CN220590078U - Vertical double-side heat conduction cold and hot table for measuring thermal strain of chip section - Google Patents
Vertical double-side heat conduction cold and hot table for measuring thermal strain of chip section Download PDFInfo
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- CN220590078U CN220590078U CN202322133458.1U CN202322133458U CN220590078U CN 220590078 U CN220590078 U CN 220590078U CN 202322133458 U CN202322133458 U CN 202322133458U CN 220590078 U CN220590078 U CN 220590078U
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- 230000007246 mechanism Effects 0.000 claims abstract description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 48
- 239000007788 liquid Substances 0.000 claims description 24
- 229910052757 nitrogen Inorganic materials 0.000 claims description 24
- 238000010438 heat treatment Methods 0.000 claims description 20
- 238000005259 measurement Methods 0.000 claims description 18
- 230000002457 bidirectional effect Effects 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000002146 bilateral effect Effects 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 230000008859 change Effects 0.000 description 12
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Abstract
The utility model provides a vertical double-side heat conduction cold and hot table for measuring thermal strain of a chip section, which comprises a temperature changing mechanism and a clamping mechanism, wherein the temperature changing mechanism comprises a temperature changing plate, the clamping mechanism comprises a supporting table, at least two groups of vertical supporting frames and a driving assembly, the vertical supporting frames are arranged on the supporting table in a sliding mode, the driving assembly is used for driving the two groups of vertical supporting frames to move in opposite directions or in opposite directions, the temperature changing plate is arranged on the vertical supporting frames through a heat insulating plate group, the temperature changing plates on the two groups of vertical supporting frames are arranged in a facing mode, clamping and releasing of the chip are realized through driving the movement of the vertical supporting frames, two ends of the chip can be abutted against the temperature changing plate, on one hand, the temperature transmission of the two sides can be enhanced in a mode of abutting the two sides, and the temperature changing plates on the two sides of the chip can be heated or cooled simultaneously, so that the chip is heated uniformly, on the other hand, the device can also be suitable for chips with different specifications, and the universality of the device is improved.
Description
Technical Field
The utility model relates to the technical field of chip section thermal strain measurement, in particular to a vertical double-side heat conduction cold and hot table for chip section thermal strain measurement.
Background
At present, in a chip section thermal strain measurement experiment, a cold and hot table is required to perform temperature change measurement on chips at various temperatures; however, the structure of the conventional cooling and heating table is mainly a flat type single-side temperature control structural design, such as a laboratory analysis and test cooling and heating table proposed by publication number CN218459580U, and the heating table of the single-side temperature control structure is easy to cause the problem of uneven heating of the chip when providing a specified temperature environment for the chip, thereby affecting the thermal strain measurement of the chip.
Disclosure of Invention
In view of the above, the utility model aims to provide a vertical double-sided heat conduction cooling and heating platform for measuring the thermal strain of a chip section.
In order to solve the technical problems, the utility model adopts the following technical scheme:
the utility model provides a vertical bilateral heat conduction cold and hot platform for chip cross-section thermal strain measurement, includes temperature change mechanism and fixture, temperature change mechanism includes the temperature change board, fixture includes brace table, at least two sets of support frame, the drive assembly of erectting of locating on the brace table that slide, drive assembly is used for driving two sets of erectting the support frame and remove in opposite directions or in opposite directions, and the temperature change board passes through the temperature change board group and installs on erectting the support frame, and the temperature change board on two sets of erectting the support frame is faced the setting.
The middle part of the bottom end of the vertical support frame is provided with a convex main sliding block, and the support table is provided with a main sliding groove corresponding to the main sliding block;
the driving assembly comprises a bidirectional screw rod and a screw rod seat, wherein the bidirectional screw rod is installed on the supporting table through a bearing and extends into the main sliding groove, and the screw rod seat is fixedly connected with the main sliding block in a penetrating mode.
The heat insulation plate set comprises a floating plate and a fixed plate, wherein the vertical support frame is of an n-shaped structure and comprises a main part at the middle position and side parts at two side positions, the floating plate is in sliding connection with the side parts of the vertical support frame, the fixed plate is fixedly connected with the main part of the vertical support frame, a placement area for placing the temperature changing plate is formed between the floating plate and the fixed plate, a jacking bolt is connected with the side parts of the vertical support frame in a threaded manner and is used for pushing the floating plate along the direction of the fixed plate.
Grooves for embedding ceramic balls are correspondingly formed on the facing ends of the floating plate and the fixed plate and the two side ends of the variable-temperature plate.
The temperature changing plate is made of copper materials and is internally provided with a liquid nitrogen runner, and a liquid nitrogen inlet pipe and a liquid nitrogen outlet pipe which are communicated with the liquid nitrogen runner are arranged at the side end of the temperature changing plate.
And a heating rod is pre-buried in the temperature changing plate and is not contacted with the liquid nitrogen runner, and a control wire electrically connected with the heating rod is arranged at the side end of the temperature changing plate.
And the side end of the temperature changing plate is also connected with a temperature sensor.
The utility model has the advantages and positive effects that
The temperature change plates on the two groups of vertical support frames are arranged in a face-to-face manner, clamping and releasing of chips are realized by driving the vertical support frames to move, both ends of the chips can be abutted against the temperature change plates, on one hand, the temperature transmission can be enhanced in a manner that both sides are abutted against, and the temperature change plates on both sides are used for heating or cooling both sides of the chips at the same time, so that the chips are heated uniformly, the temperature field environment for accurately providing thermal strain measurement is achieved, and on the other hand, the temperature change plate can be suitable for chips with different specifications, and the universality of the device is improved.
Drawings
The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model. In the drawings:
FIG. 1 is an overall block diagram of a vertical dual-sided thermally conductive cold-hot stage for chip cross-section thermal strain measurement in accordance with the present utility model at a first view angle;
FIG. 2 is a cross-sectional view of a vertical double-sided thermally conductive cold-hot stage for chip section thermal strain measurement in accordance with the present utility model;
FIG. 3 is an overall block diagram of a vertical dual-sided thermally conductive cold-hot stage for chip cross-section thermal strain measurement in accordance with the present utility model at a second view angle;
FIG. 4 is a schematic illustration of the location of a groove on a temperature change plate;
in the figure: temperature changing plate 11, supporting table 21, vertical supporting frame 22, jack bolts 221, main sliding block 41, main sliding chute 42, bidirectional screw rod 231, floating plate 51, inserting block 511, inserting slot 512, fixing plate 52, porcelain ball 61, groove 62, liquid nitrogen inlet pipe 71, liquid nitrogen outlet pipe 72, control line 8 and temperature sensor 9.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When a component is considered to be "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1 to 3, the vertical double-sided heat conduction cold and hot bench for measuring the thermal strain of the chip section comprises a temperature changing mechanism and a clamping mechanism, wherein the temperature changing mechanism comprises a temperature changing plate 11, and the temperature changing plate 11 is of a thick strip-shaped plate structure and can perform high-low temperature conversion according to measurement requirements; the clamping mechanism comprises a supporting table 21, at least two groups of vertical supporting frames 22 which are arranged on the supporting table 21 in a sliding mode, and a driving assembly, wherein a chip placement area is formed between the two groups of vertical supporting frames 22, the driving assembly is used for driving the two groups of vertical supporting frames 22 to move oppositely or back to back, further, chips are clamped or released by increasing or reducing the distance between the two groups of vertical supporting frames 22, the temperature changing plates 11 are arranged on the vertical supporting frames 22 through a heat insulating plate group, the heat insulating plate group is used for fixing the temperature changing plates 11 and preventing the temperature changing plates 11 from conducting temperature to the vertical supporting frames 22 and the supporting table 21, the temperature changing plates 11 conduct high-temperature and low-temperature conduction to the chips, the measuring accuracy is further ensured, the temperature changing plates 11 on the two groups of the vertical supporting frames 22 face each other, and both ends of the chips can be abutted against the temperature changing plates 11, so that on one hand, on the other hand, the temperature changing plates 11 on the two sides of the chip are heated up or cooled simultaneously, and the chips are balanced by heating, so that the chips are accurately provided with temperature field environments for measuring the thermal strain, on the one hand, and the device is also applicable to chips with different specifications.
Specifically, the middle part of the bottom end of the upright support frame 22 is provided with a convex main sliding block 41, auxiliary dovetail sliding blocks are symmetrically arranged relative to the main sliding block 41, the support table 21 is provided with a main sliding groove 42 and a dovetail sliding groove corresponding to the main sliding block 41, and the gravity of the support table 21 is uniformly dispersed due to the design of three groups of sliding blocks, so that stable sliding in the sliding process of the support table 21 is ensured;
the driving assembly comprises a bidirectional screw rod 231 and a screw rod seat, the bidirectional screw rod 231 is mounted on the supporting table 21 through a bearing 3 and extends into the main sliding groove 42, so that the bidirectional screw rod 231 cannot occupy the mounting space of the vertical supporting frame 22, the screw rod seat and the main sliding block 41 are fixedly connected in a penetrating manner, and further the bidirectional screw rod 231 is rotated to realize the opposite or opposite movement of the screw rod seat, and the opposite or opposite movement of the two groups of vertical supporting frames 22 is realized.
Further, in order to prevent the temperature of the temperature changing plate 11 from being conducted to a heat conducting member (such as the vertical supporting frame 22 and the supporting table 21) except for a chip, thereby causing the temperature losing of the temperature changing plate 11, in the technical scheme, ceramic balls 61 with better heat insulation effect are adopted between the temperature changing plate 11 and the vertical supporting frame 22 to be connected;
as shown in fig. 2 to 4, specifically, the thermal insulation plate set includes a floating plate 51 and a fixed plate 52, the vertical support frame 22 has an n-shaped structure, and includes a main portion in a middle position and side portions at two sides, the floating plate 51 and the side portions of the vertical support frame 22 are slidably connected, that is, slots 512 are configured on the side portions, inserting blocks 511 are correspondingly configured on the floating plate 51, the fixed plate 52 is fixedly connected with the main portion of the vertical support frame 22, a placement area for placing the temperature changing plate 11 is formed between the floating plate 51 and the fixed plate 52, a tightening bolt 221 is screwed on the side portions of the vertical support frame 22, the tightening bolt 221 is used for pushing the floating plate 51 along the direction of the fixed plate 52, and further, by adjusting the distance between the fixed plate 52 and the floating plate 51, the temperature changing plate 11 is clamped or released, grooves 62 for embedding ceramic balls 61 are correspondingly configured on the facing ends of the floating plate 51 and the two side ends of the temperature changing plate 11, in this embodiment, two sets of grooves 62 are respectively configured on the two side ends of the floating plate 11, and the temperature changing plate 11 is not lost by tightening the ceramic balls 61 on the top ends of the vertical support frame, and the temperature changing plate 11 is not in contact with the temperature changing plate 11.
Specifically, the temperature changing plate 11 is made of copper material and is internally provided with a liquid nitrogen flow channel, the liquid nitrogen flow channel can be in an inverted U shape or a coil shape, a liquid nitrogen inlet pipe 71 and a liquid nitrogen outlet pipe 72 which are communicated with the liquid nitrogen flow channel are arranged at the side end of the temperature changing plate 11, and liquid nitrogen flows through the liquid nitrogen flow channel through the liquid nitrogen inlet pipe 71 and then is discharged from the liquid nitrogen outlet pipe 72, so that the stability of low temperature is ensured;
specifically, a heating rod is pre-buried in the temperature changing plate 11, the heating rod is not in contact with the liquid nitrogen runner, so that mutual influence is avoided, a control wire 8 electrically connected with the heating rod is arranged at the side end of the temperature changing plate 11, when heating is needed, liquid nitrogen is emptied firstly, then a power supply device is electrically connected with the heating rod through the control wire 8, temperature rising of the temperature changing plate 11 is realized, a temperature sensor 9 is further connected to the side end of the temperature changing plate 11, real-time temperature signal feedback can be provided for a controller, and further real-time temperature monitoring and temperature control are realized;
specifically, the upright support frame 22 is further provided with a quick-connection module, the quick-connection module is a power control end of the heating rod and an output end of the temperature sensor 9 respectively, and the quick-connection module is of a direct-connection type male plug structure and can be connected with a controller quickly through a plug-in direct-connection type female plug.
The working principle and working process of the utility model are as follows:
before measurement, the chip is placed between two groups of temperature changing plates 11, the bidirectional screw rod 231 is rotated, the vertical supporting frame 22 drives the temperature changing plates 11 to move in opposite directions until the chip is clamped at two sides of the chip, then a heating rod or a liquid nitrogen supply device is started according to the measured temperature requirement, so that the temperature changing plates 11 are heated or refrigerated, the ceramic balls 61 are tightly abutted against two side ends of the temperature changing plates 11, the top ends and the bottom ends of the temperature changing plates 11 are in a suspension state, so that the temperature loss caused by contact with the vertical supporting frame 22 does not exist, and the temperature changing plates 11 at two sides simultaneously heat or cool the two sides of the chip, so that the chip is heated uniformly, and the temperature field environment for accurately providing thermal strain measurement is achieved.
The foregoing describes the embodiments of the present utility model in detail, but the description is only a preferred embodiment of the present utility model and should not be construed as limiting the scope of the utility model. All equivalent changes and modifications within the scope of the present utility model are intended to be covered by this patent.
Claims (7)
1. A vertical bilateral heat conduction cold and hot platform for chip cross-section thermal strain measurement, its characterized in that includes alternating temperature mechanism and fixture, alternating temperature mechanism includes alternating temperature board (11), fixture includes brace table (21), at least two sets of smooth support frame (22) of locating on brace table (21), drive assembly, two sets of form the chip between erectting support frame (22) and lay the region, drive assembly is used for driving two sets of erectting support frame (22) are moved in opposite directions or are carried on the back of each other, and alternating temperature board (11) are installed on erectting support frame (22) through the heat-insulating board group, and alternating temperature board (11) on two sets of erectting support frame (22) are the setting in the face of each other.
2. The vertical double-sided heat conduction cold and hot platform for measuring the thermal strain of the chip section according to claim 1, wherein a convex main sliding block (41) is constructed at the middle position of the bottom end of the vertical supporting frame (22), and a main sliding groove (42) corresponding to the main sliding block (41) is formed on the supporting platform (21);
the driving assembly comprises a bidirectional screw rod (231) and a screw rod seat, the bidirectional screw rod (231) is installed on the supporting table (21) through a bearing (3) and extends into the main sliding groove (42), and the screw rod seat is fixedly connected with the main sliding block (41) in a penetrating mode.
3. The vertical double-sided heat conduction cooling and heating table for chip section thermal strain measurement according to claim 2, wherein the heat insulation plate group comprises a floating plate (51) and a fixed plate (52), the vertical support frame (22) is of an n-shaped structure and comprises a main part at a middle position and side parts at two side positions, the floating plate (51) is in sliding connection with the side parts of the vertical support frame (22), the fixed plate (52) is fixedly connected with the main part of the vertical support frame (22), a placement area for placing a temperature changing plate (11) is formed between the floating plate (51) and the fixed plate (52), a jacking bolt (221) is connected to the side parts of the vertical support frame (22) in a threaded manner, and the jacking bolt (221) is used for pushing against the floating plate (51) along the direction of the fixed plate (52).
4. A vertical double-sided heat-conducting cold-hot bench for chip section thermal strain measurement according to claim 3, characterized in that grooves (62) for embedding ceramic balls (61) are correspondingly formed on the facing ends of the floating plate (51) and the fixed plate (52) and on both side ends of the temperature changing plate (11).
5. The vertical double-sided heat conduction cold and hot bench for chip section thermal strain measurement according to claim 1, characterized in that the temperature changing plate (11) is made of copper material and internally provided with a liquid nitrogen runner, and a liquid nitrogen inlet pipe (71) and a liquid nitrogen outlet pipe (72) which are communicated with the liquid nitrogen runner are arranged on the side ends of the temperature changing plate (11).
6. The vertical double-sided heat conduction cold and hot bench for measuring the thermal strain of the chip section according to claim 5, characterized in that a heating rod is pre-embedded in the temperature changing plate (11), the heating rod is not contacted with the liquid nitrogen runner, and a control line (8) electrically connected with the heating rod is arranged at the side end of the temperature changing plate (11).
7. The vertical double-sided heat conduction cold and hot stage for chip section thermal strain measurement according to claim 6, wherein the side end of the temperature changing plate (11) is further connected with a temperature sensor (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322133458.1U CN220590078U (en) | 2023-08-08 | 2023-08-08 | Vertical double-side heat conduction cold and hot table for measuring thermal strain of chip section |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322133458.1U CN220590078U (en) | 2023-08-08 | 2023-08-08 | Vertical double-side heat conduction cold and hot table for measuring thermal strain of chip section |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220590078U true CN220590078U (en) | 2024-03-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322133458.1U Active CN220590078U (en) | 2023-08-08 | 2023-08-08 | Vertical double-side heat conduction cold and hot table for measuring thermal strain of chip section |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220590078U (en) |
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2023
- 2023-08-08 CN CN202322133458.1U patent/CN220590078U/en active Active
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