CN220553410U - A miniature plastic disk structure and solid brilliant machine for solid brilliant machine of LED - Google Patents

A miniature plastic disk structure and solid brilliant machine for solid brilliant machine of LED Download PDF

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Publication number
CN220553410U
CN220553410U CN202322197018.2U CN202322197018U CN220553410U CN 220553410 U CN220553410 U CN 220553410U CN 202322197018 U CN202322197018 U CN 202322197018U CN 220553410 U CN220553410 U CN 220553410U
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China
Prior art keywords
glue
die bonder
wall
led die
extension rod
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CN202322197018.2U
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Chinese (zh)
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徐骏
陈紫阳
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Ji'an Mulinsen Electronics Co ltd
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Ji'an Mulinsen Electronics Co ltd
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Priority to CN202322197018.2U priority Critical patent/CN220553410U/en
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Abstract

The utility model relates to the technical field of LED die bonders, in particular to a miniature plastic disc structure for an LED die bonder and the die bonder. According to the miniature glue disc structure for the LED die bonder, the extension rod is adopted to connect the base piece and the glue disc, so that the glue disc for containing glue is far away from the connection position of the extension rod and the base piece, a glue dispensing area into which the glue dispensing piece can extend is formed between the glue discs, and meanwhile, the size of the glue disc can be reduced under the support of the structure, so that the glue disc can be filled with less glue, and the use amount of the glue is saved.

Description

A miniature plastic disk structure and solid brilliant machine for solid brilliant machine of LED
[ field of technology ]
The utility model relates to the technical field of LED die bonders, in particular to a miniature plastic disc structure for an LED die bonder and the die bonder.
[ background Art ]
In the current processing procedure of the LED die bonder, after the feeding mechanism conveys the PCB to the working position on the fixture, the position of the PCB, which is required to be bonded with the wafer, is glued by the glue dispensing mechanism. When the dispensing process is performed, the dispensing part firstly stretches to a glue tray for containing glue to dip the glue, and then moves to the position of the wafer to perform dispensing. As shown in fig. 5, in the conventional glue tray structure of the LED die bonder, the distance between the glue tray b and the base member a is relatively short, and if the size of the glue tray b is reduced based on the structure, the dispensing member c cannot extend into the upper side of the glue tray b to dip glue due to interference of the base member a, which is not beneficial to achieving the effect of saving glue by reducing the size of the glue tray b. Therefore, there is a need for a tray structure and a die bonder that can support the insertion of the dispensing member after the size of the tray is reduced.
[ utility model ]
The utility model aims to provide a miniature plastic disc structure for an LED die bonder and the die bonder, and solves the problem that a glue dispensing piece is inconvenient to extend into after the size of the plastic disc is reduced by the plastic disc structure of the traditional LED die bonder.
The technical scheme provided by the utility model is as follows: a miniature gluey dish structure for LED die bonder, includes base spare, glues dish, extension rod and locates be used for driving extension rod pivoted driving piece on the base spare, the one end rotation of extension rod connect in the base spare, the other end is connected glue the dish, so that glue the dish with form between the base spare and supply the point to glue the point that the piece stretches into to glue the district.
The miniature plastic plate structure for the LED die bonder is characterized in that the outer edge of the plastic plate is convexly provided with the outer wall which is arranged in a surrounding manner, the plastic plate is convexly provided with the inner wall which is sleeved on the end part of the extension rod, and a containing groove which is arranged in an annular manner is formed between the outer wall and the inner wall in a surrounding manner.
The miniature plastic plate structure for the LED die bonder further comprises a glue scraping piece arranged on the base piece, the glue scraping piece is provided with a glue scraping head extending into the containing groove, a glue retaining area is formed between the bottom side of the glue scraping head and the bottom surface of the containing groove, and when the extending rod drives the plastic plate to rotate, the glue scraping head is arranged in the containing groove and used for scraping glue with the containing height higher than that of the glue retaining area.
According to the miniature rubber disc structure for the LED die bonder, the rubber inlet and the rubber blocking wall are sequentially arranged on the rubber scraping head along the rotating direction of the rubber disc, and a rubber retaining cavity is formed between the rubber inlet and the rubber blocking wall.
The miniature glue plate structure for the LED die bonder is characterized in that the top of the glue retaining cavity is provided with the glue blocking inclined plane, one side of the glue blocking inclined plane is connected to the top end of the glue inlet, one side of the glue blocking inclined plane, which is far away from the glue inlet, is connected to the top end of the glue blocking wall, and the height of the glue inlet is higher than that of the glue blocking wall, so that the glue blocking inclined plane is arranged in a downward inclined manner along the rotation direction of the glue plate.
According to the miniature plastic disc structure for the LED die bonder, the plastic retaining cavity is gradually narrowed from the plastic inlet to the plastic blocking wall.
The miniature rubber disc structure for the LED die bonder is characterized in that the rubber scraping heads are arranged in a fan shape along the circumferential direction of the rubber disc, the outer sides of the rubber scraping heads are abutted to the outer wall, and the inner sides of the rubber scraping heads are abutted to the inner wall.
The miniature plastic disc structure for the LED die bonder further comprises a bearing assembly arranged on the base member, and the extension rod is rotatably connected to the base member through the bearing assembly.
The die bonder comprises the micro plastic disc structure for the LED die bonder.
Compared with the prior art, the utility model has the following advantages:
1. according to the miniature glue disc structure for the LED die bonder, the extension rod is adopted to connect the base piece and the glue disc, so that the glue disc for containing glue is far away from the connection position of the extension rod and the base piece, a glue dispensing area into which the glue dispensing piece can extend is formed between the glue discs, and meanwhile, the size of the glue disc can be reduced under the support of the structure, so that the glue disc can be filled with less glue, and the use amount of the glue is saved.
2. According to the miniature glue plate structure for the LED die bonder, the glue plate is connected with the base part by the extension rod, and the height of the glue dispensing area is increased by the arrangement of the extension rod, so that glue in the containing groove is far away from the base part, and when the glue dispensing part stretches into the glue dispensing area to perform glue dipping operation, the glue is not easy to splash or drop to the connecting part of the extension rod and the base part, so that the structure is more durable.
[ description of the drawings ]
Fig. 1 is a perspective view of a micro-adhesive disc structure according to the present utility model.
FIG. 2 is a cross-sectional view of the connection of the base member, extension rod and bearing assembly in the micro-disc structure of the present utility model.
Fig. 3 is a partially exploded view of the micro-adhesive disc structure of the present utility model.
Fig. 4 is a cross-sectional view showing the positional relationship among the extension rod, the adhesive disc and the doctor blade in the micro-adhesive disc structure of the present utility model.
Fig. 5 is a perspective view of a plastic tray structure of a conventional LED die bonder.
[ detailed description ] of the utility model
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to fall within the scope of the utility model.
Example 1: referring to fig. 1 to 4, the present embodiment provides a micro-adhesive disc structure for an LED die bonder, which includes a base member 1, an adhesive disc 2, an extension rod 3, and a driving member 6 disposed on the base member 1 for driving the extension rod 3 to rotate, wherein one end of the extension rod 3 is rotatably connected to the base member 1, and the other end is connected to the adhesive disc 2, so that an adhesive dispensing area 31 into which an adhesive dispensing member extends is formed between the adhesive disc 2 and the base member 1. According to the miniature glue disc structure for the LED die bonder, the extension rod 3 is adopted to connect the base part 1 and the glue disc 2, so that the glue disc 2 for containing glue is far away from the connection part of the extension rod 3 and the base part 1, a glue dispensing area 31 into which a glue dispensing part can extend is formed between the glue discs, and meanwhile, the size of the glue disc 2 can be reduced under the support of the structure, so that fewer glue can be contained in the glue disc 2, and the use amount of glue is saved.
The outer edge of the rubber plate 2 is convexly provided with an outer wall 22 which is arranged in a surrounding manner, the rubber plate 2 is convexly provided with an inner wall 23 which is sleeved on the end part of the extension rod 3, and a containing groove 21 which is arranged in an annular manner is formed between the outer wall 22 and the inner wall 23 in a surrounding manner. According to the miniature plastic disc structure for the LED die bonder, on the premise of setting based on the extension rod 3, the plastic disc 2 provided with the outer wall 22 and the inner wall 23 is adopted, wherein the outer wall 22 is positioned at the outer edge of the plastic disc 2, the outer wall 22 and the inner wall 23 are surrounded to form the containing groove 21 of the plastic disc 2, compared with the traditional plastic disc, the plastic disc 2 under the structure is more compact, meanwhile, the extension rod 3 is adopted to connect the plastic disc 2 and the base piece 1, the setting of the extension rod 3 enables the height of the glue dispensing area 31 to be increased, so that glue in the containing groove 21 is far away from the base piece 1, and when the glue dispensing piece stretches into the glue dispensing area 31 to perform glue dipping operation, the glue is not easy to splash or drop into the connecting position of the extension rod 3 and the base piece 1, and the whole plastic disc structure is more durable.
The miniature plastic disc structure for the LED die bonder further comprises a plastic scraping piece 5 arranged on the base piece 1, the plastic scraping piece 5 is provided with a plastic scraping head 51 extending into the containing groove 21, a plastic retaining area 52 is formed between the bottom side of the plastic scraping head 51 and the bottom surface of the containing groove 21, and when the extension rod 3 drives the plastic disc 2 to rotate, the plastic scraping head 51 is used for scraping plastic with the containing height higher than the plastic retaining area 52 in the containing groove 21. When the glue tray 2 rotates, the glue with a height higher than that of the glue retaining area 52 is continuously smeared on the glue scraping head 51 along with the scraping of the glue scraping head 51, and the depth of the glue dispensing part extending into the glue dipping groove 21 is kept unchanged.
The scraping head 51 is sequentially provided with a glue inlet 511 and a glue blocking wall 512 along the rotation direction of the glue tray 2, and a glue retaining cavity 513 is formed between the glue inlet 511 and the glue blocking wall 512. When the glue tray 2 rotates, glue can enter from the glue inlet 511 and is scraped by the glue blocking wall 512, and the glue retaining cavity 513 is arranged so that the glue can be temporarily accumulated in the glue retaining cavity after being scraped.
The top of the glue retaining cavity 513 is provided with a glue retaining inclined plane 514, one side of the glue retaining inclined plane 514 is connected to the top end of the glue inlet 511, one side of the glue retaining inclined plane 514, which is far away from the glue inlet 511, is connected to the top end of the glue retaining wall 512, and the height of the glue inlet 511 is higher than that of the glue retaining wall 512, so that the glue retaining inclined plane 514 is obliquely arranged downwards along the rotation direction of the glue tray 2. When the equipment is not in operation, the glue blocking inclined plane 514 is arranged, so that people can conveniently clean the glue in the glue retaining cavity 513.
The glue retaining chamber 513 is gradually narrowed from the glue inlet 511 to the glue retaining wall 512, and is configured to facilitate the scraping of glue.
The scraping head 51 is arranged in a fan shape along the circumferential direction of the glue tray 2, the outer side of the scraping head 51 is abutted on the outer wall 22, and the inner side of the scraping head 51 is abutted on the inner wall 23, so that glue can be effectively prevented from overflowing from the containing groove 21 during scraping.
The miniature plastic disc structure for the LED die bonder further comprises a bearing assembly 4 arranged on the base member 1, and the extension rod 3 is rotatably connected to the base member 1 through the bearing assembly 4. The setting of bearing assembly 4 makes the rotation of extension rod 3 more stable, has adopted extension rod 3 to connect gluey dish 2 and base spare 1, and the setting of extension rod 3 makes the high increase of some gluey district 31 to make the glue that is arranged in holding groove 21 keep away from base spare 1, make some gluey spare when stretching into some gluey district 31 and glue dipping in the operation, glue is difficult for splashing or instilling into bearing assembly 4's installation department, has prolonged bearing assembly's life.
The embodiment also provides a die bonder, which comprises the miniature plastic disc structure for the LED die bonder.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (9)

1. A miniature plastic disk structure for solid brilliant machine of LED, its characterized in that: including base spare (1), rubber disc (2), extension rod (3) and locate be used for driving extension rod (3) pivoted driving piece (6) on base spare (1), the one end rotation of extension rod (3) connect in base spare (1), the other end is connected rubber disc (2), so that rubber disc (2) with form between base spare (1) and supply the some glued district (31) that the piece stretched into of gluing.
2. The micro plastic tray structure for the LED die bonder as claimed in claim 1, wherein: the outer edge of the rubber disc (2) is convexly provided with an outer wall (22) which is arranged in a surrounding mode, the rubber disc (2) is convexly provided with an inner wall (23) which is sleeved on the end portion of the extension rod (3), and a containing groove (21) which is arranged in an annular mode is formed between the outer wall (22) and the inner wall (23) in a surrounding mode.
3. The micro plastic tray structure for the LED die bonder as claimed in claim 2, wherein: still including locating doctor blade spare (5) on base spare (1), doctor blade spare (5) be equipped with stretch into in holding groove (21) doctor blade head (51), the downside of doctor blade head (51) with form between the bottom surface of holding groove (21) and stay gluey district (52), work as extension rod (3) drive when rubber dish (2) are rotatory, doctor blade head (51) are in hold in groove (21) be used for scraping hold highly higher than glue of stay gluey district (52).
4. A micro-plastic tray structure for an LED die bonder according to claim 3, wherein: the glue scraping head (51) is sequentially provided with a glue inlet (511) and a glue blocking wall (512) along the rotation direction of the glue disc (2), and a glue retaining cavity (513) is formed between the glue inlet (511) and the glue blocking wall (512).
5. The micro plastic tray structure for the LED die bonder as claimed in claim 4, wherein: the top of leaving gluey chamber (513) is equipped with keeps off gluey inclined plane (514), keep off one side of gluing inclined plane (514) connect in advance the top of gluing mouth (511), keep off glue inclined plane (514) keep away from advance one side of gluing mouth (511) connect in keep off the top of gluing wall (512), advance the height of gluing mouth (511) to be higher than keep off gluey wall (512), make keep off gluey inclined plane (514) are followed the direction of rotation downward sloping of gluing dish (2).
6. The micro plastic tray structure for the LED die bonder as claimed in claim 4, wherein: the glue retaining cavity (513) is gradually narrowed from the glue inlet (511) to the glue blocking wall (512).
7. A micro-plastic tray structure for an LED die bonder according to claim 3, wherein: the scraping heads (51) are arranged in a fan shape along the circumferential direction of the rubber disc (2), the outer sides of the scraping heads (51) are abutted to the outer wall (22), and the inner sides of the scraping heads (51) are abutted to the inner wall (23).
8. The micro plastic tray structure for the LED die bonder as claimed in claim 1, wherein: the extension rod (3) is rotatably connected to the base member (1) through the bearing assembly (4).
9. Die bonder, its characterized in that: a micro-scale glue tray structure for an LED die bonder comprising the structure of any one of claims 1-8.
CN202322197018.2U 2023-08-15 2023-08-15 A miniature plastic disk structure and solid brilliant machine for solid brilliant machine of LED Active CN220553410U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202322197018.2U CN220553410U (en) 2023-08-15 2023-08-15 A miniature plastic disk structure and solid brilliant machine for solid brilliant machine of LED

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202322197018.2U CN220553410U (en) 2023-08-15 2023-08-15 A miniature plastic disk structure and solid brilliant machine for solid brilliant machine of LED

Publications (1)

Publication Number Publication Date
CN220553410U true CN220553410U (en) 2024-03-01

Family

ID=90006932

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202322197018.2U Active CN220553410U (en) 2023-08-15 2023-08-15 A miniature plastic disk structure and solid brilliant machine for solid brilliant machine of LED

Country Status (1)

Country Link
CN (1) CN220553410U (en)

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