CN220536440U - High-flatness blister package with pollution resistance - Google Patents
High-flatness blister package with pollution resistance Download PDFInfo
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- CN220536440U CN220536440U CN202320897396.9U CN202320897396U CN220536440U CN 220536440 U CN220536440 U CN 220536440U CN 202320897396 U CN202320897396 U CN 202320897396U CN 220536440 U CN220536440 U CN 220536440U
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- blister package
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- 239000010410 layer Substances 0.000 claims abstract description 176
- 239000012793 heat-sealing layer Substances 0.000 claims abstract description 42
- 239000002131 composite material Substances 0.000 claims abstract description 38
- 230000004888 barrier function Effects 0.000 claims abstract description 34
- 239000010408 film Substances 0.000 claims abstract description 33
- 239000011241 protective layer Substances 0.000 claims abstract description 30
- 239000004698 Polyethylene Substances 0.000 claims abstract description 22
- -1 polyethylene Polymers 0.000 claims abstract description 18
- 229920000573 polyethylene Polymers 0.000 claims abstract description 18
- 239000013039 cover film Substances 0.000 claims abstract description 12
- 238000013329 compounding Methods 0.000 claims abstract description 6
- 238000000465 moulding Methods 0.000 claims description 16
- 238000011109 contamination Methods 0.000 claims description 12
- 238000001125 extrusion Methods 0.000 claims description 10
- 229920006233 biaxially oriented polyamide Polymers 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000007789 sealing Methods 0.000 abstract description 6
- 229920000092 linear low density polyethylene Polymers 0.000 description 9
- 239000004707 linear low-density polyethylene Substances 0.000 description 9
- 229920001684 low density polyethylene Polymers 0.000 description 8
- 239000004702 low-density polyethylene Substances 0.000 description 8
- 238000007639 printing Methods 0.000 description 8
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 7
- 229920001526 metallocene linear low density polyethylene Polymers 0.000 description 5
- 229920001903 high density polyethylene Polymers 0.000 description 3
- 239000004700 high-density polyethylene Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000499 gel Substances 0.000 description 2
- 230000036541 health Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000004712 Metallocene polyethylene (PE-MC) Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- VRAIHTAYLFXSJJ-UHFFFAOYSA-N alumane Chemical compound [AlH3].[AlH3] VRAIHTAYLFXSJJ-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009924 canning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920006284 nylon film Polymers 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Abstract
The utility model discloses a high-flatness blister package with pollution resistance, which comprises a bottom film structure and a cover film structure on the matched bottom film structure; the bottom film structure sequentially comprises an upper heat sealing layer, a first forming protective layer, an upper barrier layer, a second forming protective layer and an outer layer from inside to outside, and is formed by sequentially compounding from inside to outside; the upper heat sealing layer consists of a composite layer, a middle layer and an inner layer, wherein the stiffness of the composite layer, the middle layer and the inner layer is sequentially increased, and the composite layer is in composite connection with the first forming protective layer. In the utility model, the upper heat sealing layer and the lower heat sealing layer are respectively in a three-layer composite structure of the composite layer, the middle layer and the inner layer, the density of polyethylene adopted by the composite layer, the middle layer and the inner layer is gradually increased, and the stiffness of the polyethylene is correspondingly gradually increased, so that the flatness of the blister package can be improved; in addition, island-shaped protrusions are arranged at the top of the inner layer, and the inner layer can be easily torn off after heat sealing.
Description
Technical Field
The utility model relates to the technical field of blister packages, in particular to a high-flatness blister package with pollution resistance.
Background
With the improvement of the living standard of people, the requirements on packaging are more and more strict, and the requirements are directly related to the physical health of people. The high-barrier aluminum-aluminum bubble cap not only has the effect of isolating water vapor, oxygen and ultraviolet rays, but also ensures that the contents are filled according to the amount and separated from each other, thereby being favored by the pharmaceutical industry and the health care industry.
With the diversity of content forms, the need for gels, even liquids, has evolved from conventional solid formulations. However, the conventional aluminum blister package is composed of two materials, and the bottom film has a three-layer structure: OPA/AL/PVC, is used for cold stamping forming the bubble hole; the cover film is AL/HSL, the HSL is a heat sealing glue coating, and the material can be sealed by the bottom film after being heated.
The bottom film needs to be cured at high temperature in the manufacturing process, and the shrinkage rate of the inner layer PVC is larger than that of the outer layer, so that the PVC is curled inwards; meanwhile, the outer nylon layer has strong hygroscopicity, and the film stretches after moisture absorption, so that inner winding is easy to cause. However, in the process of canning the gel or the liquid, the content is easy to splash and pollute the heat sealing surface due to uneven materials, and the heat sealing performance is affected. There is therefore a need to develop a blister package with a high flatness that is resistant to contamination.
Disclosure of Invention
In view of the above, the present utility model discloses a high flatness blister package with contamination resistance, which effectively solves the above-mentioned problems of the prior art.
In order to achieve the above object, the present utility model provides
A high-flatness blister package with anti-pollution comprises a bottom film structure and a cover film structure on the matched bottom film structure;
the bottom film structure sequentially comprises an upper heat sealing layer, a first forming protective layer, an upper barrier layer, a second forming protective layer and an outer layer from inside to outside, and is formed by sequentially compounding from inside to outside;
the upper heat sealing layer consists of a composite layer, a middle layer and an inner layer, wherein the stiffness of the composite layer, the middle layer and the inner layer is sequentially increased, and the composite layer is in composite connection with the first forming protective layer.
Further, the cover film structure comprises a lower heat sealing layer and a lower barrier layer, wherein the lower heat sealing layer and the lower barrier layer are compounded, and the lower heat sealing layer and the upper heat sealing layer are sealed by heating.
Further, the thickness of the upper heat sealing layer is 30-80 mu m, and the composite layer in the upper heat sealing layer adopts a first polyethylene co-extrusion film; the middle layer adopts a second polyethylene co-extrusion film; the inner layer adopts a third polyethylene co-extrusion film, and the thicknesses of the composite layer, the middle layer and the inner layer are the same;
island-shaped protrusions are arranged on one side, away from the middle layer, of the inner layer.
Further, the lower heat sealing layer has the same structure as the upper heat sealing layer, and the thickness of the lower heat sealing layer is 30-80 mu m.
Furthermore, the first molding protective layer and the second molding protective layer are both BOPA or PET, and the thickness of the first molding protective layer and the second molding protective layer is 15-30 μm.
Further, the outer layer is PE or PP, and the thickness of the outer layer is 30-80 mu m.
Further, the upper barrier layer adopts AL, and the thickness of the upper barrier layer is 40-80 mu m.
Further, the lower barrier layer adopts AL, and the thickness of the lower barrier layer is 12-30 mu m.
Further, the cover film structure further comprises a printing layer, and the printing layer is compounded on the lower barrier layer.
Further, the printing layer adopts PET or paper.
The utility model has the advantages and beneficial effects that:
in the utility model, the upper heat sealing layer and the lower heat sealing layer are respectively in a three-layer composite structure of the composite layer, the middle layer and the inner layer, the density of polyethylene adopted by the composite layer, the middle layer and the inner layer is gradually increased, and the stiffness of the polyethylene is correspondingly gradually increased, so that the flatness of the blister package can be improved; in addition, island-shaped protrusions are arranged at the top of the inner layer, and the inner layer can be easily torn off after heat sealing.
Drawings
FIG. 1 is a schematic view of a base film structure according to the present utility model;
fig. 2 is a schematic view of the structure of the cover film according to the present utility model.
An upper heat seal layer 1, a first forming protective layer 2, an upper barrier layer 3, a second forming protective layer 4, an outer layer 5, a lower heat seal layer 6, a lower barrier layer 7, a printing layer 8, a composite layer 11, an intermediate layer 12, an inner layer 13 and island-shaped protrusions 14.
Detailed Description
The following describes the embodiments of the present utility model further with reference to the drawings and examples. The following examples are only for more clearly illustrating the technical aspects of the present utility model, and are not intended to limit the scope of the present utility model.
LDPE: a low density polyethylene;
LLDPE: linear low density polyethylene;
HDPE: high density polyethylene;
MLLDPE: metallocene polyethylene;
BOPA: biaxially oriented nylon film;
1-2, a high flatness blister package with contamination resistance includes a base film structure and a cover film structure on the mating base film structure;
the bottom film structure comprises an upper heat sealing layer 1, a first forming protective layer 2, an upper barrier layer 3, a second forming protective layer 4 and an outer layer 5 from inside to outside in sequence, and is formed by sequentially compounding from inside to outside;
the upper heat sealing layer 1 is composed of a composite layer 11, an intermediate layer 12 and an inner layer 13, wherein the stiffness of the composite layer 11, the intermediate layer 12 and the inner layer 13 is sequentially increased, and the composite layer 11 is in composite connection with the first molding protective layer 2.
As a preferable mode of the above technical solution, the cover film structure includes a lower heat seal layer 6 and a lower barrier layer 7, the lower heat seal layer 6 is formed by compounding with the printing layer 7, and the lower heat seal layer 6 and the upper heat seal layer 1 are sealed by heating.
As the optimization of the technical scheme, the thickness of the upper heat sealing layer 1 is 30-80 mu m, the composite layer 11 in the upper heat sealing layer 1 adopts a first polyethylene co-extrusion film, and the first polyethylene co-extrusion film is one or more of LDPE and LLDPE; the middle layer 12 adopts a second polyethylene co-extrusion film which is one or more of LDPE, LLDPE and HDPE; the inner layer 13 adopts a third polyethylene co-extrusion film, the third polyethylene co-extrusion film is composed of LDPE and MLLDPE or LLDPE and MLLDPE, and the thicknesses of the composite layer 11, the middle layer 12 and the inner layer 13 are the same;
island-like protrusions 14 are arranged on the side, facing away from the middle layer, of the inner layer 13.
As a preferable mode of the above technical scheme, the lower heat-seal layer 6 has the same structure as the upper heat-seal layer 1, and the thickness of the lower heat-seal layer 6 is 30-80 μm.
As a preferable aspect of the foregoing disclosure, BOPA or PET is used for the first molding protective layer 2 and the second molding protective layer 4, and the thicknesses of the first molding protective layer 2 and the second molding protective layer 4 are 15-30 μm.
As a preferable mode of the above technical solution, the outer layer 5 is PE or PP, and the thickness of the upper heat sealing layer 1 and the outer layer 5 is 30-80 μm.
As a preferable aspect of the foregoing technical solution, AL is used as the upper barrier layer 3, and the thickness of the upper barrier layer 3 is 40-80 μm.
As a preferred embodiment of the above-mentioned method, AL is used as the lower barrier layer 7, and the thickness of the lower barrier layer 7 is 12-30 μm.
As a preferable aspect of the foregoing technical solution, the cover film structure further includes a printed layer 8, and the printed layer 8 is compounded on the lower barrier layer 7.
As a preferable aspect of the foregoing, the printing layer 8 is PET or paper.
The thickness of the PET is 12-25 mu m.
The thickness of the paper is 25-50 μm.
Examples:
a high-flatness blister package with anti-pollution comprises a bottom film structure and a cover film structure on the matched bottom film structure;
the bottom film structure comprises an upper heat sealing layer 1, a first forming protective layer 2, an upper barrier layer 3, a second forming protective layer 4 and an outer layer 5 from inside to outside in sequence, and is formed by sequentially compounding from inside to outside; the upper heat sealing layer 1 is composed of a composite layer 11, an intermediate layer 12 and an inner layer 13, wherein the stiffness of the composite layer 11, the intermediate layer 12 and the inner layer 13 is sequentially increased, and the composite layer 11 is in composite connection with the first molding protective layer 2.
The thickness of the upper heat sealing layer 1 is 60 mu m, the higher the polyethylene density is, the higher the stiffness is, and the composite layer 11 in the upper heat sealing layer 1 adopts LDPE; the middle layer 12 adopts LDPE and LLDPE, and the weight ratio of the LDPE to the LLDPE is 1:1, a step of; the inner layer 13 adopts LLDPE and MLLDPE, and the weight ratio of the LLDPE to the MLLDPE is 1:1, the thicknesses of the composite layer 11, the middle layer 12 and the inner layer 13 are the same; island-shaped protrusions 14 are arranged on one side, away from the middle side, of the inner layer 13; the first molding protective layer 2 and the second molding protective layer 4 are both BOPA, and the thicknesses of the first molding protective layer 2 and the second molding protective layer 4 are 25 mu m; the upper barrier layer 3 adopts AL, and the thickness of the upper barrier layer 3 is 55 mu m; the outer layer 5 is PE and the thickness of the outer layer 5 is 50 μm.
The cover film structure comprises a lower heat seal layer 6, a lower barrier layer 7 and a printing layer 8, wherein the lower heat seal layer 6 and the lower barrier layer 7 are compounded, and the lower heat seal layer 6 and the upper heat seal layer 1 are sealed by heating; the printed layer 8 is laminated on the lower barrier layer 7.
Wherein, the structure of the lower heat sealing layer 6 is the same as that of the upper heat sealing layer 1, and the thickness of the lower heat sealing layer 6 is 48 mu m;
the lower barrier layer 7 is AL, and the thickness of the lower barrier layer 7 is 25 μm.
The printing layer 8 is made of PET, and the thickness of the PET is 25 μm.
In the utility model, the upper heat sealing layer and the lower heat sealing layer are respectively in a three-layer composite structure of the composite layer, the middle layer and the inner layer, the density of polyethylene adopted by the composite layer, the middle layer and the inner layer is gradually increased, and the stiffness of the polyethylene is correspondingly gradually increased, so that the flatness of the blister package can be improved; in addition, island-shaped protrusions are arranged at the top of the inner layer, and the inner layer can be easily torn off after heat sealing.
The foregoing is merely a preferred embodiment of the present utility model, and it should be noted that it will be apparent to those skilled in the art that several modifications and variations can be made without departing from the technical principle of the present utility model, and these modifications and variations should also be regarded as the scope of the utility model.
Claims (10)
1. The high-flatness blister package with the pollution resistance is characterized by comprising a bottom film structure and a cover film structure on the matched bottom film structure;
the bottom film structure comprises an upper heat sealing layer (1), a first forming protective layer (2), an upper barrier layer (3), a second forming protective layer (4) and an outer layer (5) from inside to outside in sequence, and is formed by sequentially compounding from inside to outside;
the upper heat sealing layer (1) consists of a composite layer (11), an intermediate layer (12) and an inner layer (13), wherein the stiffness of the composite layer (11), the stiffness of the intermediate layer (12) and the stiffness of the inner layer (13) are sequentially increased, and the composite layer (11) is in composite connection with the first forming protection layer (2).
2. The high-flatness blister package with contamination resistance according to claim 1, wherein the lidding film structure comprises a lower heat-sealing layer (6) and a lower barrier layer (7), the lower heat-sealing layer (6) and the lower barrier layer (7) being composited, and the lower heat-sealing layer (6) and the upper heat-sealing layer (1) being sealed by heating.
3. A high flatness blister package with contamination resistance according to claim 2, characterized in that the thickness of the upper heat sealing layer (1) is 30-80 μm, the composite layer (11) in the upper heat sealing layer (1) being a first polyethylene co-extruded film; the middle layer (12) adopts a second polyethylene co-extrusion film; the inner layer (13) adopts a third polyethylene co-extrusion film, and the thicknesses of the composite layer (11), the middle layer (12) and the inner layer (13) are the same;
island-shaped protrusions (14) are arranged on one side, away from the middle layer, of the inner layer (13).
4. A high flatness blister package with contamination resistance according to claim 3, characterized in that the lower heat sealing layer (6) is of the same structure as the upper heat sealing layer (1), the thickness of the lower heat sealing layer (6) being 30-80 μm.
5. The high flatness blister package with contamination resistance according to claim 1, wherein both the first and second molding protective layers (2, 4) are BOPA or PET, and the thickness of both the first and second molding protective layers (2, 4) is 15-30 μm.
6. A high flatness blister package with contamination resistance according to claim 1, characterized in that the outer layer (5) is PE or PP and the thickness of the outer layer (5) is 30-80 μm.
7. A high flatness blister package with contamination resistance according to claim 1, characterized in that AL is used for the upper barrier layer (3), the thickness of the upper barrier layer (3) being 40-80 μm.
8. A high flatness blister package with contamination resistance according to claim 2, characterized in that AL is used for the lower barrier layer (7), the thickness of the lower barrier layer (7) being 12-30 μm.
9. A high flatness blister package with contamination resistance according to claim 2, wherein the lidding film structure further comprises a printed layer (8), the printed layer (8) being laminated to the lower barrier layer (7).
10. A high flatness blister package with contamination resistance according to claim 9, characterized in that the printed layer (8) is PET or paper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320897396.9U CN220536440U (en) | 2023-04-20 | 2023-04-20 | High-flatness blister package with pollution resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320897396.9U CN220536440U (en) | 2023-04-20 | 2023-04-20 | High-flatness blister package with pollution resistance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220536440U true CN220536440U (en) | 2024-02-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320897396.9U Active CN220536440U (en) | 2023-04-20 | 2023-04-20 | High-flatness blister package with pollution resistance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220536440U (en) |
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2023
- 2023-04-20 CN CN202320897396.9U patent/CN220536440U/en active Active
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