CN220553404U

CN220553404U - Plastic package mould for non-flash semiconductor device

Info

Publication number: CN220553404U
Application number: CN202322068377.8U
Authority: CN
Inventors: 李红伟; 蔺卫东
Original assignee: Suining Loulan Precision Machinery Co ltd
Current assignee: Suining Loulan Precision Machinery Co ltd
Priority date: 2023-08-02
Filing date: 2023-08-02
Publication date: 2024-03-01
Anticipated expiration: 2033-08-02

Abstract

The utility model belongs to the technical field of plastic packaging molds, in particular to a flash-free semiconductor device plastic packaging mold, which comprises a base, wherein a lower mold is fixedly arranged on the upper end surface of the base, a template is fixedly arranged on the upper end surface of the lower mold, an upper mold is arranged above the template, a driving assembly drives left and right internal thread sleeves to synchronously rotate, the internal thread sleeves are in threaded connection with a bolt rod, a lower pressing inclined plate moves towards the direction of an inclined plate when the internal thread sleeves rotate, inclined surfaces are formed on contact surfaces of the lower pressing inclined plate and the inclined plate, and a downward force is generated on the inclined plate and the upper mold when the lower pressing inclined plate moves towards the direction of the inclined plate.

Description

Plastic package mould for non-flash semiconductor device

Technical Field

The utility model relates to the technical field of plastic packaging molds, in particular to a plastic packaging mold for a semiconductor device without flash.

Background

In semiconductor microelectronic production, the chip is usually encapsulated, so that the chip is convenient to use, and the colloid is used for protecting the chip. The plastic packaging of the chip is usually carried out by using a plastic packaging die, in the process of the plastic packaging procedure, the pins, the metal wires and the chip are placed in the die, then the products are wrapped by using plastic packaging materials, the products after plastic packaging are plastic packaging products, and finally the plastic packaging products are subjected to residual material removal to obtain a complete product.

The plastic package mould that uses at present for the pin chamber of placing the pin is the through type, and the ratio of pin chamber design is less, so has the characteristics of no flash, but arouses the cramp because of the pin chamber is little, and the plastic package material easily makes the position of wire produce the removal when shaping injection molding, and the contact position of wire and chip will change, causes the short circuit, and this is a great quality incident. However, since there is a gap between the upper die and the lower die, the side surface of the pin cavity will overflow, and the excess material formed by the overflow has to be removed in the post-treatment, while the excess material formed by the overflow has smaller volume, in order to reduce the gap between the upper die and the lower die and reduce the overflow condition, we propose a plastic package die for a semiconductor device without overflow.

Disclosure of Invention

Aiming at the defects of the prior art, the utility model provides the plastic packaging die for the semiconductor device without flash, which solves the problem of the background.

In order to achieve the above purpose, the utility model is realized by the following technical scheme:

the utility model provides a no flash semiconductor device plastic envelope mould, includes the base, the up end fixed mounting of base has the lower mould, the up end fixed mounting of lower mould has the template, the top of template is provided with the mould, the up end middle part fixedly connected with mount of going up the mould, install the cylinder on the mount, the up end of going up the mould is all fixedly connected with sloping plate about, the up end of base is all fixedly connected with mounting panel about, rotate on the mounting panel and install the internal thread cover, the screw thread has the shank of bolt soon on the internal thread cover, the one end fixedly connected with that the internal thread cover was kept away from to the shank of bolt pushes down the swash plate, install the drive assembly who is used for driving the synchronous rotation of internal thread cover about the side on the base.

Preferably, the driving assembly comprises a double-shaft motor, the double-shaft motor is mounted at the bottom of the base through bolts, the output end of the double-shaft motor is fixedly connected with a driving sprocket, the outer surface of the internal thread sleeve is fixedly sleeved with a driven sprocket, and a chain is connected between the driven sprocket and the driving sprocket.

Preferably, a plurality of sliding rods are arranged on the mounting plate in a sliding way, and the end parts of the sliding rods are fixedly connected with the downward-pressure inclined plate.

Preferably, the outside cover of template is equipped with sealing rubber spare, sealing rubber spare's inner wall fixedly connected with a plurality of locating strips, a plurality of constant head tanks have been seted up to the up end of template, the locating strip butt is in corresponding constant head tank.

Preferably, a pressure sensor is installed on the pressing sloping plate.

Preferably, the upper end face of the lower die is fixedly connected with a plurality of positioning columns, a plurality of positioning holes are formed in the upper die, the positioning columns are inserted into the corresponding positioning holes, and a plurality of mounting holes are formed in the upper end face of the base.

Advantageous effects

The utility model provides a plastic package die for a semiconductor device without flash. Compared with the prior art, the method has the following beneficial effects:

1. this no flash semiconductor device plastic envelope mould, drive the synchronous rotation of internal thread cover of controlling the side through drive assembly, owing to internal thread cover and bolt pole threaded connection, and then the internal thread cover is rotated down and is pressed down the swash plate and will be moved to the sloping plate direction, all be formed with the inclined plane on the contact surface of swash plate and sloping plate down, and then will produce a decurrent power to sloping plate and last mould when pressing down the swash plate and moving to the sloping plate direction, not only can avoid producing the displacement condition because of the cylinder of last mould top connection through this kind of structure, can improve the leakproofness after last mould and the lower mould compound die simultaneously, and then reduce the clearance between last mould and the lower mould, reduce the flash condition.

Drawings

FIG. 1 is a schematic elevational view of the main body of the present utility model;

FIG. 2 is a schematic bottom view of the main body of the present utility model;

fig. 3 is a schematic diagram of a main body split structure of the present utility model.

In the figure: 1. a base; 2. a mounting plate; 3. a chain; 4. an internal thread sleeve; 5. a slide bar; 6. a bolt rod; 7. a fixing frame; 8. pressing down the sloping plate; 9. a bevel panel; 10. an upper die; 11. a lower die; 12. a sealing rubber member; 13. positioning holes; 14. a positioning strip; 15. a driven sprocket; 16. positioning columns; 17. a positioning groove; 18. a template; 19. a drive sprocket; 20. a double-shaft motor.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-3, the present utility model provides a technical solution: the utility model provides a no flash semiconductor device plastic envelope mould, including base 1, the up end fixed mounting of base 1 has lower mould 11, the up end fixed mounting of lower mould 11 has template 18, the top of template 18 is provided with mould 10, the up end middle part fixedly connected with mount 7 of mould 10, install the cylinder on the mount 7, the up end of mould 10 is all fixedly connected with inclined plate 9 about, the up end of base 1 is all fixedly connected with mounting panel 2 about, install internal thread cover 4 on the mounting panel 2 rotation, the screw thread has connect bolt pole 6 soon on the internal thread cover 4, the one end fixedly connected with who keeps away from internal thread cover 4 of bolt pole is pushed down inclined plate 8, install the drive assembly who is used for driving the synchronous rotation of internal thread cover 4 about on the base 1.

During die assembly, the upper die 10 and the lower die 11 are clamped, and then the driving assembly drives the left and right internal thread sleeves 4 to synchronously rotate, and as the internal thread sleeves 4 are in threaded connection with the bolt rods 6, the lower pressure inclined plates 8 move towards the inclined plates 9 when the internal thread sleeves 4 rotate, inclined planes are formed on the contact surfaces of the lower pressure inclined plates 8 and the inclined plates 9, and then downward force is generated on the inclined plates 9 and the upper die 10 when the lower pressure inclined plates 8 move towards the inclined plates 9.

The driving assembly comprises a double-shaft motor 20, the double-shaft motor 20 is mounted at the bottom of the base 1 through bolts, the output end of the double-shaft motor 20 is fixedly connected with a driving sprocket 19, the outer surface of the internal thread sleeve 4 is fixedly sleeved with a driven sprocket 15, and a chain 3 is connected between the driven sprocket 15 and the driving sprocket 19.

When the double-shaft motor 20 is started, the driving sprocket 19 is driven to rotate, and the chain 3 is connected between the driven sprocket 15 and the driving sprocket 19, so that the left and right internal thread sleeves 4 of the double-shaft motor 20 synchronously rotate during working.

A plurality of slide bars 5 are arranged on the mounting plate 2 in a sliding way, and the end parts of the slide bars 5 are fixedly connected with the downward-pressure sloping plate 8.

When the pushing down sloping plate 8 moves left and right, the sliding rod 5 is pulled to slide left and right, so that the pushing down sloping plate 8 can move left and right stably.

The sealing rubber piece 12 is sleeved outside the template 18, the inner wall of the sealing rubber piece 12 is fixedly connected with a plurality of positioning strips 14, the upper end face of the template 18 is provided with a plurality of positioning grooves 17, and the positioning strips 14 are abutted in the corresponding positioning grooves 17.

Before the mold is closed, the sealing rubber 12 is fitted around the outer periphery of the die plate 18, and the positioning strips 14 are abutted against the corresponding positioning grooves 17, so that the sealing property of the upper mold 10 and the lower mold 11 after the mold is closed can be improved again by the sealing rubber 12.

The pressure sensor is installed on the pressing sloping plate 8, and the force when the pressing sloping plate 8 contacts with the sloping plate 9 can be detected through the pressure sensor, and when the pressure reaches a certain value, the double-shaft motor 20 stops working.

The upper end face of the lower die 11 is fixedly connected with a plurality of positioning columns 16, the upper die 10 is provided with a plurality of positioning holes 13, the positioning columns 16 are inserted into the corresponding positioning holes 13, and the upper end face of the base 1 is provided with a plurality of mounting holes.

During mold closing, the positioning posts 16 are inserted into the positioning holes 13 in the upper mold 10, so that the mold closing accuracy can be improved.

Working principle: during die assembly, the upper die 10 and the lower die 11 are clamped, the positioning column 16 is inserted into the positioning hole 13 in the upper die 10, and then the die assembly accuracy can be improved, the double-shaft motor 20 drives the left and right inner threaded sleeves 4 to synchronously rotate, the inner threaded sleeves 4 are in threaded connection with the bolt rods 6, the lower pressure inclined plate 8 moves towards the inclined plate 9 when the inner threaded sleeves 4 rotate, inclined planes are formed on the contact surfaces of the lower pressure inclined plate 8 and the inclined plate 9, a downward force is generated on the inclined plate 9 and the upper die 10 when the lower pressure inclined plate 8 moves towards the inclined plate 9, the force when the lower pressure inclined plate 8 is in contact with the inclined plate 9 can be detected through the pressure sensor, when the pressure reaches a certain value, the double-shaft motor 20 stops working, the die assembly structure can not only avoid displacement conditions caused by a cylinder connected with the top of the upper die 10, but also improve the tightness after die assembly of the upper die 10 and the lower die 11, and further reduce the gap between the upper die 10 and the lower die 11, and reduce material overflow conditions.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. No flash semiconductor device plastic envelope mould, including base (1), its characterized in that: the novel plastic die is characterized in that a lower die (11) is fixedly arranged on the upper end face of the base (1), a die plate (18) is fixedly arranged on the upper end face of the lower die (11), an upper die (10) is arranged above the die plate (18), a fixing frame (7) is fixedly connected to the middle of the upper end face of the upper die (10), an air cylinder is arranged on the fixing frame (7), an inclined panel (9) is fixedly connected to the left side and the right side of the upper end face of the upper die (10), a mounting plate (2) is fixedly connected to the left side and the right side of the upper end face of the base (1), an inner thread sleeve (4) is rotatably arranged on the mounting plate (2), a bolt rod (6) is screwed on the inner thread sleeve (4), one end of the bolt rod (6) far away from the inner thread sleeve (4) is fixedly connected with a pressing inclined plate (8), and a driving assembly for driving the left side and the right side of the base (1) is synchronously rotated.

2. The flash-free semiconductor device plastic package mold of claim 1, wherein: the driving assembly comprises a double-shaft motor (20), the double-shaft motor (20) is mounted at the bottom of the base (1) through bolts, a driving sprocket (19) is fixedly connected to the output end of the double-shaft motor (20), a driven sprocket (15) is fixedly sleeved on the outer surface of the inner threaded sleeve (4), and a chain (3) is connected between the driven sprocket (15) and the driving sprocket (19).

3. The flash-free semiconductor device plastic package mold of claim 2, wherein: a plurality of sliding rods (5) are arranged on the mounting plate (2) in a sliding way, and the end parts of the sliding rods (5) are fixedly connected with the downward-pressure sloping plate (8).

4. The flash-free semiconductor device molding die according to claim 3, wherein: the sealing rubber piece (12) is sleeved outside the template (18), a plurality of positioning strips (14) are fixedly connected to the inner wall of the sealing rubber piece (12), a plurality of positioning grooves (17) are formed in the upper end face of the template (18), and the positioning strips (14) are abutted to the corresponding positioning grooves (17).

5. The flash-free semiconductor device molding die of claim 4, wherein: and a pressure sensor is arranged on the downward pressure sloping plate (8).

6. The flash-free semiconductor device molding die of claim 5, wherein: the upper end face of the lower die (11) is fixedly connected with a plurality of positioning columns (16), and the upper die (10) is opened

A plurality of positioning holes (13) are arranged, the positioning columns (16) are inserted into the corresponding positioning holes (13),

the upper end face of the base (1) is provided with a plurality of mounting holes.