CN220629589U

CN220629589U - Communication module

Info

Publication number: CN220629589U
Application number: CN202322404950.8U
Authority: CN
Inventors: 李晓伟; 朱思颖
Original assignee: Shenzhen Tongheng Weichuang Technology Co ltd
Current assignee: Shenzhen Tongheng Weichuang Technology Co ltd
Priority date: 2023-09-01
Filing date: 2023-09-01
Publication date: 2024-03-19
Anticipated expiration: 2033-09-01

Abstract

The utility model discloses a communication module, which comprises a baseband chip, a memory chip, a radio frequency component and an interface component, wherein the baseband chip is respectively and electrically connected with the memory chip, the radio frequency component and the interface component, the interface component comprises an SP I interface, an SD I interface and an US I M interface, the SP I interface is connected with an LCD display screen, the SD I interface is connected with a WI F I module, the US I M interface is connected with an US I M card slot, and when the communication module is applied to a monitoring camera product, the LTE communication and WI-Fi signal hot spot expansion of the electronic product are realized through the SD I interface and the US I M interface.

Description

Communication module

Technical Field

The utility model belongs to the technical field of communication, and particularly relates to a communication module.

Background

The term "communication module" is often mentioned in the concept of the internet of things, and the communication module includes a DDA communication module, a Wi-Fi module, an LTE module, an NB-I oT module, a LoRa module, and the like.

The LTE module is a product which is characterized in that hardware is loaded to a specified frequency band, software supports a standard LTE protocol, high-integration of the software and the hardware is modularized, and the Wi-Fi module is an embedded module which converts a serial port or TTL level into a signal conforming to a Wi-Fi wireless network communication standard.

Most of the existing electronic products of monitoring cameras in the market use LTE modules, and when the functions of 3G/4G are carried out, signal hot spot expansion of the functions of Wi F i cannot be achieved.

Therefore, it is necessary to develop a communication module in which the Wi-F i module and the LTE module coexist.

Disclosure of Invention

In order to solve the problems, the utility model provides a communication module in which a Wi-Fi module and an LTE module coexist.

The technical scheme of the utility model is as follows:

the utility model discloses a communication module, which comprises a baseband chip, a memory chip, a radio frequency component and an interface component, wherein the baseband chip is respectively and electrically connected with the memory chip, the radio frequency component and the interface component, the interface component comprises an SPI interface, and the SPI interface is connected with an LCD display screen; and/or the interface component comprises an SD I interface, and the SD I interface is connected with the WI F I module; and/or the interface component comprises a USIM interface, and the USIM interface is connected with a USIM card slot.

Further, the model of the baseband chip is ZX297520V3T.

Further, the type of the memory chip is LPDDR2.

Further, the radio frequency component comprises a radio frequency transceiver, a power amplifier and a duplexer, and the radio frequency transceiver is respectively connected with the power amplifier and the duplexer.

Further, the power management module comprises a power management chip, the model of the power management chip is ZX234296, and the power management chip is respectively connected with the baseband chip, the memory chip, the radio frequency module and the interface module.

Further, the wireless communication device further comprises an RMII interface, a UART interface, a KB interface and an I2S interface, wherein the RMII interface, the UART interface, the KB interface and the I2S interface are respectively and electrically connected with the baseband chip, the RMII interface is connected with the network port PHY chip, the UART interface is used for asynchronous serial communication, the KB interface is used for connecting with a keyboard, and the I2S interface is used for connecting with audio.

The utility model has the advantages that,

the interface component of the communication module comprises an SD I interface and a USIM interface, the SD I interface is connected with the WI F I module, the USIM interface is connected with the USIM card slot, and when the communication module is applied to the monitoring camera, the LTE communication of the monitoring camera is realized through the SD I interface and the USIM interface, and the active WI-F I signal hot spot expansion can be realized.

Drawings

FIG. 1 is a schematic diagram of a circuit frame of a communication module according to the present utility model;

fig. 2 is a schematic circuit diagram of a communication module according to the present utility model;

reference numerals: 1. baseband chip, 2, memory chip, 3, radio frequency component, 31, radio frequency transceiver, 32, power amplifier, 33, diplexer, 4, interface component, 41, SPI interface, 42, SD I interface, 43, USIM interface, 5, power management component, 51, power management chip, 6, RMII interface, 7, UART interface, 8, KB interface, 9, I2S interface.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the utility model is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.

Referring to fig. 1 and 2, the present utility model provides a baseband chip 1, a memory chip 2, a radio frequency component 3 and an interface component 4, wherein the baseband chip 4 is electrically connected with the memory chip 2, the radio frequency component 3 and the interface component 4, the interface component 4 comprises an SPI interface 41, an SD I interface 42 and a USIM interface 43, the SPI interface 41 is connected with an LCD display screen, the SD I interface 42 is connected with a WI F I module, and the USIM interface 43 is connected with a USIM card slot.

Further, the baseband chip 1 is of the model ZX297520V3T, as shown in fig. 1, and the ZX297520V3T chip includes the following processors: 2 CORTEX-A53 (application processor and protocol stack processor), 1 DSP (physical layer processor), 1M 0 processor, support the maximum downlink rate 150Mbps and the maximum uplink rate 50Mbps, realize the seamless switching between 3G network and 4G network.

Further, the model of the memory chip 2 is LPDDR2, which is used for storing temporary data in the running process of the user program.

Further, the radio frequency assembly 3 includes a radio frequency transceiver 31, a power amplifier 32 and a duplexer 33, and the radio frequency transceiver 31 is connected to the power amplifier 31 and the duplexer 33, respectively. The radio frequency module 3 is used for receiving radio frequency signals sent by the baseband chip 1 and transmitting the radio frequency signals outwards; the radio frequency module 3 is also configured to send the received radio frequency signal to the baseband chip 1. The rf transceiver 31 is mainly used for transmitting and receiving rf signals, the power amplifier 32 is mainly used for amplifying the transmitted or received signals, and the duplexer 33 is mainly used for isolating the transmitted and received signals and ensuring that both the transmission and the reception can work normally at the same time.

Further, the power management module 5 is further included, the power management module 5 includes a power management chip 51, the model of the power management chip 51 is ZX234296, and the power management chip 51 is connected to the baseband chip 1, the memory chip 2, the radio frequency module 3 and the interface module 4 respectively.

Further, the wireless communication device further comprises an RMII interface 6, a UART interface 7, a KB interface 8 and an I2S interface 9, wherein the RMII interface 6, the UART interface 7, the KB interface 8 and the I2S interface 9 are respectively and electrically connected with the baseband chip 1, the RMII interface 6 is connected with a network port PHY chip, the UART interface 7 is used for asynchronous serial communication, the KB interface 8 is used for connecting a keyboard, and the I2S interface 0 is used for connecting audio.

Example 1

When the communication module is applied to outdoor camera equipment, the CAM_SPI interface of the communication module is connected with a camera, the SD I interface 42 is connected with the WI F I module, the RMII interface 6 is connected with the network port PHY chip, and the SPI interface and the USIM interface are not required to be connected as an LCD display screen and a SIM card are not used;

after the SD I interface 42 is connected with the WI F I module and the RMII interface 6 is connected with the network port PHY chip, the outdoor camera can expand the WI F I hot spot for other mobile equipment, the signal coverage range is enlarged, and the maintenance work of the outdoor camera is also facilitated.

Example 2

When the communication module is applied to a tablet personal computer, an SPI interface 41 of the communication module is connected with an LCD display screen, an SD I interface 42 is connected with a WI F I module, a USIM interface 43 is connected with a USIM card slot, and an I2S interface 9 is used for connecting audio;

the SD I interface and the USIM interface are used for actively carrying out LTE communication and active Wi-Fi communication on the electronic product, and the function of Wi f I hot spot expansion can be carried out while signals of LTE communication are provided.

According to the two embodiments, the communication module is provided with the plurality of interface components, so that when the communication module is applied to different scenes, the corresponding interfaces are connected according to requirements, and the LTE communication and wi f i hot spot expansion of the electronic product are realized.

The foregoing examples illustrate only a few embodiments of the utility model and are described in detail herein without thereby limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims

1. The communication module is characterized by comprising a baseband chip (1), a memory chip (2), a radio frequency component (3) and an interface component (4);

the baseband chip (1) is electrically connected with the memory chip (2), the radio frequency component (3) and the interface component (4) respectively;

the interface component (4) comprises an SDI interface (42), and the SDI interface (42) is connected with the WIFI module;

and/or the interface component (4) comprises a USIM interface (43), and the USIM interface (43) is connected with a USIM card slot.

2. The communication module according to claim 1, characterized in that the baseband chip (1) is of the type ZX297520V3T.

3. The communication module according to claim 2, characterized in that the memory chip (2) is of the type LPDDR2.

4. The communication module according to claim 1, characterized in that and/or the interface assembly (4) comprises an SPI interface (41), the SPI interface (41) being connected to an LCD display screen.

5. The communication module according to claim 1, characterized in that the radio frequency assembly (3) comprises a radio frequency transceiver (31), a power amplifier (32) and a diplexer (33), the radio frequency transceiver (31) being connected to the power amplifier (32) and the diplexer (33), respectively.

6. The communication module according to claim 5, further comprising a power management component (5), the power management component (5) comprising a power management chip (51), the power management chip (51) being of model ZX234296, the power management chip (51) being connected to the baseband chip (1), the memory chip (2), the radio frequency component (3) and the interface component (4), respectively.

7. The communication module according to claim 6, further comprising a RMII interface (6), a UART interface (7), a KB interface (8) and an I2S interface (9), wherein the RMII interface (6), the UART interface (7), the KB interface (8) and the I2S interface (9) are electrically connected to the baseband chip (1), respectively, the RMII interface (6) is connected to the network port PHY chip, the UART interface (7) is used for asynchronous serial communication, the KB interface (8) is used for connecting to a keyboard, and the I2S interface (9) is used for connecting to audio.