CN220569658U - Mounting seat convenient for semiconductor chip - Google Patents
Mounting seat convenient for semiconductor chip Download PDFInfo
- Publication number
- CN220569658U CN220569658U CN202321846259.9U CN202321846259U CN220569658U CN 220569658 U CN220569658 U CN 220569658U CN 202321846259 U CN202321846259 U CN 202321846259U CN 220569658 U CN220569658 U CN 220569658U
- Authority
- CN
- China
- Prior art keywords
- semiconductor chip
- mounting
- groove
- mounting base
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 43
- 230000007246 mechanism Effects 0.000 claims abstract description 24
- 235000014676 Phragmites communis Nutrition 0.000 claims abstract description 9
- 239000000428 dust Substances 0.000 claims description 20
- 230000017525 heat dissipation Effects 0.000 claims description 11
- 230000008878 coupling Effects 0.000 claims description 6
- 238000010168 coupling process Methods 0.000 claims description 6
- 238000005859 coupling reaction Methods 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 3
- 238000004804 winding Methods 0.000 abstract description 14
- 238000000034 method Methods 0.000 abstract description 4
- 230000008569 process Effects 0.000 abstract description 3
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a mounting seat for a semiconductor chip, which comprises: and the mounting bottom plate is used for mounting the semiconductor chip. According to the utility model, through the mutual matching of the mounting base plate, the mounting base, the cover plate, the pressing mechanism and the connecting mechanism, the mounting base is convenient for placing the semiconductor chip in the mounting base, the connecting screw penetrates through the through groove and is screwed into the threaded sleeve, the cover plate is connected with the mounting base plate, the knob insert is inserted into the slot, the knob insert is screwed, the winding barrel is driven to rotate, the movable block is pulled to move in the movable groove, the bent reed is driven to deform and extrude the semiconductor chip, the limit bolt is screwed, the movable block is limited, the bent reed can be always kept in a pressing state of the semiconductor chip, the stability of the semiconductor chip in the use process is improved, the chip cannot be loosened due to external shaking, the stability of connection is ensured, and the service life of the semiconductor chip is prolonged.
Description
Technical Field
The utility model relates to the technical field of chip mounting, in particular to a mounting seat convenient for a semiconductor chip.
Background
Semiconductor chip, which is a semiconductor device that can realize a certain function, is manufactured by etching and wiring on a semiconductor sheet. Not only silicon chips, but also semiconductor materials such as gallium arsenide and germanium are common.
The method comprises the following steps: CN208722866U, the disclosed electronic chip mount pad, including mount pad and heat dissipation plectrum, the pin groove has been seted up on two symmetrical lateral walls of mount pad, the louvre has been seted up on two lateral walls of keeping away from the pin groove on the mount pad, first recess has been seted up between the louvre to being located on the mount pad, the second recess has been seted up to the below that is located first recess on the mount pad, a plurality of heat dissipation bars are installed to the below that is located the second recess on the mount pad, the lower extreme of mount pad is fixed with mounting plate, be provided with the screw hole on the mounting plate, fastening bolt has been twisted to the screw hole internal rotation, the cushion has been cup jointed to the below that is located mounting plate on the fastening bolt, first recess and second recess are inlayed fixedly with pressboard and grafting piece respectively, be fixed with a plurality of heat dissipation plectrums on the apron. This electronic chip mount pad through putting the chip in the mount pad, covers fixedly through the apron, and is fixed simple and convenient to the mount pad heat dissipation is good.
However, the above-mentioned disclosed chip mount cannot compress the chip after the chip is mounted, and the chip is easy to shake due to external shake during use, so that poor contact or damage of the chip is caused, and therefore, a mount for a semiconductor chip needs to be provided.
Disclosure of Invention
The utility model aims to provide a mounting seat for a semiconductor chip, which is convenient for solving the problems in the background technology.
In order to achieve the above purpose, the present utility model provides the following technical solutions: a mount for facilitating semiconductor chips, comprising:
the mounting base plate is used for mounting the semiconductor chip, and the top of the mounting base plate is fixedly connected with a mounting seat;
the cover plate is used for sealing the mounting seat and is arranged above the mounting seat;
the compressing mechanism is used for compressing the semiconductor chip and is arranged in the cover plate;
the connecting mechanism is used for connecting the cover plate with the mounting bottom plate and is fixedly connected to the bottom of the mounting bottom plate.
Preferably, the hold-down mechanism includes a winding drum, the winding drum is connected with the top of apron through the pivot, the movable groove has all been seted up on the surface of apron and be located the left and right sides of winding drum, the inside of movable groove is provided with movable block, and the bottom of two movable blocks is connected through curved reed, the top threaded connection of movable block has stop bolt, stop bolt's bottom fixedly connected with rubber pad, stop bolt's top is connected with the connector link through the pivot, the connector link is connected through the stay cord with the winding drum, the slot has been seted up at the top of winding drum, the inside of slot is provided with the knob inserted block.
Preferably, the connecting mechanism comprises a through groove, a connecting screw is arranged in the through groove, a threaded sleeve is fixedly connected to the surface of the mounting bottom plate corresponding to the position of the through groove, and a cushion block is fixedly connected to the bottom of the threaded sleeve.
Preferably, the top fixedly connected with screwed connection ring of apron, screwed connection has the dust cover at the top screw thread of screwed connection ring, the bottom of mounting plate corresponds the inside dust screen that has through the screw connection in the position of groove of mounting plate, the fixed surface of mount pad is connected with a plurality of heat dissipation sticks.
Compared with the prior art, the utility model has the following beneficial effects:
1. according to the utility model, through the mutual matching of the mounting base plate, the mounting base, the cover plate, the pressing mechanism and the connecting mechanism, the mounting base is convenient for placing the semiconductor chip in the mounting base, the connecting screw penetrates through the through groove and is screwed into the threaded sleeve, the cover plate is connected with the mounting base plate, the knob insert is inserted into the slot, the knob insert is screwed, the winding barrel is driven to rotate, the movable block is pulled to move in the movable groove, the bent reed is driven to deform and extrude the semiconductor chip, the limit bolt is screwed, the movable block is limited, the bent reed can be always kept in a pressing state of the semiconductor chip, the stability of the semiconductor chip in the use process is improved, the chip cannot be loosened due to external shaking, the stability of connection is ensured, and the service life of the semiconductor chip is prolonged.
2. According to the utility model, the dust cover and the dust screen are arranged, so that external dust is prevented from entering the chip in a long-term use process, the chip is prevented from being damaged due to static electricity generated by the dust, the heat dissipation efficiency in the mounting seat is improved through arranging the heat dissipation rod and the through groove at the bottom of the mounting bottom plate, and the friction force between the limit bolt and the cover plate is improved through arranging the rubber pad, so that the limit effect is more stable, and a gap is formed between the mounting bottom plate and the PCB through the thread sleeve and the cushion block, so that the heat dissipation efficiency is improved.
Drawings
FIG. 1 is a cross-sectional view of a front view of the present utility model;
FIG. 2 is a cross-sectional view of a top view of the present utility model
Fig. 3 is a schematic top view of the dust cap of the present utility model.
In the figure: 1 mounting bottom plate, 2 mount pad, 3 apron, 4 hold-down mechanism, 401 receive reel, 402 movable groove, 403 movable block, 404 curved reed, 405 spacing bolt, 406 rubber pad, 407 connector link, 408 slot, 409 knob plug, 5 coupling mechanism, 501 logical groove, 502 connecting screw, 503 thread bush, 504 cushion, 6 screwed joint ring, 7 dust cover, 8 dust screen, 9 heat dissipation stick.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-3, a mounting base for a semiconductor chip, comprising:
the mounting base plate 1 is used for mounting the semiconductor chip, and the top of the mounting base plate 1 is fixedly connected with the mounting seat 2.
And the cover plate 3 is used for sealing the mounting seat 2, and the cover plate 3 is arranged above the mounting seat 2.
The compressing mechanism 4 is used for compressing the semiconductor chip, the compressing mechanism 4 is arranged in the cover plate 3, the compressing mechanism 4 comprises a winding drum 401, the winding drum 401 is connected with the top of the cover plate 3 through a rotating shaft, movable grooves 402 are formed in the left side and the right side of the surface of the cover plate 3 and located on the winding drum 401, movable blocks 403 are arranged in the movable grooves 402, bottoms of the two movable blocks 403 are connected through bent bolts 404, limit bolts 405 are connected to the tops of the movable blocks 403 through threads, rubber pads 406 are fixedly connected to the bottoms of the limit bolts 405, friction force between the limit bolts 405 and the cover plate 3 is improved, the limit effect is more stable, connecting buckles 407 are connected with the winding drum 401 through a pull rope, slots 408 are formed in the top of the winding drum 401, knob inserting blocks 409 are arranged in the slots 408, the knob inserting blocks 409 are screwed, the winding drum 401 are driven to rotate, the movable blocks 403 are pulled to move in the movable grooves 402, accordingly, the bent bolts 404 are driven to deform the semiconductor chip to be extruded, the limit bolts 405 are screwed, the limit bolts 403 are always connected to the semiconductor chip through the rotating shafts, the limit bolts 404 are enabled to be not to be loose, and the semiconductor chip is enabled to be in a stable state, and the semiconductor chip is not to be in use, and the stability is guaranteed.
The coupling mechanism 5 for be connected apron 3 with mounting plate 1, coupling mechanism 5 fixed connection is in the bottom of mounting plate 1, coupling mechanism 5 includes logical groove 501, the inside of logical groove 501 is provided with connecting screw 502, the position fixedly connected with thread bush 503 of logical groove 501 is corresponding to the surface of mounting plate 1, put into mount pad 2 with the semiconductor chip, connecting screw 502 passes logical groove and screws into in thread bush 503, be connected apron 3 with mounting plate 1, the bottom fixedly connected with cushion 504 of thread bush 503, make and form the clearance between mounting plate 1 and the PCB board, the radiating efficiency has been improved, the top fixedly connected with screwed connection ring 6 of apron 3, the top screwed connection of screwed connection ring 6 has dust cover 7, the bottom of mounting plate 1 is corresponding to the inside position of leading to the groove of mounting plate 1 has dust screen 8 through screwed connection, through setting up dust cover 7 and dust screen 8, avoid inside the outside dust entering chip in permanent use, avoid the dust to produce static and lead to the chip to take place to damage, the fixed surface of mount pad 2 is connected with a plurality of sticks 9, the radiating efficiency in the mount pad 2 has been promoted.
When the semiconductor chip is used, the semiconductor chip is placed in the mounting seat 2, the connecting screw 502 penetrates through the through groove and is screwed into the threaded sleeve 503, the cover plate 3 is connected with the mounting bottom plate 1, the knob insert 409 is inserted into the slot 408, the knob insert 409 is screwed, the winding drum 401 is driven to rotate, the movable block 403 is pulled to move in the movable groove 402, the bent reed 404 is driven to deform to extrude the semiconductor chip, the limiting bolt 405 is screwed, the movable block 403 is limited, the bent reed 404 can always keep in a compression state of the semiconductor chip, heat is dissipated through the through groove at the bottom of the mounting bottom plate 1 and the heat dissipation rod 9, and dust is prevented through the dust cover 7 and the dust screen 8.
To sum up: this mount pad for semiconductor chip of being convenient for, through the mutually supporting of mounting plate 1, installation base 2, apron 3, hold-down mechanism 4 and coupling mechanism 5, the problem that has solved in the background art and put forward.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. A mount pad for a semiconductor chip of being convenient for, characterized by comprising:
the mounting base plate (1) is used for mounting the semiconductor chip, and the top of the mounting base plate (1) is fixedly connected with the mounting seat (2);
the cover plate (3) is used for sealing the mounting seat (2), and the cover plate (3) is arranged above the mounting seat (2);
the compressing mechanism (4) is used for compressing the semiconductor chip, and the compressing mechanism (4) is arranged in the cover plate (3);
the connecting mechanism (5) is used for connecting the cover plate (3) with the mounting base plate (1), and the connecting mechanism (5) is fixedly connected to the bottom of the mounting base plate (1).
2. The mount for semiconductor chips of claim 1, wherein: compressing mechanism (4) are including receiving reel (401), the top of reel (401) and apron (3) are connected through the pivot, movable groove (402) have all been seted up on the surface of apron (3) and the left and right sides that is located receipts reel (401), the inside of movable groove (402) is provided with movable block (403), and the bottom of two movable blocks (403) is connected through curved reed (404), the top threaded connection of movable block (403) has stop bolt (405), the bottom fixedly connected with rubber pad (406) of stop bolt (405), the top of stop bolt (405) is connected with connector link (407) through the pivot, connector link (407) are connected through the stay cord with reel (401), slot (408) have been seted up at the top of reel (401), the inside of slot (408) is provided with knob inserted block (409).
3. A mount for a semiconductor chip according to claim 2, wherein: coupling mechanism (5) are including leading to groove (501), the inside of leading to groove (501) is provided with connecting screw (502), the surface of mounting plate (1) corresponds the position fixedly connected with thread bush (503) of leading to groove (501), the bottom fixedly connected with cushion (504) of thread bush (503).
4. A mount for a semiconductor chip as defined in claim 3, wherein: the top fixedly connected with screwed connection ring (6) of apron (3), the top threaded connection of screwed connection ring (6) has dust cover (7), the position that the bottom of mounting plate (1) corresponds mounting plate (1) inside logical groove is through screwed connection having dust screen (8), the fixed surface of mount pad (2) is connected with a plurality of heat dissipation stick (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321846259.9U CN220569658U (en) | 2023-07-13 | 2023-07-13 | Mounting seat convenient for semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321846259.9U CN220569658U (en) | 2023-07-13 | 2023-07-13 | Mounting seat convenient for semiconductor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220569658U true CN220569658U (en) | 2024-03-08 |
Family
ID=90093545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321846259.9U Active CN220569658U (en) | 2023-07-13 | 2023-07-13 | Mounting seat convenient for semiconductor chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220569658U (en) |
-
2023
- 2023-07-13 CN CN202321846259.9U patent/CN220569658U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN220569658U (en) | Mounting seat convenient for semiconductor chip | |
| CN218547047U (en) | Optical fiber wavelength division multiplexer | |
| CN209563047U (en) | A kind of position limiting structure of circuit board | |
| CN218240475U (en) | SFP optical fiber socket | |
| CN114901007A (en) | Circuit isolator breaks away from safety device | |
| CN213577341U (en) | Clamping mounting structure of LED lamp shade | |
| CN208336535U (en) | A kind of explosion-proof injection molding terminal of energy efficiency monitoring | |
| CN219834240U (en) | Television box convenient to install | |
| CN219760528U (en) | Groove type cable bridge with compressing function | |
| CN214535825U (en) | Fixing device of LED lamp tube | |
| CN219889512U (en) | Outdoor LED lamp with good waterproof effect is with installation lamp stand | |
| CN219162942U (en) | Integrated LED large screen | |
| CN215569999U (en) | Install LED lamp strip fast | |
| CN219264086U (en) | LED packaging structure | |
| CN216357886U (en) | High-power electronic radiating fin | |
| CN220066291U (en) | Router shell capable of preventing wiring from falling off | |
| CN220623950U (en) | Ultrathin LED strip lamp | |
| CN219019131U (en) | LED light circuit board convenient to dismantle | |
| CN218849157U (en) | Data line production fixing device | |
| CN218348453U (en) | LED module lamp convenient to installation and dismantlement | |
| CN221053335U (en) | Quick mounting structure of shaft tower | |
| CN218450400U (en) | Portable audio processor | |
| CN220064440U (en) | Optical transceiver module shell convenient to installation | |
| CN220911054U (en) | Wall-mounted advertising machine | |
| CN220312014U (en) | Electric spark machine with wire falling-off prevention structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |