CN220626989U - Integrated circuit embedded computer motherboard - Google Patents

Integrated circuit embedded computer motherboard Download PDF

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Publication number
CN220626989U
CN220626989U CN202322440755.0U CN202322440755U CN220626989U CN 220626989 U CN220626989 U CN 220626989U CN 202322440755 U CN202322440755 U CN 202322440755U CN 220626989 U CN220626989 U CN 220626989U
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CN
China
Prior art keywords
heat dissipation
embedded computer
mounting block
integrated circuit
computer motherboard
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Active
Application number
CN202322440755.0U
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Chinese (zh)
Inventor
叶建平
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Shenzhen United Shengxin Technology Co ltd
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Shenzhen United Shengxin Technology Co ltd
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Priority to CN202322440755.0U priority Critical patent/CN220626989U/en
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model discloses an integrated circuit embedded computer mainboard, which relates to the technical field of computer mainboards, and aims at solving the problems that the existing integrated circuit embedded computer mainboard is time-consuming and labor-consuming to assemble and disassemble for many times, the assembly is unstable, and the computer mainboard generates a large amount of heat during operation, so that the operation of a computer is not smooth enough. The utility model has novel structure, the spring buckle is arranged above the T-shaped groove, the clamping hand is connected below the mounting block, the sliding mounting block enters the T-shaped groove, and the heat generated by the main board component can be discharged through the heat dissipation net by the operation of the fan.

Description

Integrated circuit embedded computer motherboard
Technical Field
The present utility model relates to the field of computer boards, and more particularly, to an integrated circuit embedded computer board.
Background
The prior Chinese patent published application number CN212623832U, named as a tablet computer main board convenient to install, clearly records that 'the main board is inconvenient to align, a plurality of welding points are arranged on the back surface of the main board, the problem that the welding points are possibly worn in the process of aligning and rubbing a chassis for a long time', and solves the problem by the technical means of the patent; and the computer main board can generate a large amount of heat during operation, and if heat cannot be removed in time, the operation of the computer is not smooth enough.
Disclosure of Invention
The utility model provides an integrated circuit embedded computer motherboard, which solves the existing problems.
In order to achieve the above purpose, the present utility model adopts the following technical scheme: the utility model provides an integrated circuit embedded computer mainboard, includes the quick-witted case, just one side of machine case is connected with cooling mechanism, cooling mechanism is rotatable blast structure for cool down to machine incasement portion, just cooling mechanism includes the heat dissipation net, the heat dissipation net sets up in quick-witted case both sides, just the heat dissipation net is used for discharging the inside heat of machine case, the internal connection of machine case has fixed establishment, the inside mainboard subassembly that is provided with of fixed establishment, just fixed establishment is screw thread rotation clamping structure.
Preferably, the heat dissipation mechanism comprises heat dissipation nets, the heat dissipation nets are connected to two sides of the case, and a dust screen is arranged in one heat dissipation net.
Preferably, the heat dissipation mechanism comprises connecting frames, the connecting frames are symmetrically arranged at the upper end and the lower end of one side of the case, the connecting frames are of bending structures, and a shell is connected between the two connecting frames.
Preferably, the shell is provided with an empty slot, the upper and lower symmetry of the empty slot is provided with a square frame, four sides of the square frame are provided with supports, the two sides of the square frame are provided with guard rails, a plurality of transverse slots are uniformly formed in the guard rails, and the supports are internally connected with fans.
Preferably, the fixing mechanism comprises a connecting block, the connecting block is connected to the inner side of the chassis, a T-shaped groove is formed in one side of the connecting block in the inward direction, a mounting block is arranged in the T-shaped groove, and the mounting block can move in the connecting block.
Preferably, the T-shaped groove is internally provided with a spring buckle, the spring buckle is used for propping against the mounting block, two ends of the mounting block are provided with baffle plates for further clamping and fixing, the mounting block is provided with a hollow groove towards, the hollow groove is internally provided with clamping hands, the clamping hands are symmetrically provided with two, and the upper end of the clamping hands is provided with a rotating shaft.
Preferably, empty slots are formed in two sides of the clamping hand, a rotating rod is arranged in the empty slots, threads are arranged at one end of the rotating rod, a connecting sleeve is arranged outside the other end of the rotating rod, the empty slots are formed in the rotating rod and one end of the connecting sleeve jointly, connecting sleeves are arranged in the empty slots, and one end of the roller rod is connected with a nut.
The beneficial effects of the utility model are as follows: the device is characterized in that a T-shaped groove is formed in the connecting block, a mounting block is matched in the T-shaped groove, a spring buckle is arranged above the T-shaped groove, a clamping hand is connected below the mounting block, the main board assembly can be clamped by the clamping hand through a matched rotating rod, the sliding mounting block enters the T-shaped groove, the mounting is convenient, and the situation that a fixing port is enlarged can not be caused by repeated disassembly; two sides of the case are provided with radiating nets, two fans are fixedly arranged on one side of the case, and heat generated by the main board assembly can be discharged through the radiating nets by the operation of the fans, so that the radiating effect of the main board device body of the computer is better, and the operating efficiency of the computer is improved.
Drawings
Fig. 1 is a schematic structural view of the present utility model.
Fig. 2 is a schematic diagram of the internal structure of the present utility model.
Fig. 3 is a schematic diagram illustrating the structural disassembly of the present utility model.
Fig. 4 is a schematic view of a heat dissipation mechanism according to the present utility model.
Fig. 5 is a schematic view of the fixing mechanism of the present utility model.
Reference numerals in the drawings: 1. a chassis; 2. a heat dissipation mechanism; 201. a heat dissipation net; 202. a dust screen; 203. a connecting frame; 204. a housing; 205. a loop-shaped frame; 206. a bracket; 207. a guard rail; 208. a fan; 3. a fixing mechanism; 301. a connecting block; 302. a T-shaped groove; 303. a mounting block; 304. a spring buckle; 305. a baffle; 306. a clamping hand; 307. a rotating shaft; 308. a rotating rod; 309. connecting sleeves; 310. a roller bar; 311. a nut; 4. and a motherboard assembly.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Referring to fig. 1-5, an integrated circuit embedded computer motherboard comprises a chassis 1, wherein one side of the chassis 1 is connected with a heat dissipation mechanism 2, the heat dissipation mechanism 2 is of a rotatable air blast structure and is used for cooling the interior of the chassis 1, the heat dissipation mechanism 2 comprises heat dissipation nets 201, the heat dissipation nets 201 are arranged on two sides of the chassis 1, the heat dissipation nets 201 are used for discharging heat in the chassis 1, a fixing mechanism 3 is connected with the interior of the chassis 1, a motherboard component 4 is arranged in the fixing mechanism 3, and the fixing mechanism 3 is of a threaded rotary clamping structure.
Referring to fig. 3 and 4, the heat dissipation mechanism 2 includes a heat dissipation net 201, the heat dissipation net 201 is connected to two sides of the chassis 1, a dust screen 202 is disposed in one heat dissipation net 201, the heat dissipation mechanism 2 includes a connecting frame 203, the connecting frame 203 is symmetrically disposed at two ends of one side of the chassis 1, the connecting frame 203 is of a bent structure, a shell 204 is connected between the two connecting frames 203, the shell 204 is provided with a hollow groove, a rectangular frame 205 is symmetrically disposed in the hollow groove, four sides of the rectangular frame 205 are provided with a support 206, guard rails 207 are disposed at two sides of the rectangular frame 205, a plurality of transverse grooves are uniformly disposed in the guard rails 207, a fan 208 is connected to the support 206, the shell 204 is fixed on one side of the chassis 1 by arranging two symmetrical connecting frames 203, and the fan 208 rotates to blow and cool the interior of the chassis 1 through the heat dissipation net 201.
Referring to fig. 5, the fixing mechanism 3 includes a connection block 301, the connection block 301 is connected to the inner side of the chassis 1, a T-shaped groove 302 is provided in an inward direction of one side of the connection block 301, a mounting block 303 is provided in the T-shaped groove 302, the mounting block 303 can move in the connection block 301, a spring buckle 304 is provided in the T-shaped groove 302, the spring buckle 304 is used for tightly supporting the mounting block 303, two ends of the mounting block 303 are provided with baffles 305 for further clamping and fixing, the mounting block 303 is provided with a hollow groove, a clamping hand 306 is provided in the hollow groove, two clamping hands 306 are symmetrically provided, a rotating shaft 307 is provided at the upper end of the clamping hand 306, hollow grooves are provided at two sides of the clamping hand 306, a rotating rod 308 is provided in the hollow groove, a connecting sleeve 309 is provided at one end of the rotating rod 308, a connecting sleeve 309 is provided at the other end of the rotating rod 308, a connecting sleeve 309 is provided in the hollow groove, a nut 311 is connected at one end of the rotating rod 310, the rotating rod 310 drives the rotating rod 308 to tightly clamp two clamping hands 306 to fix the main board assembly 4, the mounting block 303 slides into the T-shaped groove 302, and the spring buckle 304 is elastically fastened and tightly supports and fixes.
Working principle: firstly, the main board assembly 4 is placed between the clamping hands 306, the rotating roller rods 310 drive the rotating rods 308 to rotate, the clamping hands 306 clamp the main board assembly 4 slowly, the clamping hands 306 are connected with the lower portion of the mounting block 303, the mounting block 303 slides in the T-shaped groove 302 in a matched mode, the spring buckle 304 is arranged above the T-shaped groove 302 and clamps and fixes the mounting block 303, the heat dissipation net 201 is arranged on two sides of the case 1, two fans 208 are fixedly arranged on one side of the case 1, heat generated by the main board assembly 4 can be discharged through the heat dissipation net 201 through operation of the fans 208, and therefore the heat dissipation effect of the main board device body of the computer is better.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.

Claims (7)

1. The utility model provides an integrated circuit embedded computer mainboard, includes quick-witted case (1), its characterized in that, just one side of machine case (1) is connected with cooling body (2), cooling body (2) are rotatable blast structure for cool down to machine case (1) inside, just cooling body (2) are including heat dissipation net (201), heat dissipation net (201) set up in machine case (1) both sides, just heat dissipation net (201) are used for discharging the inside heat of machine case (1), the internal connection of machine case (1) has fixed establishment (3), fixed establishment (3) inside is provided with mainboard subassembly (4), just fixed establishment (3) are screw thread rotation clamping structure.
2. An integrated circuit embedded computer motherboard according to claim 1, wherein the heat dissipation mechanism (2) comprises a heat dissipation net (201), the heat dissipation net (201) is connected to two sides of the chassis (1), and a dust-proof net (202) is disposed inside one of the heat dissipation nets (201).
3. The embedded computer motherboard of claim 2, wherein the heat dissipation mechanism (2) comprises a connecting frame (203), the connecting frame (203) is symmetrically arranged at the upper end and the lower end of one side of the chassis (1), the connecting frame (203) is of a bending structure, and a shell (204) is connected between the two connecting frames (203).
4. An integrated circuit embedded computer motherboard according to claim 3, wherein the housing (204) is provided with a hollow slot, a rectangular frame (205) is symmetrically arranged in the hollow slot, four sides in the rectangular frame (205) are provided with brackets (206), guard rails (207) are arranged on two sides of the rectangular frame (205), a plurality of transverse slots are uniformly formed in the guard rails (207), and a fan (208) is connected in the brackets (206).
5. The integrated circuit embedded computer motherboard according to claim 1, wherein the fixing mechanism (3) comprises a connection block (301), the connection block (301) is connected to the inner side of the chassis (1), a T-shaped groove (302) is formed in one side of the connection block (301) in an inward direction, a mounting block (303) is arranged in the T-shaped groove (302), and the mounting block (303) can move in the connection block (301).
6. The embedded computer motherboard of claim 5, wherein a spring buckle (304) is arranged in the T-shaped groove (302), the spring buckle (304) is used for propping against a mounting block (303), two ends of the mounting block (303) are provided with baffle plates (305), the mounting block (303) is provided with a hollow groove, clamping hands (306) are arranged in the hollow groove, two clamping hands (306) are symmetrically arranged, and a rotating shaft (307) is arranged at the upper end of the clamping hands (306).
7. The embedded computer motherboard of claim 6, wherein empty slots are formed in two sides of the clamping hand (306), a rotating rod (308) is arranged in each empty slot, threads are arranged at one end of the rotating rod (308), a connecting sleeve (309) is arranged at the other end of the rotating rod (308), empty slots are formed in one end of the rotating rod (308) and one end of the connecting sleeve (309), the connecting sleeve (309) is arranged in each empty slot, and nuts (311) are connected at one end of the roller rod (310).
CN202322440755.0U 2023-09-08 2023-09-08 Integrated circuit embedded computer motherboard Active CN220626989U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202322440755.0U CN220626989U (en) 2023-09-08 2023-09-08 Integrated circuit embedded computer motherboard

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202322440755.0U CN220626989U (en) 2023-09-08 2023-09-08 Integrated circuit embedded computer motherboard

Publications (1)

Publication Number Publication Date
CN220626989U true CN220626989U (en) 2024-03-19

Family

ID=90224325

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202322440755.0U Active CN220626989U (en) 2023-09-08 2023-09-08 Integrated circuit embedded computer motherboard

Country Status (1)

Country Link
CN (1) CN220626989U (en)

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