CN220545198U

CN220545198U - PCB packaging structure capable of avoiding intermediate threading of optocoupler

Info

Publication number: CN220545198U
Application number: CN202322071027.7U
Authority: CN
Inventors: 吴键峰; 王灿钟
Original assignee: Edadoc Co ltd
Current assignee: Edadoc Co ltd
Priority date: 2023-08-01
Filing date: 2023-08-01
Publication date: 2024-02-27
Anticipated expiration: 2033-08-01

Abstract

The utility model discloses a PCB packaging structure for avoiding middle threading of an optocoupler, which comprises a PCB body, wherein the PCB body is provided with optocoupler bonding pads, the center of each optocoupler bonding pad is provided with an optocoupler silk screen, one side of each optocoupler bonding pad close to the optocoupler silk screen is correspondingly provided with a grounding via hole, the center of the optocoupler silk screen is provided with a wire-inhibition area, the length of a first side of the wire-inhibition area is equal to the length of a side parallel to the optocoupler silk screen, and the distance between the first side of the wire-inhibition area and the side of the grounding via hole far from the optocoupler bonding pad is less than 1 mil. The utility model sets the forbidden wiring area and the position and the size of the forbidden wiring area, so that the forbidden wiring area is in a proper area and has proper size, on one hand, wiring at the optocoupler device can be prevented, and on the other hand, the size of the forbidden wiring area is reduced as much as possible, thereby leading to larger area wiring on the circuit board and facilitating circuit board design.

Description

PCB packaging structure capable of avoiding intermediate threading of optocoupler

Technical Field

The utility model relates to the technical field of PCB packaging structures, in particular to a PCB packaging structure for avoiding intermediate threading of an optocoupler.

Background

PCB (Printed Circuit Board) the Chinese name printed circuit board, also called printed circuit board, is an important electronic component, is a support for electronic components, and is a carrier for electrically interconnecting electronic components. It is called a "printed" circuit board because it is made using electronic printing.

Optocouplers (OC) are also known as opto-isolators, optocouplers. The photocoupler transmits an electrical signal with light as a medium. It has good isolation effect on input and output electric signals, so that it can be widely used in various circuits.

The circuit board prohibits wiring at the optocoupler device to prevent the optocoupler device from interfering with the wiring or the wiring from interfering with the optocoupler device. The size of a forbidden wiring area is determined empirically at an optocoupler according to the prior circuit board, the forbidden wiring area is too large, the wiring area of the circuit board is reduced, wiring is affected, the forbidden wiring area is too small, and the circuit is arranged at the optocoupler, so that the circuit and the optocoupler cannot work normally.

The above disadvantages are to be improved.

Disclosure of Invention

In order to solve or relieve the problem that the existing circuit board determines the size of a forbidden wiring area according to experience at an optocoupler, the forbidden wiring area is too large, the wiring area of the circuit board is reduced, wiring is affected, the forbidden wiring area is too small, and the circuit is arranged at the optocoupler, so that the circuit and the optocoupler cannot work normally.

The technical scheme of the utility model is as follows:

the utility model provides a avoid PCB packaging structure of threading in middle of opto-coupler device, includes the PCB body, be provided with opto-coupler device pad on the PCB body, each opto-coupler device pad's center is provided with opto-coupler device silk screen printing, opto-coupler device pad is close to opto-coupler device silk screen printing one side one-to-one is provided with the ground connection via hole, opto-coupler device silk screen printing center is provided with the forbidden wiring district, the length of the first limit of forbidden wiring district with opto-coupler device silk screen printing parallel one side length equals, the first limit of forbidden wiring district with the interval that the one side cut that the ground connection via hole kept away from opto-coupler device pad is less than 1 mil.

According to the PCB packaging structure for preventing intermediate threading of the optocoupler, the distance between the pad of the optocoupler and the corresponding grounding via hole is not smaller than 6 mils.

Further, the distance between the optical coupler bonding pad and the corresponding grounding via hole is equal to 6 mils.

According to the PCB packaging structure for preventing intermediate threading of the optocoupler, the diameter of the grounding via hole is 16-20 mils.

Further, the diameter of the grounding via hole is 18 mils.

According to the PCB packaging structure for preventing intermediate threading of the optocoupler, the distance between the first edge of the wire inhibition area and the side edge of the grounding via hole far away from the optocoupler bonding pad is 0.5 mil.

According to the PCB packaging structure for preventing the intermediate threading of the optocoupler, the distance between adjacent pads of the optocoupler is 100 mils.

According to the PCB packaging structure for preventing intermediate threading of the optocoupler, the distance between the PCB packaging structure and the pad of the optocoupler is 244.1 mils.

According to the PCB packaging structure for preventing middle threading of the optocoupler, the length of the bonding pad of the optocoupler is 83 mils, and the width of the bonding pad of the optocoupler is 26 mils.

According to the PCB packaging structure for preventing intermediate threading of the optocoupler, the length of the wire-forbidden area is 161.42 mils, and the width of the wire-forbidden area is 112 mils.

According to the scheme, the utility model has the beneficial effects that the forbidden wiring area and the position and the size of the forbidden wiring area are set, so that the forbidden wiring area is in a proper area and has proper size, wiring at an optocoupler can be prevented on one hand, and the size of the forbidden wiring area is reduced as much as possible on the other hand, so that a circuit board is provided with a larger area for wiring, and circuit board design is facilitated.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments or the description of the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of the present utility model applied to a TLP184 package;

fig. 2 is a schematic structural diagram of the present utility model applied to the FODM214 package.

Wherein, each reference sign in the figure: 1. a PCB body; 2. an optocoupler device pad; 3. silk screen printing of an optical coupler device; 4. a ground via; 5. the wiring region is prohibited.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the utility model is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.

It will be understood that when an element is referred to as being "mounted" or "disposed" or "connected" to another element, it can be directly or indirectly on the other element. The directions or positions indicated by the terms "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are directions or positions based on the drawings, and are merely for convenience of description and are not to be construed as limiting the present technical solution. The terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "multiple" is two or more, unless explicitly defined otherwise. The meaning of "a number" is one or more than one, unless specifically defined otherwise.

As shown in fig. 1 and fig. 2, in one embodiment of the present utility model, a PCB packaging structure for avoiding intermediate threading of an optocoupler device includes a PCB body 1, an optocoupler device pad 2 is disposed on the PCB body 1, an optocoupler device screen 3 is disposed at a center of each optocoupler device pad 2, grounding vias 4 are disposed on one side of the optocoupler device pad 2 near the optocoupler device screen 3 in a one-to-one correspondence manner, a wire prohibiting area 5 is disposed at a center of the optocoupler device screen 3, a length of a first side of the wire prohibiting area 5 is equal to a length of a side parallel to the optocoupler device screen 3, and a distance L1 between the first side of the wire prohibiting area 5 and a side edge of the grounding via 4 away from the optocoupler device pad 2 is smaller than 1 mil.

In this embodiment, the forbidden wiring area 5 is set in the region of the pad 2 of the optocoupler device, so that wiring at the optocoupler device during PCB design is prevented, interference of the optocoupler device to the circuit is prevented, or interference of the circuit to the optocoupler device is prevented, and normal operation of the optocoupler device and the circuit is ensured. The first side of the wire-forbidden area 5 is equal to the parallel side of the optical coupler device silk screen 3, the distance L1 between the first side of the wire-forbidden area 5 and the same side grounding via hole 4 is smaller than 1 mil, the size of the optical coupler device silk screen 3 is equal to that of the optical coupler device, the circuit of the optical coupler device is mainly concentrated at the center, the wire-forbidden area 5 covers the center of the optical coupler device, on one hand, the mutual interference of the optical coupler device and the circuit can be prevented, and the normal work of the optical coupler device and the circuit can be ensured; on the other hand, the wiring prohibiting area 5 is in the range of the optical coupler device silk screen 3, and only limits wiring in the range of the optical coupler device, controls the area of the circuit board where wiring is prohibited, and facilitates normal wiring of other areas of the circuit board; on the other hand, the forbidden wiring area 5 does not exceed the grounding via hole 4, normal wiring at the via hole is ensured, the size of the forbidden wiring area 5 is further reduced, the area capable of wiring is enlarged, and wiring is facilitated.

In this embodiment, by setting the wire-inhibition area 5 and the position and size of the wire-inhibition area 5, the wire-inhibition area 5 is located in a proper area and has a proper size, so that on one hand, the wire can be prevented from being routed at the optocoupler device, and on the other hand, the size of the wire-inhibition area 5 is reduced as much as possible, so that a larger area is routed on the circuit board, and the circuit board design is facilitated.

In practical application, the utility model can use optical coupling devices with different types, such as TLP184, FODM214 and the like, not limited to 4 pins, but also applicable to 6 pins, 8 pins and the like.

As shown in fig. 1, in a preferred embodiment, the distance L2 between the optocoupler pad 2 and the corresponding ground via 4 is not less than 6 mils, and the distance L2 between the optocoupler pad 2 and the corresponding ground via 4 is equal to 6 mils. In this embodiment, by controlling the interval between the optocoupler bonding pad 2 and the ground via hole 4, a sufficient interval is provided between the optocoupler bonding pad 2 and the ground via hole 4, so as to prevent the optocoupler bonding pad 2 and the ground via hole 4 from being too close, and the ground bonding pad damages the bonding pad structure during the production and manufacture process, thereby preventing the connection between the optocoupler and the optocoupler bonding pad 2 from being affected. The spacing between the pad 2 of the optical coupler device and the grounding via 4 is generally 6 mil, 7 mil, 10 mil, 12 mil and the like, and the spacing is reduced as much as possible in the process range, so that the forbidden wiring area 5 can cover the range of the optical coupler device more comprehensively, and the normal operation of the optical coupler device is ensured.

As shown in fig. 1, in a preferred example, the diameter D of the ground via 4 is 16 mils to 20 mils, and the diameter D of the ground via 4 is 18 mils. The ground vias 4 in this example provide a circuit for the ground point to improve the interference rejection of the overall circuit board. Meanwhile, the length of a current loop of the PCB can be effectively shortened, and the loop is prevented from being formed. Prevent large-area copper sheet from tilting and falling off, and improve electromagnetic compatibility (EMC) and electrostatic discharge (ESD). By controlling the diameter D of the ground via hole 4, the ground via hole 4 is not too large, the range of the forbidden wiring area 5 is prevented from being smaller, the coverage range of the optocoupler is limited, and the normal operation of the optocoupler may be affected. And the grounding via hole 4 is not too small, so that the grounding via hole 4 is prevented from being influenced to play a role. Specifically, the diameter D of the ground via 4 is 16 mils, 17 mils, 18 mils, 20 mils, or the like.

As shown in fig. 1, in a preferred example, a pitch L1 between the first side of the no-wiring area 5 and the side of the ground via 4 away from the optocoupler pad 2 is 0.5 mils. In this embodiment, by controlling the distance between the forbidden wiring area 5 and the ground via 4, it is ensured that the forbidden wiring area 5 has a sufficiently large range, and can cover the optocoupler more completely, so as to ensure the normal operation of the optocoupler.

As shown in fig. 1, in a preferred example, the distance L3 between adjacent optocoupler pads 2 is 100 mils, and the distance L4 between adjacent optocoupler pads 2 is 244.1 mils; the length L5 of the optocoupler bonding pad 2 is 83 mils, the width L6 of the optocoupler bonding pad 2 is 26 mils, the length L7 of the no-wire-laying area 5 is 161.42 mils, and the width L8 of the no-wire-laying area 5 is 112 mils. The embodiment is suitable for TLP184 packaging, and by setting a suitable pad position and size, the TLP can be matched with an optocoupler, so that the forbidden wiring area 5 can cover the central area of the optocoupler. By setting the forbidden wiring area 5 with a proper size, the main working area of the optical coupler device can be well covered, and the normal operation of the optical coupler device is ensured.

The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.

Claims

1. The PCB packaging structure is characterized by comprising a PCB body, wherein an optocoupler device bonding pad is arranged on the PCB body, optocoupler device silk-screen printing is arranged at the center of each optocoupler device bonding pad, grounding through holes are arranged on one side, close to the optocoupler device silk-screen printing, of each optocoupler device silk-screen printing in a one-to-one correspondence mode, a wire-inhibition area is arranged at the center of each optocoupler device silk-screen printing, the length of a first side of the wire-inhibition area is equal to the length of one side, parallel to the optocoupler device silk-screen printing, of each optocoupler device, and the distance between the first side of the wire-inhibition area and a side edge of each grounding through hole, far away from the optocoupler device bonding pad, is smaller than 1 mil.

2. The PCB packaging structure of claim 1, wherein a pitch between the optocoupler pad and the corresponding ground via is not less than 6 mils.

3. The PCB packaging structure of claim 2, wherein a pitch between the optocoupler pads and the corresponding ground vias is equal to 6 mils.

4. The PCB packaging structure of claim 1, wherein the ground via has a diameter of 16 mils to 20 mils.

5. The PCB packaging structure of claim 4, wherein the ground via has a diameter of 18 mils.

6. The PCB packaging structure of claim 1, wherein a pitch between the first edge of the no-wire-laying area and a side of the ground via away from the optocoupler pad is 0.5 mils.

7. The PCB packaging structure of claim 1, wherein a pitch between adjacent optocoupler pads is 100 mils.

8. The PCB packaging structure of claim 1, wherein the pitch of the pads of the optocoupler is 244.1 mils.

9. The PCB packaging structure of claim 1, wherein the optocoupler pads have a length of 83 mils and a width of 26 mils.

10. The PCB packaging structure of claim 1, wherein the length of the no-wire-laying area is 161.42 mils, and the width of the no-wire-laying area is 112 mils.