CN220596278U - Multi-layer material taking mechanism for primary and secondary rings of semiconductor equipment - Google Patents

Abstract

The utility model discloses a multi-layer material taking mechanism for a primary ring and a secondary ring of semiconductor equipment, which relates to the field of material taking of the primary ring and the secondary ring, and comprises a mounting bracket, wherein a movable lifting mechanism is arranged on the mounting bracket, a fixed plate is arranged on the outer wall of one side of the movable lifting mechanism far away from the mounting bracket, mounting grooves are formed in two sides of the upper surface of the fixed plate, racks are connected in the mounting grooves, a U-shaped plate is arranged on the lower surface of the fixed plate, connecting blocks are respectively connected to the inner walls of the U-shaped ends of the two ends of the U-shaped plate, a placing groove is formed in the position, close to the bottom end, of the U-shaped plate, a telescopic component is arranged in the placing groove, a rotating mechanism is connected to the lower part of the U-shaped plate, one end, far away from the U-shaped plate, of the rotating mechanism is connected with the material taking component, the telescopic component is driven to stretch out and draw back through the telescopic component, and when the primary ring and secondary ring with different thicknesses are required to be clamped through the telescopic component.

Description

Multi-layer material taking mechanism for primary and secondary rings of semiconductor equipment

Technical Field

The utility model mainly relates to the technical field of primary and secondary ring material taking, in particular to a primary and secondary ring multilayer material taking mechanism of semiconductor equipment.

Background

At present, the operation of sorting and putting the cloth into the barrel according to the bar codes on the primary and secondary rings is completed manually, and the manual operation is time-consuming and labor-consuming, low in efficiency and easy to make mistakes.

The material taking mechanism for facilitating multiple layers of the primary ring and the secondary ring of the semiconductor equipment described in the prior art comprises a mechanism mounting bracket; a vertical movement module; a rack and pinion mechanism is moved left and right; front and rear telescopic mechanisms of the material taking clamping jaw; a 90-degree rotation mechanism of the material taking clamping jaw; the female ring multilayer extracting mechanism of terminal.

According to the technology, although the primary and secondary rings in the lifting basket can be held through the primary and secondary multi-ring material taking mechanism, the positions of the clamping plates on the primary and secondary multi-ring material taking mechanism are fixed, and when the primary and secondary rings with different thicknesses are encountered, the positions of the clamping plates in the primary and secondary multi-ring material taking mechanism cannot be adjusted, so that the primary and secondary rings cannot be clamped and fixed conveniently.

Disclosure of Invention

Based on this, the present utility model aims to provide a multi-layer material taking mechanism for a primary ring and a secondary ring of a semiconductor device, so as to solve the technical problems set forth in the above background art.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

the utility model provides a multi-layer feeding mechanism of primary and secondary ring of semiconductor equipment, includes the installing support, install on the installing support and remove elevating system, the fixed plate is installed to one side outer wall that the installing support was kept away from to remove elevating system, the mounting groove has all been seted up to fixed plate upper surface both sides, every all be connected with the rack in the mounting groove, the fixed plate lower surface is equipped with the U template, U type end inner wall at U template both ends is located the mounting groove top and is connected with the connecting block respectively, the U template is close to the bottom in seted up the standing groove, all be equipped with flexible subassembly in the standing groove, U template below is connected with rotary mechanism, the one end that U template was kept away from to rotary mechanism is connected with gets the material subassembly, flexible subassembly is used for driving and gets material subassembly concertina movement, it is used for carrying out the centre gripping to the primary and secondary ring to get the material subassembly.

Preferably, the material taking assembly comprises a fixed block, a second bidirectional motor is arranged in the fixed block, a first rotating wheel is sleeved and fixed on the outer walls of the output ends of the two ends of the second bidirectional motor respectively, one side of each first rotating wheel is provided with a bidirectional threaded rod, each outer wall of the bottom end of each bidirectional threaded rod is positioned at the first rotating wheel and sleeved and fixed with a second rotating wheel, each bidirectional threaded rod is positioned above the second rotating wheel and sleeved with two movable plates, and one end of each movable plate, far away from the bidirectional threaded rod, is connected with a clamping plate.

Preferably, a fixed slot is formed in the fixed block at the second bidirectional motor, movable slots communicated with the outer wall and the fixed slot are formed in the fixed block at the movable plate, and one end of the movable plate, far away from the bidirectional threaded rod, penetrates out of the movable slot and extends to the outside to be connected with the clamping plate.

Preferably, the fixed block outer wall is all connected with the groove inner wall bolt on the rotary mechanism, the output at second bidirectional motor both ends is all connected with fixed slot inner wall bolt, every the second rotates the wheel and all is connected with first rotation wheel meshing, every bidirectional threaded rod all rotates with the removal inslot wall to be connected, every the movable plate all with bidirectional threaded rod outer wall threaded connection, every movable plate outer wall all with removal inslot wall sliding connection.

Preferably, the telescopic assembly comprises a first bidirectional motor, the first bidirectional motor is located the standing groove, the output at the two ends of the first bidirectional motor is connected with a first worm, one side of each first worm is provided with a second worm, each second worm outer wall is located at the first worm and is sleeved with and fixed with a first worm wheel, each second worm is located at one side of the top and is provided with a rotating rod, each rotating rod outer wall is located at the second worm and is sleeved with and fixed with a second worm wheel, and each rotating rod is far away from one end outer wall of the second worm wheel and is sleeved with and fixed with a gear.

Preferably, the U-shaped plate is located at the first worm wheel and is provided with a rotating groove communicated with the placing groove, the U-shaped plate is located at the second worm wheel and is provided with a rotating groove, the top end of each second worm penetrates through the rotating groove and extends into the rotating groove to be connected with the second worm wheel, each connecting block is located at the gear and is provided with a through groove communicated with the lower surface, each through groove is communicated with the mounting groove, each gear is located above the rack, and one end of each rotating rod, far away from the second worm wheel, penetrates through the outer wall of the U-shaped plate and extends into the through groove.

Preferably, each first worm is rotationally connected with the inner wall of the placing groove, each second worm is rotationally connected with the inner wall of the rotating groove and the inner wall of the rotating groove respectively at two ends, each first worm wheel is engaged and connected with the first worm, each second worm wheel is engaged and connected with the second worm, each rotating rod is rotationally connected with the inner wall of the rotating groove and the inner wall of the through groove respectively at two ends, and each gear is engaged and connected with the rack.

In summary, the technical scheme mainly has the following beneficial effects: to the problem that the background art put forward, this application drives the material subassembly through the flexible subassembly that sets up and stretches out and draws back, and the material subassembly that the rethread set up is when needs carry out the centre gripping to the primary and secondary ring of thickness inequality, can carry out the adjustment position through removing two grip blocks to reach and to carry out the centre gripping to the primary and secondary ring of different thickness.

Drawings

FIG. 1 is an isometric view of the present utility model overall structure;

FIG. 2 is a plan view of the present utility expansion assembly;

FIG. 3 is a cut-away view of the present utility model telescoping assembly and take-out assembly;

fig. 4 is an enlarged view of the present utility model at a.

Description of the drawings: 1. a mounting bracket; 2. a movable lifting mechanism; 3. a rotation mechanism; 4. a U-shaped plate; 401. a connecting block; 4011. a through groove; 402. a placement groove; 403. a rotating groove; 404. a rotary groove; 5. a telescoping assembly; 501. a first bi-directional motor; 502. a first worm; 503. a first worm wheel; 504. a second worm; 505. a second worm wheel; 506. a rotating lever; 507. a gear; 6. a material taking assembly; 601. a fixed block; 602. a moving groove; 603. a fixing groove; 604. a second bi-directional motor; 605. a two-way threaded rod; 606. a moving plate; 607. a clamping plate; 608. a first rotating wheel; 609. a second rotating wheel; 7. a fixing plate; 701. a mounting groove; 702. a rack.

Detailed Description

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model.

Examples

Wherein, all electrical components in the device are controlled by an external controller.

Referring to fig. 1-4, the present utility model provides a technical solution:

the utility model provides a multi-layer feeding mechanism of primary and secondary ring of semiconductor equipment, including installing support 1, install on the installing support 1 and remove elevating system 2, remove elevating system 2 and keep away from one side outer wall of installing support 1 and install fixed plate 7, the mounting groove 701 has all been seted up to fixed plate 7 upper surface both sides, all be connected with rack 702 in the mounting groove 701, the fixed plate 7 lower surface is equipped with U type end inner wall at U type board 4,U template 4 both ends and is located the connecting block 401 respectively of mounting groove 701 top, U type board 4 is close to and has offered standing groove 402 in the bottom, all be equipped with telescopic assembly 5 in the standing groove 402, U type board 4 below is connected with rotary mechanism 3, rotary mechanism 3 is connected with the feeding assembly 6 from the one end of U type board 4, telescopic assembly 5 is used for driving feeding assembly 6 telescopic movement, feeding assembly 6 is used for carrying out the centre gripping to the primary and secondary ring.

The telescopic assembly 5 drives the material taking assembly 6 to stretch out and draw back, and the material taking assembly 6 is arranged to clamp the primary and secondary rings with different thicknesses through moving the two clamping plates 607 to adjust the positions, so that the primary and secondary rings with different thicknesses can be clamped.

When the semiconductor primary and secondary ring is required to be taken, a worker starts the movable lifting mechanism 2 to move through the external controller, when the movable lifting mechanism 2 moves to a specified position, the worker starts the telescopic assembly 5 to move to the specified position through the external controller, then the worker starts the taking assembly 6 to clamp the primary and secondary ring through the external controller, then the telescopic operation of the telescopic assembly 5 is repeated to enable the taking assembly 6 to stretch out and draw back to an initial position, the rotating mechanism 3 is started through the external controller to drive the taking assembly 6 to rotate with the clamped primary and secondary ring, then the movable lifting mechanism 2 is started through the external controller to place the primary and secondary ring to the specified position, and when the primary and secondary ring is required to be talked to be loosened, the worker repeats the primary and secondary ring clamping operation.

Referring to fig. 3-4, the material taking assembly 6 includes a fixing block 601, a second bi-directional motor 604 is disposed in the fixing block 601, outer walls of output ends of two ends of the second bi-directional motor 604 are respectively sleeved and fixed with a first rotating wheel 608, one side of the first rotating wheel 608 is provided with a bi-directional threaded rod 605, outer walls of bottom ends of the bi-directional threaded rod 605 are respectively sleeved and fixed with a second rotating wheel 609, two moving plates 606 are sleeved and fixed above the second rotating wheel 609, one ends of the moving plates 606, far away from the bi-directional threaded rod 605, are connected with a clamping plate 607, fixed grooves 603 are formed in the fixing block 601, moving grooves 602 which are communicated with the outer walls and the fixed grooves 603 are formed in the positions of the fixing block 601, one ends of the moving plates 606, far away from the bi-directional threaded rod 605, penetrate out of the moving grooves 602 and extend to the outside to be connected with the clamping plate 607, outer walls of the fixing block 601 are all connected with inner walls of the first rotating wheel 608, output ends of the second bi-directional motor 604 are all connected with inner walls of the fixing grooves 603 by bolts, the second rotating wheel 605 are all meshed with the first rotating wheel 608, the inner walls 605 are all connected with the inner walls of the moving plates 602, and the two-way rotating plates 605 are all connected with the outer walls of the two-way rotating plates 602, and all connected with the two moving plates 602, and all the two-way rotating plates are connected with the two sides of the moving plates 602, and all connected with the two-way rotating plates.

The staff starts the second bi-directional motor 604 to work through the external controller, and the output ends at two ends of the working second bi-directional motor 604 drive the second rotating wheel 609 in meshed connection to rotate through the first rotating wheel 608, the second rotating wheel 609 rotates the bi-directional threaded rod 605, the rotating bi-directional threaded rod 605 drives the two moving plates 606 in threaded connection to synchronously move inwards, and the moving plates 606 drive the clamping plates 607 to move until the clamping plates 607 clamp the primary ring and the secondary ring.

Referring to fig. 2-3, the telescopic assembly 5 includes a first bi-directional motor 501, the first bi-directional motor 501 is located in the placement groove 402, output ends at two ends of the first bi-directional motor 501 are connected with a first worm 502, one side of the first worm 502 is provided with a second worm 504, an outer wall of the second worm 504 is located at the first worm 502 and sleeved with a first worm wheel 503, one side of the second worm 504 is provided with a rotating rod 506, an outer wall of the rotating rod 506 is located at the second worm 504 and sleeved with a second worm wheel 505, an outer wall of one end of the rotating rod 506 away from the second worm wheel 505 is sleeved with a gear 507, a U-shaped plate 4 is located at the first worm wheel 503 and provided with a rotating groove 403 communicated with the placement groove 402, a U-shaped plate 4 is located at the second worm wheel 505 and provided with a rotating groove 404, the top end of the second worm 504 penetrates through the rotating groove 403 and extends into the rotating groove 404 to be connected with the second worm wheel 505, a through groove 4011 communicated with the lower surface is formed in the position of the connecting block 401, which is located at the gear 507, the through groove 4011 is communicated with the mounting groove 701, the gear 507 is located above the rack 702, one end of the rotating rod 506, which is far away from the second worm wheel 505, penetrates through the outer wall of the U-shaped plate 4 and extends into the through groove 4011, the first worm 502 is rotationally connected with the inner wall of the placing groove 402, two ends of the second worm 504 are rotationally connected with the rotating groove 403 and the inner wall of the rotating groove 404 respectively, the first worm wheel 503 is in meshed connection with the first worm 502, the second worm wheel 505 is in meshed connection with the second worm wheel 504, two ends of the rotating rod 506 are rotationally connected with the rotating groove 404 and the inner wall of the through groove 4011 respectively, and the gear 507 is in meshed connection with the rack 702.

The staff starts first bi-directional motor 501 work through external control ware, and the output at first bi-directional motor 501 both ends drives first worm 502 rotation, and rotatory first worm 502 drives second worm 504 rotation through meshing connection's first worm wheel 503, and rotatory second worm 504 drives meshing connection's second worm wheel 505 rotation, and rotatory second worm wheel 505 drives gear 507 rotation through dwang 506, and rotatory gear 507 rotates the displacement on meshing connection's rack 702, and until U template 4 drives rotary mechanism 3 and removes to the appointed position.

The working principle of the utility model is as follows: when the semiconductor primary-secondary ring is required to be taken, a worker starts the movable lifting mechanism 2 to move through the external controller, when the movable lifting mechanism 2 moves to a specified position, the worker starts the first bidirectional motor 501 to work through the external controller, the output ends at two ends of the first bidirectional motor 501 drive the first worm 502 to rotate, the rotating first worm 502 drives the second worm 504 to rotate through the meshed and connected first worm wheel 503, the rotating second worm 504 drives the meshed and connected second worm wheel 505 to rotate, the rotating second worm wheel 505 drives the gear 507 to rotate through the rotating rod 506, the rotating gear 507 rotationally displaces on the meshed and connected rack 702 until the U-shaped plate 4 drives the rotating mechanism 3 to move to the specified position, then the worker starts the second bidirectional motor 604 to work through the external controller, the output ends at two ends of the working second bidirectional motor 604 drive the second rotating wheels 609 which are in meshed connection to rotate through the first rotating wheels 608, the rotating second rotating wheels 609 drive the bidirectional threaded rod 605 to rotate, the rotating bidirectional threaded rod 605 drives the two movable plates 606 in threaded connection to synchronously move inwards, the movable plates 606 drive the clamping plates 607 to move until the clamping plates 607 hold the primary ring and the secondary ring, then the telescopic operation of the telescopic assembly 5 is repeated to enable the material taking assembly 6 to be in an initial position, the rotating mechanism 3 is started through the external controller to drive the material taking assembly 6 to rotate with the clamped primary ring and the secondary ring to be placed at a designated position through the external controller to start the movable lifting mechanism 2, and when the primary ring needs to be loosened, the worker repeats the primary ring clamping operation.

The above embodiments are only for illustrating the technical idea of the present utility model, and the protection scope of the present utility model is not limited thereto, and any modification made on the basis of the technical scheme according to the technical idea of the present utility model falls within the protection scope of the present utility model.

Claims (7)

1. The utility model provides a semiconductor device primary and secondary ring multilayer feeding mechanism, includes installing support (1), its characterized in that: install on installing support (1) and remove elevating system (2), remove elevating system (2) and keep away from one side outer wall of installing support (1) and install fixed plate (7), mounting groove (701) have all been seted up to fixed plate (7) upper surface both sides, every all be connected with rack (702) in mounting groove (701), fixed plate (7) lower surface is equipped with U template (4), U type end inner wall at U template (4) both ends is located and is connected with connecting block (401) respectively above mounting groove (701), U template (4) are close to and have seted up standing groove (402) in the bottom, all be equipped with telescopic machanism (5) in standing groove (402), U template (4) below is connected with rotary mechanism (3), one end that U template (4) were kept away from to rotary mechanism (3) is connected with and gets material subassembly (6), telescopic machanism (5) are used for driving and get material subassembly (6) flexible removal, it is used for carrying out centre gripping to sub-ring to get material subassembly (6).

2. The semiconductor device primary-secondary loop multilayer take off mechanism of claim 1, wherein: the material taking assembly (6) comprises a fixed block (601), a second bidirectional motor (604) is arranged in the fixed block (601), a first rotating wheel (608) is sleeved and fixed on the outer walls of output ends of the two ends of the second bidirectional motor (604), one side of each first rotating wheel (608) is provided with a bidirectional threaded rod (605), the outer walls of the bottom ends of the bidirectional threaded rods (605) are sleeved and fixed with second rotating wheels (609) at the positions of the first rotating wheels (608), the bidirectional threaded rods (605) are sleeved and fixed above the second rotating wheels (609), two movable plates (606) are sleeved and arranged on the outer walls of output ends of the second bidirectional motors (604), and one ends, far away from the bidirectional threaded rods (605), of each movable plate (606) are connected with clamping plates (607).

3. The semiconductor device primary-secondary loop multilayer take off mechanism of claim 2, wherein: a fixed groove (603) is formed in the fixed block (601) and located at the second bidirectional motor (604), movable grooves (602) communicated with the outer wall and the fixed groove (603) are formed in the fixed block (601) and located at the movable plate (606), and one end, far away from the bidirectional threaded rod (605), of the movable plate (606) penetrates out of the movable groove (602) and extends to the outside to be connected with the clamping plate (607).

4. A semiconductor device primary and secondary loop multilayer take off mechanism as defined in claim 3, wherein: the outer wall of the fixed block (601) is in bolt connection with the inner wall of a groove on the rotating mechanism (3), the output ends at two ends of the second bidirectional motor (604) are in bolt connection with the inner wall of the fixed groove (603), each second rotating wheel (609) is in meshed connection with the first rotating wheel (608), each bidirectional threaded rod (605) is in rotary connection with the inner wall of the movable groove (602), each movable plate (606) is in threaded connection with the outer wall of the bidirectional threaded rod (605), and each outer wall of the movable plate (606) is in sliding connection with the inner wall of the movable groove (602).

5. The semiconductor device primary-secondary loop multilayer take off mechanism of claim 1, wherein: the telescopic component (5) comprises a first bidirectional motor (501), the first bidirectional motor (501) is located in the placing groove (402), output ends at two ends of the first bidirectional motor (501) are connected with a first worm (502), one side of each first worm (502) is provided with a second worm (504), one side of each second worm (504) is located at the first worm (502) and is sleeved and fixed with a first worm wheel (503), one side of each second worm (504) is located at the top end and is provided with a rotating rod (506), one side of each rotating rod (506) is located at the second worm (504) and is sleeved and fixed with a second worm wheel (505), and one end outer wall of each rotating rod (506) far away from the second worm wheel (505) is sleeved and fixed with a gear (507).

6. The semiconductor device primary and secondary loop multilayer take off mechanism of claim 5, wherein: the U-shaped plate (4) is located at the first worm wheel (503) and is provided with rotating grooves (403) communicated with the placing grooves (402), the U-shaped plate (4) is located at the second worm wheel (505) and is provided with rotating grooves (404), the top end of each second worm (504) penetrates through the rotating grooves (403) and extends into the rotating grooves (404) to be connected with the second worm wheel (505), the connecting block (401) is located at the gear (507) and is provided with through grooves (4011) communicated with the lower surface, the through grooves (4011) are communicated with the mounting grooves (701), each gear (507) is located above the racks (702), and one end, far away from the second worm wheel (505), of each rotating rod (506) penetrates through the outer wall of the U-shaped plate (4) and extends into the through grooves (4011).

7. The semiconductor device primary and secondary loop multilayer take off mechanism of claim 6, wherein: every first worm (502) all rotates with standing groove (402) inner wall to be connected, every second worm (504) both ends respectively with rotate groove (403) and rotary groove (404) inner wall and rotate to be connected, every first worm wheel (503) all with first worm (502) meshing to be connected, every second worm wheel (505) all with second worm (504) meshing to be connected, every dwang (506) both ends respectively with rotary groove (404) and logical groove (4011) inner wall rotation to be connected, every gear (507) all with rack (702) meshing to be connected.