CN220534802U

CN220534802U - Semi-wrapping type key rubber coating die

Info

Publication number: CN220534802U
Application number: CN202322181879.1U
Authority: CN
Inventors: 封亚青
Original assignee: Suzhou Meisi Electronic Technology Co ltd
Current assignee: Suzhou Meisi Electronic Technology Co ltd
Priority date: 2023-08-14
Filing date: 2023-08-14
Publication date: 2024-02-27
Anticipated expiration: 2033-08-14

Abstract

The utility model relates to a semi-wrapped key encapsulation mould which comprises an upper template, a middle template and a lower template, wherein the upper template, the middle template and the lower template jointly form a cavity; the middle template is provided with a first diversion trench and a first overflow trench, and the first overflow trench is arranged around the cavity; the first guiding gutter is provided with the buffer hole with the glue inlet junction that sets up on the cope match-plate pattern, and the buffer that passes through the buffer hole earlier after the glue inlet advances, rethread first guiding gutter gets into the die cavity. Through the arrangement of the buffer holes at the end part of the glue inlet, liquid glue is buffered by the buffer holes firstly during glue inlet and then enters the cavity through the first diversion trench, so that the direct impact of high-pressure molten glue on the cavity is greatly reduced; meanwhile, the first diversion trench is designed to be bent and long in distance, so that the pressure intensity of glue feeding is further reduced, and the stability of glue feeding is guaranteed.

Description

Semi-wrapping type key rubber coating die

Technical Field

The utility model relates to the technical field of rubber coating products, in particular to a half-package type key rubber coating die.

Background

The existing keys and the shell are generally provided with a certain gap, water drops, dust and the like are easy to enter the shell from the gap, so that elements inside the shell are damaged, therefore, the cases are required to be encapsulated, the tightness between the shell and the cases is improved, and meanwhile, the hand feeling and the texture of the cases are also improved.

The existing encapsulation mould has the following problems: the glue feeding pressure is high, so that the glue feeding is unstable, and bubbles are easy to generate; because the thickness of the rubber coating part is smaller, when the melted rubber flows to a position far away from the rubber inlet, bubbles are easy to accumulate, and the shortage of materials is caused. How to encapsulate the keys stably and with high quality is a matter of consideration for the person skilled in the art.

Disclosure of Invention

The utility model aims at: the semi-wrapped key encapsulation mould is used for solving the problems of unstable glue feeding, material shortage of encapsulation and the like in the prior art.

The technical scheme of the utility model is as follows: the semi-wrapped key encapsulation die comprises an upper die plate, a middle die plate and a lower die plate, wherein the upper die plate, the middle die plate and the lower die plate jointly form a die cavity; the middle template is provided with a first diversion trench and a first overflow trench, and the first overflow trench is arranged around the cavity; the first guiding gutter is provided with the buffer hole with the glue inlet junction that sets up on the cope match-plate pattern, and the buffer that passes through the buffer hole earlier after the glue inlet advances, rethread first guiding gutter gets into the die cavity.

Preferably, the first diversion trench is connected with the cavity through the first overflow trench, and the first diversion trench is not communicated with the first overflow trench.

Preferably, the middle template is provided with a second overflow groove, and the second overflow groove is arranged on one side far away from the joint of the first diversion groove and the cavity.

Preferably, the second overflow groove is provided with an overflow hole, and one end of the overflow hole, which is far away from the second overflow groove, is connected with the lower end of the cavity.

Preferably, the overflow hole is conical, and the smaller opening end of the overflow hole is connected with the cavity.

Preferably, a fixed block is arranged at the upper end of the lower template, the fixed block is arranged in the middle template, and key raw materials are sleeved on the fixed block; the upper end of the fixed block is provided with an insert, and the insert is arranged in the cavity.

Preferably, a plurality of guide posts are arranged on the lower template, and the upper ends of the guide posts are sequentially connected with the first guide holes on the middle template and the second guide holes on the upper template.

Compared with the prior art, the utility model has the advantages that:

(1) Through the arrangement of the buffer holes at the end part of the glue inlet, liquid glue is buffered by the buffer holes firstly during glue inlet and then enters the cavity through the first diversion trench, so that the direct impact of high-pressure molten glue on the cavity is greatly reduced; meanwhile, the first diversion trench is designed to be bent and long in distance, so that the pressure intensity of glue feeding is further reduced, and the stability of glue feeding is ensured;

(2) The design of the first overflow groove can store gas extruded by the colloid in the flowing process and redundant colloid; the design of overflow holes on the second overflow glue groove can discharge redundant glue and gas far away from the glue inlet part in the cavity, so that the generation of material shortage is avoided.

Drawings

The utility model is further described below with reference to the accompanying drawings and examples:

FIG. 1 is a schematic diagram of an exploded construction of an encapsulation die according to the present utility model;

FIG. 2 is a top view and A-A cross-sectional view of the encapsulation mold of the present utility model;

FIG. 3 is an enlarged schematic view of the structure of FIG. 2B;

FIG. 4 is a schematic view of the upper template structure according to the present utility model;

fig. 5 is a schematic view of a middle template structure according to the present utility model.

Wherein: the mold comprises an upper mold plate 1, a first groove 11, a glue inlet 12, a second guide hole 13, a middle mold plate 2, a cavity hole 21, a first guide groove 22, a buffer hole 221, a first overflow groove 23, a second overflow groove 24, an overflow hole 241, a lower mold plate 3, a fixed block 31, an insert 32, a guide post 33 and a cavity 4.

Detailed Description

The following describes the present utility model in further detail with reference to specific examples:

as shown in fig. 1-5, a half-package type key encapsulation mold comprises an upper mold plate 1, a middle mold plate 2 and a lower mold plate 3, wherein the upper mold plate 1, the middle mold plate 2 and the lower mold plate 3 jointly form a cavity 4. Specifically, the lower end of the upper template 1 is provided with a first groove 11; the middle template 2 is provided with a through cavity hole 21; the upper end of the lower template 3 is provided with a fixed block 31, the fixed block 31 is arranged in the cavity hole 21 of the middle template 2, the key raw material is sleeved on the fixed block 31, and the periphery of the key is connected with the inner wall of the cavity hole 21; the upper end of the fixed block 31 is provided with an insert 32, and the insert 32 is arranged in the cavity 4, namely, when the die is assembled, the upper end of the key raw material, the insert 32, the cavity hole 21 and the first groove 11 jointly form the cavity 4.

The middle die plate 2 is provided with a first diversion trench 22 and a first overflow trench 23, and the first overflow trench 23 is arranged around the cavity 4; a buffer hole 221 is arranged at the joint of the first diversion trench 22 and the glue inlet 12 arranged on the upper template 1, and after the glue inlet 12 is filled with glue, the glue is buffered by the buffer hole 221 and then enters the cavity 4 through the first diversion trench 22. The first diversion trench 22 is connected with the cavity 4 through the first overflow trench 23, and the first diversion trench 22 is not communicated with the first overflow trench 23, so that glue immersed in the first diversion trench 22 is prevented from directly entering the first overflow trench 23.

The middle template 2 is provided with a second overflow groove 24 which is arranged at one side far away from the joint of the first diversion trench 22 and the cavity 4. The second overflow groove 24 is provided with an overflow hole 241, and one end of the overflow hole 241 away from the second overflow groove 24 is connected with the lower end of the cavity 4. The overflow hole 241 is the toper, and the less open end of overflow hole 241 is connected with die cavity 4, can be enough with gaseous or unnecessary glue discharge, can directly get the material when again, separate the glue in the overflow hole 241 with the rubber coating, avoided getting the material back and carried out the process of burring again, improved production efficiency.

The lower template 3 is provided with a plurality of guide posts 33, and the upper ends of the guide posts 33 are sequentially connected with the first guide holes 25 on the middle template 2 and the second guide holes 13 on the upper template 1. The die assembly precision and the encapsulation quality are improved by guiding the guide posts 33 and the first guide holes 25 and the second guide holes 13.

The above embodiments are only for illustrating the technical concept and features of the present utility model, and are intended to enable those skilled in the art to understand the content of the present utility model and implement the same according to the content of the present utility model, and are not intended to limit the scope of the present utility model. It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments and that the present utility model may be embodied in other specific forms without departing from the spirit or essential attributes thereof, and it is therefore desired that the present utility model be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims

1. The utility model provides a half package formula button rubber coating mould which characterized in that: the mold comprises an upper mold plate, a middle mold plate and a lower mold plate, wherein the upper mold plate, the middle mold plate and the lower mold plate form a cavity together; the middle template is provided with a first diversion trench and a first overflow trench, and the first overflow trench is arranged around the cavity; the first guiding gutter is provided with the buffer hole with the glue inlet junction that sets up on the cope match-plate pattern, and the buffer that passes through the buffer hole earlier after the glue inlet advances, rethread first guiding gutter gets into the die cavity.

2. The half-wrapped key encapsulation mold of claim 1, wherein: the first diversion trench is connected with the cavity through the first overflow trench, and the first diversion trench is not communicated with the first overflow trench.

3. The half-wrapped key encapsulation mold of claim 1, wherein: the middle template is provided with a second overflow groove, and the second overflow groove is arranged on one side far away from the joint of the first diversion groove and the cavity.

4. A half-pack key encapsulation mold according to claim 3, wherein: and the second overflow groove is provided with an overflow hole, and one end of the overflow hole, which is far away from the second overflow groove, is connected with the lower end of the cavity.

5. The half-wrapped key encapsulation mold of claim 4, wherein: the overflow hole is conical, and the smaller opening end of the overflow hole is connected with the cavity.

6. The half-wrapped key encapsulation mold of claim 1, wherein: the upper end of the lower template is provided with a fixed block, the fixed block is arranged in the middle template, and key raw materials are sleeved on the fixed block; the upper end of the fixed block is provided with an insert, and the insert is arranged in the cavity.

7. The half-wrapped key encapsulation mold of claim 1, wherein: the lower template is provided with a plurality of guide posts, and the upper ends of the guide posts are sequentially connected with a first guide hole in the middle template and a second guide hole in the upper template.