CN220526916U

CN220526916U - Antistatic Micro LED display structure and display panel

Info

Publication number: CN220526916U
Application number: CN202322194454.4U
Authority: CN
Inventors: 杨博; 王维年; 王春盼; 王敏智; 张玉贵
Original assignee: Ziyangsheng Optoelectronics Technology Zibo Co ltd
Current assignee: Ziyangsheng Optoelectronics Technology Zibo Co ltd
Priority date: 2023-08-15
Filing date: 2023-08-15
Publication date: 2024-02-23
Anticipated expiration: 2033-08-15

Abstract

The utility model discloses an antistatic Micro LED display structure and a display panel, wherein the display structure comprises a substrate, a conducting layer, a black matrix with an optical filter inside and a Micro LED chip arranged on the optical filter from bottom to top, and the display structure further comprises an inorganic packaging layer and an organic flat layer; the thickness of the inside of the black matrix is equal to the sum of the thicknesses of the optical filter and the Micro LED chip, and the bottom area of the black matrix is smaller than the substrate; the top end of the Micro LED chip and the outer side of the black matrix are sequentially wrapped by an inorganic packaging layer and an organic flat layer; the optical filter is provided with red, green and blue colors, and red light, green light and blue light Micro LED chips are respectively arranged on the optical filter; the conductive layer is a transparent conductive material with the thickness of 0.01-0.1 mu m. The antistatic Micro LED display structure provided by the utility model can effectively prevent static impact caused by external factors such as touch and the like while not affecting the display effect, and enhances the experience effect of user products.

Description

Antistatic Micro LED display structure and display panel

Technical Field

The utility model relates to the technical field of Micro LEDs, in particular to an anti-static Micro LED display structure and a display panel.

Background

Micro LEDs are expected to surpass OLEDs, becoming a new generation of display technology. All advantages of the OLED are adopted in the design of the Micro LEDs: the self-luminescence technology, perfect black and excellent color, while discarding the organic compound, achieves a smaller light emitting element size than the miniLED, which means that the Micro LED display panel is very thin, capable of providing excellent viewing angle. Meanwhile, since the Micro LEDs are directly arranged on the liquid crystal display panel, a backlight module and an optical film are not needed, and an inorganic material is adopted to form a light-emitting layer, so that OLED screen burning is not easy to occur, the transmittance is more superior to that of an LCD and an OLED by 90%, and the display can save electricity.

The Micro LED display panel comprises a drive substrate, an LED chip below 50 μm and an active drive array. The existing Micro LED display panel cannot release static electricity when external static electricity exists, so that the reliability of products is easily reduced.

Disclosure of Invention

In order to solve the problems in the prior art, the utility model provides an anti-static Micro LED display structure which comprises a substrate, a conductive layer, a black matrix with an optical filter inside and a Micro LED chip arranged on the optical filter from bottom to top, wherein the display effect is not influenced, and static damage caused by external factors such as touch is effectively prevented;

the thickness of the black matrix is equal to the sum of the thicknesses of the optical filter and the Micro LED chip, and the bottom area of the black matrix is smaller than the substrate;

the top end of the Micro LED chip and the outer side of the black matrix are sequentially wrapped by an inorganic packaging layer and an organic flat layer;

the optical filter is provided with red, green and blue colors, and red light, green light and blue light Micro LED chips are respectively arranged on the optical filter;

the conductive layer is a transparent conductive material with the thickness of 0.01-0.1 mu m.

Further, the thickness of the filter is 1-3 μm.

Further, the thickness of the Micro LED chip is 3-7 μm.

Further, the thickness of the inorganic encapsulation layer is 0.1-1 μm.

Further, the thickness of the organic planarization layer is 1 to 3 μm.

Further, the inorganic encapsulation layer and the organic planarization layer also encapsulate the area of the upper end of the substrate not covered by the black matrix.

The utility model further provides a display panel, which comprises the anti-static Micro LED display structure.

Further, the display panel further comprises a CMOS blue LED chip and frame glue, wherein the frame glue is used for fixing the CMOS blue LED chip and the display structure to form the display panel.

Compared with the prior art, the utility model has the following beneficial effects:

the antistatic Micro LED display structure provided by the utility model can effectively prevent static impact caused by external factors such as touch and the like while not affecting the display effect, improves the reliability of products and enhances the experience effect of user products.

Additional features and advantages of the utility model will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model. The objectives and other advantages of the utility model may be realized and attained by the structure particularly pointed out in the written description and drawings.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 shows a cross-sectional view of an antistatic Micro LED display structure in an embodiment of the utility model;

FIG. 2 shows a top view of a Micro LED in a black matrix in an embodiment of the utility model;

FIG. 3 shows a cross-sectional view of a display panel in an embodiment of the utility model;

reference numerals illustrate:

100. antistatic Micro LED display structure; 110. a substrate; 120. a conductive layer; 130. a black matrix; 140. a light filter; 141. a red light filter; 142. a green light filter; 143. a blue light filter; 150. micro LED chip; 151. red light Micro LED chip; 152. a green light Micro LED chip; 153. blue light Micro LED chips; 160. an inorganic encapsulation layer; 170. an organic planarization layer; 200. frame glue; 300. CMOS blue LED chip.

Detailed Description

The endpoints of the ranges and any values disclosed in the present utility model are not limited to the precise range or value, and the range or value should be understood to include values close to the range or value. For numerical ranges, one or more new numerical ranges may be obtained in combination with each other between the endpoints of each range, between the endpoint of each range and the individual point value, and between the individual point values, and are to be considered as specifically disclosed in the present utility model.

The following description of specific embodiments of the present utility model and the accompanying drawings will provide a clear and complete description of the technical solutions of embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

As shown in fig. 1, in one embodiment of the present utility model, an antistatic Micro LED display structure 100 is provided, which includes a substrate 110, a conductive layer 120, a black matrix 130 from bottom to top, and an inorganic encapsulation layer 160 and an organic planarization layer 170. The black matrix 130 is internally provided with a light filter 140, the light filter 140 is further provided with a Micro LED chip 150, the thickness of the inside of the black matrix 130 is equal to the sum of the thicknesses of the light filter 140 and the Micro LED chip 150, and the bottom area of the black matrix 130 is smaller than the upper surface area of the substrate 110. More specifically, the conductive layer 120 is a transparent conductive material having a thickness of 0.05 μm; the thickness of the optical filter 140 is 2 μm, the thickness of the Micro LED150 chip is 5 μm, as shown in fig. 2, the black matrix 130 on the conductive layer 120 is provided with a plurality of grooves arranged in an equidistant array, a red optical filter 141, a green optical filter 142 and a blue optical filter 143 are arranged in the grooves, and a plurality of red Micro LED chips 151, green Micro LED chips 152 and blue Micro LED chips 153 are respectively arranged on the red optical filter 141, the green optical filter 142 and the blue optical filter 143; the top end of the Micro LED chip 150 and the outer side of the black matrix 130 are sequentially coated with an inorganic encapsulation layer 160 and an organic planarization layer 170, the thickness of the inorganic encapsulation layer 160 is 0.5 μm, and the thickness of the organic planarization layer 170 is 2 μm. The bottom area of the black matrix 130 is smaller than the upper surface area of the substrate 110, and the inorganic encapsulation layer 160 and the organic planarization layer 170 also encapsulate the upper end of the substrate 110 in the area not covered by the black matrix 130.

In this embodiment, the substrate 110 material is selected to be 0.5mm thick low sodium glass; the transparent conductive material of the conductive layer 120 is preferably Indium Tin Oxide (ITO), but other transparent conductive materials such as graphene, metal nanowires, carbon nanotubes, conductive polymers, and silver, copper, aluminum films, etc. are also possible.

As shown in fig. 3, another embodiment of the present utility model provides a display panel, which includes the antistatic Micro LED display structure 100, the CMOS blue LED chip 300 and the frame glue 200 in the foregoing embodiment, and the CMOS blue LED chip 300 is adhered to the area of the antistatic Micro LED display structure 100 not covered by the black matrix 130 by the frame glue 200, so that the antistatic Micro LED display structure 100 is flipped, and when static electricity occurs outside above the conductive layer 120, the static electricity can be perfectly shielded, so that the static electricity cannot reach the inside of the structure.

Finally, it should be noted that: the foregoing description is only illustrative of the preferred embodiments of the present utility model, and although the present utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present utility model.

Claims

1. An antistatic Micro LED display structure is characterized by comprising a substrate, a conducting layer, a black matrix internally provided with an optical filter and a Micro LED chip arranged on the optical filter from bottom to top, and further comprises an inorganic packaging layer and an organic flat layer;

the thickness of the inside of the black matrix is equal to the sum of the thicknesses of the optical filter and the Micro LED chip, and the bottom area of the black matrix is smaller than the substrate;

2. The antistatic Micro LED display structure according to claim 1, wherein the thickness of the optical filter is 1-3 μm.

3. The antistatic Micro LED display structure according to claim 1, wherein the thickness of the Micro LED chip is 3-7 μm.

4. The antistatic Micro LED display structure according to claim 1, wherein the thickness of the inorganic encapsulation layer is 0.1-1 μm.

5. The antistatic Micro LED display structure according to claim 1, wherein the thickness of the organic planarization layer is 1 to 3 μm.

6. The antistatic Micro LED display structure according to claim 1, wherein said inorganic encapsulation layer and said organic planarization layer further encapsulate an area of an upper end of said substrate not covered by said black matrix.

7. A display panel comprising the antistatic Micro LED display structure of any one of claims 1 to 6.

8. The display panel of claim 7, further comprising a CMOS blue LED chip and a frame glue for securing the CMOS blue LED chip to the display structure to form a display panel.