CN220554103U - Loudspeaker assembly - Google Patents

Abstract

Disclosed is a speaker assembly including: a magnetic circuit assembly including a magnet and a magnetically permeable member and defining a magnetic gap; a bracket connected to the magnetic circuit assembly; and a vibration assembly including a diaphragm, a center mount connected to the bracket through the diaphragm, and a voice coil connected to the diaphragm and/or the center mount, a portion of the voice coil being suspended in the magnetic gap, the center mount including one or more support legs extending on an outer sidewall of the voice coil.

Description

Loudspeaker assembly

Technical Field

The present utility model relates to speaker assemblies, and more particularly, to micro-speaker assemblies.

Background

Micro speakers have been widely used in various compact electronic products such as mobile phones, tablet computers, notebook computers, wearable devices, and the like. With the continuous pursuit of lightening and thinning of electronic products, micro speakers, as an important component of electronic products, are also facing the requirement of satisfying both lightening and thinning and large amplitude of products. This is a significant challenge for micro-speakers.

In the process of pursuing the miniaturization and the large amplitude of the micro-speaker, there often occur problems that the total harmonic distortion is increased and the resonance frequency is too high. These problems can lead to acoustic distortion of the micro-speaker in actual use, affecting acoustic performance.

In addition, in the process of light and thin, the micro-speaker may also encounter other problems caused by the volume reduction, which also affect the sound performance of the micro-speaker, further reducing the user experience.

Accordingly, there is a need for a speaker or micro-speaker that can at least partially solve the above-mentioned problems, while satisfying the demands for light weight and large amplitude, and at the same time, improving sound performance.

Disclosure of Invention

The present utility model aims to overcome at least some of the above problems in the prior art.

According to one aspect of the utility model, there is provided a speaker assembly comprising: a magnetic circuit assembly including a magnet and a magnetically permeable member and defining a magnetic gap; a bracket connected to the magnetic circuit assembly; and a vibration assembly including a diaphragm, a center mount connected to the bracket through the diaphragm, and a voice coil connected to the diaphragm and/or the center mount, a portion of the voice coil being suspended in the magnetic gap, the center mount including one or more support legs extending on an outer sidewall of the voice coil.

According to one or more embodiments of the present utility model, the speaker assembly further includes a flexible circuit board connected to an outer sidewall of the voice coil for delivering an audio signal to the voice coil, and the one or more support legs extend to and are connected to the flexible circuit board on the outer sidewall of the voice coil.

According to one or more embodiments of the present utility model, the flexible circuit board is connected to an outer sidewall of the voice coil at or near a lower end of the voice coil.

According to one or more embodiments of the present utility model, the center paste includes a center paste first portion on a radially inner side of the voice coil, a center paste second portion connected between the diaphragm and the voice coil, and a center paste third portion on a radially outer side of the voice coil, the center paste third portion including the one or more support legs.

According to one or more embodiments of the present utility model, the rest of the third portion of the center patch, excluding the one or more support legs, is connected to the diaphragm.

According to one or more embodiments of the present utility model, the one or more support legs include a plurality of support legs symmetrically arranged around an outer sidewall of the voice coil.

According to one or more embodiments of the utility model, the speaker assembly is rectangular, and the one or more support legs comprise a plurality of support legs arranged on short sides of the rectangle.

According to one or more embodiments of the present utility model, the vibration assembly further includes a reinforcing sheet attached to the diaphragm near the support legs.

According to one or more embodiments of the utility model, the speaker assembly is rectangular, circular or racetrack.

According to one or more embodiments of the utility model, each of the support legs is a strap integrally formed with the patch.

According to one or more embodiments of the utility model, the support legs extend over an outer side wall of the voice coil by an axial dimension that is greater than 50% of the axial dimension of the voice coil.

According to one or more embodiments of the utility model, the speaker assembly is a micro-speaker assembly, the height of the speaker assembly being less than 10mm.

Drawings

FIGS. 1A and 1B illustrate a speaker assembly according to one or more embodiments of the present utility model, where FIG. 1A is a top view of the speaker assembly and FIG. 1B is an exploded view of the speaker assembly;

FIG. 2A is a cross-sectional view of the speaker assembly taken along line 2A-2A of FIG. 1;

FIG. 2B is an enlarged view of the encircled portion of FIG. 2A;

FIG. 3A shows an exploded view of the vibration assembly;

FIG. 3B illustrates an assembled view of the vibration assembly, with the vibration assembly partially broken away to show internal structure;

fig. 4A-4C illustrate an assembly process of a vibration assembly of a speaker assembly according to the present utility model;

fig. 5 illustrates a speaker assembly according to another or more embodiments of the utility model;

fig. 6 illustrates an exploded view of a magnetic circuit assembly of a speaker assembly in accordance with one or more embodiments of the present utility model, wherein the side magnets are not shown for clarity;

FIG. 7A is a cross-sectional view taken along line 7A-7A of FIG. 1A and rotated 90 degrees clockwise;

FIG. 7B is a cross-sectional view taken along line 7B-7B of FIG. 1A and rotated 90 degrees clockwise;

FIG. 7C is a view similar to FIG. 2B;

fig. 8 shows a driving force conversion factor BL graph of a speaker assembly according to an embodiment of the present utility model and a speaker assembly of a comparative example;

fig. 9 shows frequency response graphs of a speaker assembly according to an embodiment of the present utility model and a speaker assembly of a comparative example.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.

Unless defined otherwise, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this utility model belongs. In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Herein, the term "axis" refers to the central axis x of the speaker assembly, the term "axial" or "axial direction" refers to a direction along the axis of the speaker, the term "radial" or "radial direction" refers to a direction generally perpendicular to the axis, pointing toward or away from the axis, the term "radially inward" or "radially inward" refers to a component, portion, position or direction relatively close to the axis, and the term "radially outward" or "radially outward" refers to a component, portion, position or direction relatively away from the axis. The terms "upper" and "lower" refer to a component, portion, position or direction of the vibration assembly that is relatively close to or toward the speaker assembly in the axial direction, and "lower" refer to a component, portion, position or direction of the magnetic circuit assembly that is relatively close to or toward the speaker assembly in the axial direction.

The utility model provides a loudspeaker assembly, comprising: a magnetic circuit assembly; a bracket; and a vibration assembly including a diaphragm, a center mount, and a voice coil. The center mount includes one or more support legs extending over an outer sidewall of the voice coil. The one or more supporting legs extend on the outer side wall of the voice coil, so that the connection strength between the middle paste and the voice coil can be enhanced, the structural strength of the vibration assembly is enhanced, and the audio quality of the loudspeaker assembly is improved.

In one or more embodiments according to the present utility model, the speaker assembly further includes a flexible circuit board connected to an outer sidewall of the voice coil for delivering an audio signal to the voice coil, and the one or more support legs extend to and are connected to the flexible circuit board on the outer sidewall of the voice coil.

The structure of the flexible circuit board of the speaker assembly connected to the outer side wall of the voice coil saves axial space compared to previous speaker designs (without support legs, flexible circuit board connected to the lower end face of the voice coil) so that the voice coil of the speaker assembly can have a larger axial dimension and a larger mass. This is very important in the design of micro-speakers with small axial dimensions. At the same time, the support legs extend to and connect with the flexible circuit board, which provides support for the flexible circuit board. This structure ensures the supporting strength of the flexible circuit board. These can reduce the total harmonic distortion and resonant frequency of the speaker assembly, improving the audio performance of the speaker assembly.

Fig. 1A and 1B illustrate a speaker assembly 100 according to one or more embodiments of the present utility model, where fig. 1A is a top view of the speaker assembly 100 and fig. 1B is an exploded view of the speaker assembly 100. Fig. 2A is a cross-sectional view of the speaker assembly 100 taken along line 2A-2A in fig. 1, and fig. 2B is an enlarged view of the circled portion 2B in fig. 2A.

The speaker assembly 100 is generally rectangular and has an axis x. Speaker assembly 100 includes magnetic circuit assembly 160, cradle 150, and vibration assembly 110. The magnetic circuit assembly 160 includes a center magnet 180, side magnets 186, a yoke 162, and a top plate 190, and defines a magnetic gap 176. The yoke 162 and top plate 190 of the magnetic circuit assembly 160 act as magnetic conductors to direct and concentrate the magnetic flux from the center magnet 180 and the side magnets 186 through the magnetic gap 176. The bracket 150 is fixedly connected to the magnetic circuit assembly 160. The vibration assembly 110 includes a diaphragm 112, a center mount 120, and a voice coil 140. The diaphragm 112 includes a diaphragm outer portion 114, a bellows portion 116, and a diaphragm inner portion 118, wherein the diaphragm outer portion 114 is coupled to a bracket 150 and the diaphragm inner portion 118 is coupled to a center piece 120, the bellows portion 116 being between the diaphragm outer portion 114 and the diaphragm inner portion 118, allowing axial movement of the diaphragm inner portion 118 and the center piece 120 relative to the diaphragm outer portion 114. The vibration assembly 110 further includes a flexible circuit board 146 connected to the voice coil 140, the flexible circuit board 146 for delivering audio electrical signals to the voice coil 140.

The center patch 120 includes a center patch first portion 122, a center patch second portion 124, and a center patch third portion 126. The center rest second part 120 is disposed between the diaphragm inner 118 and the voice coil 140, and has an upper surface connected to the diaphragm inner 118 and a lower surface connected to an upper end surface of the voice coil 140, thereby connecting the diaphragm inner 118, the voice coil 140, and the center rest 120 together. Whereby the diaphragm inner portion 118, voice coil 140 and center piece 120 may move axially together relative to the diaphragm outer portion 114 and the bracket 150 and magnetic circuit assembly 160. The center-mount first portion 122 is radially inward of the voice coil 140 and the center-mount third portion 126 is radially outward of the voice coil.

The lower portion of the voice coil 140 is suspended in the magnetic gap 176 of the magnetic circuit assembly 160. When an audio signal is transmitted to the voice coil 140 through the flexible circuit board 146, the magnetic field in the magnetic gap 176 generates a force on the audio signal current through the voice coil 140 that drives the voice coil 140 and, in turn, the center piece 120 and the diaphragm interior 118 to vibrate axially, thereby the speaker assembly 100 emits sound.

Fig. 3A shows an exploded view of the vibration assembly 110. Fig. 3B illustrates an assembled view of the vibration assembly 110, wherein the vibration assembly 110 is partially cut away to show internal structure. As shown, the center strap third portion 126 includes a plurality of support legs 128. The support leg 128 is a strip cut from the middle patch third portion 126, the strip of support leg 128 being connected to the remainder of the middle patch 120 only at its radially inner end. The support leg 128 is bent downward with respect to the rest of the center rest third portion 126 and extends in an axially downward direction to the vicinity of the lower end of the voice coil 140 while abutting the outer side wall of the voice coil 140. The support leg 128 also includes a connection portion 128a. The connection portion 128a is a radially outward bent portion at or near the free end of the support leg 128 for connection to the flexible circuit board 146.

A flexible circuit board 146 is connected to an outer sidewall of the voice coil 140 at or near a lower end of the voice coil 140 for transmitting an audio signal to the voice coil 140. The connection portion 128a of the support leg 128 of the center mount third portion 126 is connected to the flexible circuit board 146 for supporting the flexible circuit board 146. In the illustrated embodiment, the connection portion 128a of the support leg 128 of the center rest third portion 126 is connected to the flexible circuit board 146 by an adhesive (not shown). In other one or more embodiments, the connection portion 128a of the support leg 128 may be connected to the flexible circuit board 146 in any suitable manner. In some embodiments, the support leg 128 attached to the outer side wall of the voice coil 140 may also be attached to the outer side wall of the voice coil 140, for example, by an adhesive, to further strengthen the vibration assembly 160.

As described above, the flexible circuit board 146 of the speaker assembly 100 is connected to the outer sidewall of the voice coil 140 at or near the lower end of the voice coil 140. The structure in which the flexible circuit board 146 of the speaker assembly 100 is coupled to the outer sidewall of the voice coil 140 saves axial space compared to previous speaker designs (no support legs, flexible circuit board coupled to the lower end surface of the voice coil), so that the voice coil 140 of the speaker assembly 100 can have a larger axial dimension and a larger mass. This is very important in the design of micro-speakers with small axial dimensions. In one example of a speaker assembly 100, the speaker assembly 100 is a micro-speaker having a length, width and height of 38mm, 13mm and 2.5mm, respectively. The axial dimension of the voice coil 140 of this speaker example increased from 1.25mm to 1.35mm, and the voice coil weight increased from 436mg to 522mg, as compared to the previous speaker design.

At the same time, the support leg 128 of the center rest third portion 126 is connected to the flexible circuit board 146 via the connection portion 128, which provides support for the flexible circuit board 146. That is, in the speaker assembly 100, the support leg 128 and voice coil 140 of the center rest third portion 126 together provide support for the flexible circuit board 146. This structure ensures the support strength of the flexible circuit board 146 as compared with the previous speaker design (no support leg, flexible circuit board attached to the lower end surface of the voice coil, larger attachment area).

That is, the voice coil 140 of the speaker assembly 100 may have a larger axial dimension and a larger mass than previous speaker designs (without support legs, with the flexible circuit board attached to the lower end surface of the voice coil) while the support strength of the vibration assembly 110 to the flexible circuit board 146 is enhanced. These can reduce the total harmonic distortion and resonant frequency of the speaker assembly 100, improving the sound performance of the speaker assembly 100.

Fig. 1A-3B illustrate a speaker assembly 100 and a vibration assembly 110 in accordance with one or more embodiments of the present utility model. The present utility model is not limited thereto and in another embodiment or embodiments according to the present utility model, the speaker assembly and the vibration assembly may have various modified structures.

In the embodiment shown in fig. 1A-3B, the speaker assembly 100 and the vibration assembly 110 are miniature speakers of rectangular configuration. In another or more embodiments according to the present utility model, the speaker assembly and the vibration assembly may have micro speakers not limited to rectangular structures, but may be racetrack, circular, or other shapes

In the embodiment shown in fig. 1A-3B, the speaker assembly 100 and the vibration assembly 110 are micro speakers of rectangular structure, and the support legs 128 of the center patch 120 are provided on the short sides of the rectangle for connecting and supporting the flexible circuit board 146 arranged on the short sides. As shown, three support legs 128 are provided for each short side of the rectangle, and the support legs 128 are symmetrically arranged. Specifically, the three support legs 128 of each short side are symmetrically arranged about a rectangular center line parallel to the long side of the rectangle, and the support legs 128 of the two short sides are symmetrically arranged about a rectangular center line parallel to the short side of the rectangle. The symmetrically arranged support legs can uniformly support the flexible circuit board while uniformly reinforcing the structural strength of the vibration assembly of the speaker assembly. This ensures the audio quality of the speaker assembly. In another embodiment or embodiments according to the utility model, each short side of the rectangle may be provided with any suitable number of support legs. In other embodiments, the flexible circuit board is not limited to being disposed on the short sides of the rectangle, but may be disposed on the long sides of the rectangle. The support legs of the middle mount are then correspondingly arranged on the long sides of the rectangle.

In the embodiment shown in fig. 1A-3B, each support leg 128 of the center patch 120 is disposed at a position along the periphery of the center patch corresponding to the flexible circuit board, extending from the upper end surface of the voice coil 140 to the flexible circuit board along the outer side surface of the voice coil 140, for connecting and supporting the flexible circuit board. In another or more embodiments according to the present utility model, at least some of the support legs of the center patch 120 may be disposed at locations along the perimeter of the center patch that do not correspond to the flexible circuit board. The support legs are not used for connecting and supporting the flexible circuit board, but are mainly used for strengthening the connection strength of the middle paste 120 and the voice coil and strengthening the structural strength of the vibration assembly. These support legs may extend over the entire axial dimension of the voice coil as shown, or may extend over only a portion of the axial dimension of the voice coil. For example, in some embodiments according to the utility model, at least some of the support legs of the center mount extend over an outer sidewall of the voice coil by an axial dimension that is greater than 50%, 65%, or 80% of the axial dimension of the voice coil.

In still other embodiments according to the utility model, the speaker assembly may not include a flexible circuit board and the voice coil of the speaker receives audio signals through the leads. In these embodiments, the support legs of the center patch 120 are not used to connect and support the flexible circuit board, but are used to strengthen the connection strength of the center patch 120 and the voice coil, strengthening the structural strength of the vibration assembly. These support legs may extend over the entire axial dimension of the voice coil as shown, or may extend over only a portion of the axial dimension of the voice coil. For example, in some embodiments according to the utility model, at least some of the support legs of the center mount extend over an outer sidewall of the voice coil by an axial dimension that is greater than 50%, 65%, or 80% of the axial dimension of the voice coil.

In the embodiment shown in the figures, the support legs of the center patch are in the form of strips. In another or more embodiments according to the present utility model, the support legs of the center patch may be of any suitable shape.

Fig. 4A-4C illustrate an assembly process of the vibration assembly 110 of the speaker assembly 100 according to the present utility model. In step one, as shown in fig. 4A, a flexible circuit board 146 is attached to the voice coil 140, wherein the flexible circuit board 146 is attached to a bracket 150. The connection of flexible circuit board 146 to cradle 150 may be before or after flexible circuit board 146 is connected to voice coil 140. In the illustrated embodiment, a flexible circuit board 146 is connected to the outer sidewall 144 of the voice coil 140 at or near the lower end of the voice coil 140. In step two, as shown in fig. 4B, the center paste 120 is connected to the voice coil 140 and the flexible circuit board 146. Specifically, the center paste 120 is aligned with and bonded to the voice coil 140 such that the center paste second portion 124 is bonded to the upper end face 142 of the voice coil 140 by an adhesive, and such that the center paste first portion 122 is radially inward of the voice coil 140 and the center paste third portion 126 is radially outward of the voice coil. While also extending the support leg 128 of the center rest third portion 126 against the outer side wall 144 of the voice coil 140 and bonding the connection portion 128a of the support leg 128 to the flexible circuit board 146 by an adhesive. In step three, as shown in fig. 4C, the diaphragm 112 is attached to the bracket 150 and the center piece 120. Specifically, the diaphragm inner portion 118 is bonded to the center-mount second portion 124 by an adhesive, such that the center-mount second portion 124 is connected between the diaphragm inner portion 118 and the voice coil 140, and the diaphragm outer portion 114 is bonded to the bracket 150 by an adhesive.

In the assembly process shown in fig. 4A-4C, the center-mount second portion 124 is first adhered to the upper end surface 142 of the voice coil 140 by an adhesive, and then the diaphragm interior 118 is adhered to the center-mount second portion 124. Because the center-mount second portion 124 is disposed between the voice coil 140 and the diaphragm interior 118, the center-mount second portion 124 is closely spaced from the voice coil 140, and heat generated by the voice coil 140 during operation of the speaker assembly 100 is easily dissipated through the center-mount 120. In some embodiments according to the present utility model, the bonding process of step one may employ a larger pressing force. The bonding force during the two bonding processes (particularly the bonding force of step one) may result in a thinner layer of adhesive between the second portion 124 of the center rest and the upper end surface 142 of the voice coil 140. The thin adhesive layer further enhances heat transfer between voice coil 140 and center piece 120, improving heat dissipation of speaker assembly 100. This is very beneficial for micro-speaker assemblies, especially large amplitude micro-speaker assemblies. This assembly also ensures that the more resilient diaphragm interior 118 is not over compressed.

Fig. 5 illustrates a speaker assembly 100' in accordance with another or more embodiments of the present utility model. In contrast to the speaker assembly 100, the speaker assembly 100' further includes a reinforcing sheet 132 attached to the diaphragm interior 118 of the diaphragm 112. The reinforcing sheet 132 is disposed near the support leg 128 for compensating for a loss of structural strength of the diaphragm assembly or reinforcing the structure of the diaphragm assembly due to the disposition of the support leg 128. The reinforcing sheet 132 may be made of the same material as the center paste. The remaining structure of the speaker assembly 100' except for the reinforcing sheet 132 is the same as that of the speaker assembly 100, and will not be described again.

The inventors of the present utility model have found that challenges relating to gas flow and heat dissipation also arise in the development of ever-thinner and larger amplitude micro-speaker assemblies. Specifically, as the speaker assembly is reduced in size and weight, the internal space is reduced, resulting in a restricted gas flow. This can lead to imbalance in internal pressure of the speaker assembly during operation, thereby reducing the audio performance and efficiency of the speaker assembly. Furthermore, in large amplitude operation, the micro-speaker assembly may generate more heat. As the size decreases, the heat dissipation capability of the speaker assembly decreases. The combination of these problems may lead to sound distortion, reduced audio quality, and further reduced user experience.

In order to solve the problems, the inventor of the present utility model sets an air flow channel between a central magnet and a magnetic yoke of a magnetic circuit assembly, thereby effectively improving the problem of limited air flow and improving the heat dissipation of a speaker.

Fig. 6 illustrates an exploded view of the magnetic circuit assembly 160 of the speaker assembly 100 in accordance with one or more embodiments of the present utility model, wherein the side magnets 186 are not shown for clarity. As shown in fig. 6, the yoke 162 includes a yoke body and four bosses 164 extending from the yoke body. Each boss 164 is elongated and extends along the long side of the rectangle. The upper surfaces of the four bosses are flush with one another and are arranged in a 2 x 2 array spaced apart from one another to define air flow channels 166, 168 therebetween. The four bosses 164 are symmetrically arranged with respect to the center of the speaker assembly 100 such that the air flow channels 166, 168 each pass through the center of the speaker assembly 100. The center magnet 180 has a center bore 182. When the center magnet 180 is disposed on the yoke 162, the center bore 182 of the center magnet 180 communicates with the air flow passages 166, 168 of the yoke 162. As shown, the overall shape of the four bosses 164 generally corresponds to the shape of the center magnet 180 except where the air flow channels 166, 168 are located, thus providing good support for the center magnet 180.

Fig. 7A is a cross-sectional view taken along line 7A-7A of fig. 1A and rotated 90 degrees clockwise, fig. 7B is a cross-sectional view taken along line 7B-7B of fig. 1A and rotated 90 degrees clockwise, and fig. 7C is a view similar to fig. 2B. As best seen in fig. 7B, in the assembled state of the speaker assembly 100, the center magnet 180 is supported on the four bosses 164 of the yoke 162. Further, as best seen in fig. 7A and 7C, in the assembled state of the speaker assembly 100, the central bore 182 of the central magnet 180 is in fluid communication with the air flow passages 166, 168 of the yoke 162. Thus, by providing the boss 162 on the yoke 162, additional airflow passages 166, 168 between the space within the central bore 182 of the central magnet 180 and the space radially outward of the central magnet 180 are achieved.

When the speaker assembly is operated, the vibration assembly of the speaker assembly vibrates up and down to thereby emit sound. The flow of gas caused by the up-and-down vibration of the vibration assembly of the speaker assembly may be limited due to the limited internal space of the speaker assembly. This can lead to imbalance in pressure within the speaker assembly, reducing the audio quality and efficiency of the speaker assembly. This problem is particularly pronounced when the speaker assembly is a micro-speaker and the amplitude is large.

In the speaker assembly 100 according to the present utility model, the air flow between the space within the center hole 182 of the center magnet 180 and the space above the center magnet 180 and the space radially outside the center magnet 180 is smoother due to the presence of the air flow passages 166, 168. This allows for a more uniform internal pressure when the speaker assembly is in operation, which improves the audio quality of the reduced speaker assembly. Meanwhile, since the air flow inside the speaker assembly 100 is smoother, the heat dissipation of the speaker assembly 100 is also improved.

In the embodiment shown, the yoke 162 also includes recesses 172 disposed at both ends of the airflow channel 166. The recess 172 allows for a smoother airflow through the airflow channel 166.

In the illustrated embodiment, the airflow channels 166 and 168 are defined by four specially shaped bosses 164 provided on the surface of the yoke 162 for supporting the center magnet 180. In other embodiments according to the present utility model, the boss 164 may have any suitable shape and number as long as it can define an air flow passage so that the space within the central bore 182 of the central magnet 180 and the space radially outward of the central magnet 180 communicate with each other. In other embodiments according to the utility model, the boss may not be an integral part of the yoke, but rather a separate boss piece connected to the yoke or the central magnet. In other embodiments, a boss may be formed on the central magnet. In other embodiments, the air flow channel may be formed by a structure other than a boss, for example, the air flow channel may be formed by grooves formed on the yoke and/or the magnet.

Fig. 8 shows a driving force conversion factor BL graph of a speaker assembly according to an embodiment of the present utility model and a speaker assembly of a comparative example. Fig. 9 shows frequency response graphs of a speaker assembly according to an embodiment of the present utility model and a speaker assembly of a comparative example. The embodiment of fig. 8-9 and the comparative example are micro speakers having a length, width and height of 38×13×2.5mm, respectively, wherein the speaker assembly of the embodiment of fig. 8-9 is structured as shown in fig. 1A-7C, whereas the speaker assembly of the comparative example does not include the boss structure as shown in fig. 6-7C, nor the center mount support leg as shown in fig. 1A-5, and the flexible circuit board is connected to the lower end face of the voice coil.

As shown in fig. 8, the BL curve of the speaker assembly according to the embodiment of the present utility model is smoother and symmetrical as compared to the BL curve of the comparative example. Therefore, the loudspeaker assembly provided by the embodiment of the utility model has lower total harmonic distortion performance and lower resonance frequency, and has better audio performance.

As shown in fig. 9, the speaker assembly according to the embodiment of the present utility model has a better frequency response at a low frequency band than the frequency response curve of the comparative example. This is very advantageous as a low-frequency loudspeaker.

In one or more embodiments according to the present utility model, the speakers are micro-speakers having a length, width and height of 38×13×2.5mm, respectively. In one or more other embodiments according to the utility model, the speaker may be any suitably sized micro-speaker, for example, a micro-speaker having a length-width or diameter dimension of 60mm or less and a thickness of 10mm or 5mm or less. In other embodiments according to the utility model, the speaker may be any suitably sized micro-speaker, for example, a micro-speaker having a length dimension of 60mm or less, a width dimension of 25mm or less, and a thickness of 10mm or 5mm or less. In other embodiments according to the utility model, the speaker may also be a small speaker having a diameter size of not less than 60mm and a thickness of not less than 10mm.

In the embodiment shown in the figures, the loudspeaker assembly according to the utility model is in the form of a single loudspeaker. In another embodiment or embodiments according to the present utility model, the vibration assembly structure and the magnetic circuit assembly structure according to the present utility model may also be used for back-to-back speaker assemblies. Back-to-back speaker assembly refers to a speaker assembly that is provided with one sound unit on each of a first axial side and an opposite second axial side so that the speaker assembly can sound from the opposite axial sides.

In the embodiment shown in the figures, the magnetic circuit assembly includes a center magnet and side magnets. In another or more embodiments according to the utility model, the magnetic circuit assembly may include only the center magnet and not the side magnets.

The utility model can be realized in the following ways:

item 1: a speaker assembly, comprising: a magnetic circuit assembly including a magnet and a magnetically permeable member and defining a magnetic gap; a bracket connected to the magnetic circuit assembly; and a vibration assembly including a diaphragm, a center mount connected to the bracket through the diaphragm, and a voice coil connected to the diaphragm and/or the center mount, a portion of the voice coil being suspended in the magnetic gap, the center mount including one or more support legs extending on an outer sidewall of the voice coil.

Item 2: the speaker assembly of item 1, further comprising a flexible circuit board connected to an outer sidewall of the voice coil for delivering audio signals to the voice coil, the one or more support legs extending to and connected to the flexible circuit board on the outer sidewall of the voice coil.

Item 3: the speaker assembly as recited in any one of items 1-2, the flexible circuit board being connected to an outer sidewall of the voice coil at or near a lower end of the voice coil.

Item 4: the speaker assembly as recited in any one of claims 1-3, wherein the center paste comprises a center paste first portion radially inward of the voice coil, a center paste second portion connected between the diaphragm and the voice coil, and a center paste third portion radially outward of the voice coil, the center paste third portion comprising the one or more support legs.

Item 5: the speaker assembly as recited in any one of items 1-4, the remainder of the center rest third portion, except for the one or more support legs, being connected to the diaphragm.

Item 6: the speaker assembly as recited in any one of items 1-5, the one or more support legs comprising a plurality of support legs symmetrically disposed about an outer sidewall of the voice coil.

Item 7: the speaker assembly as recited in any one of items 1-6, the speaker assembly being rectangular, the one or more support legs comprising a plurality of support legs arranged on short sides of the rectangle.

Item 8: the speaker assembly as recited in any one of items 1-7, the vibration assembly further comprising a reinforcing sheet attached to the diaphragm adjacent the support leg.

Item 9: the speaker assembly as recited in any one of items 1-8, wherein the speaker assembly is rectangular, circular, or racetrack.

Item 10: the speaker assembly as in any one of items 1-9, each of the support legs being a strap integrally formed with the center patch.

Item 11: the speaker assembly as recited in any one of items 1-10, the support leg extending an axial dimension on an outer sidewall of the voice coil that is greater than 50% of the axial dimension of the voice coil.

Item 12: the speaker assembly as recited in any one of items 1-11, which is a miniature speaker assembly, the speaker assembly having a height of less than 10mm.

The foregoing description of the exemplary embodiments has been presented only for the purpose of illustrating the principles of the utility model and is not intended to limit the scope of the utility model. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and the spirit of the utility model, and these modifications and improvements are also within the scope of the utility model.

Claims (12)

1. A speaker assembly, comprising:

a magnetic circuit assembly including a magnet and a magnetically permeable member and defining a magnetic gap;

a bracket connected to the magnetic circuit assembly; and

a vibration assembly including a diaphragm, a center mount connected to the bracket through the diaphragm, and a voice coil connected to the diaphragm and/or the center mount, a portion of the voice coil being suspended in the magnetic gap,

the center mount includes one or more support legs extending over an outer sidewall of the voice coil.

2. The speaker assembly as recited in claim 1, further comprising a flexible circuit board connected to an outer sidewall of the voice coil for delivering audio signals to the voice coil, the one or more support legs extending to and connected to the flexible circuit board on the outer sidewall of the voice coil.

3. The speaker assembly as recited in claim 2, wherein the flexible circuit board is attached to an outer sidewall of the voice coil at or near a lower end of the voice coil.

4. The speaker assembly as recited in claim 1, wherein the center paste includes a center paste first portion radially inward of the voice coil, a center paste second portion connected between the diaphragm and the voice coil, and a center paste third portion radially outward of the voice coil, the center paste third portion including the one or more support legs.

5. The speaker assembly as recited in claim 4, wherein a remainder of the center rest third portion, excluding the one or more support legs, is coupled to the diaphragm.

6. The speaker assembly as recited in any one of claims 1-5, wherein the one or more support legs comprise a plurality of support legs symmetrically disposed about an outer sidewall of the voice coil.

7. The speaker assembly as recited in any one of claims 1-5, wherein the speaker assembly is rectangular, the one or more support legs comprising a plurality of support legs disposed on short sides of the rectangle.

8. The loudspeaker assembly of any of claims 1-5, wherein the vibration assembly further comprises a reinforcing sheet attached to the diaphragm adjacent the support leg.

9. The speaker assembly as recited in any one of claims 1-5, wherein the speaker assembly is rectangular, circular or racetrack.

10. The speaker assembly as recited in any one of claims 1-5, wherein each of the support legs is a strap integrally formed with the center patch.

11. The speaker assembly as recited in any one of claims 1-5, wherein the support leg extends over an outer sidewall of the voice coil an axial dimension that is greater than 50% of the axial dimension of the voice coil.

12. The loudspeaker assembly according to any of claims 1-5, characterized in that the loudspeaker assembly is a micro-speaker assembly, the height of the loudspeaker assembly being less than 10mm.