CN220543873U - Semiconductor component adsorption machine - Google Patents
Semiconductor component adsorption machine Download PDFInfo
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- CN220543873U CN220543873U CN202321488579.1U CN202321488579U CN220543873U CN 220543873 U CN220543873 U CN 220543873U CN 202321488579 U CN202321488579 U CN 202321488579U CN 220543873 U CN220543873 U CN 220543873U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 128
- 238000001179 sorption measurement Methods 0.000 title claims abstract description 41
- 230000007246 mechanism Effects 0.000 claims abstract description 49
- 238000012937 correction Methods 0.000 claims abstract description 33
- 230000000694 effects Effects 0.000 claims abstract description 4
- 238000009434 installation Methods 0.000 abstract description 14
- 238000006243 chemical reaction Methods 0.000 abstract description 5
- 238000012545 processing Methods 0.000 abstract description 2
- 230000009471 action Effects 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model discloses a semiconductor component adsorption machine, and relates to the technical field of semiconductor processing. The device comprises a machine mechanism, wherein a semiconductor placing groove and a component placing groove are respectively formed in a top valve of the machine mechanism. Through setting up correction mechanism, make it carry out the connection support through connecting branch and spacing branch to correcting the roller, when the semiconductor panel of placing on the connection bedplate takes place to touch with correction roller in advancing, correction roller takes place to rotate, connecting spring takes place to shrink, semiconductor panel receives the reaction force that takes place to touch with correction roller and produces takes place the position offset, in order to realize correcting the state that semiconductor panel placed, and then limiting clamp plate carries out the location centre gripping to the semiconductor panel of placing on the connection bedplate under the effect of spring expansion piece, prevent that semiconductor panel from taking place the position offset when carrying out the components and parts installation, stability and accuracy in order to ensure components and parts installation, improve its installation quality.
Description
Technical Field
The utility model relates to the technical field of semiconductor processing, in particular to a semiconductor component adsorption machine.
Background
The semiconductor refers to a material with conductivity between a conductor and an insulator at normal temperature; semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high power conversion, etc., such as diodes, which are devices fabricated using semiconductors; the importance of semiconductors is enormous, both from a technological and an economic point of view.
In the prior art, when a semiconductor is applied to an integrated circuit, a semiconductor component required by the use of the integrated circuit is required to be installed on the integrated circuit, and the installation of the existing semiconductor component is carried out by adsorbing the component on a semiconductor plate.
However, in the existing adsorption equipment for semiconductor components, when the adsorption equipment is used, semiconductor boards are placed below the component adsorption equipment, so that deviation of the placement positions of the semiconductor boards is easily caused, and the quality of component installation is affected.
Disclosure of Invention
The utility model provides a semiconductor component adsorption machine table, which aims to solve the problems in the background technology.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the semiconductor component adsorption machine comprises a machine mechanism, wherein a semiconductor placing groove and a component placing groove are respectively formed in a top valve of the machine mechanism, an adsorption mechanism is arranged above the semiconductor placing groove and the component placing groove, and a connecting push rod is connected between the semiconductor placing groove and the component placing groove;
semiconductor standing groove includes connecting guide rail, connecting guide rail sets up the interior bottom wall at the semiconductor standing groove, be provided with the supporting seat on the connecting guide rail, the top of supporting seat is provided with the connection bedplate, the inside of supporting seat runs through and is provided with the connecting rod, the semiconductor standing groove still includes connection spout, correction mechanism and spring expansion piece set up respectively at the both sides inner wall of semiconductor standing groove, and the one end connection that the semiconductor standing groove inner wall was kept away from to the spring expansion piece is provided with spacing splint, the semiconductor standing groove is close to the inside connection spout of having seted up in one side of components and parts standing groove.
Further, the adsorption mechanism comprises a support frame, a linear cylinder is arranged on one side of the front face of the support frame, a linear guide rail is connected with the output end of the linear cylinder, and a connecting piece is arranged on the linear guide rail.
Further, limiting slide bars are arranged on two sides of the front face of the connecting piece, electric pushing rods are arranged between the limiting slide bars on two sides of the front face of the connecting piece, an adsorption assembly is connected to the outer wall of the limiting slide bars in a sliding mode, and the bottom end of the electric pushing rods is movably clamped with the adsorption assembly.
Further, the correction mechanism comprises a connection supporting rod, one end of the connection supporting rod is provided with a limiting supporting piece, the inner side of the limiting supporting piece is provided with a correction roller, a limiting groove is formed in the joint of the limiting supporting piece and the correction roller, and the inner wall of the limiting groove is connected with a connecting spring in a clamping mode with the rotating shaft end of the correction roller.
Further, the model of correction mechanism is provided with two kinds, and two kinds correction mechanism sets up the inner wall at the semiconductor standing groove in front and back, and the last spacing groove of correction mechanism and the length of connecting spring that the position was in front all are less than the last spacing groove of correction mechanism and the length of connecting spring that the position was in back.
Further, the shape size structure setting of semiconductor standing groove and components and parts standing groove is the same, semiconductor standing groove and components and parts standing groove use the perpendicular bisector of board mechanism to set up as symmetry axis symmetry, and connect the spout mutually link up on semiconductor standing groove and the components and parts standing groove, and run through between semiconductor standing groove and components and parts standing groove and be provided with same connecting rod, the middle section department outer wall of connecting rod and the one end activity joint of connecting the push rod.
Further, the lower surface of the limiting clamp plate and the upper surface of the connecting seat plate are arranged on the same horizontal plane, and the front side part of the limiting clamp plate is arranged as an arc-shaped curved surface body which is outwards turned towards the side wall of the semiconductor placing groove.
By means of the technical scheme, the utility model provides a semiconductor component adsorption machine, which has at least the following beneficial effects:
1. this semiconductor components and parts adsorb board through setting up correction mechanism, makes it carry out joint support through connecting branch and spacing branch to correcting the roller, when the semiconductor panel of placing on the connection bedplate takes place to touch with correcting the roller in advancing, correcting the roller and taking place to rotate, connecting spring takes place to shrink, semiconductor panel receives the reaction force that takes place to touch with correcting the roller and produces and takes place the position offset, in order to realize correcting the state that semiconductor panel placed, and then under the effect of spring expansion piece, the semiconductor panel of placing on the connection bedplate carries out location centre gripping, prevent that semiconductor panel from appearing the position offset when carrying out components and parts installation, in order to ensure the stability and the accuracy of components and parts installation, improve its installation quality.
2. This semiconductor components and parts adsorbs board through setting up electric putter, makes it drive the adsorption component and slides along the extending direction of spacing slide bar to adjust its use height, and adsorb components and parts through adsorption component, with the wearing and tearing that reduces the components and parts and draws, improve the protectiveness that its used, and then drive the linear guide through the linear cylinder and drive the connecting piece and carry out horizontal position adjustment, and shift the adsorbed components and parts of adsorption component to placing on the semiconductor panel in the semiconductor standing groove, carry out components and parts installation, and then effectively promote its flexibility of using the operation, strengthen its practicality.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this application:
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a front cross-sectional view of a semiconductor placement tank and component placement tank connection of the present utility model;
FIG. 3 is a top cross-sectional view of a semiconductor placement tank of the present utility model;
FIG. 4 is an enlarged schematic view of the structure of FIG. 2A according to the present utility model;
fig. 5 is a schematic structural view of an adsorption mechanism according to the present utility model.
In the figure: 1. a machine mechanism; 2. a semiconductor placement groove; 201. a connecting guide rail; 202. a support base; 203. a connecting seat board; 204. a connecting rod; 205. the connecting chute; 206. a correction mechanism; 2061. a connecting strut; 2062. a limit support; 2063. correcting the rotating roller; 2064. a limit groove; 2065. a connecting spring; 207. a spring telescoping member; 208. limiting clamping plates; 3. a component placement groove; 4. the push rod is connected; 5. an adsorption mechanism; 501. a support frame; 502. a linear cylinder; 503. a linear guide rail; 504. a connecting piece; 505. an electric push rod; 506. a limit slide bar; 507. and (5) an adsorption component.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-5, the utility model discloses a semiconductor component adsorbing machine, which comprises a machine mechanism 1, wherein a semiconductor placing groove 2 and a component placing groove 3 are respectively formed in a top valve of the machine mechanism 1, an adsorbing mechanism 5 is arranged above the semiconductor placing groove 2 and the component placing groove 3, and a connecting push rod 4 is arranged between the semiconductor placing groove 2 and the component placing groove 3 in a connecting way;
semiconductor standing groove 2 includes connecting rail 201, connecting rail 201 sets up the interior diapire at semiconductor standing groove 2, be provided with supporting seat 202 on the connecting rail 201, the top of supporting seat 202 is provided with connection bedplate 203, the inside of supporting seat 202 runs through and is provided with connecting rod 204, semiconductor standing groove 2 still includes connecting chute 205, correction mechanism 206 and spring expansion piece 207 set up respectively at semiconductor standing groove 2's both sides inner wall, and the one end connection that the inner wall of semiconductor standing groove 2 was kept away from to spring expansion piece 207 is provided with spacing splint 208, connecting chute 205 has been seted up to the inside one side that semiconductor standing groove 2 is close to components and parts standing groove 3, the semiconductor standing groove 2 is close to,
Specifically, the adsorption mechanism 5 includes a support frame 501, a linear cylinder 502 is disposed on one side of the front surface of the support frame 501, a linear guide 503 is disposed at an output end of the linear cylinder 502 in a connecting manner, and a connecting piece 504 is disposed on the linear guide 503. Make adsorption equipment 5 when using, support it through support frame 501 to drive linear guide 503 through linear cylinder 502 and drive connecting piece 504 and carry out horizontal position adjustment, and then be convenient for shift the adsorbed components and parts of adsorption component 507 to the semiconductor panel of placing in semiconductor standing groove 2 on, carry out the components and parts installation, with the flexibility that promotes its use operation, strengthen its usability.
Specifically, limiting slide bars 506 are arranged on two sides of the front face of the connecting piece 504, an electric push rod 505 is arranged between the limiting slide bars 506 on two sides, an adsorption assembly 507 is slidably connected to the outer wall of the limiting slide bars 506, and the bottom end of the electric push rod 505 is movably clamped with the adsorption assembly 507. When the adsorption mechanism 5 is used, the adsorption assembly 507 is driven to slide along the extending direction of the limiting slide rod 506 through the pushing of the electric push rod 505, so that the use height of the adsorption mechanism is adjusted, and components are adsorbed through the adsorption assembly 507, so that the abrasion of component extraction is reduced, and the use protection and convenience of the adsorption mechanism are improved.
Specifically, the correction mechanism 206 includes a connection strut 2061, one end of the connection strut 2061 is provided with a limit support 2062, the inner side of the limit support 2062 is provided with a correction roller 2063, a connection part of the limit support 2062 and the correction roller 2063 is provided with a limit groove 2064, and the inner wall of the limit groove 2064 is connected with a connection spring 2065 in a clamping connection with the rotation shaft end of the correction roller 2063. So that the straightening mechanism 206 is in use, the straightening roller 2063 is connected and supported by the connecting support rod 2061 and the limiting support piece 2062, when the semiconductor board placed on the connecting seat plate 203 is in contact with the straightening roller 2063 in the pushing process, the straightening roller 2063 rotates, the connecting spring 2065 contracts, the semiconductor board is subjected to the position deviation of the reaction force generated by the contact with the straightening roller 2063, so that the placed state of the semiconductor board is straightened, the subsequent semiconductor board enters the limiting clamping plate 208 to be positioned and clamped, the use operability of the semiconductor board is ensured, and the practicability of the semiconductor board is enhanced.
Specifically, the types of the correction mechanisms 206 are two, the two correction mechanisms 206 are arranged on the inner wall of the semiconductor placing groove in tandem, and the lengths of the limit groove 2064 and the connecting spring 2065 on the correction mechanism 206 at the front position are smaller than those of the limit groove 2064 and the connecting spring 2065 on the correction mechanism 206 at the rear position. When the device is used, the position of the semiconductor plate placed on the connecting seat plate 203 is adjusted through the correcting mechanism 206 arranged in tandem, and the lengths of the limiting groove 2064 and the connecting spring 2065 on the correcting mechanism 206 at the front position are smaller than those of the limiting groove 2064 and the connecting spring 2065 on the correcting mechanism 206 at the rear position, so that the correcting mechanism 206 can correct and adjust the placement of the semiconductor plate positions with different sizes, and the accuracy of mounting of semiconductor components is further ensured.
Specifically, the shape, size and structure settings of the semiconductor placing groove 2 and the component placing groove 3 are the same, the semiconductor placing groove 2 and the component placing groove 3 are symmetrically arranged by taking the perpendicular bisector of the machine table mechanism 1 as a symmetry axis, the connecting sliding groove 205 on the semiconductor placing groove 2 and the component placing groove 3 are mutually communicated, the same connecting rod 204 is arranged between the semiconductor placing groove 2 and the component placing groove 3 in a penetrating way, and the outer wall of the middle section of the connecting rod 204 is movably clamped with one end of the connecting push rod 4. When the device is used, the semiconductor and the components are effectively led in and placed, through the mutual penetration of the connecting sliding groove 205, an operable space is reserved for the sliding of the connecting rod 204, and then the moving synchronism of the device is guaranteed under the pushing of the connecting push rod 4, so that the semiconductor plate and the components and the semiconductor plate and the components with the components mounted are conveniently taken in and placed, and the convenience of operation and use of the device is effectively improved.
Specifically, the lower surface of the limiting clamp plate 208 and the upper surface of the connection seat plate 203 are disposed on the same horizontal plane, and the front portion of the limiting clamp plate 208 is disposed as an arc-shaped curved surface body turned outwards toward the side wall of the semiconductor placing groove 2. When the limiting clamp plate 208 is used, the lower surface of the limiting clamp plate 208 and the upper surface of the connecting seat plate 203 are kept on the same horizontal plane, the limiting clamp plate 208 is used for positioning and clamping the semiconductor plates placed on the connecting seat plate 203 under the action of the spring telescopic piece 207, so that the semiconductor plates are prevented from position deviation during component installation, meanwhile, the front side part of the limiting clamp plate 208 is arranged to be an arc-shaped curved surface body outwards turned towards the side wall of the semiconductor placing groove 2, the connecting seat plate 203 is effectively enabled to be convenient for the semiconductor plates on the connecting seat plate 203 to enter between the limiting clamp plates 208 when the semiconductor plates are driven to move to the component installation position, and the operability of the semiconductor plates entering between the limiting clamp plates 208 is further guaranteed, and the practicability is improved.
When the semiconductor component adsorbing machine is used, the connecting push rod 4 is pulled, the connecting seat plate 203 in the placing groove is driven to slide to the front sides of the semiconductor placing groove 2 and the component placing groove 3 along the extending direction of the connecting guide rail 201 through the action of the connecting rod 204, then the semiconductor plate and the component are placed on the connecting seat plate 203 respectively, the connecting push rod 4 is pushed, and then the semiconductor plate placed on the connecting seat plate 203 is contacted with the correcting roller 2063 in the pushing process.
The straightening roller 2063 rotates, the connecting spring 2065 contracts, and the semiconductor plate is subjected to a position shift by a reaction force generated by touching the straightening roller 2063, so that the state of the semiconductor plate is straightened. And under the pushing of the connecting push rod 4, the limiting clamp plate 208 is arranged by an arc-shaped curved surface body which is outwards turned towards the side wall of the semiconductor placing groove 2 at the front side part of the limiting clamp plate, so that the semiconductor plate on the connecting seat plate 203 enters between the limiting clamp plates 208. And then the limiting clamp plate 208 is used for positioning and clamping the semiconductor plate placed on the connection seat plate 203 under the action of the spring expansion piece 207, so that the semiconductor plate is prevented from being shifted when components are mounted. And the connection seat board 203 drives the upper semiconductor plate to move to the component mounting position under the pushing of the connection push rod 4, and meanwhile, the components placed in the component placing groove 3 are operated to the mounting position after being corrected in the same way under the synchronous conduction of the connection rod 204. And then the adsorption component 507 is driven to slide along the extending direction of the limit sliding rod 506 by the pushing of the electric push rod 505 so as to adjust the use height of the adsorption component.
The components and parts are adsorbed through the adsorption component 507 to reduce the wearing and tearing to the components and parts extraction, and then drive linear guide 503 through the linear cylinder 502 and drive the connecting piece 504 and carry out horizontal position adjustment, and shift the adsorbed components and parts of adsorption component 507 to the semiconductor panel of placing in semiconductor standing groove 2 on, carry out the components and parts installation, accomplish the operation to the device through above-mentioned.
To sum up, this semiconductor components and parts adsorbs board, through setting up electric putter 505, make it drive the adsorption component 507 and slide along the extending direction of spacing slide bar 506, with its use height of adjustment, and adsorb components and parts through adsorption component 507, with the wearing and tearing to the components and parts extraction, improve the protectiveness that its used, and then drive linear guide 503 through linear cylinder 502 and drive connecting piece 504 and carry out horizontal position adjustment, and shift the adsorbed components and parts of adsorption component 507 to the semiconductor panel of placing in semiconductor standing groove 2 on, carry out components and parts installation, and then effectively promote its flexibility of using operation, strengthen its practicality.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a semiconductor components and parts adsorbs board, includes board mechanism (1), its characterized in that: the top valve of the machine table mechanism (1) is provided with a semiconductor placing groove (2) and a component placing groove (3) respectively, an adsorption mechanism (5) is arranged above the semiconductor placing groove (2) and the component placing groove (3), and a connecting push rod (4) is connected between the semiconductor placing groove (2) and the component placing groove (3);
semiconductor standing groove (2) are including connecting guide rail (201), connecting guide rail (201) set up the interior bottom wall at semiconductor standing groove (2), be provided with supporting seat (202) on connecting guide rail (201), the top of supporting seat (202) is provided with connection bedplate (203), the inside of supporting seat (202) runs through and is provided with connecting rod (204), semiconductor standing groove (2) still includes connection spout (205), correction mechanism (206) and spring expansion piece (207) set up the both sides inner wall at semiconductor standing groove (2) respectively, and the one end connection that semiconductor standing groove (2) inner wall was kept away from to spring expansion piece (207) is provided with spacing splint (208), connection spout (205) has been seted up to inside one side that semiconductor standing groove (2) is close to components and parts standing groove (3).
2. The semiconductor component adsorbing machine as set forth in claim 1, wherein: the adsorption mechanism (5) comprises a support frame (501), a linear cylinder (502) is arranged on one side of the front face of the support frame (501), a linear guide rail (503) is connected and arranged at the output end of the linear cylinder (502), and a connecting piece (504) is arranged on the linear guide rail (503).
3. The semiconductor component adsorbing machine as set forth in claim 2, wherein: limiting slide bars (506) are arranged on two sides of the front face of the connecting piece (504), an electric push rod (505) is arranged between the limiting slide bars (506) on two sides, an adsorption assembly (507) is connected to the outer wall of the limiting slide bars (506) in a sliding mode, and the bottom end of the electric push rod (505) is movably clamped with the adsorption assembly (507).
4. The semiconductor component adsorbing machine as set forth in claim 1, wherein: the correction mechanism (206) comprises a connection support rod (2061), one end of the connection support rod (2061) is provided with a limit support piece (2062), the inner side of the limit support piece (2062) is provided with a correction roller (2063), a limit groove (2064) is formed in the joint of the limit support piece (2062) and the correction roller (2063), and the inner wall of the limit groove (2064) is connected with a connection spring (2065) in a clamping manner with the rotating shaft end of the correction roller (2063).
5. The semiconductor component adsorbing machine as set forth in claim 4, wherein: the type of correction mechanism (206) is provided with two kinds, and two kinds correction mechanism (206) set up in the inner wall of semiconductor standing groove in tandem, and the length of spacing groove (2064) and connecting spring (2065) on correction mechanism (206) that the position is in front all is less than the length of spacing groove (2064) and connecting spring (2065) on correction mechanism (206) that the position is in rear.
6. The semiconductor component adsorbing machine as set forth in claim 1, wherein: the shape size structure setting of semiconductor standing groove (2) and components and parts standing groove (3) is the same, semiconductor standing groove (2) and components and parts standing groove (3) use the perpendicular bisector of board mechanism (1) to set up for symmetry axis symmetry, and connect spout (205) each other link up on semiconductor standing groove (2) and components and parts standing groove (3), and run through between semiconductor standing groove (2) and components and parts standing groove (3) and be provided with same connecting rod (204), the middle section department outer wall of connecting rod (204) and the one end activity joint of connecting push rod (4).
7. The semiconductor component adsorbing machine as set forth in claim 1, wherein: the lower surface of the limiting clamp plate (208) and the upper surface of the connecting seat plate (203) are arranged on the same horizontal plane, and the front side part of the limiting clamp plate (208) is an arc-shaped curved surface body which is outwards turned towards the side wall of the semiconductor placing groove (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321488579.1U CN220543873U (en) | 2023-06-12 | 2023-06-12 | Semiconductor component adsorption machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321488579.1U CN220543873U (en) | 2023-06-12 | 2023-06-12 | Semiconductor component adsorption machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220543873U true CN220543873U (en) | 2024-02-27 |
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ID=89963363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321488579.1U Active CN220543873U (en) | 2023-06-12 | 2023-06-12 | Semiconductor component adsorption machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220543873U (en) |
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2023
- 2023-06-12 CN CN202321488579.1U patent/CN220543873U/en active Active
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