CN220517617U - Hot press device - Google Patents
Hot press device Download PDFInfo
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- CN220517617U CN220517617U CN202322091226.4U CN202322091226U CN220517617U CN 220517617 U CN220517617 U CN 220517617U CN 202322091226 U CN202322091226 U CN 202322091226U CN 220517617 U CN220517617 U CN 220517617U
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- plate
- mounting plate
- hot press
- hot pressing
- hot
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- 238000007731 hot pressing Methods 0.000 claims abstract description 44
- 238000005192 partition Methods 0.000 claims abstract description 9
- 238000001816 cooling Methods 0.000 claims abstract description 5
- 238000009423 ventilation Methods 0.000 claims description 16
- 238000003825 pressing Methods 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 abstract description 25
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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Abstract
The utility model provides a hot pressing device, which relates to the technical field of semiconductor hot pressing and comprises a base, a lower hot pressing table and a top seat; the left and right parts of the upper end surface of the base are respectively provided with a supporting rod, the upper ends of the supporting rods are supported under the lower hot press table, the middle part of the lower end surface of the top seat is provided with an upper fixing plate, an upper mounting plate is arranged under the upper fixing plate, and a middle mounting plate is arranged under the upper mounting plate; the lower end face of the upper mounting plate is fixedly provided with an upper fixing sleeve, a plurality of groups of hydraulic telescopic cylinders are sleeved in the upper fixing sleeve, an upper groove is formed in the middle of the upper end face of the middle mounting plate, the lower end of each hydraulic telescopic cylinder is fixed on the middle mounting plate, a partition plate is arranged below the middle mounting plate, and a hot pressing plate is arranged below the partition plate. The utility model is convenient for carrying out rapid air cooling and cooling after the semiconductor workpiece is hot pressed, so that the surface of the semiconductor workpiece can be rapidly cooled, and the semiconductor workpiece is convenient to discharge immediately, thereby improving the overall hot pressing working efficiency.
Description
Technical Field
The utility model relates to the technical field of semiconductor hot pressing, in particular to a hot pressing device.
Background
When the semiconductor is hot-pressed, the semiconductor is required to be placed on a hot-pressing table surface, and the hot-pressing module is driven to carry out downward hot-pressing work through telescopic gas. In the prior art (publication No. CN 210390143U), a hot pressing device is mentioned as 'comprising a frame and a cylinder arranged on the upper part of the frame', wherein the output end of the cylinder is provided with an electric soldering iron and an elastic pre-pressing device, the output end of the cylinder can drive the electric soldering iron and the elastic pre-pressing device to move up and down, the elastic pre-pressing device comprises a vertically arranged pressing column, the pressing column can stretch up and down, a workbench is arranged on the lower part of the frame, and a storage box is arranged on the workbench, but the surface of a semiconductor in the prior art after hot pressing is stable or very high, so that the semiconductor can be unloaded after being cooled for a certain time, the whole working efficiency of hot pressing is influenced relatively, and the device is not fast and convenient.
Disclosure of Invention
In order to overcome the defects existing in the prior art, the hot pressing device is provided at present, so that the problems that the surface of a semiconductor after hot pressing is stable or very high, the semiconductor can be unloaded after being cooled for a certain time, the whole working efficiency of hot pressing is affected, and the semiconductor is not fast and convenient are solved.
In order to achieve the above purpose, a hot press device is provided, which comprises a base, a lower hot press table and a top seat; the upper end face left and right parts of the base are respectively provided with a supporting rod, the upper ends of the supporting rods are supported below the lower hot press table, the rear end of the base is provided with a rear fixing plate, the upper end of the rear fixing plate is fixedly provided with a top seat, the middle part of the lower end face of the top seat is provided with an upper fixing plate, an upper mounting plate is arranged below the upper fixing plate, and a middle mounting plate is arranged below the upper mounting plate.
Further, the lower end face of the upper mounting plate is fixedly provided with an upper fixing sleeve, a plurality of groups of hydraulic telescopic cylinders are sleeved in the upper fixing sleeve, an upper groove is formed in the middle of the upper end face of the middle mounting plate, the lower end of each hydraulic telescopic cylinder is fixed on the middle mounting plate, a partition plate is arranged below the middle mounting plate, and a hot pressing plate is arranged below the partition plate.
Further, the hot pressing groove has been seted up in the middle of the upper portion of lower hot pressing platform, and the interior bottom of hot pressing groove is provided with interior clamp plate, has seted up the lower pocket in the interior clamp plate to the gomphosis has the lower panel in the lower pocket, and the up end middle part of base is provided with the cushion, installs multiunit thimble in the cushion, and the upper end top of thimble is under the lower terminal surface of lower panel.
Further, two sets of side ventilation channels have all been seted up to the left and right sides of lower hot press platform, and the outer port department of side ventilation channel is provided with outer net frame, and the internally mounted of side ventilation channel has interior radiator fan to all be linked together between the side ventilation channel on both sides and the autoclave.
Further, two groups of side grooves are formed in the front side wall and the rear side wall of the hot pressing groove, guide rods are arranged at the upper portion and the lower portion of the side grooves, a first motor is arranged at the rear end of the side grooves, and a screw rod is arranged at the front end of the first motor and located between the two groups of guide rods.
Further, clamping plates are movably connected between two groups of screw rods aligned on the front side wall and the rear side wall in the hot pressing groove, and rubber protrusions are arranged on the clamping surfaces of the clamping plates.
The utility model has the beneficial effects that:
1. the upper fixing sleeve is telescopic in the vertical direction, and can drive the middle mounting plate to move up and down in the vertical direction, so that the hot pressing plate is conveniently driven to be pressed on a semiconductor workpiece placed on the lower panel.
2. The ejector pin is arranged in the utility model, so that after the hot pressing of the semiconductor workpiece on the upper end surface of the lower panel is finished, the lower panel is lifted up straightly, the unloading work of the hot pressed semiconductor workpiece on the lower panel is convenient, and the arrangement is more convenient and trouble-saving.
3. The ventilation channels on the left and right sides of the lower hot pressing table are arranged to facilitate ventilation and heat dissipation treatment in the hot pressing groove, and the semiconductor workpiece hot-pressed on the upper end surface of the lower panel can be rapidly cooled by air with the help of the inner heat dissipation fan, so that the completion of hot pressing work is promoted, and the overall work efficiency is improved.
4. According to the utility model, the screw rods are rotatably and movably arranged in the side grooves arranged on the front side wall and the rear side wall of the hot pressing groove, the clamping plates are driven to straightly move right when the screw rods rotate clockwise, and the clamping plates are driven to straightly move left when the screw rods rotate anticlockwise, so that the clamping plates on the left side and the right side are conveniently and flexibly moved, and the semiconductor workpiece is stably clamped, and is subjected to hot pressing on the premise of being stabilized.
Drawings
FIG. 1 is a schematic front view of an embodiment of the present utility model;
FIG. 2 is a schematic cross-sectional view of an embodiment of the present utility model;
FIG. 3 is a schematic view illustrating the structure of the lower part of the top base according to an embodiment of the present utility model;
FIG. 4 is a schematic cross-sectional view of a lower stage according to an embodiment of the present utility model.
In the figure: 1. a base; 10. a support rod; 11. a cushion block; 12. a rear fixing plate; 13. a thimble; 2. a lower hot press table; 20. a side vent passage; 21. an outer frame; 22. an inner heat radiation fan; 23. an inner pressure plate; 24. a lower groove; 25. a lower panel; 26. a hot pressing groove; 27. a first motor; 270. a screw rod; 28. a side groove; 280. a guide rod; 29. a clamping plate; 3. a top base; 30. an upper fixing plate; 31. an upper mounting plate; 32. an upper fixing sleeve; 33. a hydraulic telescopic cylinder; 34. an upper groove; 35. a middle mounting plate; 36. a partition plate; 37. and (5) a hot pressing plate.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved more clearly apparent, the present utility model is further described in detail below with reference to the accompanying drawings and embodiments. The specific embodiments described herein are offered by way of illustration only and not as limitations of the utility model, and specific details such as particular system architectures, techniques, etc. may be set forth in order to provide a more thorough understanding of the embodiments of the utility model. The described embodiments are some, but not all, embodiments of the present disclosure. It will be apparent, however, to one skilled in the art that the present utility model may be practiced in other embodiments that depart from these specific details. Based on the embodiments in this disclosure, all other embodiments that a person skilled in the art would obtain without making any inventive effort are within the scope of protection of this disclosure.
Specific embodiments of the present utility model are described in detail below with reference to the accompanying drawings.
Fig. 1 is a schematic front view of an embodiment of the present utility model, fig. 2 is a schematic cross-sectional view of an embodiment of the present utility model, fig. 3 is a schematic view of a structure under a top seat of an embodiment of the present utility model, and fig. 4 is a schematic cross-sectional view of a lower hot press table of an embodiment of the present utility model.
Referring to fig. 1 to 4, the present utility model provides a hot press apparatus, which includes a base 1, a lower hot press table 2, and a top base 3; the upper end face left and right parts of the base 1 are provided with support rods 10, the upper ends of the support rods 10 are supported under the lower hot press table 2, the rear end of the base 1 is provided with a rear fixing plate 12, the upper end of the rear fixing plate 12 is fixedly provided with a top seat 3, the middle part of the lower end face of the top seat 3 is provided with an upper fixing plate 30, an upper mounting plate 31 is arranged below the upper fixing plate 30, and a middle mounting plate 35 is arranged below the upper mounting plate 31.
In this embodiment, an upper fixing sleeve 32 is fixed on the lower end surface of the upper mounting plate 31, a plurality of groups of hydraulic telescopic cylinders 33 are sleeved in the upper fixing sleeve 32, an upper groove 34 is formed in the middle of the upper end surface of the middle mounting plate 35, the lower end of the hydraulic telescopic cylinders 33 is fixed on the middle mounting plate 35, a partition plate 36 is arranged below the middle mounting plate 35, and a hot pressing plate 37 is arranged below the partition plate 36.
As a preferred embodiment, the upper mounting plate 32 is vertically movable in a telescoping manner to drive the middle mounting plate 35 to vertically move up and down, thereby facilitating the pressing of the hot platen 37 against a semiconductor workpiece placed on the lower panel 25.
In this embodiment, a hot pressing groove 26 is formed in the middle of the upper portion of the lower hot pressing table 2, an inner pressing plate 23 is arranged at the inner bottom of the hot pressing groove 26, a lower groove 24 is formed in the inner pressing plate 23, a lower panel 25 is embedded in the lower groove 24, a cushion block 11 is arranged in the middle of the upper end face of the base 1, a plurality of groups of ejector pins 13 are arranged in the cushion block 11, and the upper ends of the ejector pins 13 are propped against the lower end face of the lower panel 25.
As a preferred embodiment, the ejector pins 13 are arranged to facilitate the straight ejection of the lower panel 25 after the hot pressing of the semiconductor workpiece on the upper end surface of the lower panel 25 is completed, and facilitate the unloading of the hot pressed semiconductor workpiece on the lower panel 25, so that the arrangement is more convenient and trouble-saving.
In this embodiment, two sets of side ventilation channels 20 are respectively provided at the left and right parts of the lower hot press stage 2, an outer net frame 21 is provided at the outer port of the side ventilation channels 20, an inner cooling fan 22 is installed inside the side ventilation channels 20, and the side ventilation channels 20 at the left and right sides are respectively communicated with the hot press tank 26.
As a preferred embodiment, the ventilation channels 20 on the left and right sides of the lower hot press table 2 are arranged to facilitate ventilation and heat dissipation treatment in the hot press tank 26, and the semiconductor workpiece hot-pressed on the upper end surface of the lower panel 25 can be rapidly cooled by air with the aid of the inner cooling fan 22, so that the completion of hot press work is promoted, and the overall work efficiency is improved.
In the embodiment, two groups of side grooves 28 are formed in the front and rear side walls of the hot pressing groove 26, guide rods 280 are arranged in the upper and lower parts of the side grooves 28, a first motor 27 is arranged at the rear end of the side grooves 28, a screw rod 270 is arranged at the front end of the first motor 27, and the screw rod 270 is positioned between the two groups of guide rods 280; clamping plates 29 are movably connected between two groups of screw rods 270 aligned on the front side wall and the rear side wall in the hot pressing groove 26, and rubber protrusions are arranged on clamping surfaces of the clamping plates 29.
As a preferred embodiment, the side grooves 28 provided on the front and rear side walls of the hot pressing groove 26 are provided with the screw rods 270 in a rotating manner, the clamping plates 29 are driven to move straight right when the screw rods 270 rotate clockwise, and the clamping plates 29 are driven to move straight left when the screw rods 270 rotate anticlockwise, so that the clamping plates 29 on the left and right sides can be moved flexibly and conveniently, and the semiconductor workpiece can be clamped stably, so that the semiconductor workpiece can be hot pressed on the premise of being stabilized.
The utility model can effectively solve the problems that the surface of the semiconductor after hot pressing is stable or very high in the prior art, the semiconductor can be unloaded after being cooled for a certain time, the whole hot pressing working efficiency is influenced relatively, and the utility model is not fast and convenient.
The above-described embodiments are intended to illustrate the present utility model, not to limit it, and any modifications and variations made to the present utility model within the spirit of the utility model and the scope of the claims should be included in the scope of the present utility model.
Claims (6)
1. The hot press device is characterized by comprising a base (1), a lower hot press table (2) and a top seat (3); the upper end face left and right parts of the base (1) are respectively provided with a support rod (10), the upper ends of the support rods (10) are supported under the lower hot press table (2), the rear end of the base (1) is provided with a rear fixing plate (12), the upper end of the rear fixing plate (12) is fixedly provided with a footstock (3), the middle part of the lower end face of the footstock (3) is provided with an upper fixing plate (30), an upper mounting plate (31) is arranged under the upper fixing plate (30), and a middle mounting plate (35) is arranged below the upper mounting plate (31).
2. The hot press device according to claim 1, wherein an upper fixing sleeve (32) is fixed on the lower end face of the upper mounting plate (31), a plurality of groups of hydraulic telescopic cylinders (33) are sleeved in the upper fixing sleeve (32), an upper groove (34) is formed in the middle of the upper end face of the middle mounting plate (35), the lower end of the hydraulic telescopic cylinders (33) is fixed on the middle mounting plate (35), a partition plate (36) is arranged under the middle mounting plate (35), and a hot press plate (37) is arranged under the partition plate (36).
3. The hot press device according to claim 1, wherein a hot pressing groove (26) is formed in the middle of the upper portion of the lower hot pressing table (2), an inner pressing plate (23) is arranged at the inner bottom of the hot pressing groove (26), a lower groove (24) is formed in the inner pressing plate (23), a lower panel (25) is embedded in the lower groove (24), a cushion block (11) is arranged in the middle of the upper end face of the base (1), a plurality of groups of ejector pins (13) are arranged in the cushion block (11), and the upper ends of the ejector pins (13) are propped against the lower end face of the lower panel (25).
4. The hot press apparatus according to claim 1, wherein the left and right parts of the lower hot press table (2) are provided with two sets of side ventilation channels (20), an outer screen frame (21) is disposed at an outer port of the side ventilation channels (20), an inner cooling fan (22) is mounted in the side ventilation channels (20), and the side ventilation channels (20) on the left and right sides are communicated with the hot press tank (26).
5. A hot press according to claim 3, wherein two sets of side grooves (28) are provided on both front and rear side walls in the hot press tank (26), guide bars (280) are provided on both upper and lower inner portions of the side grooves (28), a first motor (27) is provided at the rear end of the side grooves (28), a screw (270) is mounted at the front end of the first motor (27), and the screw (270) is located between the two sets of guide bars (280).
6. The hot press apparatus according to claim 5, wherein a clamping plate (29) is movably connected between two sets of screws (270) aligned on front and rear side walls in the hot press tank (26), and a rubber protrusion is provided on a clamping surface of the clamping plate (29).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202322091226.4U CN220517617U (en) | 2023-08-04 | 2023-08-04 | Hot press device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202322091226.4U CN220517617U (en) | 2023-08-04 | 2023-08-04 | Hot press device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN220517617U true CN220517617U (en) | 2024-02-23 |
Family
ID=89937457
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202322091226.4U Active CN220517617U (en) | 2023-08-04 | 2023-08-04 | Hot press device |
Country Status (1)
Country | Link |
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CN (1) | CN220517617U (en) |
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2023
- 2023-08-04 CN CN202322091226.4U patent/CN220517617U/en active Active
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