CN220510084U - Intelligent lead storage battery with stably-installed chip assembly - Google Patents

Abstract

The utility model discloses an intelligent lead storage battery with a stably-installed chip assembly, which comprises a battery groove and a battery cover which are mutually covered, wherein the battery cover comprises a middle cover and a cover plate, the top surface of the middle cover is provided with a cover plate groove, the cover plate is used for sealing the cover plate groove, the intelligent lead storage battery also comprises a chip assembly, one side of the cover plate groove is provided with an installation groove for installing the chip assembly, the bottom surface of the installation groove is provided with a plurality of positioning protrusions, and the bottom surface of the chip assembly is provided with positioning holes matched with the positioning protrusions. According to the utility model, the plurality of positioning protrusions are arranged on the bottom surface of the mounting groove for mounting the chip assembly, the positioning holes matched with the positioning protrusions are arranged on the bottom surface of the chip assembly, and the chip assembly is limited by the matching between the positioning protrusions and the positioning holes, so that the chip assembly is prevented from moving in the mounting groove, and the normal use of the chip assembly is prevented from being influenced.

Description

Intelligent lead storage battery with stably-installed chip assembly

Technical Field

The utility model relates to the technical field of lead storage batteries, in particular to an intelligent lead storage battery with a stably-installed chip assembly.

Background

The lead storage battery is a common recyclable electric energy storage device, is very widely applied, is green and pollution-free, has no emission of harmful substances, is commonly used on electric road vehicles, and is convenient for people to travel in short distance.

The current lead storage battery has the following problems: 1. because the stored electricity is limited, the charging time is long after discharging, and people cannot use the battery as soon as possible; 2. the box body is sealed and light-tight, the capacity of the internal electrolyte cannot be intuitively known, the internal temperature and the air pressure cannot be directly obtained, and the safety accidents cannot be effectively stopped.

In order to improve the intelligent level in the use process of the lead storage battery, a battery management system is introduced so as to know the real-time capacity change, the temperature change, the driving position and the like of the lead storage battery. The general chip assembly may have some or all of the functions of temperature detection, voltage detection, and positioning, etc., as desired.

For example, the utility model of the grant publication number CN217216003U discloses a battery management system, comprising: the main control chip is used for a charging circuit for charging the storage battery, a buzzer circuit for charging prompt and alarm, a current acquisition circuit for acquiring the charging current of the storage battery and amplifying the charging current, a temperature sensor module for detecting the temperature of the storage battery, and the charging circuit and the buzzer circuit are controlled by the main control chip, and the acquisition circuit and the temperature sensor module are fed back to the main control chip.

In the prior art, when a chip is mounted, a mounting groove is generally directly formed in a battery cover, then the chip is placed in the mounting groove, for example, the utility model application with publication number of CN112582700A discloses a lead-acid storage battery, which comprises a battery shell, a battery cover, a binding post electrically connected with the binding post, and a chip mounting groove for mounting the chip is formed in the battery cover, and the chip is connected in series between the binding post and the binding post. However, simply placing the chip in the mounting groove does not fix the chip well, so that the chip is easy to move in the mounting groove, and may cause damage to the chip during use. And connection wires of the chip and the connection terminals and the like are routed from the outside of the top surface of the battery cover, there is a problem in that the routing is inconvenient and also the appearance of the lead storage battery is affected.

Disclosure of Invention

Aiming at the problem of unstable chip installation in the lead storage battery in the prior art, the utility model provides an intelligent lead storage battery with a stable chip assembly.

The utility model provides an intelligent lead accumulator of chip subassembly stable installation, includes battery jar and the battery lid of mutually lid, the battery lid includes well lid and cover plate, well lid top surface has the cover plate groove, the cover plate is used for the closing cap the cover plate groove, the battery still includes the chip subassembly, one side of cover plate groove is equipped with and is used for the installation the mounting groove of chip subassembly, the bottom surface of mounting groove is equipped with a plurality of location arch, the bottom surface of chip subassembly be equipped with location protruding complex locating hole.

Preferably, a plurality of supporting bosses are arranged on the bottom surface of the mounting groove, the chip assembly is placed on the supporting bosses, and the positioning bosses are arranged on at least part of the supporting bosses. The chip assembly is placed on the plurality of supporting bosses, so that the chip assembly is not in direct contact with the bottom surface of the mounting groove, and the influence of heating on the chip assembly in the use process of the lead storage battery can be reduced.

Preferably, the top surface of the chip assembly is arranged on the buffer pad, and the bottom surface of the cover plate compresses the buffer pad when the cover plate covers the cover plate groove. The cushion pad may be directly adhered to the top surface of the chip assembly with double sided tape or other glue. When the circumstances such as bump take place for lead accumulator in the use, the chip subassembly can not take place violently to collide with the cover plate to the setting of blotter can make the cover plate act on the blotter, and the chip subassembly is acted on by the blotter again, in order to compress tightly the chip subassembly, avoids the chip subassembly to take place to remove relative lead accumulator.

Preferably, the bottom surface of the cover plate groove is provided with acid injection hole columns, each acid injection hole column is positioned in the middle area of the cover plate groove, the bottom surface of the cover plate groove is protruded to form a first boss, and acid injection Kong Zhuwei is arranged on the first boss; the bottom surface of the cover plate groove is protruded along the two side edges of the width direction of the lead storage battery to form a plurality of second bosses, the top surface of each second boss is used as a supporting surface for installing the cover plate,

the first boss, the second boss positioned on one side of the mounting groove and the side wall of the cover plate groove surround to form the mounting groove. The arrangement of the second boss can increase the supporting surface of the cover plate.

More preferably, the first boss is provided with a plurality of support rods, and the top surfaces of the support rods and the top surface of the second boss are located on the same plane. The arrangement of the support bars also provides support to the central region of the cover sheet.

Preferably, the middle cover is provided with two terminal grooves, the terminal grooves are internally provided with positive electrode wiring terminals and negative electrode wiring terminals, the mounting grooves are positioned on one side where the terminal grooves are positioned, and the chip assembly is connected and conducted with the positive electrode wiring terminals and the negative electrode wiring terminals through positive electrode power lines and negative electrode power lines respectively. For a chip assembly which only needs temperature detection and positioning functions, the chip assembly can be powered by independently providing an additional power supply; for voltage detection, a detection line needs to be connected from the lead storage battery to the chip assembly, and the detection line can serve as a power supply line of the chip assembly at the same time. Of course, even if no voltage detection is required, the chip assembly can be powered by wiring from the lead storage battery.

According to the utility model, the plurality of positioning protrusions are arranged on the bottom surface of the mounting groove for mounting the chip assembly, the positioning holes matched with the positioning protrusions are arranged on the bottom surface of the chip assembly, and the chip assembly is limited by the matching between the positioning protrusions and the positioning holes, so that the chip assembly is prevented from moving in the mounting groove, and the normal use of the chip assembly is prevented from being influenced.

Drawings

Fig. 1 is a schematic perspective view of an intelligent lead storage battery without a cover plate.

Fig. 2 is a schematic top view of the intelligent lead storage battery without a cover plate.

Fig. 3 is a schematic perspective view of the middle cap without the chip assembly.

Fig. 4 is a partial enlarged view of fig. 3 a.

Fig. 5 is a schematic top view of the middle cap without the chip assembly.

Fig. 6 is a schematic perspective view of a chip assembly.

Fig. 7 is a schematic view of the bottom structure of the middle cap.

Fig. 8 is a partial enlarged view of B in fig. 7.

Fig. 9 is a schematic diagram of a connection structure of the positive and negative power lines.

Fig. 10 is a schematic diagram of a connection structure between a positive connection terminal and one end of a positive power line.

Fig. 11 is a schematic view of a partial sectional structure of the positive and negative power line connectors.

Fig. 12 is a schematic view of a square-section positive and negative power supply line.

Reference numerals:

the battery jar 1 is provided with a plurality of battery cells,

the middle cover 2, the cover plate groove 21, the mounting groove 22, the positioning protrusion 23, the supporting boss 24, the acid injection hole column 25, the first boss 26, the second boss 27, the supporting rod 28, the wiring groove 29,

chip assembly 3, positioning hole 31, positive power line connector 32, negative power line connector 33, plug hole 34, plug hole 35,

the cushion pad 4 is provided with a recess,

a positive electrode power supply line 5,

a negative electrode power supply line 6,

positive terminal 7, mounting ring 71, terminal portion 72, mounting hole 73,

and a negative electrode terminal 8.

Detailed Description

As shown in fig. 1 and 2, an intelligent lead storage battery comprises a battery groove 1 and a battery cover which are mutually covered, wherein the battery cover comprises a middle cover 2 and a cover plate (the cover plate is not shown in the figure), the top surface of the middle cover 2 is provided with a cover plate groove 21, and the cover plate is used for covering the cover plate groove 21. The storage battery further comprises a chip assembly 3, the whole shell of the chip assembly 3 is of a cuboid structure, a chip, a related detection sensor and a connecting circuit are arranged inside the chip assembly 3, the utility model point in the application is not in the internal structure of the chip assembly 3, so that the chip assembly 3 can use the existing chip and related structures in the prior art, and the functions to be completed by the chip assembly 3 in the application can be one or more of temperature detection, voltage detection and positioning functions and other functions to be realized when the existing common lead storage battery is intelligently upgraded.

As shown in fig. 3 to 6, one side of the cover plate groove 21 is provided with a mounting groove 22 for mounting the chip assembly 3, the bottom surface of the mounting groove 22 is provided with a plurality of positioning protrusions 23, and the bottom surface of the chip assembly 3 is provided with positioning holes 31 matched with the positioning protrusions 23.

The bottom surface of the mounting groove 22 is provided with a plurality of supporting bosses 24, and the chip assembly 3 is placed on the supporting bosses 24, wherein at least part of the supporting bosses 24 are provided with positioning bosses 23. In the structure shown in the figure, the number of the support bosses 24 is 4, and the support bosses 24 are respectively positioned at four corners of the mounting groove 22, and positioning bosses 23 are arranged on two diagonally arranged support bosses 24. The chip assembly 3 is placed on the plurality of support bosses 24, so that the chip assembly 3 is not in direct contact with the bottom surface of the mounting groove 22, and the influence of heat generation on the chip assembly 3 in the use process of the lead storage battery can be reduced.

The top surface of the chip assembly 3 is provided with a cushion pad 4, and the cushion pad 4 can be a sponge cushion. The bottom surface of the cover plate presses the cushion pad 4 when the cover plate covers the cover plate groove 21. The cushion pad 4 may be directly attached to the top surface of the chip assembly 3 with double sided tape or other glue. When the circumstances such as bump take place for the lead accumulator in the use, the setting of blotter 4 can make the chip subassembly 3 can not take place violently to collide with the cover plate to the setting of blotter 4 can make the cover plate act on blotter 4, is acted on chip subassembly 3 by blotter 4 again, in order to compress tightly chip subassembly 3, avoids chip subassembly 3 to take place to remove for the lead accumulator.

As shown in fig. 1 and 2, the bottom surface of the cover plate slot 21 is provided with acid injection hole columns 25, each acid injection hole column 25 is located in the middle area of the cover plate slot 21, the lead storage battery is internally provided with 6 single cells, the 6 single cells are arranged in a row along the length direction of the lead storage battery, and correspondingly, each single cell is correspondingly provided with one acid injection hole column 25 on the cover plate slot 21, so that the 6 acid injection hole columns 25 are also arranged in a row. The bottom surface of the cover plate groove 21 is protruded to form a first boss 26, and the acid injection hole column 25 is positioned on the first boss 26; the bottom surface of the cover plate groove 21 is protruded along the two side edges of the width direction of the lead storage battery to form a plurality of second bosses 27, and the top surface of the second bosses 27 is used as a supporting surface for mounting the cover plate. Wherein the first boss 26, the second boss 27 located at one side of the mounting groove 22, and the side wall of the cover plate groove 21 surround to form the mounting groove 22. The provision of the second boss 27 can increase the support surface for the cover plate.

The first boss 26 is provided with a plurality of support rods 28, and the top surfaces of the support rods 28 and the top surfaces of the second bosses 27 are positioned on the same plane. The support bar 28 also provides support to the central region of the flap.

The middle cover 2 is provided with two terminal grooves, a positive terminal 7 and a negative terminal 8 are arranged in the terminal grooves, and the mounting groove 22 is positioned on one side of the terminal grooves. As shown in fig. 7 to 9, the chip module 3 is connected to and conducted with the positive electrode terminal 7 and the negative electrode terminal 8 via the positive electrode power supply line 5 and the negative electrode power supply line 6, respectively. For the chip assembly 3 requiring only the temperature sensing and positioning functions, the chip assembly 3 may be powered by providing an additional power supply alone; for voltage detection, a detection line is connected from the lead-acid battery to the chip module 3, and this detection line can serve as a supply line for the chip module 3. Of course, even if no voltage detection is required, the chip assembly 3 can be supplied with power from the lead-acid battery wiring.

The wiring mode of positive electrode power line 5 and negative electrode power line 6 in this intelligent lead storage battery is inside wiring, and positive electrode power line 5 and negative electrode power line 6 are walked the line from the bottom surface of well lid 2 or in the pre-buried well lid 2 of integrative moulding plastics when well lid 2 moulds plastics.

If the positive power line 5 and the negative power line 6 are integrally injection-molded and pre-buried in the middle cover 2 when the middle cover 2 is injection-molded, the positive power line 5 and the negative power line 6 are required to be put into an injection mold when the middle cover 2 is injection-molded, and the advantage of integral injection molding is that holes for extending the two ends of the power line out of the middle cover 2 are not required to be reserved, and electrolyte is not required to climb outwards from the reserved holes.

As shown in fig. 7 to 9, the bottom surface of the middle cover 2 is provided with bus bar glue grooves for accommodating bus bars, when the positive electrode power line 5 and the negative electrode power line 6 are routed from the bottom surface of the middle cover 2, the bottom surfaces of the two bus bar glue grooves are provided with wire routing grooves 29 for accommodating the positive electrode power line 5 or the negative electrode power line 6, and one end of each of the positive electrode power line 5 and the negative electrode power line 6 penetrates out of the middle cover 2 to the terminal groove for being connected with the corresponding positive electrode wiring terminal 7 or negative electrode wiring terminal 8, and the other end penetrates out of the middle cover 2 to the mounting groove 22 for being connected with the chip assembly 3. Through setting up the wiring groove 29 in the bottom surface of corresponding busbar glued groove, can arrange the wiring groove 29 according to nearest route, shorten the wiring distance, the setting of wiring groove 29 does not occupy the space that the busbar glued groove held the busbar simultaneously, and the sealed glue that the busbar glued groove used when the equipment can just in time carry out sealed fixed with the positive pole power cord 5 and the negative pole power cord 6 of arranging in wiring groove 29 again. The step of placing the positive power line 5 and the negative power line 6 in the injection mold during injection molding of the middle cover 2 is not needed by prefabricating the wiring groove 29 on the bottom surface of the middle cover 2, but the positive power line 5 and the negative power line 6 are installed at a later stage, holes, extending out of the middle cover 2, at two ends of the power line are needed to be reserved during injection molding, and the holes can be sealed through sealant so as to avoid acid climbing at the later stage.

The parts of the two ends of the positive electrode power line 5 and the negative electrode power line 6 penetrating out of the middle cover 2 are vertically upwards arranged. The ends of the positive power line 5 and the negative power line 6 are vertically upwards arranged, so that connection with the wiring terminal and the chip assembly 3 can be facilitated.

The positive electrode binding post 7 and the negative electrode binding post 8 respectively comprise a mounting ring matched with an end pole of the lead storage battery and a binding part used for external binding during charging and discharging, the mounting ring is provided with a mounting hole, and one end of the positive electrode power wire 5 is clamped into the mounting hole on the mounting ring of the positive electrode binding post 7; one end of the negative power cord 6 is snapped into a mounting hole in the mounting ring of the negative terminal 8.

The same binding post is used to anodal binding post 7 and negative pole binding post 8 to the symmetry is equipped with two mounting holes on the collar, and when binding post was used for anodal binding post 7, in one of them mounting hole was gone into to positive pole power cord 5's one end card, and binding post was used for negative pole binding post 8, in the another one end card of negative pole power cord 6 was gone into in the another mounting hole of symmetry. As shown in fig. 10, a schematic diagram of a connection structure between the positive electrode terminal 7 and one end of the positive electrode power line 5 is shown, the positive electrode terminal 7 includes a mounting ring 71 and a wiring portion 72, two mounting holes 73 are provided on the mounting ring 71, and the mounting holes 73 are vertically arranged so as to be connected with one end of the positive electrode power line 5 which is vertically arranged.

As shown in fig. 9 and 11, the chip assembly 3 has a positive power line connector 32 and a negative power line connector 33, the positive power line connector 32 has a plug hole 34, and the negative power line connector 33 has a plug hole 35. One end of the positive power line 5 is in plug-in fit with the plug hole 34 of the positive power line connector 32, and one end of the negative power line 6 is in plug-in fit with the plug hole 35 of the negative power line connector 33. By means of this plug-in fit, the connection can be realized very conveniently. And, the jack holes 34 and 35 are vertically downward arranged so as to be connected with one ends of the positive electrode power supply line 5 and the negative electrode power supply line 6, respectively, which are vertically arranged.

The cross sections of the positive electrode power supply line 5 and the negative electrode power supply line 6 are circular or square, and the cross section of the power supply line in the structure shown in fig. 10 is circular, and the cross section of the power supply line in the structure shown in fig. 12 is square.

In a preferred embodiment, the ends of the positive and negative power lines 5, 6 are tapered. The thickness of the conical end part gradually decreases from the position close to the middle to the end surface, and the size of the mounting hole on the mounting ring is preferably thicker than the position where the conical end part is the thinnest and thinner than the position where the conical end part is the thickest, so that the end part can be stretched into the mounting hole to be tightly clamped; similarly, the plug holes 34 and 35 of the positive and negative power line connectors 32 and 33 on the chip module 3 are preferably thicker than the thinnest part of the tapered end part and thinner than the thickest part, so that the end parts can be inserted into the plug holes to be clamped.

The positive power supply line 5 and the negative power supply line 6 are preferably both copper wires. Electrolyte is filled in the lead storage battery, the electrolyte is sulfuric acid solution with a certain concentration, copper does not react with dilute sulfuric acid, so that the use safety of the positive power line 5 and the negative power line 6 can be ensured by using copper wires as the positive power line 5 and the negative power line 6.

Claims (6)

1. The utility model provides an intelligent lead accumulator of chip subassembly stable installation, includes battery jar and the battery lid of mutual lid, the battery lid includes well lid and cover plate, well lid top surface has the cover plate groove, the cover plate is used for the closing cap the cover plate groove, the battery still includes chip subassembly, its characterized in that, one side of cover plate groove is equipped with and is used for installing chip subassembly's mounting groove, the bottom surface of mounting groove is equipped with a plurality of location arch, chip subassembly's bottom surface be equipped with the protruding complex locating hole of location.

2. The intelligent lead storage battery for stably mounting the chip assembly according to claim 1, wherein a plurality of supporting bosses are arranged on the bottom surface of the mounting groove, the chip assembly is placed on the supporting bosses, and the positioning bosses are arranged on at least part of the supporting bosses.

3. The intelligent lead storage battery of claim 1, wherein the top surface of the chip assembly is provided with a buffer pad, and the bottom surface of the cover plate compresses the buffer pad when the cover plate covers the cover plate groove.

4. The intelligent lead storage battery with the stably installed chip assembly according to claim 1, wherein the bottom surface of the cover plate groove is provided with acid injection hole columns, each acid injection hole column is positioned in the middle area of the cover plate groove, the bottom surface of the cover plate groove protrudes to form a first boss, and acid injection Kong Zhuwei is arranged on the first boss; the bottom surface of the cover plate groove is protruded along the two side edges of the width direction of the lead storage battery to form a plurality of second bosses, the top surface of each second boss is used as a supporting surface for installing the cover plate,

the first boss, the second boss positioned on one side of the mounting groove and the side wall of the cover plate groove surround to form the mounting groove.

5. The intelligent lead storage battery with the stably-installed chip assembly according to claim 4, wherein the first boss is provided with a plurality of supporting rods, and the top surfaces of the supporting rods and the top surfaces of the second bosses are located on the same plane.

6. The intelligent lead storage battery with the stable chip assembly installed according to claim 1, wherein two terminal grooves are formed in the middle cover, positive electrode wiring terminals and negative electrode wiring terminals are arranged in the terminal grooves, the installation grooves are located on one side of the terminal grooves, and the chip assembly is connected and conducted with the positive electrode wiring terminals and the negative electrode wiring terminals through positive electrode power lines and negative electrode power lines respectively.