CN220548556U - Exhaust mechanism of semiconductor plastic package die - Google Patents
Exhaust mechanism of semiconductor plastic package die Download PDFInfo
- Publication number
- CN220548556U CN220548556U CN202321873280.8U CN202321873280U CN220548556U CN 220548556 U CN220548556 U CN 220548556U CN 202321873280 U CN202321873280 U CN 202321873280U CN 220548556 U CN220548556 U CN 220548556U
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- Prior art keywords
- ring
- exhaust
- exhaust mechanism
- plastic packaging
- pipe
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- 230000007246 mechanism Effects 0.000 title claims abstract description 25
- 239000004065 semiconductor Substances 0.000 title claims abstract description 20
- 230000005540 biological transmission Effects 0.000 claims abstract description 21
- 238000004806 packaging method and process Methods 0.000 claims description 25
- 230000000087 stabilizing effect Effects 0.000 claims description 11
- 239000007787 solid Substances 0.000 description 4
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000011435 rock Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
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Abstract
The utility model discloses an exhaust mechanism of a semiconductor plastic package die, which relates to the technical field of exhaust mechanisms and comprises a plastic package machine main body, an exhaust pipe and an exhaust mechanism arranged on the surface of the exhaust pipe, wherein the top of the plastic package machine main body is provided with the exhaust pipe, and the exhaust mechanism comprises a connection assembly and a fastening assembly; the connecting assembly comprises a guide pipe, a connecting ring and a rotating ring, wherein the guide pipe is sleeved on the surface of the exhaust pipe, the connecting ring is fixedly connected to the surface of the guide pipe, and the rotating ring is connected to the surface of the connecting ring in a threaded manner; according to the utility model, the rotating ring is arranged, and because the rotating ring is in threaded connection with the connecting ring, the rotating ring can move upwards along the surface of the connecting ring when rotating, and the movable plate is arranged, so that the connecting block can be pulled upwards when the rotating ring moves upwards, and then the connecting block drives the transmission block and the fastening ring to clamp the exhaust pipe through the movable plate, so that the guide pipe is firmly fixed on the surface of the exhaust pipe.
Description
Technical Field
The utility model relates to the technical field of exhaust mechanisms, in particular to an exhaust mechanism of a semiconductor plastic package die.
Background
The semiconductor refers to a material with conductivity between the conductor and the insulator at normal temperature, the semiconductor needs to be subjected to plastic packaging treatment in the production and transportation processes, and air in a plastic packaging mold is removed, so that the semiconductor is protected, and when the semiconductor is subjected to plastic packaging, a plastic packaging machine is generally adopted for plastic packaging.
When the exhaust device on the semiconductor plastic package die is used for exhausting the plastic package die, the gas is easy to separate from the exhaust pipe due to the impact force of the gas when the gas passes through the exhaust pipe, so that the exhaust of equipment is affected.
Disclosure of Invention
The utility model aims to provide an exhaust mechanism of a semiconductor plastic package die, which aims to solve the problems in the background technology.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the exhaust mechanism of the semiconductor plastic packaging die comprises a plastic packaging machine body, an exhaust pipe and an exhaust mechanism arranged on the surface of the exhaust pipe, wherein the top of the plastic packaging machine body is provided with the exhaust pipe, and the exhaust mechanism comprises a connection assembly and a fastening assembly;
the connecting assembly comprises a guide pipe, a connecting ring and a rotating ring, wherein the guide pipe is sleeved on the surface of the exhaust pipe, the connecting ring is fixedly connected to the surface of the guide pipe, and the rotating ring is connected to the surface of the connecting ring in a threaded manner;
the fastening assembly comprises a connecting block, a movable plate, a transmission block and a fastening ring, wherein the connecting block is rotatably connected to the bottom of the rotating ring, the inner wall of the connecting block is rotatably connected with the movable plate, the surface of the movable plate is rotatably connected with the transmission block, and the bottom of the transmission block is fixedly connected with the fastening ring.
Preferably, the back threaded connection of plastic envelope machine main part has the lead screw, the afterbody swivelling joint of lead screw has the slider, the surface swivelling joint of slider has the power board, the surface swivelling joint of power board has the slide bar, the afterbody fixedly connected with solid fixed ring of slide bar.
Preferably, the circle centers of the rotating ring and the connecting ring are positioned at the same point, and the connecting block is embedded into an annular groove of which the circle center at the bottom of the rotating ring and the rotating ring are positioned at the same point.
Preferably, the movable plate is obliquely arranged relative to the side surface of the exhaust pipe, and the tail part of the movable plate is connected with the transmission block.
Preferably, the transmission block is in sliding connection with the side face of the adapter ring, and the transmission block drives the fastening ring to form a clamping structure through the movable plate.
Preferably, the power plate is symmetrically provided with two groups which are in an eight shape relative to the center point of the sliding block.
Preferably, the stabilizing ring is in sliding connection with the surface of the plastic packaging machine main body, and the stabilizing ring forms a sliding structure through the power plate.
Compared with the prior art, the utility model has the beneficial effects that:
1. according to the utility model, the rotating ring is arranged, and because the rotating ring is in threaded connection with the adapter ring, the rotating ring can move upwards along the surface of the adapter ring when rotating, and the movable plate is arranged, so that the adapter block can be pulled upwards when the rotating ring moves upwards, and then the movable plate drives the transmission block and the fastening ring to clamp the exhaust pipe, so that the guide pipe is firmly fixed on the surface of the exhaust pipe;
2. according to the utility model, the stabilizing ring is arranged, so that the exhaust pipe is prevented from shaking during exhaust, and then when noise is generated, the screw rod can be screwed, the screw rod can drive the sliding block which is rotationally connected with the screw rod to slide along the plastic packaging machine main body and gradually move away from the exhaust pipe, the power plate can drive the sliding rod to approach the stabilizing ring through the movement of the sliding block, and the stabilizing ring can firmly clamp the exhaust pipe to prevent the exhaust pipe from shaking during exhaust.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic view of a stabilizer ring according to the present utility model;
FIG. 3 is a schematic view of a power plate structure according to the present utility model;
fig. 4 is a schematic view of a moving plate structure according to the present utility model.
In the figure: 1. a plastic packaging machine main body; 2. an exhaust pipe; 3. a conduit; 4. a linking ring; 5. a rotating ring; 6. a joint block; 7. a movable plate; 8. a transmission block; 9. a fastening ring; 10. a screw rod; 11. a slide block; 12. a power plate; 13. a slide bar; 14. a stabilizing ring.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
As shown in fig. 1-2, an exhaust mechanism of a semiconductor plastic packaging die comprises a plastic packaging machine main body 1, an exhaust pipe 2 and an exhaust mechanism arranged on the surface of the exhaust pipe 2, wherein the exhaust pipe 2 is arranged at the top of the plastic packaging machine main body 1, and the exhaust mechanism comprises a connection assembly and a fastening assembly;
the connecting component comprises a guide pipe 3, a connecting ring 4 and a rotating ring 5, wherein the guide pipe 3 is sleeved on the surface of the exhaust pipe 2, the connecting ring 4 is fixedly connected to the surface of the guide pipe 3, and the rotating ring 5 is connected to the surface of the connecting ring 4 in a threaded manner;
the fastening assembly comprises a connecting block 6, a movable plate 7, a transmission block 8 and a fastening ring 9, wherein the connecting block 6 is rotationally connected to the bottom of the rotary ring 5, the inner wall of the connecting block 6 is rotationally connected with the movable plate 7, the surface of the movable plate 7 is rotationally connected with the transmission block 8, and the bottom of the transmission block 8 is fixedly connected with the fastening ring 9.
The circle centers of the rotating ring 5 and the connecting ring 4 are located at the same point, and the connecting block 6 is embedded into an annular groove at the same point as the circle center of the bottom of the rotating ring 5 and the rotating ring 5, because the rotating ring 5 is in threaded connection with the connecting ring 4, and when the rotating ring rotates, the rotating ring moves upwards along the surface of the connecting ring 4.
Wherein, fly leaf 7 is the slope setting about the side of blast pipe 2, and the afterbody of fly leaf 7 is connected with drive block 8, through setting up fly leaf 7, when rotatory ring 5 upward movement, can upwards pull joint piece 6, and joint piece 6 immediately drives drive block 8 and fastening ring 9 through fly leaf 7 and carry out the centre gripping to blast pipe 2.
Wherein, transmission piece 8 and the side sliding connection who links up ring 4, transmission piece 8 drive fastening ring 9 through fly leaf 7 and constitute the clamping structure, through setting up fastening ring 9, when fastening ring 9 carries out the centre gripping to blast pipe 2, can prevent that pipe 3 from dropping from blast pipe 2.
As shown in fig. 3-4, the back of the plastic packaging machine main body 1 is connected with a screw rod 10 in a threaded manner, the tail of the screw rod 10 is rotationally connected with a sliding block 11, the surface of the sliding block 11 is rotationally connected with a power plate 12, the surface of the power plate 12 is rotationally connected with a sliding rod 13, and the tail of the sliding rod 13 is fixedly connected with a stabilizing ring 14.
Wherein, the power plate 12 is symmetrically provided with two groups of eight-shaped with respect to the center point of the sliding block 11, and the power plate 12 drives the sliding rod 13 to approach the stabilizing ring 14 through the movement of the sliding block 11.
The fixing ring 14 is slidably connected with the surface of the plastic sealing machine body 1, the fixing ring 14 forms a sliding structure through the power plate 12, and the fixing ring 14 can firmly clamp the exhaust pipe 2 to prevent the exhaust pipe 2 from shaking during exhaust.
Working principle: when the exhaust mechanism of the semiconductor plastic packaging die is used, the guide pipe 3 is sleeved on the surface of the exhaust pipe 2, gas enters the guide pipe 3 through the exhaust pipe 2 for exhaust treatment, and because the impact force is relatively high during the exhaust of the gas, in order to prevent the guide pipe 3 from loosening from the surface of the exhaust pipe 2, the rotating ring 5 can be controlled to rotate on the surface of the adapter ring 4, and the rotating ring 5 is in threaded connection with the adapter ring 4, so that the rotating ring 5 moves upwards along the surface of the adapter ring 4 during the rotation, the movable plate 7 is arranged, the adapter block 6 is pulled upwards during the upward movement of the rotating ring 5, and the movable plate 7 drives the transmission block 8 and the fastening ring 9 to clamp the exhaust pipe 2, so that the guide pipe 3 is firmly fixed on the surface of the exhaust pipe 2;
through setting up solid ring 14, in order to prevent that blast pipe 2 from taking place to rock when exhausting, when producing the noise then, the accessible twists movable lead screw 10, and lead screw 10 can drive the slider 11 with self swivelling joint and slide along plastic envelope machine main part 1, keeps away from blast pipe 2 gradually, and power board 12 can drive slide bar 13 to solid ring 14 and be close to, and solid ring 14 can carry out firm centre gripping to blast pipe 2, prevents that blast pipe 2 from taking place to rock when exhausting.
The embodiments of the utility model have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the utility model in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments were chosen and described in order to best explain the principles of the utility model and the practical application, and to enable others of ordinary skill in the art to understand the utility model for various embodiments with various modifications as are suited to the particular use contemplated.
Claims (7)
1. The utility model provides an exhaust mechanism of semiconductor plastic envelope mould, includes plastic envelope machine main part (1), blast pipe (2) and sets up in the exhaust mechanism on blast pipe (2) surface, its characterized in that: an exhaust pipe (2) is arranged at the top of the plastic packaging machine main body (1), and the exhaust mechanism comprises a connection assembly and a fastening assembly;
the connecting assembly comprises a guide pipe (3), a connecting ring (4) and a rotating ring (5), wherein the guide pipe (3) is sleeved on the surface of the exhaust pipe (2), the connecting ring (4) is fixedly connected to the surface of the guide pipe (3), and the rotating ring (5) is connected to the surface of the connecting ring (4) in a threaded manner;
the fastening assembly comprises a connecting block (6), a movable plate (7), a transmission block (8) and a fastening ring (9), wherein the connecting block (6) is rotationally connected to the bottom of the rotary ring (5), the movable plate (7) is rotationally connected to the inner wall of the connecting block (6), the transmission block (8) is rotationally connected to the surface of the movable plate (7), and the fastening ring (9) is fixedly connected to the bottom of the transmission block (8).
2. The exhaust mechanism of a semiconductor plastic packaging die according to claim 1, wherein a screw rod (10) is connected to the back side of the plastic packaging machine body (1) in a threaded manner, a sliding block (11) is connected to the tail of the screw rod (10) in a rotating manner, a power plate (12) is connected to the surface of the sliding block (11) in a rotating manner, a sliding rod (13) is connected to the surface of the power plate (12) in a rotating manner, and a stabilizing ring (14) is fixedly connected to the tail of the sliding rod (13).
3. The exhaust mechanism of the semiconductor plastic packaging die according to claim 1, wherein the circle centers of the rotating ring (5) and the connecting ring (4) are positioned at the same point, and the connecting block (6) is embedded into an annular groove of which the circle center at the bottom of the rotating ring (5) and the rotating ring (5) are positioned at the same point.
4. The exhaust mechanism of the semiconductor plastic packaging die according to claim 1, wherein the movable plate (7) is obliquely arranged relative to the side face of the exhaust pipe (2), and the tail part of the movable plate (7) is connected with the transmission block (8).
5. The exhaust mechanism of the semiconductor plastic packaging die according to claim 1, wherein the transmission block (8) is slidably connected with the side surface of the adapter ring (4), and the transmission block (8) drives the fastening ring (9) to form a clamping structure through the movable plate (7).
6. The exhaust mechanism of a semiconductor plastic packaging mold according to claim 2, wherein the power plate (12) is symmetrically provided with two groups in an eight shape with respect to a center point of the slider (11).
7. The exhaust mechanism of a semiconductor plastic packaging mold according to claim 2, wherein the stabilizing ring (14) is slidably connected with the surface of the plastic packaging machine body (1), and the stabilizing ring (14) forms a sliding structure through the power plate (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321873280.8U CN220548556U (en) | 2023-07-17 | 2023-07-17 | Exhaust mechanism of semiconductor plastic package die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321873280.8U CN220548556U (en) | 2023-07-17 | 2023-07-17 | Exhaust mechanism of semiconductor plastic package die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220548556U true CN220548556U (en) | 2024-03-01 |
Family
ID=90006459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321873280.8U Active CN220548556U (en) | 2023-07-17 | 2023-07-17 | Exhaust mechanism of semiconductor plastic package die |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220548556U (en) |
-
2023
- 2023-07-17 CN CN202321873280.8U patent/CN220548556U/en active Active
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