CN220511530U - Gateway with good heat dissipation effect - Google Patents
Gateway with good heat dissipation effect Download PDFInfo
- Publication number
- CN220511530U CN220511530U CN202321839491.XU CN202321839491U CN220511530U CN 220511530 U CN220511530 U CN 220511530U CN 202321839491 U CN202321839491 U CN 202321839491U CN 220511530 U CN220511530 U CN 220511530U
- Authority
- CN
- China
- Prior art keywords
- gateway
- liquid filling
- cooling liquid
- heat dissipation
- coolant
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 31
- 230000000694 effects Effects 0.000 title claims abstract description 21
- 239000000110 cooling liquid Substances 0.000 claims abstract description 47
- 239000004065 semiconductor Substances 0.000 claims abstract description 22
- 239000002826 coolant Substances 0.000 claims description 35
- 239000007788 liquid Substances 0.000 claims description 26
- 229910000838 Al alloy Inorganic materials 0.000 claims description 24
- 229920000742 Cotton Polymers 0.000 claims description 9
- 239000006260 foam Substances 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 238000000605 extraction Methods 0.000 claims description 6
- 238000005057 refrigeration Methods 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 238000004378 air conditioning Methods 0.000 claims description 2
- 239000003507 refrigerant Substances 0.000 claims description 2
- 238000001816 cooling Methods 0.000 abstract description 3
- 239000011257 shell material Substances 0.000 description 11
- 230000004087 circulation Effects 0.000 description 7
- 238000004891 communication Methods 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000004089 microcirculation Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000003245 working effect Effects 0.000 description 2
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a gateway with good heat dissipation effect, which relates to the technical field of gateway equipment and comprises a gateway main body, and further comprises a cooling liquid filling box fixedly arranged on the top surface of the gateway main body, wherein the top surface of the cooling liquid filling box is provided with a semiconductor refrigerating sheet capable of cooling internal cooling liquid, the cold surface of the cooling liquid filling box is attached to the surface of the cooling liquid filling box, an S-shaped heat exchange tube is arranged in the cooling liquid filling box, the cooling liquid is cooled through the semiconductor refrigerating sheet, then air flow and the cooling liquid are subjected to heat exchange to reduce the temperature and then enter the gateway main body to cool elements, and then the air flow and the heat are discharged into the gateway main body through a heat removal grid together.
Description
Technical Field
The utility model relates to the technical field of gateway equipment, in particular to a gateway with good heat dissipation effect.
Background
The gateway is also called gateway connector and protocol converter. The gateway realizes network interconnection above the network layer, is a complex network interconnection device, and is only used for network interconnection with two different higher-layer protocols. The gateway may be used for both wide area network interconnection and local area network interconnection.
At present, most of the existing control system gateways are open and self-radiating, or are made of shell materials with better heat conduction and are additionally provided with a radiating fan to assist in radiating, but the radiating modes are passive radiating or accelerating air flow radiating modes, the radiating modes are relatively simple and crude, the radiating effect of the gateway is poor when the gateway works under high load, heat radiates towards a low heat position by itself or is discharged from the gateway through the action of air flow, the electronic components in the gateway cannot be radiated flexibly, the electronic components are burnt out easily due to heat accumulation, and therefore, how to effectively radiate the electronic components when the gateway works under high load becomes a problem to be solved urgently.
Disclosure of Invention
The utility model aims to provide a gateway with a good heat dissipation effect so as to solve the problems in the background technology.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a gateway that radiating effect is good, includes the gateway main part, still including fixed setting is in coolant liquid filling case on the gateway main part top surface, and be provided with the semiconductor refrigeration piece that can cool down inside coolant liquid on the top surface of coolant liquid filling case and its cold face laminating on the surface of coolant liquid filling case, install S type heat exchange tube in the coolant liquid filling case, and S type heat exchange tube runs through and installs the intake pipe that can extract outside air and the aspiration pump that carries the air conditioning in two ports of coolant liquid filling case top and lateral wall respectively the cooperation, in the gas outlet grafting of coolant tube is to the gateway main part, install the heat extraction grid that can outwards discharge to inside steam on gateway main part one side outer fringe face.
Preferably, an L-shaped communicating pipe is installed at the top of one side of the cooling liquid filling box, a water absorbing foam cotton with a moisture absorption function is inserted into an opening at the top of the L-shaped communicating pipe, a heat radiation fan is installed on the outer edge surface of one side of the L-shaped communicating pipe, which is far away from the cooling liquid filling box, and an air outlet of the heat radiation fan is opposite to the water absorbing foam cotton.
Preferably, an aluminum alloy circulating pipe is arranged on one side, far away from the L-shaped communicating pipe, of the cooling liquid filling box, two ports of the aluminum alloy circulating pipe are respectively communicated with a liquid inlet and a liquid outlet of the cooling liquid filling box, a micro circulating pump is arranged on the aluminum alloy circulating pipe, and the micro circulating pump is started, so that cooling liquid in the cooling liquid filling box can circulate in aluminum alloy circulating exchange.
Preferably, the shell of the gateway main body is made of an aluminum alloy material with high heat conductivity coefficient, the surface of the aluminum alloy circulating pipe is attached to the surface of the shell of the gateway main body, when cooling liquid circularly flows, the cooling liquid attached to the aluminum alloy circulating pipe on the aluminum alloy gateway shell can absorb heat radiated to the shell from the gateway main body outwards, passive heat dissipation is avoided, heat around the shell of the gateway main body is absorbed in an independent heat exchange mode, and the heat dissipation effect is further improved.
Preferably, the cooling liquid filling box is filled with cooling liquid serving as a cooling medium, the cooling liquid is water, the specific heat capacity of the cooling water is large, and more heat can be absorbed at a low temperature.
Preferably, the top of the L-shaped communication pipe is higher than the top of the coolant filling tank, so that the coolant in the coolant filling tank can be prevented from overflowing through the top opening of the L-shaped communication pipe.
Compared with the prior art, the utility model has the beneficial effects that:
1. the semiconductor refrigerating plate cools down the cooling liquid, then makes the air current and the cooling liquid enter into the gateway main part after taking place heat exchange to cool down the component, then together discharges the air current and heat in the gateway main part through the heat extraction grid, compared with the passive heat dissipation mode of traditional gateway and the heat dissipation mode with the fan, the heat dissipation efficiency to the gateway has been improved greatly, when the gateway high load work, can dispel the heat effectively, prevent overheated, have better result of use.
2. The air flow with the temperature reduced is blown on the hot surface of the semiconductor refrigerating sheet through the heat radiation fan, so that the hot surface of the semiconductor refrigerating sheet can be cooled, the working effect of the semiconductor refrigerating sheet is prevented from being influenced due to overheat of the hot surface of the semiconductor refrigerating sheet, the continuous working time of the semiconductor refrigerating sheet is prolonged, and the use effect is good.
3. Through the circulation flow of the cooling liquid, the cooling liquid attached to the aluminum alloy circulating pipe on the aluminum alloy gateway shell can absorb the heat radiated to the shell from the gateway main body outwards, so that passive heat dissipation is avoided, the heat around the shell of the gateway main body is absorbed in an independent heat exchange mode, and the heat dissipation effect is further improved
Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.
Drawings
The foregoing and/or additional aspects and advantages of the utility model will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic view of another angle of the coolant fill tank of the present utility model;
fig. 3 is a schematic structural view of the integral cooling liquid filling tank of the present utility model.
In the figure: 1. a gateway body; 2. a heat extraction grille; 3. an L-shaped communicating tube; 4. an air extracting pump; 5. a cooling liquid filling tank; 6. an air inlet pipe; 7. a semiconductor refrigeration sheet; 8. absorbent foam cotton; 9. a heat radiation fan; 10. an aluminum alloy circulation pipe; 11. a micro circulation pump; 12. s-shaped heat exchange tube.
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.
In the description of the present utility model, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present utility model and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present utility model.
In the description of the present utility model, a number means one or more, a number means two or more, and greater than, less than, exceeding, etc. are understood to not include the present number, and above, below, within, etc. are understood to include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present utility model, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present utility model can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.
Example 1
Referring to fig. 1 and 3, a gateway with good heat dissipation effect in the drawing includes a gateway main body 1, and further includes a cooling liquid filling box 5 fixedly disposed on the top surface of the gateway main body 1, a cooling liquid serving as a refrigerant is filled in the cooling liquid filling box 5, the cooling liquid is water, the specific heat capacity of the water is large, more heat can be absorbed at low temperature, a semiconductor refrigeration sheet 7 capable of cooling the internal cooling liquid is disposed on the top surface of the cooling liquid filling box 5, a cold surface of the cooling liquid filling box is attached to the surface of the cooling liquid filling box 5, an S-shaped heat exchange tube 12 is mounted in the cooling liquid filling box 5, two ports penetrating through the top and the side wall of the cooling liquid filling box 5 are respectively matched with an air inlet pipe 6 capable of extracting external air and an air pump 4 for delivering cold air, an air outlet of the cooling tube is inserted into the gateway main body 1, and a heat extraction grid 2 capable of discharging the hot air from the inside is mounted on one side outer edge of the gateway main body 1.
It should be noted that: in this scheme, the semiconductor refrigeration piece 7 that sets up is the thermocouple pair that is linked by an N type semiconductor material and a P type semiconductor material, when there is the electric current to pass through wherein, will produce the heat transfer between the both ends, the heat will be shifted to the other end from one end, thereby produce the difference in temperature and form the cold and hot end, the cold face of semiconductor refrigeration piece 7 laminating on coolant liquid filling box 5 will cool down the coolant liquid in coolant liquid filling box 5 like this, thereby make the temperature of coolant liquid reduce, aspiration pump 4 also is in the circular telegram operating condition this moment, it is through the outside air of S type heat exchange tube 12 and intake pipe 6 extraction, when drawing in outside air to S type heat exchange tube 12, thereby the temperature of air through the pipe wall of S type heat exchange tube 12 and coolant liquid in coolant liquid filling box 5 take place the heat exchange, then the temperature of messenger' S gas reduces, then the air current that has reduced the temperature is through driving into coolant liquid filling box 5 in, so can be through the air current that has reduced the temperature and the element in the coolant liquid filling box 5 cools down, prevent gateway main part in the high load during operation and the element overheat, thereby can be passed through semiconductor heat exchange tube 7 and then can cool down the heat with the heat dissipation mode to the gateway 1 through the heat dissipation device, the heat dissipation effect is carried out to the heat dissipation mode and the heat dissipation device is carried out to the gateway in the heat exchange mode is high heat exchange to the heat with the heat dissipation main part, and then has the heat dissipation effect is carried out to the heat to the heat dissipation device is cooled down the heat to the gateway and has the heat to the heat when the heat.
Referring to fig. 1, an L-shaped communicating tube 3 is mounted at the top of one side of a cooling liquid filling tank 5 in the drawing, a water-absorbing foam cotton 8 with a moisture absorption function is inserted into an opening at the top of the L-shaped communicating tube 3, a heat dissipation fan 9 is mounted on an outer edge surface of one side of the L-shaped communicating tube 3, which is far away from the cooling liquid filling tank 5, and an air outlet of the heat dissipation fan 9 is opposite to the water-absorbing foam cotton 8.
It should be noted that: the cooling liquid filling box 5 is also filled in the L-shaped communicating pipe 3 through the communicating vessel, then the water-absorbing foam cotton 8 inserted in the L-shaped communicating pipe 3 is sucked out, at the moment, the heat radiation fan 9 is started, so that the air flow passes through the water-absorbing foam cotton 8 absorbing water with lower temperature and is directly contacted with the water, the temperature of the air flow can be reduced, and then the air flow with reduced temperature is blown on the hot surface of the semiconductor refrigerating sheet 7, so that the hot surface of the semiconductor refrigerating sheet 7 can be cooled, the working effect of the semiconductor refrigerating sheet 7 is prevented from being influenced by overheat of the hot surface of the semiconductor refrigerating sheet 7, the continuous working time of the semiconductor refrigerating sheet 7 is prolonged, and the use effect is better;
notably, are: in order to prevent the coolant in the coolant-filled tank 5 from overflowing through the top opening of the L-shaped communication tube 3, the top height of the L-shaped communication tube 3 in the drawing is higher than the top height of the coolant-filled tank 5.
Example 2
Referring to fig. 1 and 2, in this embodiment, for further description of example 1, an aluminum alloy circulation pipe 10 is disposed on a side of the cooling liquid filling tank 5 far from the L-shaped communication pipe 3, two ports of the aluminum alloy circulation pipe 10 are respectively connected with a liquid inlet and a liquid outlet of the cooling liquid filling tank 5, and a micro circulation pump 11 is mounted on the aluminum alloy circulation pipe 10.
It should be noted that: by starting the micro circulation pump 11, the coolant in the coolant filling tank 5 can be circulated during the aluminum alloy circulation.
In addition, referring to fig. 1 and 2, the housing of the gateway main body 1 is made of an aluminum alloy material with high thermal conductivity, and the surface of the aluminum alloy circulation pipe 10 is attached to the surface of the housing of the gateway main body 1.
It should be noted that: when the cooling liquid circularly flows, the cooling liquid in the aluminum alloy circulating pipe 10 attached to the aluminum alloy gateway shell can absorb the heat radiated to the outside of the gateway main body 1, so that passive heat dissipation is avoided, the heat around the shell of the gateway main body 1 is absorbed in an independent heat exchange mode, and the heat dissipation effect is further improved.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A gateway with good heat dissipation effect comprises;
a gateway main body (1);
characterized in that it also comprises;
the utility model provides a fixed setting is in coolant liquid filling case (5) on gateway main part (1) top surface, and be provided with semiconductor refrigeration piece (7) that can cool down inside coolant liquid on the top surface of coolant liquid filling case (5) and its cold face laminating is on the surface of coolant liquid filling case (5), install S type heat exchange tube (12) in coolant liquid filling case (5), and S type heat exchange tube (12) run through in two ports of coolant liquid filling case (5) top and lateral wall and cooperate respectively and install intake pipe (6) that can extract outside air and aspiration pump (4) that carry the air conditioning, the gas outlet of coolant flow tube peg graft to in gateway main part (1), install heat extraction grid (2) that can outwards discharge inside steam on the outer fringe face of gateway main part (1).
2. The gateway with good heat dissipation effect according to claim 1, wherein: the cooling liquid filling box (5) one side top is installed L type communicating pipe (3), and the open-top grafting of L type communicating pipe (3) has the foam cotton (8) that absorbs moisture, install radiator fan (9) on the outer fringe face of one side that cooling liquid filling box (5) was kept away from to L type communicating pipe (3) to the air outlet of radiator fan (9) is just to foam cotton (8) that absorbs water.
3. The gateway with good heat dissipation effect according to claim 2, wherein: an aluminum alloy circulating pipe (10) is arranged on one side, far away from the L-shaped communicating pipe (3), of the cooling liquid filling box (5), two ports of the aluminum alloy circulating pipe (10) are respectively communicated with a liquid inlet and a liquid outlet of the cooling liquid filling box (5), and a micro circulating pump (11) is arranged on the aluminum alloy circulating pipe (10).
4. A gateway with good heat dissipation effect according to claim 3, wherein: the shell of the gateway main body (1) is made of an aluminum alloy material with high heat conductivity coefficient, and the surface of the aluminum alloy circulating pipe (10) is attached to the surface of the shell of the gateway main body (1).
5. The gateway with good heat dissipation effect according to claim 4, wherein: the coolant filling box (5) is filled with coolant serving as a refrigerant, and the coolant is water.
6. The gateway with good heat dissipation effect according to claim 5, wherein: the top of the L-shaped communicating pipe (3) is higher than the top of the cooling liquid filling tank (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321839491.XU CN220511530U (en) | 2023-07-13 | 2023-07-13 | Gateway with good heat dissipation effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321839491.XU CN220511530U (en) | 2023-07-13 | 2023-07-13 | Gateway with good heat dissipation effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220511530U true CN220511530U (en) | 2024-02-20 |
Family
ID=89881782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321839491.XU Active CN220511530U (en) | 2023-07-13 | 2023-07-13 | Gateway with good heat dissipation effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220511530U (en) |
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2023
- 2023-07-13 CN CN202321839491.XU patent/CN220511530U/en active Active
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