidirectional diode V1; the other end of the input positive end current limiting resistor R1 is grounded;
the sampling input negative end of the first instrument amplifier D1 is simultaneously connected with one end of the input negative end current limiting resistor R4 and the other end of the bidirectional diode V1; the other end of the input negative end current limiting resistor R4 is used as the input end of the signal amplifying circuit;
a first amplification factor adjusting resistor R3 is connected between the gain setting positive end and the gain setting negative end of the first instrumentation amplifier D1;
the output end of the first instrumentation amplifier D1 is connected with one end of a first output current limiting resistor R2, and the other end of the first output current limiting resistor R2 is used as the output end of the signal amplifying circuit.
5. The data acquisition device of claim 2, wherein the thermocouple conditioning circuit comprises an input positive side protection resistor R6, an input negative side protection resistor R9, a second amplification factor adjustment resistor R8, a second output current limiting resistor R7, and a second instrumentation amplifier D2;
the sampling input positive end of the second instrument amplifier D2 is used as a first input end of the thermocouple conditioning circuit, and is simultaneously connected with one end of the input positive end protection resistor R6 and the output positive end of the thermocouple temperature sensor; the other end of the input positive end protection resistor R6 is grounded;
the sampling input negative end of the second instrument amplifier D2 is used as a second input end of the thermocouple conditioning circuit, and one end of the input negative end protection resistor R9 and the output negative end of the thermocouple temperature sensor are connected at the same time; the other end of the input negative terminal protection resistor R9 is grounded;
a second amplification factor adjusting resistor R8 is connected between the gain setting positive end and the gain setting negative end of the second instrumentation amplifier D2;
the output end of the second instrumentation amplifier D2 is connected with one end of a second output current-limiting resistor R7, and the other end of the second output current-limiting resistor R7 is used as the output end of the thermocouple conditioning circuit.
6. The data acquisition device of claim 1, wherein the oil amount acquisition device comprises an oil amount sensor and a first signal conditioning circuit; the pressure acquisition device comprises a pressure sensor and a second signal conditioning circuit;
the acquisition end of the oil quantity sensor is arranged at the bottom of the fuel tank or the lubricating oil tank, and the output end of the oil quantity sensor is connected with the input end of the first signal conditioning circuit; the output end of the first signal conditioning circuit is connected with the MCU processing circuit;
the acquisition end of the pressure sensor is arranged at the side part of the oil tank, and the output end of the pressure sensor is connected with the input end of the second signal conditioning circuit; the output end of the second signal conditioning circuit is connected with the MCU processing circuit.
7. The data acquisition device of claim 6, wherein the first signal conditioning circuit and the second signal conditioning circuit are identical in structure and each comprise a first amplification ratio adjustment resistor, a second amplification ratio adjustment resistor and a second operational amplifier;
the non-inverting input end of the second operational amplifier is connected with one end of the first amplification proportion adjusting resistor; the other end of the first amplification proportion adjusting resistor is used as an input end of the first signal conditioning circuit or the second signal conditioning circuit and is connected with one end of the second amplification proportion adjusting resistor; the other end of the second amplification proportion adjusting resistor is grounded;
the output end of the second operational amplifier is used as the output end of the first signal conditioning circuit or the second signal conditioning circuit and is simultaneously connected with the inverting input end of the second operational amplifier.
8. The data acquisition device of claim 1, wherein the rotational speed acquisition device comprises a rotational speed sensor and a rotational speed conditioning circuit;
the acquisition end of the rotation speed sensor is arranged at the position of the engine gear, the output end of the rotation speed conditioning circuit is connected with one end of the rotation speed conditioning circuit, and the other end of the rotation speed conditioning circuit is used as the output end of the rotation speed acquisition device and is connected with the MCU processing circuit.
9. The data acquisition device of claim 8, wherein the rotational speed conditioning circuit comprises a first threshold adjustment resistor R14, a second threshold adjustment resistor R15, a third threshold adjustment resistor R16, a fourth threshold adjustment resistor R17, and a third operational amplifier D5;
the non-inverting input end of the third operational amplifier D5 is simultaneously connected with one end of the first threshold adjusting resistor R14 and one end of the second threshold adjusting resistor R15; the other end of the second threshold value adjusting resistor R15 is used as an input end of the rotating speed conditioning circuit;
an inverting input terminal of the third operational amplifier D5 is simultaneously connected to one end of the third threshold adjustment resistor R16 and one end of the fourth threshold adjustment resistor R17; the other end of the third threshold value adjusting resistor R16 is connected with a power supply; the other end of the fourth threshold adjusting resistor R17 is grounded;
the output end of the third operational amplifier D5 is used as the output end of the rotating speed conditioning circuit, and is simultaneously connected with the other end of the first threshold value adjusting resistor R14 and the MCU processing circuit.
10. The data acquisition device of claim 1, wherein the data acquisition device comprises a CAN communication circuit; the CAN communication circuit comprises a CAN transceiver chip D6, a CAN bus communication rate adjusting resistor R18 and a CAN bus matching resistor R19;
the TXD port and the RXD port of the CAN transceiver chip D6 are connected with the CAN_TX port and the CAN_RX port of the MCU processing circuit;
the RS port of the CAN transceiver chip D6 is grounded through a CAN bus communication rate adjusting resistor R18;
and a CAN bus matching resistor R19 is connected between a CANH port and a CANL port of the CAN transceiver chip D6, and simultaneously the CAN_H port and the CAN_L port of the upper computer are connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322342999.5U CN220646076U (en) | 2023-08-30 | 2023-08-30 | Data acquisition device for engine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322342999.5U CN220646076U (en) | 2023-08-30 | 2023-08-30 | Data acquisition device for engine |
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| Publication Number | Publication Date |
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| CN220646076U true CN220646076U (en) | 2024-03-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322342999.5U Active CN220646076U (en) | 2023-08-30 | 2023-08-30 | Data acquisition device for engine |
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| CN (1) | CN220646076U (en) |
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2023
- 2023-08-30 CN CN202322342999.5U patent/CN220646076U/en active Active
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