CN220528301U - Copper deposition pretreatment device for HDI high-density PCB circuit board - Google Patents
Copper deposition pretreatment device for HDI high-density PCB circuit board Download PDFInfo
- Publication number
- CN220528301U CN220528301U CN202322150666.2U CN202322150666U CN220528301U CN 220528301 U CN220528301 U CN 220528301U CN 202322150666 U CN202322150666 U CN 202322150666U CN 220528301 U CN220528301 U CN 220528301U
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- shell
- circuit board
- copper deposition
- pcb circuit
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 38
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 37
- 239000010949 copper Substances 0.000 title claims abstract description 37
- 230000008021 deposition Effects 0.000 title claims abstract description 26
- 230000007306 turnover Effects 0.000 claims abstract description 10
- 230000007246 mechanism Effects 0.000 claims abstract description 7
- 238000004140 cleaning Methods 0.000 claims description 12
- 238000007781 pre-processing Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 13
- 230000008569 process Effects 0.000 abstract description 11
- 239000003344 environmental pollutant Substances 0.000 abstract description 10
- 231100000719 pollutant Toxicity 0.000 abstract description 10
- 238000001556 precipitation Methods 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000012535 impurity Substances 0.000 abstract description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 4
- 229910001431 copper ion Inorganic materials 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
The utility model relates to the technical field of PCB circuit boards, in particular to an HDI high-density PCB circuit board copper deposition pretreatment device which comprises a shell and a workbench, wherein the shell is positioned at the top of the workbench, the top of the workbench is fixedly connected with a supporting plate, the top of one side of the supporting plate is fixedly connected with the shell, the top of the workbench is fixedly connected with a turnover device, one side of the turnover device is fixedly connected with the PCB circuit board, and the top of the shell is fixedly connected with a fixing seat. The utility model has the advantages of reducing the risk of equipment faults, being convenient to clean and improving the production efficiency, in the actual use process, pollutants and residues in the equipment can be effectively removed through the matching use of the adjusting mechanism, the minimization of impurities in the copper precipitation process is ensured, the uniformity and the stability of the copper precipitation quality are improved, the problems of electrical performance and mechanical strength are reduced, and then the PCB circuit board is clean and comprehensive through the arrangement of the turnover device.
Description
Technical Field
The utility model relates to the technical field of PCB circuit boards, in particular to a copper deposition pretreatment device for an HDI high-density PCB circuit board.
Background
The copper deposition pretreatment equipment for the PCB circuit board is used for carrying out copper deposition pretreatment on a Printed Circuit Board (PCB) in the electronic manufacturing process, and is mainly used for forming a layer of copper foil on the surface through copper deposition operation in the PCB manufacturing process so as to improve the electrical performance and the mechanical strength.
The through hole copper deposition device of the high-density HDI multilayer circuit board disclosed by the publication No. CN206879236U has the beneficial effects that: the pump body is used for injecting gas into the copper deposition cabinet to form high pressure, so that the electroplating solution enters the through hole and slowly flows, new electroplating solution continuously enters the through hole, old electroplating solution is discharged, copper plating uniformity of the through hole is guaranteed, electrical connection stability of the multilayer circuit board is guaranteed, the copper deposition pretreatment device is simple in structure and does not have a cleaning function, and copper ion solution, residual chemical liquid and other pollutants can be generated in the copper deposition pretreatment process. If no cleaning device is provided, the pollutants may accumulate in the machine, increasing the risk of equipment failure and avoiding unavoidable downtime, the cleanliness of the copper precipitation pretreatment device directly affects the uniformity and stability of the copper precipitation quality, and if the accumulation of the pollutants exists in the equipment, the copper precipitation layer may be uneven, further affecting the electrical performance and mechanical strength of the PCB, and certain limitations exist.
Therefore, there is an urgent need for a copper deposition pretreatment device for an HDI high-density PCB circuit board, which solves the above problems.
Disclosure of Invention
The utility model aims to provide a copper deposition pretreatment device for an HDI high-density PCB circuit board, which has the advantages of reducing equipment fault risk, facilitating cleaning and improving production efficiency, and solves the problems that the copper deposition pretreatment device does not have a cleaning function and copper ion solution, residual chemical liquid medicine and other pollutants can be generated in the copper deposition pretreatment process.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a HDI high density PCB circuit board copper deposition preprocessing device, includes casing and workstation, the casing is located the top of workstation, the top fixedly connected with backup pad of workstation, the top and the casing fixed connection of backup pad one side, the top fixedly connected with turning device of workstation, one side fixedly connected with PCB circuit board of turning device, the top fixedly connected with fixing base of casing;
the adjusting mechanism comprises a motor fixedly connected to one side of the fixed seat, an output shaft of the motor penetrates through an inner cavity of the shell and is fixedly connected with a movable arm, one side of the bottom of the movable arm is fixedly connected with a round block, the inner cavity of the shell is provided with two racks, the top of each rack located on the left side is fixedly connected with a locating plate, one side of each locating plate is provided with a limiting hole, the inner wall of each limiting hole is in sliding connection with the round block, the bottom of the inner cavity of the shell is rotationally connected with a gear, the gear is meshed with the rack, the bottom of each rack is fixedly connected with a guide plate, and the bottom of each guide plate extends to the outer side of the shell and is fixedly connected with a cleaning brush.
Preferably, two through holes are formed in the bottom of the shell, one side of the guide plate extends to the outer side of the through hole, and the guide plate is in sliding connection with the inner wall of the through hole.
Preferably, the surface of the motor is sleeved with a mounting seat, and one side of the mounting seat is fixedly connected with the fixing seat.
Preferably, both sides of the inner cavity of the shell are provided with sliding grooves, the inner cavity of each sliding groove is connected with a sliding block in a sliding mode, and one side of each sliding block is fixedly connected with the rack.
Preferably, the bottom of workstation fixedly connected with support frame, the quantity of support frame is three.
Compared with the prior art, the utility model has the following beneficial effects:
the utility model has the advantages of reducing the fault risk of equipment, being convenient to clean and improving the production efficiency, in the actual use process, the pollutants and residues in the equipment can be effectively removed through the matching use of the adjusting mechanism, the minimization of the impurities in the copper precipitation process is ensured, the uniformity and stability of the copper precipitation quality are improved, the problems of electrical performance and mechanical strength are reduced, and then the turnover device is arranged, so that the PCB circuit board is clean and comprehensive, the pollutants in the equipment can be accurately positioned and removed, the maintenance and cleaning process of the equipment is simplified, the operator can perform daily maintenance and periodical cleaning more easily, the maintenance time and the workload are reduced, and the problems that copper ion solution, residual chemical liquid and other pollutants can be generated in the copper precipitation pretreatment process are solved.
Drawings
FIG. 1 is a schematic perspective view of the present utility model;
FIG. 2 is a schematic view of a partial perspective structure of the present utility model;
FIG. 3 is a schematic view of a portion of a three-dimensional structure of the present utility model;
fig. 4 is a schematic view of a partially cut-away perspective structure of the present utility model.
In the figure: 1. a housing; 2. a fixing seat; 3. a motor; 4. a moving arm; 5. round blocks; 6. a gear; 7. a positioning plate; 8. a limiting hole; 9. a mounting base; 10. a rack; 11. a guide plate; 12. a cleaning brush; 13. a through hole; 14. a chute; 15. a slide block; 16. a turnover device; 17. a PCB circuit board; 18. a support plate; 19. a work table; 20. and (5) supporting frames.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
The existing copper deposition pretreatment device does not have a cleaning function, and copper ion solution, residual chemical liquid medicine and other pollutants can be generated in the copper deposition pretreatment process, so that the copper deposition pretreatment device has the functions of being convenient to clean and improving production efficiency by adopting the adjusting mechanism and the turnover device 16 to be matched for use, and meanwhile, the equipment fault risk is reduced, so that the problem is solved.
As shown in fig. 1 to 4: the utility model provides an HDI high-density PCB circuit board copper deposition pretreatment device, which comprises a shell 1 and a workbench 19, wherein the bottom of the workbench 19 is fixedly connected with support frames 20, the number of the support frames 20 is three, the shell 1 is positioned at the top of the workbench 19, the top of the workbench 19 is fixedly connected with a support plate 18, the top of one side of the support plate 18 is fixedly connected with the shell 1, the top of the workbench 19 is fixedly connected with a turnover device 16, one side of the turnover device 16 is fixedly connected with a PCB circuit board 17, and the top of the shell 1 is fixedly connected with a fixing seat 2;
the adjusting mechanism comprises a motor 3 fixedly connected to one side of a fixed seat 2, an output shaft of the motor 3 penetrates through an inner cavity of a shell 1 and is fixedly connected with a movable arm 4, one side of the bottom of the movable arm 4 is fixedly connected with a round block 5, the inner cavity of the shell 1 is provided with two racks 10, the top of each rack 10 located on the left side is fixedly connected with a locating plate 7, one side of each locating plate 7 is provided with a limiting hole 8, the inner wall of each limiting hole 8 is in sliding connection with the round block 5, the bottom of the inner cavity of the shell 1 is rotationally connected with a gear 6, the gear 6 is meshed with the rack 10, the bottom of each rack 10 is fixedly connected with a guide plate 11, and the bottom of each guide plate 11 extends to the outer side of the shell 1 and is fixedly connected with a cleaning brush 12.
Referring to fig. 2, two through holes 13 are formed in the bottom of the housing 1, one side of the guide plate 11 extends to the outer side of the through hole 13, the guide plate 11 is slidably connected with the inner wall of the through hole 13, the guide plate 11 is limited and guided through the arrangement of the through hole 13, and the situation that the guide plate 11 is loose, slides and inclines during moving is avoided.
Referring to fig. 3, the surface of the motor 3 is sleeved with a mounting seat 9, one side of the mounting seat 9 is fixedly connected with the fixed seat 2, and the motor 3 is supported and fixed through the arrangement of the mounting seat 9, so that the motor 3 is prevented from deviating during working.
Referring to fig. 4, the two sides of the inner cavity of the casing 1 are provided with the sliding grooves 14, the inner cavity of the sliding groove 14 is slidably connected with the sliding block 15, one side of the sliding block 15 is fixedly connected with the rack 10, the effect of limiting and supporting the rack 10 is achieved through the matched use of the sliding groove 14 and the sliding block 15, the situation that the rack 10 shifts in position during moving is avoided, and the stability of the processing device is improved.
Working principle: when the PCB circuit board copper deposition pretreatment is carried out, the PCB circuit board 17 is fixed through the turning device 16, at this moment, the motor 3 rotates to drive the movable arm 4 to rotate through the starting motor 3, the movable arm 4 rotates and drives the round block 5 to slide in the inner cavity of the limiting hole 8, the round block 5 slides and drives the locating plate 7 to move, the locating plate 7 moves and drives the left rack 10 to move, the left rack 10 moves and drives the gear 6 to rotate, the gear 6 rotates and drives the right rack 10 to move, the rack 10 moves and drives the guide plate 11 to move, the guide plate 11 moves and drives the cleaning brush 12 to reciprocate on the surface of the PCB circuit board 17, floating ash on the surface of the PCB circuit board 17 can be effectively cleaned, after one surface of the PCB circuit board 17 is cleaned, the PCB circuit board 17 is reversed through the turning device 16, and then the other surface of the PCB circuit board 17 is cleaned through the cooperation of the parts, pollutants and residues inside the equipment can be effectively removed, the copper deposition process is ensured, the uniformity of copper deposition process is improved, and the mechanical strength is stable.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a high density PCB circuit board copper deposition preprocessing device of HDI, includes casing (1) and workstation (19), its characterized in that: the shell (1) is positioned at the top of the workbench (19), the top of the workbench (19) is fixedly connected with a supporting plate (18), the top of one side of the supporting plate (18) is fixedly connected with the shell (1), the top of the workbench (19) is fixedly connected with a turnover device (16), one side of the turnover device (16) is fixedly connected with a PCB (printed circuit board) 17, and the top of the shell (1) is fixedly connected with a fixing seat (2);
the utility model provides an adjustment mechanism, adjustment mechanism includes motor (3) of fixed base (2) one side, the output shaft of motor (3) runs through to the inner chamber of casing (1) and fixedly connected with removal arm (4), one side fixedly connected with kicker (5) of removal arm (4) bottom, the inner chamber of casing (1) is provided with two racks (10), and the top fixedly connected with locating plate (7) of rack (10) that are located the left side, spacing hole (8) have been seted up to one side of locating plate (7), the inner wall and kicker (5) sliding connection of spacing hole (8), the bottom rotation of casing (1) inner chamber is connected with gear (6), gear (6) meshes with rack (10), the bottom fixedly connected with deflector (11) of rack (10), the bottom of deflector (11) extends to the outside of casing (1) and fixedly connected with cleaning brush (12).
2. The device for copper deposition pretreatment of the HDI high-density PCB according to claim 1, wherein the device comprises: two through holes (13) are formed in the bottom of the shell (1), one side of the guide plate (11) extends to the outer side of the through holes (13), and the guide plate (11) is in sliding connection with the inner wall of the through holes (13).
3. The device for copper deposition pretreatment of the HDI high-density PCB according to claim 1, wherein the device comprises: the surface of the motor (3) is sleeved with a mounting seat (9), and one side of the mounting seat (9) is fixedly connected with the fixed seat (2).
4. The device for copper deposition pretreatment of the HDI high-density PCB according to claim 1, wherein the device comprises: both sides of the inner cavity of the shell (1) are provided with sliding grooves (14), the inner cavity of the sliding grooves (14) is connected with sliding blocks (15) in a sliding mode, and one side of each sliding block (15) is fixedly connected with the rack (10).
5. The device for copper deposition pretreatment of the HDI high-density PCB according to claim 1, wherein the device comprises: the bottom of workstation (19) is fixedly connected with support frame (20), the quantity of support frame (20) is three.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322150666.2U CN220528301U (en) | 2023-08-10 | 2023-08-10 | Copper deposition pretreatment device for HDI high-density PCB circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322150666.2U CN220528301U (en) | 2023-08-10 | 2023-08-10 | Copper deposition pretreatment device for HDI high-density PCB circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220528301U true CN220528301U (en) | 2024-02-23 |
Family
ID=89929711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322150666.2U Active CN220528301U (en) | 2023-08-10 | 2023-08-10 | Copper deposition pretreatment device for HDI high-density PCB circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220528301U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117915575A (en) * | 2024-03-20 | 2024-04-19 | 苏州市亿利华电子有限公司 | Gold melting device and gold melting process for six-sided copper plating of PCB |
-
2023
- 2023-08-10 CN CN202322150666.2U patent/CN220528301U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117915575A (en) * | 2024-03-20 | 2024-04-19 | 苏州市亿利华电子有限公司 | Gold melting device and gold melting process for six-sided copper plating of PCB |
| CN117915575B (en) * | 2024-03-20 | 2024-05-14 | 苏州市亿利华电子有限公司 | Gold melting device and gold melting process for six-sided copper plating of PCB |
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