CN220626577U - Semiconductor wafer detection device - Google Patents
Semiconductor wafer detection device Download PDFInfo
- Publication number
- CN220626577U CN220626577U CN202321941693.5U CN202321941693U CN220626577U CN 220626577 U CN220626577 U CN 220626577U CN 202321941693 U CN202321941693 U CN 202321941693U CN 220626577 U CN220626577 U CN 220626577U
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- semiconductor wafer
- motor
- fixedly installed
- fixedly arranged
- assembly
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 44
- 238000001514 detection method Methods 0.000 title abstract description 14
- 238000007689 inspection Methods 0.000 claims description 10
- 238000007664 blowing Methods 0.000 claims description 4
- 239000000428 dust Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 7
- 239000000463 material Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a semiconductor wafer detection device, which comprises a bearing table; the thread moving assembly is fixedly arranged on the upper side of the bearing table and used for driving movement; the rotary clamping assembly comprises a moving column, a rotating assembly and a clamping part, wherein the moving column is movably sleeved on the threaded moving assembly, the rotating assembly is fixedly arranged on one side of the moving column, and the clamping part is fixedly arranged on one side of the rotating assembly; the frame body is fixedly arranged on the upper part of the bearing table. According to the scheme, the thread moving assembly and the rotary clamping device are arranged, so that the semiconductor wafer is turned over in the detection process, the whole clamp is only required to be turned over, the wafer is clamped in the air during detection, and no object contact is caused between the upper part and the lower part of the wafer, the phenomenon that the wafer is worn on one side due to the turning over is prevented, and the effect of protecting the surface of the wafer is achieved by utilizing the structure.
Description
Technical Field
The present utility model relates to the field of semiconductor technology, and more particularly, to a semiconductor wafer inspection apparatus.
Background
The semiconductor wafer refers to a circular silicon wafer or a substrate of other semiconductor materials which is manufactured on a semiconductor material through a specific process, and is the basis for manufacturing integrated circuits and other semiconductor devices, the main material of the semiconductor wafer is silicon, and silicon has good semiconductor characteristics and usability, so that the semiconductor wafer is the most common and widely used material, but in the detection process of the semiconductor, both sides of the semiconductor wafer need to be detected, and when the semiconductor wafer is directly placed on a detection platform to be turned over, the wafer is easy to rub with the platform, so that the wafer is worn, and loss is caused.
Disclosure of Invention
In order to overcome the defects in the prior art, the utility model provides a semiconductor wafer detection device, which aims to solve the problems that in the detection process of a semiconductor, both sides of the semiconductor wafer need to be detected, and when the semiconductor wafer is directly placed on a detection platform to turn over, the wafer is easy to rub with the platform, so that the wafer is worn and lost.
In order to solve the technical problems, the utility model provides the following technical scheme: a semiconductor wafer inspection apparatus comprising:
a carrying platform;
the thread moving assembly is fixedly arranged on the upper side of the bearing table and used for driving movement;
the rotary clamping assembly comprises a moving column, a rotating assembly and a clamping part, wherein the moving column is movably sleeved on the threaded moving assembly, the rotating assembly is fixedly arranged on one side of the moving column, and the clamping part is fixedly arranged on one side of the rotating assembly;
the frame body is fixedly arranged at the upper part of the bearing table;
the first hydraulic lifter is fixedly arranged at the bottom side of the middle part of the frame body;
and the detector is fixedly arranged at the bottom of the first hydraulic lifter.
The screw thread moving assembly comprises a first limiting shell, a first motor and a one-way threaded rod, wherein the first limiting shell is fixedly arranged on the upper portion of the bearing table, the first motor is fixedly arranged on one side of the inside of the first limiting shell, the one-way threaded rod is fixedly arranged on the driving end of the first motor, and the moving column is movably sleeved on the one-way threaded rod and moves along the one-way threaded rod.
The rotating assembly comprises a round chassis, a sliding groove, a pulley and a second motor, wherein the round chassis is fixedly arranged on one side of the moving column, the sliding groove is formed in one side, far away from the moving column, of the round chassis, the pulley is arranged in the sliding groove and slides along the sliding groove, and the second motor is fixedly clamped on one side of the sliding groove.
The clamping part comprises a second limiting shell, a third motor, a double-head threaded rod and a clamp, wherein two ends of the rear side of the second limiting shell are fixedly arranged on the front side of a pulley, the driving end of the second motor is fixedly arranged in the middle of the second limiting shell, the third motor is fixedly arranged on one side of the second limiting shell, the double-head threaded rod is fixedly connected to the driving end of the third motor, and the clamp is movably sleeved on the double-head threaded rod and is used for clamping a semiconductor wafer.
The semiconductor wafer blowing device further comprises a fan and a supporting table, wherein the fan is fixedly arranged on two sides of the frame body and used for blowing away dust on the surface of the semiconductor wafer, and the supporting table is fixedly arranged on the top of the supporting table and used for supporting the semiconductor wafer.
The pallet comprises a second hydraulic lifter and a pallet, wherein the second hydraulic lifter is fixedly arranged at the top of the bearing table, and the pallet is fixedly arranged at the top of the bearing table.
Compared with the prior art, the utility model has the beneficial effects that:
according to the utility model, the threaded moving assembly and the rotary clamping device are arranged, so that the semiconductor wafer is only required to be turned over through the clamp integrally in the process of detection, the wafer is clamped in the air in the process of detection, and no object contact exists between the upper part and the lower part, so that the phenomenon that the detection result of the wafer is influenced due to abrasion of one side of the wafer caused by the turning over is prevented.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic view of a thread moving assembly according to the present utility model;
FIG. 3 is a schematic view of a rotary clamping assembly according to the present utility model;
fig. 4 is a schematic view of a pallet according to the present utility model.
[ reference numerals ]
1. A carrying platform; 2. a thread moving assembly; 3. a rotary clamping assembly; 4. a frame body; 5. a first hydraulic lifter; 6. a detector; 7. a fan; 8. a support; 21. a first limit housing; 22. a first motor; 23. a one-way threaded rod; 31. a moving column; 32. a rotating assembly; 33. a clamping part; 81. a second hydraulic lifter; 82. a tray; 321. a circular chassis; 322. a chute; 323. a pulley; 324. a second motor; 331. the second limiting shell; 332. a third motor; 333. a double-ended threaded rod; 334. and a clip.
Detailed Description
In order to make the technical problems, technical solutions and advantages to be solved more apparent, the following detailed description will be given with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1 to 4, an embodiment of the present utility model provides a semiconductor wafer inspection apparatus, including:
a carrying platform 1;
the screw thread moving assembly 2 is fixedly arranged on the upper side of the bearing table 1 and used for driving movement;
the rotary clamping assembly 3 comprises a moving column 31, a rotating assembly 32 and a clamping part 33, wherein the moving column 31 is movably sleeved on the threaded moving assembly 2, the rotating assembly 32 is fixedly arranged on one side of the moving column 31, and the clamping part 33 is fixedly arranged on one side of the rotating assembly 32;
the frame body 4 is fixedly arranged at the upper part of the bearing table 1;
the first hydraulic lifter 5 is fixedly arranged at the bottom side of the middle part of the frame body 4;
the detector 6, the detector 6 is fixed mounting in the bottom of first hydraulic lifter 5.
The screw thread moving assembly 2 comprises a first limiting shell 21, a first motor 22 and a one-way threaded rod 23, wherein the first limiting shell 21 is fixedly installed on the upper portion of the bearing table 1, the first motor 22 is fixedly installed on one side of the inner portion of the first limiting shell 21, the one-way threaded rod 23 is fixedly installed on the driving end of the first motor 22, and the moving column 31 is movably sleeved on the one-way threaded rod 23 and moves along the one-way threaded rod 23.
The rotating assembly 32 includes a circular chassis 321, a chute 322, a pulley 323, and a second motor 324, the circular chassis 321 is fixedly mounted on one side of the moving post 31, the chute 322 is disposed on one side of the circular chassis 321 far away from the moving post 31, the pulley 323 is disposed in the chute 322 and slides along the chute 322, and the second motor 324 is fixedly clamped on one side of the chute 322.
The clamping part 33 comprises a second limiting shell 331, a third motor 332, a double-end threaded rod 333 and a clamp 334, wherein two ends of the rear side of the second limiting shell 331 are fixedly arranged on the front side of the pulley 323, the driving end of the second motor 324 is fixedly arranged in the middle of the second limiting shell 331, the third motor 332 is fixedly arranged on one side of the second limiting shell 331, the double-end threaded rod 333 is fixedly connected to the driving end of the third motor 332, and the clamp 334 is movably sleeved on the double-end threaded rod 333 and is used for clamping semiconductor crystals.
The device further comprises a fan 7 and a supporting table 8, wherein the fan 7 is fixedly arranged on two sides of the frame body 4 and used for blowing away dust on the surface of a semiconductor wafer, the supporting table 8 is fixedly arranged on the top of the supporting table 1 and used for supporting the semiconductor wafer, and the fan 7 can be started to clean the semiconductor wafer when the device clamps the wafer by arranging the fan 7, so that dust is prevented from adhering to the surface, and the detection is affected.
The tray table 8 comprises a second hydraulic lifter 81 and a tray 82, the second hydraulic lifter 81 is fixedly installed at the top of the carrying table 1, the tray 82 is fixedly installed at the top of the carrying table 1, the surface of the tray 82 is made of flexible materials, and the wafer is placed on the tray table and cannot be damaged when being lifted.
The working process of the utility model is as follows:
the worker now places the semiconductor wafer to be inspected on the tray 82, starts the second hydraulic lifter 81 to be lifted to a proper position, then adjusts the distance between the rotary clamping assemblies 3 by starting the screw moving assembly 2, then clamps the semiconductor wafer, then starts the first hydraulic lifter 5 to adjust the height of the detector 6, and finishes the inspection of the semiconductor wafer by the detector 6, wherein the fan 7 can be started to perform wind cleaning on the semiconductor wafer.
The last points to be described are: first, in the description of the present application, it should be noted that, unless otherwise specified and defined, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be mechanical or electrical, or may be a direct connection between two elements, and "upper," "lower," "left," "right," etc. are merely used to indicate relative positional relationships, which may be changed when the absolute position of the object being described is changed;
secondly: in the drawings of the disclosed embodiments, only the structures related to the embodiments of the present disclosure are referred to, and other structures can refer to the common design, so that the same embodiment and different embodiments of the present disclosure can be combined with each other under the condition of no conflict;
finally: the foregoing description of the preferred embodiments of the utility model is not intended to limit the utility model to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and principles of the utility model are intended to be included within the scope of the utility model.
Claims (6)
1. A semiconductor wafer inspection apparatus, comprising:
a carrying platform (1);
the screw thread moving assembly (2) is fixedly arranged on the upper side of the bearing table (1) and used for driving movement;
the rotary clamping assembly (3), the rotary clamping assembly (3) comprises a moving column (31), a rotating assembly (32) and a clamping part (33), the moving column (31) is movably sleeved on the threaded moving assembly (2), the rotating assembly (32) is fixedly arranged on one side of the moving column (31), and the clamping part (33) is fixedly arranged on one side of the rotating assembly (32);
the frame body (4), the said frame body (4) is fixedly mounted on the upper portion of the bearing table (1);
the first hydraulic lifter (5) is fixedly arranged at the bottom side of the middle part of the frame body (4);
and the detector (6) is fixedly arranged at the bottom of the first hydraulic lifter (5).
2. The semiconductor wafer inspection device according to claim 1, wherein the screw moving assembly (2) comprises a first limiting housing (21), a first motor (22) and a unidirectional threaded rod (23), the first limiting housing (21) is fixedly installed on the upper portion of the carrying table (1), the first motor (22) is fixedly installed on one side inside the first limiting housing (21), the unidirectional threaded rod (23) is fixedly installed on the driving end of the first motor (22), and the moving column (31) is movably sleeved on the unidirectional threaded rod (23) and moves along the unidirectional threaded rod (23).
3. The semiconductor wafer inspection device according to claim 1, wherein the rotating assembly (32) comprises a circular chassis (321), a chute (322), a pulley (323) and a second motor (324), the circular chassis (321) is fixedly installed on one side of the moving column (31), the chute (322) is formed on one side of the circular chassis (321) far away from the moving column (31), the pulley (323) is arranged in the chute (322) and slides along the chute (322), and the second motor (324) is fixedly clamped on one side of the chute (322).
4. A semiconductor wafer inspection apparatus according to claim 3, wherein the clamping portion (33) comprises a second limiting housing (331), a third motor (332), a double-ended threaded rod (333), and a clip (334), two ends of the rear side of the second limiting housing (331) are fixedly installed on the front side of the pulley (323), the driving end of the second motor (324) is fixedly installed in the middle of the second limiting housing (331), the third motor (332) is fixedly installed on one side of the second limiting housing (331), the double-ended threaded rod (333) is fixedly connected to the driving end of the third motor (332), and the clip (334) is movably sleeved on the double-ended threaded rod (333) and is used for clamping the semiconductor wafer.
5. The semiconductor wafer inspection apparatus according to claim 1, further comprising a fan (7) and a supporting table (8), wherein the fan (7) is fixedly installed at both sides of the frame body (4) and is used for blowing away dust on the surface of the semiconductor wafer, and the supporting table (8) is fixedly installed at the top of the supporting table (1) and is used for supporting the semiconductor wafer.
6. The semiconductor wafer inspection apparatus according to claim 5, wherein the pallet (8) comprises a second hydraulic lifter (81) and a tray (82), the second hydraulic lifter (81) is fixedly installed on top of the carrier (1), and the tray (82) is fixedly installed on top of the carrier (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321941693.5U CN220626577U (en) | 2023-07-24 | 2023-07-24 | Semiconductor wafer detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321941693.5U CN220626577U (en) | 2023-07-24 | 2023-07-24 | Semiconductor wafer detection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220626577U true CN220626577U (en) | 2024-03-19 |
Family
ID=90222331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321941693.5U Active CN220626577U (en) | 2023-07-24 | 2023-07-24 | Semiconductor wafer detection device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220626577U (en) |
-
2023
- 2023-07-24 CN CN202321941693.5U patent/CN220626577U/en active Active
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| GR01 | Patent grant |