CN220605940U - Communication switch with heat dissipation device - Google Patents

Communication switch with heat dissipation device Download PDF

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Publication number
CN220605940U
CN220605940U CN202322110391.XU CN202322110391U CN220605940U CN 220605940 U CN220605940 U CN 220605940U CN 202322110391 U CN202322110391 U CN 202322110391U CN 220605940 U CN220605940 U CN 220605940U
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CN
China
Prior art keywords
switch
clamping
clamping block
heat dissipation
connecting buckle
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Active
Application number
CN202322110391.XU
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Chinese (zh)
Inventor
王雪
刘麒麟
王拥军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shaanxi Jiewei Information Technology Co ltd
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Dongguan Weigangyun Technology Co ltd
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Priority to CN202322110391.XU priority Critical patent/CN220605940U/en
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Abstract

A communication exchanger with a heat dissipation device comprises an exchanger. Compared with the prior art, the utility model has the advantages that: when the dustproof filter plate is disassembled, the pulling plate is pulled to drive the clamping block to retract into the L-shaped chute, the connecting buckle can be disassembled after losing the limit of the clamping block, during installation, the connecting buckle is inserted opposite to the clamping groove, the connecting buckle can push the clamping block, the clamping block can gradually retract into the L-shaped chute and compress the abutting spring after being stressed, after the connecting buckle is completely inserted into the clamping groove, the clamping block loses stress and enters the clamping groove under the pushing of the abutting spring, limit is formed on the connecting buckle, the installation can be completed, the disassembly and the assembly are convenient and quick, the device is more practical, the cooling surface of the semiconductor refrigerating sheet can cool the fins, air sucked into the switch by the air inlet fan becomes cold air after passing through the fins, and even if the environment temperature is higher, the switch can effectively dissipate heat, and the operation of the semiconductor refrigerating sheet can be controlled according to the environment temperature, and the device is more energy-saving.

Description

Communication switch with heat dissipation device
Technical Field
The utility model relates to the technical field of communication switches, in particular to a communication switch with a heat dissipation device.
Background
The switch is a type of switch for electrical (optical) signal forwarding. It may provide an exclusive path for any two of the access switches. The most common switch is. Other common are telephone voice switches, etc.
Through retrieving the chinese patent of publication No. CN218679246U, a communication switch is disclosed, including the casing and set up the switch body inside the casing, air inlet and gas vent have been seted up to switch body lateral wall, the casing lateral wall is provided with the filter component who is used for filtering gas, be used for radiating gas to enter into inside the casing from the air inlet, filter component is including the mounting panel and with air inlet assorted filter screen, the penetrating hole with air inlet assorted has been seted up at the middle part of mounting panel, the top of mounting panel is provided with the mounting groove, the filter screen is pegged graft in the mounting groove, one side that the filter screen is close to the casing is provided with sealed the pad, sealed pad and the lateral wall butt of casing, the mounting panel is connected with the fixed subassembly that is used for fixed filter screen.
The prior art scheme has the following defects: when the filter screen is disassembled, the fixing screw is required to be unscrewed, then the filter screen is disassembled to be cleaned, the fixing screw is required to be screwed again when the filter screen is assembled, the disassembly and assembly are time-consuming and quite troublesome, the exchanger can generate heat during operation, if the ambient temperature is higher, the heat dissipation requirement can not be met by simply utilizing natural wind for heat dissipation, and the service life of the exchanger can be influenced by high heat.
Disclosure of Invention
In order to solve the above-mentioned shortcomings in the prior art, the present utility model provides a communication switch with a heat dissipation device, so as to solve the problems set forth in the above-mentioned background art.
In order to achieve the above purpose, the technical scheme adopted by the utility model is that the communication switch with the heat dissipation device comprises a switch, wherein two air inlet fans are embedded and installed on one side wall of the switch, a dustproof filter plate is detachably connected to the outer wall of one side of the switch through a clamping component, two exhaust fans are embedded and installed on the other side wall of the switch, a heat dissipation opening is formed in the rear side wall of the switch, and a refrigerating component is arranged in the switch.
As an improvement: the clamping assembly comprises a clamping groove, L-shaped sliding grooves, clamping blocks, a pulling plate and a tight propping spring, wherein two clamping grooves which are symmetrically distributed are formed in the outer wall of one side of the switch, the two clamping grooves are respectively formed in a side wall which is far away from each other, the clamping blocks are connected in the L-shaped sliding grooves in a sliding manner, the pulling plate is fixedly connected with one end of the clamping blocks, which is far away from the clamping grooves, the tight propping spring is fixedly connected with the side wall, which is far away from the clamping blocks, of the pulling plate, and the other end of the tight propping spring is fixedly connected with one side wall, which is far away from the clamping grooves, of the L-shaped sliding grooves.
As an improvement: the refrigerating assembly comprises a mounting plate, a semiconductor refrigerating sheet, fins, a heat-dissipating fan and a heat-insulating pipe, wherein the mounting plate is fixedly connected to the inner wall of one side of the switch, the semiconductor refrigerating sheet is embedded and mounted on the mounting plate, the fins are mounted on the cold surface of the semiconductor refrigerating sheet, the heat-dissipating fan is mounted on the hot surface of the semiconductor refrigerating sheet, the heat-insulating pipe is mounted on the rear side wall of the heat-dissipating fan, and the other end of the heat-insulating pipe is communicated with a heat-dissipating opening.
As an improvement: two connecting buckles matched with the clamping blocks are fixedly connected to one side wall of the dustproof filter plate, which is close to the switch.
As an improvement: one end face of the clamping block, which is close to the clamping groove, is an arc slope.
As an improvement: and a temperature control switch is arranged in the switch.
Compared with the prior art, the utility model has the following beneficial effects:
1. when the dustproof filter plate is disassembled, the pulling plate is pulled to drive the clamping block to retract into the L-shaped chute, the connecting buckle can be disassembled after losing the limit of the clamping block, during installation, the connecting buckle is inserted opposite to the clamping groove, the connecting buckle can push the clamping block, the clamping block can gradually retract into the L-shaped chute and compress the abutting spring after being stressed, after the connecting buckle is completely inserted into the clamping groove, the clamping block loses stress and enters the clamping groove under the pushing of the abutting spring, limit is formed on the connecting buckle, the installation can be completed, the disassembly and the assembly are convenient and quick, the device is more practical, the cooling surface of the semiconductor refrigerating sheet can cool the fins, air sucked into the switch by the air inlet fan becomes cold air after passing through the fins, and even if the environment temperature is higher, the switch can effectively dissipate heat, and the operation of the semiconductor refrigerating sheet can be controlled according to the environment temperature, and the device is more energy-saving.
Drawings
Fig. 1 is a schematic diagram of the whole structure of a communication switch with a heat dissipating device according to the present utility model;
fig. 2 is a schematic diagram of an air inlet fan of a communication switch with a heat dissipating device according to the present utility model;
fig. 3 is a cross-sectional view of a communication switch with a heat sink according to the present utility model;
fig. 4 is a schematic structural diagram of a refrigeration assembly of a communication switch with a heat dissipating device according to the present utility model;
as shown in the figure:
1. a switch; 1.1, an air inlet fan; 2. a clamping assembly; 1.2, dustproof filter plates; 1.3, an exhaust fan; 1.4, a heat dissipation port; 3. a refrigeration assembly; 2.1, a clamping groove; 2.2, an L-shaped chute; 2.3, a clamping block; 2.4, pulling the plate; 2.5, abutting against the spring; 3.1, mounting plate; 3.2, a semiconductor refrigerating sheet; 3.3, fins; 3.4, a cooling fan; 3.5, heat insulation pipe; 1.21, connecting buckle; 4. a temperature control switch.
Detailed Description
In order to make the technical means, the creation characteristics and the effect of achieving the object of the present utility model easy to understand, the present utility model is further described below with reference to the specific embodiments.
In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both sides", "one side", "the other side", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
As shown in fig. 1 to 3, a communication switch with a heat dissipation device includes a switch 1, two air inlet fans 1.1 are embedded and installed on one side wall of the switch 1, a dustproof filter plate 1.2 is detachably connected on one side outer wall of the switch 1 through a clamping component 2, two air outlet fans 1.3 are embedded and installed on the other side wall of the switch 1, the air inlet fans 1.1 can conduct heat dissipation by sucking outside air into the interior of the switch 1 after being filtered by the dustproof filter plate 1.2, the air outlet fans 1.3 can accelerate air discharge in the switch 1, heat dissipation effect is improved, a heat dissipation opening 1.4 is arranged on the rear side wall of the switch 1, the heat dissipation opening 1.4 is used for discharging heat released by a semiconductor refrigerating sheet 3.2 hot surface out of the switch 1, and a refrigerating component 3 is arranged in the switch 1.
Specifically, as shown in fig. 2 and fig. 3, a communication switch with heat abstractor, the joint subassembly 2 includes joint groove 2.1, L shape spout 2.2, joint piece 2.3, pulling plate 2.4 and support tight spring 2.5, two joint grooves 2.1 that are symmetrical distribution have been seted up on the outer wall of one side of switch 1, L shape spout 2.2 has all been seted up on the lateral wall that two joint grooves 2.1 kept away from each other, L shape spout 2.2 sliding connection has joint piece 2.3, one end fixedly connected with pulling plate 2.4 that joint groove 2.1 was kept away from to joint piece 2.3, fixedly connected with butt spring 2.5 on one lateral wall that joint piece 2.3 was kept away from to pulling plate 2.4, the other end and L shape spout 2.2 are kept away from joint groove 2.1, when need dismantle dustproof filter plate 1.2 and clean, pulling plate 2.4 makes its drive joint piece 2.3L shape and falls into joint groove 2.21, the end fixedly connected with pulling plate 2.4 after the joint piece 2.1, the end of joint piece 2.1 is kept away from joint groove 2.1, can be realized in the expansion joint piece 2.21, the jack-down can be accomplished in the expansion joint groove 2.1, the jack-up groove can be realized, the jack-down is realized in the jack-stop joint groove 2.21, and the jack-stop piece can be realized, the jack-stop joint is realized, and the jack-stop piece 2.21 is realized, and the jack-stop piece is more is completely, and can be connected to the jack-stop, and can be more 21, and can be connected.
Specifically, as shown in fig. 3 and fig. 4, a communication switch with a heat dissipation device is provided, the refrigeration component 3 includes a mounting plate 3.1, a semiconductor refrigeration fin 3.2, a fin 3.3, a heat dissipation fan 3.4 and a heat insulation pipe 3.5, the mounting plate 3.1 is fixedly connected to the inner wall of one side of the switch 1, the semiconductor refrigeration fin 3.2 is embedded and mounted on the mounting plate 3.1, the fin 3.3 is mounted on the cold surface of the semiconductor refrigeration fin 3.2, the heat dissipation fan 3.4 is mounted on the hot surface of the semiconductor refrigeration fin 3.2, the heat insulation pipe 3.5 is mounted on the rear side wall of the heat dissipation fan 3.4, the other end of the heat insulation pipe 3.5 is communicated with the heat dissipation port 1.4, the cold surface of the semiconductor refrigeration fin 3.3 can enable the fin 3.3 to cool to form a low temperature, the air sucked into the switch 1.3 can become cold air after passing through the fin 3.3, the switch 1 is cooled by the cold air, the heat dissipation can be effectively performed on the switch 1 even if the ambient temperature is higher, the heat dissipation fan 3.4 can be performed on the switch 1, the heat dissipation fan 3.2 can be discharged through the heat dissipation pipe 1.4 through the heat insulation pipe 1.5.
Specifically, as shown in fig. 3, in a communication switch with a heat dissipating device, two connecting buckles 1.21 matched with a clamping block 2.3 are fixedly connected to a side wall of a dustproof filter plate 1.2 close to the switch 1.
Specifically, as shown in fig. 3, an end face of the clamping block 2.3, which is close to the clamping groove 2.1, is an arc slope, so that the clamping block 2.3 is easier to be stressed when the connecting buckle 1.21 is inserted into the clamping groove 2.1.
Specifically, as shown in fig. 3, a communication switch with a heat dissipation device is provided, a temperature control switch 4 is installed in the switch 1, and the temperature control switch 4 can control the operation of the semiconductor refrigeration sheet 3.2 according to the ambient temperature, so that the energy is saved.
In the concrete implementation of the utility model, when the ambient temperature is not high, the air inlet fan 1.1 can operate to suck external air into the interior of the exchanger 1 for heat dissipation after being filtered by the dustproof filter plate 1.2, the air outlet fan 1.3 can accelerate the air discharge in the exchanger 1, the heat dissipation effect is improved, when the ambient temperature is high, the temperature control switch 4 senses the temperature rise, the semiconductor refrigerating sheet 3.2 and the heat dissipation fan 3.4 can be started, the cold surface of the semiconductor refrigerating sheet 3.2 can cool the fin 3.3 to form low temperature, the air sucked into the exchanger 1 by the air inlet fan 1.3 can become cold air after passing through the fin 3.3, the heat dissipation and the temperature reduction can be carried out on the exchanger 1 by utilizing the cold air, the heat dissipation fan 3.4 can effectively dissipate the heat of the exchanger 1 even when the ambient temperature is high, the hot surface of the semiconductor refrigerating sheet 3.2 can be discharged out of the exchanger 1 through the heat insulation pipe 3.5 and the heat dissipation opening 1.4, the temperature control switch 4 can control the operation of the semiconductor refrigerating sheet 3.2 according to the ambient temperature, and is more energy-saving, when the dustproof filter plate 1.2 needs to be disassembled for cleaning, the pulling plate 2.4 is pulled, so that the clamping block 2.3 is driven to retract into the L-shaped chute 2.2, after the connecting buckle 1.21 loses the limit of the clamping block 2.3, the dustproof filter plate 1.2 can be disassembled, when the connecting buckle 1.21 is installed, the connecting buckle 1.21 is inserted into the clamping groove 2.1, when the connecting buckle 1.21 is inserted, the clamping block 2.3 can be pushed, the clamping block 2.3 can be gradually retracted into the L-shaped chute 2.2 after the clamping block 2.3 is stressed, and is compressed to tightly press the spring 2.5, when the connecting buckle 1.21 is completely inserted into the clamping groove 2.1, the clamping block 2.3 loses stress and enters the clamping groove 2.1 under the pushing of the pushing spring 2.5, and the connecting buckle 1.21 is limited, and the installation can be completed.
The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims (6)

1. Communication switch with heat dissipation device, comprising a switch (1), characterized in that: two air inlet fans (1.1) are embedded and installed on one side wall of the switch (1), a dustproof filter plate (1.2) is detachably connected to the outer wall of one side of the switch (1) through a clamping component (2), two air outlet fans (1.3) are embedded and installed on the other side wall of the switch (1), a heat dissipation opening (1.4) is formed in the rear side wall of the switch (1), and a refrigerating component (3) is arranged in the switch (1).
2. A communications switch with heat sink as defined in claim 1, wherein: the clamping assembly (2) comprises clamping grooves (2.1), L-shaped sliding grooves (2.2), clamping blocks (2.3), pulling plates (2.4) and supporting springs (2.5), two clamping grooves (2.1) which are symmetrically distributed are formed in the outer wall of one side of the switch (1), L-shaped sliding grooves (2.2) are formed in the side walls of the clamping grooves (2.1) which are far away from each other, the clamping blocks (2.3) are connected in a sliding manner, one ends of the clamping blocks (2.3) far away from the clamping grooves (2.1) are fixedly connected with pulling plates (2.4), supporting springs (2.5) are fixedly connected to the side walls of the pulling plates (2.4) far away from the clamping blocks (2.3), and the other ends of the supporting springs (2.5) are fixedly connected with one side walls of the L-shaped sliding grooves (2.2) far away from the clamping grooves (2.1).
3. A communications switch with heat sink as defined in claim 1, wherein: the refrigerating assembly (3) comprises a mounting plate (3.1), semiconductor refrigerating sheets (3.2), fins (3.3), a cooling fan (3.4) and a heat insulation pipe (3.5), wherein the mounting plate (3.1) is fixedly connected to the inner wall of one side of the switch (1), the semiconductor refrigerating sheets (3.2) are embedded and mounted on the mounting plate (3.1), the fins (3.3) are mounted on the cold surface of the semiconductor refrigerating sheets (3.2), the cooling fan (3.4) is mounted on the hot surface of the semiconductor refrigerating sheets (3.2), the heat insulation pipe (3.5) is mounted on the rear side wall of the cooling fan (3.4), and the other end of the heat insulation pipe (3.5) is communicated with the cooling port (1.4).
4. A communications switch with heat sink according to claim 2, wherein: two connecting buckles (1.21) matched with the clamping blocks (2.3) are fixedly connected to one side wall, close to the switch (1), of the dustproof filter plate (1.2).
5. A communications switch with heat sink according to claim 2, wherein: one end face of the clamping block (2.3) close to the clamping groove (2.1) is an arc slope.
6. A communications switch with heat sink according to claim 3, wherein: a temperature control switch (4) is arranged in the switch (1).
CN202322110391.XU 2023-08-07 2023-08-07 Communication switch with heat dissipation device Active CN220605940U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202322110391.XU CN220605940U (en) 2023-08-07 2023-08-07 Communication switch with heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202322110391.XU CN220605940U (en) 2023-08-07 2023-08-07 Communication switch with heat dissipation device

Publications (1)

Publication Number Publication Date
CN220605940U true CN220605940U (en) 2024-03-15

Family

ID=90182950

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202322110391.XU Active CN220605940U (en) 2023-08-07 2023-08-07 Communication switch with heat dissipation device

Country Status (1)

Country Link
CN (1) CN220605940U (en)

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Effective date of registration: 20240318

Address after: 710000, Building D, Tangfeng International, No. 18 Fenghui South Road, High tech Zone, Xi'an City, Shaanxi Province, China, 1202

Patentee after: Shaanxi Jiewei Information Technology Co.,Ltd.

Country or region after: China

Address before: Room 202, No. 33 Yuanhua Road, Changping Town, Dongguan City, Guangdong Province, 523000

Patentee before: Dongguan Weigangyun Technology Co.,Ltd.

Country or region before: China