CN220548629U - Semiconductor plastic package die capable of preventing exhaust blocking - Google Patents
Semiconductor plastic package die capable of preventing exhaust blocking Download PDFInfo
- Publication number
- CN220548629U CN220548629U CN202322132815.2U CN202322132815U CN220548629U CN 220548629 U CN220548629 U CN 220548629U CN 202322132815 U CN202322132815 U CN 202322132815U CN 220548629 U CN220548629 U CN 220548629U
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- Prior art keywords
- exhaust
- groove
- movable
- die
- demolding
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 21
- 230000000903 blocking effect Effects 0.000 title claims description 4
- 238000003825 pressing Methods 0.000 claims abstract description 15
- 238000007789 sealing Methods 0.000 claims description 25
- 238000000605 extraction Methods 0.000 claims description 11
- 238000000465 moulding Methods 0.000 claims description 8
- 238000007493 shaping process Methods 0.000 claims description 8
- 238000009434 installation Methods 0.000 claims description 7
- 230000000694 effects Effects 0.000 claims description 5
- 230000002265 prevention Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 6
- 230000001887 anti-feedant effect Effects 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003723 Smelting Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Abstract
The utility model discloses a semiconductor plastic package die capable of preventing exhaust blockage, which comprises a base, wherein a lower die is arranged in the middle of the upper end of the base, a forming groove is formed in the upper end of the lower die, exhaust holes are uniformly formed in the forming groove, an anti-feeding structure is arranged at the lower end of the exhaust holes, demolding holes are uniformly formed in the forming groove, demolding needles are movably inserted in the demolding holes, movable structures are arranged at the lower ends of the demolding needles, when in plastic package, the upper die is attached to the lower die, the upper die extrudes a pressing plate, the pressing plate drives a moving plate to move downwards, the moving plate drives a connecting rod to move downwards, the connecting rod drives a moving block to move downwards to stretch a reset spring, the moving plate drives the demolding needles to move downwards, after forming, the upper die is separated from the lower die, the moving plate returns to the original position under the action of the reset spring, and the demolding needles move upwards to enable the molded material to be ejected out of the forming groove, so that the demolding is convenient and quick.
Description
Technical Field
The utility model relates to the technical field of semiconductor plastic packaging molds, in particular to a semiconductor plastic packaging mold capable of preventing exhaust blockage.
Background
The mould is used in the industrial production to obtain various moulds and tools of the required products by injection molding, blow molding, extrusion, die casting or forging, smelting, stamping and other methods, in short, the mould is a tool used for manufacturing the molded articles, the tool is composed of various parts, and different moulds are composed of different parts, and the processing of the appearance of the articles is realized mainly by changing the physical state of the molded materials, namely the model is named as "industrial master";
through searching, the utility model discloses an exhaust mechanism of a semiconductor plastic package die with the publication number of CN211868350U, although the utility model meets the use requirement of a user to a certain extent, certain defects still exist in the use process, such as when the traditional semiconductor plastic package die is used, a plastic package material flows into an exhaust channel to block the exhaust channel, the die is required to be disassembled to clean the exhaust channel, the manual operation amount is increased, the time is wasted, the production efficiency is reduced, and the molded semiconductor is sunken in the molding groove and adhered to the inner wall of the molding groove, so that the molded semiconductor cannot be quickly demolded.
Disclosure of Invention
The utility model aims to provide a semiconductor plastic package die capable of preventing exhaust blockage, which solves the problems in the background technology.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a prevent semiconductor plastic envelope mould of exhaust jam, includes the base, the centre of base upper end is provided with the lower mould, the shaping groove has been seted up to the upper end of lower mould, the exhaust hole has evenly been seted up to the inside of shaping groove, the lower extreme of exhaust hole is provided with prevents feeding structure, the demoulding hole has evenly been seted up to the inside of shaping groove, the inside activity of demoulding hole alternates there is the drawing of patterns needle, the lower extreme of drawing of patterns needle is provided with movable structure, the both sides of base upper end all are provided with flexible post, the upper end of flexible post is provided with the mould, the lower extreme of going up the mould is provided with the mold core.
Preferably, the feeding prevention structure comprises an exhaust groove, the exhaust groove is arranged at the lower end of the exhaust hole, and a connecting hole is arranged between the two exhaust grooves positioned on the same straight line.
Preferably, an exhaust pipe is installed at one side of the lower die, and one side of the exhaust pipe is connected with the connecting hole.
Preferably, the inside fixed mounting of exhaust groove has the installation piece, the upper end movable sleeve of installation piece is equipped with the seal cover, the upper end fixed mounting of seal cover has the sealing block, the sealing block activity alternates in the inside of exhaust hole.
Preferably, a supporting spring is fixedly arranged at the upper end of the mounting block, and the upper end of the supporting spring is fixedly connected with the sealing sleeve.
Preferably, the lower die is internally and uniformly provided with air extraction grooves, one end of each air extraction groove is provided with an air extraction pipe, and the middle of each mounting block is provided with an air extraction hole connected with each air extraction groove.
Preferably, the movable structure comprises a movable groove, the movable groove is formed in the lower die, connecting grooves are formed in two sides of the upper end of the movable groove, a movable plate is movably mounted in the movable groove, and the movable plate is connected with the lower end of the demolding needle.
Preferably, the connecting rods are fixedly installed on two sides of the upper end of the moving plate, the upper ends of the connecting rods are movably inserted into the connecting grooves, moving blocks are fixedly installed at the ends of the connecting rods, reset springs connected with the moving blocks are sleeved on the surfaces of the connecting rods, pressing plates are installed on two sides of the upper end of the moving plate, and the upper ends of the pressing plates are movably inserted into the outer sides of the lower die.
Compared with the prior art, the utility model has the beneficial effects that:
1. in the utility model, when in plastic packaging, the upper die is attached to the lower die, the upper die extrudes the pressing plate, the pressing plate drives the moving plate to move downwards, the moving plate drives the connecting rod to move downwards, the connecting rod drives the moving block to move downwards, the reset spring is stretched, the moving plate drives the demolding needle to move downwards, after the molding is finished, the upper die is separated from the lower die, the moving plate returns to the original position under the action of the reset spring, and the demolding needle moves upwards, so that the demolding needle ejects molded materials out of the molding groove, thereby facilitating rapid demolding;
2. according to the utility model, when the exhaust is needed, the exhaust pipe and the exhaust pipe are connected with the air exhaust device, the exhaust pipe generates suction force, air between the mounting block and the sealing sleeve is extracted through the air exhaust hole and the air exhaust groove, so that the sealing sleeve moves downwards, the supporting spring is compressed, the sealing block is extracted from the exhaust hole, air in the forming groove is exhausted through the exhaust hole, the exhaust groove and the exhaust pipe, the later plastic package is facilitated, after the air is extracted, the sealing sleeve and the sealing block recover to the original position under the action of the supporting spring, the sealing block is inserted into the exhaust hole, and the exhaust hole is prevented from being blocked when plastic is injected.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic view of the bottom structure of the device of the present utility model;
FIG. 3 is a schematic side cross-sectional view of the apparatus of the present utility model;
FIG. 4 is a schematic view of the semi-sectional structure of the device of the present utility model;
fig. 5 is an enlarged schematic view of the structure of fig. 4 a according to the present utility model.
In the figure: 1. a base; 2. a lower die; 3. a telescopic column; 4. an upper die; 5. an exhaust pipe; 6. a forming groove; 7. a pressing plate; 8. a demolding needle; 9. an upper mold core; 10. an exhaust pipe; 11. a movable groove; 12. a moving plate; 13. a connecting groove; 14. a connecting rod; 15. a return spring; 16. a moving block; 17. a demolding hole; 18. an exhaust groove; 19. a connection hole; 20. an exhaust hole; 21. an air extraction groove; 22. a mounting block; 23. sealing sleeve; 24. a sealing block; 25. a support spring; 26. and an air suction hole.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Embodiment 1 referring to fig. 1 to 5, an embodiment of the present utility model is provided: the utility model provides a prevent semiconductor plastic package mould of exhaust jam, including base 1, the centre of base 1 upper end is provided with lower mould 2, lower mould 2's upper end has seted up shaping groove 6, the inside of shaping groove 6 has evenly been seted up exhaust hole 20, exhaust hole 20's lower extreme is provided with prevents feeding structure, base 1 upper end's both sides all are provided with telescopic column 3, telescopic column 3's upper end is provided with upper mould 4, upper mould 4's lower extreme is provided with mold core 9, prevent feeding structure includes exhaust groove 18, exhaust groove 18 has seted up the lower extreme at exhaust hole 20, connecting hole 19 has been seted up between two exhaust grooves 18 on the same straight line, exhaust pipe 10 is installed to one side of lower mould 2, one side of exhaust pipe 10 is connected with connecting hole 19, the inside fixed mounting of exhaust groove 18 has installation piece 22, the upper end movable sleeve of installation piece 22 has seal cover 23, seal piece 24 is movable in exhaust hole 20's inside, installation piece 22's upper end has support spring 25, support spring 25's upper end and 23 fixed connection, exhaust groove 21's inside of lower mould 2 has evenly been seted up exhaust groove 21, exhaust pipe 21 is connected with intermediate vent hole 26;
when the exhaust is needed, the exhaust pipe 5 and the exhaust pipe 10 are connected with the air extractor, the exhaust pipe 5 generates suction force, air between the mounting block 22 and the sealing sleeve 23 is extracted through the air extracting hole 26 and the air extracting groove 21, so that the sealing sleeve 23 moves downwards, the supporting spring 25 is compressed, the sealing block 24 is extracted from the exhaust hole 20, air in the forming groove 6 is exhausted through the exhaust hole 20, the exhaust groove 18 and the exhaust pipe 10, the later plastic packaging is convenient, after the air is extracted, the sealing sleeve 23 and the sealing block 24 restore to the original position under the action of the supporting spring 25, the sealing block 24 is inserted into the exhaust hole 20, and the exhaust hole 20 is prevented from being blocked when plastic is prevented from being injected.
Referring to fig. 1 to 3, an embodiment of the present utility model provides: the semiconductor plastic package die capable of preventing exhaust blocking is characterized in that a demolding hole 17 is uniformly formed in the molding groove 6, demolding pins 8 are movably inserted into the demolding hole 17, a movable structure is arranged at the lower end of the demolding pin 8, the movable structure comprises a movable groove 11, the movable groove 11 is formed in the lower die 2, connecting grooves 13 are formed in two sides of the upper end of the movable groove 11, a movable plate 12 is movably mounted in the movable groove 11, the movable plate 12 is connected with the lower end of the demolding pin 8, connecting rods 14 are fixedly mounted on two sides of the upper end of the movable plate 12, the upper ends of the connecting rods 14 are movably inserted into the connecting grooves 13, moving blocks 16 are fixedly mounted at the ends of the connecting rods, reset springs 15 connected with the moving blocks 16 are sleeved on the surfaces of the connecting rods 14, pressing plates 7 are mounted on two sides of the upper end of the movable plate 12, and the upper ends of the pressing plates 7 are movably inserted into the outer sides of the lower die 2;
when in plastic packaging, the upper die 4 is attached to the lower die 2, the upper die 4 extrudes the pressing plate 7, the pressing plate 7 drives the moving plate 12 to move downwards, the moving plate 12 drives the connecting rod 14 to move downwards, the connecting rod 14 drives the moving block 16 to move downwards, the reset spring 15 is stretched, the moving plate 12 drives the demolding pin 8 to move downwards, after the molding, the upper die 4 and the lower die 2 are separated, the moving plate 12 returns to the original position under the action of the reset spring 15, the demolding pin 8 moves upwards, and the demolding pin 8 ejects molded materials out of the molding groove 6, so that the rapid demolding is convenient.
Working principle: when in plastic packaging, the upper die 4 is attached to the lower die 2, the upper die 4 extrudes the pressing plate 7, the pressing plate 7 drives the moving plate 12 to move downwards, the moving plate 12 drives the connecting rod 14 to move downwards, the connecting rod 14 drives the moving block 16 to move downwards, the reset spring 15 is stretched, the moving plate 12 drives the demoulding needle 8 to move downwards, after the plastic packaging is carried out, the upper die 4 is separated from the lower die 2, the moving plate 12 is restored to original position under the action of the reset spring 15, the demoulding needle 8 moves upwards, the demoulding needle 8 enables the formed material to be ejected out of the forming groove 6, so that the rapid demoulding is facilitated, when exhaust is needed, the exhaust pipe 5 and the exhaust pipe 10 are connected with the exhaust device, the exhaust pipe 5 generates suction force, air between the mounting blocks 22 and 23 is extracted through the exhaust hole 26 and the exhaust groove 21, the sealing sleeve 23 moves downwards, the supporting spring 25 is compressed, the sealing block 24 is extracted from the inside the exhaust hole 20, the air inside the forming groove 6 is discharged through the exhaust hole 20, the exhaust groove 18 and the exhaust pipe 10, after the air is extracted, the sealing block 24 and the sealing block 24 is prevented from being inserted into the exhaust hole 20 after the exhaust hole is extracted, and the sealing block 24 is prevented from being inserted into the inside the exhaust hole 20.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (8)
1. The utility model provides a prevent semiconductor plastic envelope mould that exhaust blockked up, includes base (1), its characterized in that: the middle of base (1) upper end is provided with lower mould (2), shaping groove (6) have been seted up to the upper end of lower mould (2), exhaust hole (20) have evenly been seted up to the inside of shaping groove (6), the lower extreme of exhaust hole (20) is provided with prevents feeding structure, demoulding hole (17) have evenly been seted up to the inside of shaping groove (6), the inside activity of demoulding hole (17) is alternated there is drawing of patterns needle (8), the lower extreme of drawing of patterns needle (8) is provided with movable structure, the both sides of base (1) upper end all are provided with telescopic column (3), the upper end of telescopic column (3) is provided with mould (4), the lower extreme of going up mould (4) is provided with mold core (9).
2. The semiconductor plastic package mold for preventing exhaust blockage according to claim 1, wherein: the feeding prevention structure comprises exhaust grooves (18), wherein the exhaust grooves (18) are formed in the lower ends of exhaust holes (20), and connecting holes (19) are formed between the two exhaust grooves (18) which are positioned on the same straight line.
3. The semiconductor plastic package mold for preventing exhaust blocking of claim 2, wherein: an exhaust pipe (10) is arranged on one side of the lower die (2), and one side of the exhaust pipe (10) is connected with a connecting hole (19).
4. A semiconductor molding die for preventing exhaust plugging as defined in claim 3, wherein: the inside fixed mounting of exhaust groove (18) has installation piece (22), the upper end activity cover of installation piece (22) is equipped with seal cover (23), the upper end fixed mounting of seal cover (23) has sealing block (24), sealing block (24) activity interlude in the inside of exhaust hole (20).
5. The semiconductor plastic package mold for preventing exhaust clogging of claim 4, wherein: the upper end of the mounting block (22) is fixedly provided with a supporting spring (25), and the upper end of the supporting spring (25) is fixedly connected with the sealing sleeve (23).
6. The semiconductor plastic package mold for preventing exhaust clogging of claim 5, wherein: the inner part of the lower die (2) is uniformly provided with air extraction grooves (21), one end of each air extraction groove (21) is provided with an air extraction pipe (5), and the middle of each mounting block (22) is provided with an air extraction hole (26) connected with each air extraction groove (21).
7. The semiconductor plastic package mold for preventing exhaust blockage according to claim 1, wherein: the movable structure comprises a movable groove (11), the movable groove (11) is formed in the lower die (2), connecting grooves (13) are formed in two sides of the upper end of the movable groove (11), a movable plate (12) is movably mounted in the movable groove (11), and the movable plate (12) is connected with the lower end of the demolding needle (8).
8. The semiconductor plastic package mold for preventing exhaust clogging of claim 7, wherein: the movable die comprises a lower die (2), and is characterized in that connecting rods (14) are fixedly installed on two sides of the upper end of the movable plate (12), the upper ends of the connecting rods (14) are movably inserted into the connecting grooves (13), movable blocks (16) are fixedly installed at the ends of the connecting rods, reset springs (15) connected with the movable blocks (16) are sleeved on the surfaces of the connecting rods (14), pressing plates (7) are installed on two sides of the upper end of the movable plate (12), and the upper ends of the pressing plates (7) are movably inserted into the outer sides of the lower die (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322132815.2U CN220548629U (en) | 2023-08-09 | 2023-08-09 | Semiconductor plastic package die capable of preventing exhaust blocking |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322132815.2U CN220548629U (en) | 2023-08-09 | 2023-08-09 | Semiconductor plastic package die capable of preventing exhaust blocking |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220548629U true CN220548629U (en) | 2024-03-01 |
Family
ID=90002913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322132815.2U Active CN220548629U (en) | 2023-08-09 | 2023-08-09 | Semiconductor plastic package die capable of preventing exhaust blocking |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220548629U (en) |
-
2023
- 2023-08-09 CN CN202322132815.2U patent/CN220548629U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |