CN220627614U - Chip adsorption and collection device of cutting mechanism of multilayer ceramic capacitor laminating machine - Google Patents
Chip adsorption and collection device of cutting mechanism of multilayer ceramic capacitor laminating machine Download PDFInfo
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- CN220627614U CN220627614U CN202322010354.1U CN202322010354U CN220627614U CN 220627614 U CN220627614 U CN 220627614U CN 202322010354 U CN202322010354 U CN 202322010354U CN 220627614 U CN220627614 U CN 220627614U
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- cutting mechanism
- suction nozzle
- suction
- adsorption
- multilayer ceramic
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- 230000007246 mechanism Effects 0.000 title claims abstract description 57
- 238000001179 sorption measurement Methods 0.000 title claims abstract description 56
- 238000005520 cutting process Methods 0.000 title claims abstract description 54
- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 21
- 238000010030 laminating Methods 0.000 title claims abstract description 15
- 239000000758 substrate Substances 0.000 claims description 3
- 230000008901 benefit Effects 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 10
- 238000003475 lamination Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000012545 processing Methods 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The utility model discloses a scrap adsorption and collection device of a cutting mechanism of a multilayer ceramic capacitor laminating machine, which comprises a cutting mechanism, a suction nozzle and an adsorption pipeline, wherein the suction nozzle is arranged on the suction pipeline; the suction nozzle is rotatably arranged on the shell of the cutting mechanism, one end of the suction pipeline is connected with the vacuum pump of the laminating machine, and the other end of the suction pipeline is connected with the debris sucking port of the suction nozzle; the chip suction inlet of the suction nozzle faces one side of the hob of the cutting mechanism; one end of the adsorption pipeline, which is close to the vacuum pump of the laminator, is connected with a scrap collector; the suction nozzle is internally provided with a non-return air duct for preventing the chips from flowing backwards. The utility model can absorb and collect film scraps in real time, thereby reducing the probability of poor electrical characteristics of the wafer caused by mixing the film scraps, and has the advantages of simple structure, convenient operation and strong universality.
Description
Technical Field
The utility model relates to the technical field of processing of multilayer ceramic capacitor products, in particular to a scrap adsorption and collection device of a cutting mechanism of a multilayer ceramic capacitor laminating machine.
Background
Currently, when a multilayer ceramic capacitor (MLCC) is processed, a sample laminator is generally required to cut a thin film, and the laminator is provided with a conveying mechanism, a cutting mechanism and a thin film adsorption mechanism, wherein the cutting mechanism and the thin film adsorption mechanism are adjacently arranged and are all arranged on the conveying mechanism. When the film feeding device works, the film is placed on the conveying mechanism, cut into a plurality of film blocks under the action of the cutting mechanism and then adsorbed on the film adsorption mechanism. However, the punching and cutting mode of the lamination equipment is a hob cutting mode, and the sliding friction type stripping and conveying mode and undershoot airflow generated by a cleaning unit above the equipment can cause scattering of film scraps generated during cutting, so that the risk that scraps are mixed into lamination blocks is increased, and the probability of poor electrical characteristics of wafers is greatly increased.
Disclosure of Invention
The utility model aims to provide a chip adsorption and collection device of a cutting mechanism of a multilayer ceramic capacitor lamination machine, which has the advantages of simple structure, convenient operation and strong universality, and can adsorb and collect film chips in real time, thereby reducing the probability of poor electrical characteristics of wafers caused by mixing of the film chips.
In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:
the chip adsorption and collection device of the cutting mechanism of the multilayer ceramic capacitor laminating machine comprises the cutting mechanism, a suction nozzle and an adsorption pipeline; the suction nozzle is rotatably arranged on the shell of the cutting mechanism, one end of the suction pipeline is connected with a vacuum pump of the laminating machine, and the other end of the suction pipeline is connected with a debris sucking port of the suction nozzle; the chip suction inlet of the suction nozzle faces one side of the hob of the cutting mechanism; one end of the adsorption pipeline, which is close to the vacuum pump of the laminator, is connected with a scrap collector;
be equipped with the non-return air flue that is used for preventing the piece refluence in the suction nozzle, the inside of suction nozzle is followed the piece is inhaled the export extremely the piece is inhaled the mouth interval arrangement has a plurality of baffle groups, baffle group is including being "eight" first baffle and the second baffle that the word was arranged, first baffle with form between the second baffle the main wind channel in non-return wind flue, main wind channel the piece is inhaled the mouth with the piece is inhaled the export and is all located same axis.
As a preferable scheme of the utility model, the suction nozzle comprises a buffer cavity and an adsorption channel which are communicated with each other, wherein the volume of the buffer cavity is larger than that of the adsorption channel; the front end of the adsorption channel is the debris suction inlet, and the debris suction outlet is arranged on the end face of the rear end of the buffer cavity; the baffle group is arranged in the buffer cavity.
As a preferable scheme of the utility model, a secondary air channel of the non-return air channel is formed between two adjacent first baffle plates and two adjacent second baffle plates.
In a preferred embodiment of the present utility model, the first baffle plate and the second baffle plate are spaced apart from an inner wall surface of the buffer chamber.
As a preferred embodiment of the present utility model, the outer side surface of the suction nozzle is mounted on the housing of the cutting mechanism through an angle adjusting assembly.
As a preferable scheme of the utility model, the angle adjusting component comprises a mounting plate, screws and threaded holes, wherein the mounting plate is fixedly arranged on the outer side surface of the suction nozzle, the mounting plate is rotationally connected with the shell of the cutting mechanism, and the mounting plate is provided with arc adjusting holes which extend along the rotation track of the mounting plate; the shell of the cutting mechanism is provided with a threaded hole, the threaded hole is opposite to the circular arc adjusting hole, and the screw penetrates through the circular arc adjusting hole to be in threaded connection with the threaded hole and tightly presses the mounting plate on the shell of the cutting mechanism.
As a preferable mode of the utility model, a throttle valve is arranged between the adsorption pipeline and the suction nozzle.
As a preferred embodiment of the present utility model, the debris collector is a visible bin filter.
As a preferable scheme of the utility model, a drag chain is sleeved outside the adsorption pipeline, and the drag chain is placed on a fixed substrate of the laminator.
Compared with the prior art, the chip adsorption and collection device for the cutting mechanism of the multilayer ceramic capacitor laminating machine has the beneficial effects that:
when the utility model works, as the suction nozzle is rotatably arranged on the shell of the cutting mechanism, the suction nozzle moves along with the movement of the hob in the cutting mechanism, namely, the suction nozzle can realize the real-time adsorption of scattered film scraps on the premise of not influencing the original processing action and collect the scraps into the scraps collector through the adsorption pipeline, thereby reducing the risk of scraps mixing into laminated bars and further greatly reducing the probability of poor electrical characteristics of wafers; meanwhile, the adsorption coverage area can be increased and the adsorption effect can be improved by adjusting the adsorption angle of the suction nozzle, so that the suction nozzle is applicable to laminating machines with different specifications, and has strong universality; secondly, the suction nozzle is directly connected with a vacuum pump of the laminating machine through the adsorption pipeline, so that no other power adsorption equipment is needed to be connected, and the structure is simple and the operation is convenient; in addition, through setting up the contrary wind channel that ends in the inside of suction nozzle, when adsorbing the piece, because the main wind channel is close to one side opening that the piece was inhaled the mouth is greater than being close to one side opening that the piece was inhaled the mouth, so can prevent effectively that the piece flows backwards, the adsorption efficiency is better.
Drawings
In order to more clearly illustrate the technical solution of the embodiments of the present utility model, the drawings of the embodiments will be briefly described below.
FIG. 1 is a schematic view of a chip adsorbing and collecting device of a cutting mechanism of a multilayer ceramic capacitor laminator according to an embodiment of the utility model;
fig. 2 is a schematic view of the internal structure of the suction nozzle.
The marks in the figure:
1. a cutting mechanism; 11. a hob; 2. a suction nozzle; 21. a debris suction outlet; 22. a debris suction inlet; 23. a buffer chamber; 24. an adsorption channel; 3. an adsorption pipeline; 4. a debris collector; 5. a baffle group; 51. a first baffle; 52. a second baffle; 6. a non-return air duct; 61. a main air duct; 62. an auxiliary air duct; 7. an angle adjustment assembly; 71. a mounting plate; 711. arc adjusting holes; 72. a screw; 73. a threaded hole; 8. a throttle valve; 9. a drag chain.
Detailed Description
The following describes in further detail the embodiments of the present utility model with reference to the drawings and examples. The following examples are illustrative of the utility model and are not intended to limit the scope of the utility model.
In the description of the present utility model, it should be understood that the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. It should be understood that the terms "first," "second," and the like are used herein to describe various information, but such information should not be limited to these terms, which are used merely to distinguish one type of information from another. For example, a "first" message may also be referred to as a "second" message, and similarly, a "second" message may also be referred to as a "first" message, without departing from the scope of the utility model.
As shown in fig. 1 to 2, the preferred embodiment of the present utility model provides a chip adsorbing and collecting device of a cutting mechanism of a multilayer ceramic capacitor lamination machine, which comprises a cutting mechanism 1, a suction nozzle 2 and an adsorbing pipeline 3; the suction nozzle 2 is rotatably arranged on the shell of the cutting mechanism 1, one end of the suction pipeline 3 is connected with a vacuum pump of the laminator, and the other end of the suction pipeline 3 is connected with a debris suction outlet 21 of the suction nozzle 2; the chip suction inlet 22 of the suction nozzle 2 faces to the hob 11 side of the cutting mechanism 1; one end of the adsorption pipeline 3, which is close to a vacuum pump of the laminator, is connected with a scrap collector 4.
The suction nozzle 2 is internally provided with a non-return air duct 6 for preventing chips from flowing backwards, a plurality of baffle groups 5 are arranged in the suction nozzle 2 at intervals from the chips suction outlet 21 to the chips suction inlet 22, each baffle group 5 comprises a first baffle 51 and a second baffle 52 which are arranged in an eight shape, a main air duct 61 of the non-return air duct 6 is formed between the first baffle 51 and the second baffle 52, and the main air duct 61, the chips suction inlet 22 and the chips suction outlet 21 are all positioned on the same axis.
According to the chip adsorption and collection device of the cutting mechanism of the multilayer ceramic capacitor lamination machine, when the chip adsorption and collection device is in operation, as the suction nozzle 2 is rotatably arranged on the shell of the cutting mechanism 1, the suction nozzle 2 moves along with the movement of the hob 11 in the cutting mechanism 1, namely, the suction nozzle 2 can realize the real-time adsorption of scattered film chips on the premise of not influencing the original processing action and collect the scattered film chips into the chip collector 4 through the adsorption pipeline 3, so that the risk that the chips are mixed into lamination blocks is reduced, and the probability of poor electrical characteristics of wafers is greatly reduced; meanwhile, the adsorption coverage area can be increased and the adsorption effect can be improved by adjusting the adsorption angle of the suction nozzle 2, so that the suction nozzle is applicable to laminating machines with different specifications, and the universality is high; secondly, the suction nozzle 2 is directly connected with a vacuum pump of the laminating machine through the adsorption pipeline 3, so that no other power adsorption equipment is needed to be connected, and the structure is simple and the operation is convenient; in addition, by providing the non-return air duct 6 inside the suction nozzle 2, when the chips are sucked, since the opening of the main air duct 61 on the side close to the chip suction port 22 is larger than the opening on the side close to the chip suction port 21, the backflow of the chips can be effectively prevented, and the suction effect is better.
Illustratively, the suction nozzle 2 includes a buffer chamber 23 and an adsorption channel 24 that are communicated with each other, and the volume of the buffer chamber 23 is larger than the volume of the adsorption channel 24; the front end of the adsorption channel 24 is the debris suction inlet 22, and the debris suction outlet 21 is arranged on the rear end face of the buffer cavity 23; the baffle group 5 is disposed in the buffer chamber 23. Due to the design, the volume of the buffer cavity 23 is larger than that of the adsorption channel 24, so that the suction force of the adsorption channel 24 is more concentrated, and when the chips enter the buffer cavity 23 from the adsorption channel 24, the buffer effect can be achieved on the chips, and the chips are prevented from blocking the adsorption pipeline 3.
Illustratively, to further improve the adsorption efficiency of the debris, the auxiliary air duct 62 of the non-return air duct 6 is formed between two adjacent first baffles 51 and between two adjacent second baffles 52; the first baffle plate 51 and the second baffle plate 52 are spaced apart from the inner wall surface of the buffer chamber 23.
Illustratively, the outside surface of the suction nozzle 2 is mounted on the housing of the cutting mechanism 1 by an angle adjustment assembly 7. Specifically, the angle adjusting assembly 7 includes a mounting plate 71, a screw 72 and a threaded hole 73, the mounting plate 71 is fixedly arranged on the outer side surface of the suction nozzle 2, the mounting plate 71 is rotationally connected with the housing of the cutting mechanism 1, and the mounting plate 71 is provided with a circular arc adjusting hole 711 extending along the rotation track of the mounting plate 71; the shell of the cutting mechanism 1 is provided with a threaded hole 73, the threaded hole 73 is opposite to the circular arc adjusting hole 711, and the screw 72 passes through the circular arc adjusting hole 711 to be in threaded connection with the threaded hole 73 and tightly presses the mounting plate 71 on the shell of the cutting mechanism 1. Thus, by providing the angle adjusting unit 7, the coverage area of the suction nozzle 2 can be made larger, and the adjustability can be enhanced accordingly, so that the suction effect can be improved. In addition, the adjusting mode has the advantage of convenient operation.
The throttle valve 8 is arranged between the adsorption pipeline 3 and the suction nozzle 2, so that the air suction quantity can be flexibly adjusted, different processing situations can be met, and the universality is high.
Illustratively, the debris collector 4 is preferably a visual cartridge filter, which can facilitate a technician to observe the state of collection of debris within the filter to determine the degree of degradation of the cut condition, and can facilitate corresponding process adjustments.
Illustratively, the outer side of the adsorption pipeline 3 is sleeved with a drag chain 9, and the drag chain 9 is placed on a fixed substrate of the laminator, and the drag chain 9 has better wear resistance and toughness, so that the adsorption pipeline 3 can be effectively protected, and the service life of the device is prolonged.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "connected," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
The foregoing is merely a preferred embodiment of the present utility model, and it should be noted that modifications and substitutions can be made by those skilled in the art without departing from the technical principles of the present utility model, and these modifications and substitutions should also be considered as being within the scope of the present utility model.
Claims (9)
1. The chip adsorption and collection device of the cutting mechanism of the multilayer ceramic capacitor laminating machine is characterized by comprising the cutting mechanism, a suction nozzle and an adsorption pipeline; the suction nozzle is rotatably arranged on the shell of the cutting mechanism, one end of the suction pipeline is connected with a vacuum pump of the laminating machine, and the other end of the suction pipeline is connected with a debris sucking port of the suction nozzle; the chip suction inlet of the suction nozzle faces one side of the hob of the cutting mechanism; one end of the adsorption pipeline, which is close to the vacuum pump of the laminator, is connected with a scrap collector;
be equipped with the non-return air flue that is used for preventing the piece refluence in the suction nozzle, the inside of suction nozzle is followed the piece is inhaled the export extremely the piece is inhaled the mouth interval arrangement has a plurality of baffle groups, baffle group is including being "eight" first baffle and the second baffle that the word was arranged, first baffle with form between the second baffle the main wind channel in non-return wind flue, main wind channel the piece is inhaled the mouth with the piece is inhaled the export and is all located same axis.
2. The scrap adsorbing and collecting device of a cutting mechanism of a multilayer ceramic capacitor laminator according to claim 1, wherein the suction nozzle includes a buffer chamber and an adsorption channel which are communicated with each other, and the volume of the buffer chamber is larger than the volume of the adsorption channel; the front end of the adsorption channel is the debris suction inlet, and the debris suction outlet is arranged on the end face of the rear end of the buffer cavity; the baffle group is arranged in the buffer cavity.
3. The scrap adsorbing and collecting device of a cutting mechanism of a multilayer ceramic capacitor laminator according to claim 2, wherein a secondary air duct of the non-return air duct is formed between two adjacent first baffles and between two adjacent second baffles.
4. The scrap adsorbing and collecting device of a cutting mechanism of a multilayer ceramic capacitor laminator according to claim 3, wherein the first baffle and the second baffle are spaced apart from an inner wall surface of the buffer chamber.
5. The scrap adsorbing and collecting device of a cutting mechanism of a multilayer ceramic capacitor laminator according to claim 1, wherein an outer side surface of the suction nozzle is mounted on a housing of the cutting mechanism by an angle adjusting assembly.
6. The scrap adsorbing and collecting device of the cutting mechanism of the multilayer ceramic capacitor laminating machine according to claim 5, wherein the angle adjusting assembly comprises a mounting plate, screws and threaded holes, the mounting plate is fixedly arranged on the outer side surface of the suction nozzle, the mounting plate is rotationally connected with a shell of the cutting mechanism, and the mounting plate is provided with arc adjusting holes which extend along the rotation track of the mounting plate; the shell of the cutting mechanism is provided with a threaded hole, the threaded hole is opposite to the circular arc adjusting hole, and the screw penetrates through the circular arc adjusting hole to be in threaded connection with the threaded hole and tightly presses the mounting plate on the shell of the cutting mechanism.
7. The scrap adsorbing and collecting device of a cutting mechanism of a multilayer ceramic capacitor laminator according to claim 1, wherein a throttle valve is provided between the adsorbing duct and the suction nozzle.
8. The scrap suction collection device of a multilayer ceramic capacitor laminator cutting mechanism of claim 1, wherein the scrap collector is a visible bin filter.
9. The scrap adsorbing and collecting device of a cutting mechanism of a multilayer ceramic capacitor laminator according to claim 1, wherein a drag chain is sleeved outside the adsorbing pipe, and the drag chain is placed on a fixed substrate of the laminator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322010354.1U CN220627614U (en) | 2023-07-28 | 2023-07-28 | Chip adsorption and collection device of cutting mechanism of multilayer ceramic capacitor laminating machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322010354.1U CN220627614U (en) | 2023-07-28 | 2023-07-28 | Chip adsorption and collection device of cutting mechanism of multilayer ceramic capacitor laminating machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220627614U true CN220627614U (en) | 2024-03-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322010354.1U Active CN220627614U (en) | 2023-07-28 | 2023-07-28 | Chip adsorption and collection device of cutting mechanism of multilayer ceramic capacitor laminating machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220627614U (en) |
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2023
- 2023-07-28 CN CN202322010354.1U patent/CN220627614U/en active Active
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