CN220502665U - Filling device for solder resist coating - Google Patents
Filling device for solder resist coating Download PDFInfo
- Publication number
- CN220502665U CN220502665U CN202321851990.0U CN202321851990U CN220502665U CN 220502665 U CN220502665 U CN 220502665U CN 202321851990 U CN202321851990 U CN 202321851990U CN 220502665 U CN220502665 U CN 220502665U
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- China
- Prior art keywords
- filling
- solder resist
- valve
- tube body
- connecting plate
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Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 25
- 239000011248 coating agent Substances 0.000 title claims abstract description 11
- 238000000576 coating method Methods 0.000 title claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 24
- 238000007789 sealing Methods 0.000 claims abstract description 13
- 238000003466 welding Methods 0.000 claims description 13
- 238000007599 discharging Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 claims description 4
- 230000007423 decrease Effects 0.000 claims description 2
- 238000003860 storage Methods 0.000 abstract description 5
- 230000000903 blocking effect Effects 0.000 description 6
- 238000007639 printing Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000010019 resist printing Methods 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
Abstract
The utility model relates to the technical field of filling devices, and discloses a filling device for a solder resist coating, which solves the problem of material leakage of the existing filling device and comprises a solder resist ink storage tank, wherein a discharge pipe is fixedly arranged at the bottom end of the solder resist ink storage tank, a filling pipe body is arranged at the bottom end of the discharge pipe, an electromagnetic valve I is arranged at the top end of the outer side of the filling pipe body, an electromagnetic valve II is arranged at the bottom end of the outer side of the filling pipe body, a quantitative filling cylinder body is arranged at the middle position of one side, far away from the electromagnetic valve I and the electromagnetic valve II, of the filling pipe body, a piston is movably arranged in the quantitative filling cylinder body, one end, far away from the filling pipe body, is provided with a cylinder connected with the piston, a filling port is movably arranged at the bottom end of the filling pipe body, a material leakage preventing sealing mechanism connected with the electromagnetic valve II is arranged at the bottom of the filling port, and a material receiving container is arranged at the bottom of the filling port; the quantitative filling can be realized through the filling device, and meanwhile, the condition of material leakage can be avoided.
Description
Technical Field
The utility model belongs to the technical field of filling devices, and particularly relates to a filling device for a solder resist coating.
Background
The printing ink used in the PCB solder resist procedure is a liquid photo solder resist, the main components are epoxy resin and acrylic resin, and the solder resist printing ink is coated on the surface of the PCB to form a solder resist coating.
The welding-resistant ink is stored and transported by utilizing the filling barrel after production is completed, the filling device is needed when the welding-resistant ink is filled, the filling device used at present has the condition of leaking materials in filling gaps, the main reason for causing the leaking materials is that the welding-resistant ink has certain viscosity, and when the filling barrel is replaced, the welding-resistant ink can slowly drip along the inner side wall of the filling opening, so the application provides a filling device for welding-resistant coating, which is used for improving the existing filling device.
Disclosure of Invention
Aiming at the situation, in order to overcome the defects of the prior art, the utility model provides the filling device for the solder resist coating, which effectively solves the problem of material leakage of the existing filling device.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a filling device for welding resistance coating, includes the welding resistance ink holding vessel, the bottom mounting of welding resistance ink holding vessel is provided with the discharging pipe, the bottom of discharging pipe is provided with the filling tube body, the top outside the filling tube body is fixed to be provided with the solenoid valve first that alternates in the filling tube body, the bottom mounting outside the filling tube body is provided with the solenoid valve second that alternates in the filling tube body, the filling tube body is kept away from the solenoid valve first and the intermediate position fixed of solenoid valve second one side is provided with the ration filling barrel, the inside activity of ration filling barrel is provided with the piston, the fixed cylinder that is provided with and piston connection of one end that is kept away from the filling tube body of ration filling barrel, the bottom mounting of the filling tube body is provided with the filling mouth, the inside activity of filling mouth is provided with the leak protection material shutoff mechanism that is connected with the solenoid valve two-phase cooperation, the bottom of filling mouth is provided with the filling and connects the material container.
Preferably, the first electromagnetic valve and the second electromagnetic valve are both composed of a valve body and a valve plate, the valve body is fixedly connected to the outer side edge of the filling pipe body, and the valve plate is positioned in the filling pipe body and is fixedly connected with an output shaft of the valve body.
Preferably, the leakage-proof plugging mechanism comprises a connecting rod, a first connecting plate, a second connecting plate and a plugging head, wherein the first connecting plate is fixedly connected to one side of the bottom end of a valve plate on the second electromagnetic valve, the second connecting plate is fixedly connected to the middle position of the top end of the plugging head, and the connecting rod is movably connected between the first connecting plate and the second connecting plate.
Preferably, the sealing plug is of a conical structure, the maximum outer diameter of the sealing plug is the same as the minimum inner diameter of the filling opening, the diameter of the filling opening is gradually decreased from top to bottom, and a sealing ring matched with the filling opening is fixedly arranged at the bottom end of the outer side edge of the sealing plug.
Preferably, both sides on the top end of the plugging head are provided with limit sleeves, the bottom ends of the limit sleeves are inserted in the plugging head and fixedly connected with the plugging head, both sides inside the filling opening are fixedly provided with L-shaped guide rods matched with the limit sleeves, and the L-shaped guide rods are inserted in the limit sleeves and are in sliding connection with the limit sleeves.
Compared with the prior art, the utility model has the beneficial effects that:
(1) In operation, the quantitative filling can be realized according to the volume of the filling material receiving container by arranging the filling pipe body, the first electromagnetic valve, the second electromagnetic valve, the quantitative filling cylinder body, the piston and the air cylinder, so that the filling accuracy is effectively improved;
(2) Through setting up the leak protection material shutoff mechanism that comprises connecting rod, connecting plate one, connecting plate two and shutoff head, can realize the shutoff to the filling mouth when filling the clearance and connect the material container to can avoid the solder mask printing ink to follow the filling mouth whereabouts, effectively reduce the possibility of leaking the material, also can realize the shutoff to the filling mouth simultaneously after the filling is accomplished, avoid impurity such as dust to enter into the inside of filling mouth.
Drawings
The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model.
In the drawings:
FIG. 1 is a schematic diagram of a filling device for a solder resist coating according to the present utility model;
FIG. 2 is a schematic view of the internal structure of the filling tube and the quantitative filling tube of the present utility model;
FIG. 3 is an enlarged view of a portion of FIG. 2 in accordance with the present utility model;
in the figure: 1. a solder resist ink reservoir; 2. a discharge pipe; 3. filling a tube body; 4. a first electromagnetic valve; 5. a second electromagnetic valve; 6. quantitatively filling a cylinder; 7. a piston; 8. a cylinder; 9. a filling port; 10. a leakage-proof blocking mechanism; 11. filling a receiving container; 12. a valve body; 13. a valve plate; 14. a connecting rod; 15. a first connecting plate; 16. a second connecting plate; 17. a blocking head; 18. a seal ring; 19. a limit sleeve; 20. l-shaped guide rod.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model; all other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
As shown in fig. 1 and 2, a filling device for a solder resist coating of the present utility model comprises a solder resist ink storage tank 1, wherein a discharge pipe 2 is fixedly arranged at the bottom end of the solder resist ink storage tank 1, a filling pipe 3 is arranged at the bottom end of the discharge pipe 2, a solenoid valve I4 penetrating through the filling pipe 3 is fixedly arranged at the top end of the outer side of the filling pipe 3, a solenoid valve II 5 penetrating through the filling pipe 3 is fixedly arranged at the bottom end of the outer side of the filling pipe 3, a quantitative filling cylinder 6 is fixedly arranged at the middle position of one side, far from the solenoid valve I4 and the solenoid valve II 5, of the filling pipe 3, a piston 7 is movably arranged in the quantitative filling cylinder 6, a cylinder 8 connected with the piston 7 is fixedly arranged at one end, far from the filling pipe 3, a filling port 9 is fixedly arranged at the bottom end of the filling pipe 3, a material sealing mechanism 10 matched and connected with the solenoid valve II 5 is movably arranged at the inner side of the filling port 9, and a leak-proof material container 11 is arranged at the bottom of the filling port 9;
when filling, the first electromagnetic valve 4 is opened, the second electromagnetic valve 5 is closed, the cylinder 8 is started, the cylinder 8 pulls the piston 7 to move, negative pressure is formed in the quantitative filling cylinder 6 in the moving process of the piston 7, so that the welding-resistant ink in the welding-resistant ink storage tank 1 can be sucked into the quantitative filling cylinder 6 and the filling pipe 3, the telescopic distance of the cylinder 8 is controlled according to the internal volume of the filling material receiving container 11, the filling quantity can be controlled, quantitative accurate filling is realized, after the welding-resistant ink enters the quantitative filling cylinder 6, the first electromagnetic valve 4 is closed, the second electromagnetic valve 5 is opened, and the cylinder 8 pushes the piston 7 to move, so that the welding-resistant ink can be discharged from the filling opening 9 into the filling material receiving container 11;
the two electromagnetic valves (4, 5) are respectively formed by a valve body (12) and a valve plate (13), the valve body (12) is fixedly connected to the outer side of the filling pipe body (3), the valve plate (13) is positioned in the filling pipe body (3) and is fixedly connected with an output shaft of the valve body (12), the anti-leakage plugging mechanism (10) is formed by a connecting rod (14), a connecting plate (15), a connecting plate (16) and a plugging head (17), the connecting plate (15) is fixedly connected to one side of the bottom end of the valve plate (13) on the electromagnetic valve (5), the connecting plate (16) is fixedly connected to the middle position of the top end of the plugging head (17), the connecting rod (14) is movably connected between the connecting plate (15) and the connecting plate (16), the plugging head (17) is of a conical structure, the maximum outer diameter of the plugging head (17) is the same as the minimum inner diameter of the filling port (9), the diameter of the filling port (9) decreases from top to bottom in sequence, a sealing ring (18) matched with the filling port (9) is fixedly arranged at the bottom end of the outer side of the plugging head (17), a limit sleeve (19) is arranged at two sides of the top end of the plugging head (17), the limit sleeve (19) is inserted into the plugging head (17) and fixedly connected with the plugging head (17), two sides of the inside the plugging head (9) are fixedly arranged at two sides of the plugging head (9) and are fixedly inserted and connected with the limit sleeve (19) and matched with the limit guide rods (19, and the limit sleeve (19);
after the filling receiving container 11 is filled, the second electromagnetic valve 5 is closed, the valve plate 13 on the second electromagnetic valve 5 deflects, one side of the valve plate 13 ascends, the other side descends, the connecting rod 14 is driven to descend, the connecting rod 14 pushes the blocking head 17 to descend, the blocking head 17 descends along the L-shaped guide rod 20, limit guiding of the blocking head 17 is achieved through the L-shaped guide rod 20, the sealing ring 18 on the blocking head 17 is attached to the bottom end of the inner side wall of the filling opening 9, and therefore dripping of solder resist ink on the inner side wall of the filling opening 9 can be avoided, and the possibility of material leakage is effectively reduced.
In operation, the quantitative filling cylinder, the piston and the cylinder are arranged through the filling pipe body, the first electromagnetic valve, the second electromagnetic valve, the quantitative filling cylinder body, so that quantitative filling can be realized according to the volume of the filling material receiving container, and the filling accuracy is effectively improved; through setting up the leak protection material shutoff mechanism that comprises connecting rod, connecting plate one, connecting plate two and shutoff head, can realize the shutoff to the filling mouth when filling the clearance and connect the material container to can avoid the solder mask printing ink to follow the filling mouth whereabouts, effectively reduce the possibility of leaking the material, also can realize the shutoff to the filling mouth simultaneously after the filling is accomplished, avoid impurity such as dust to enter into the inside of filling mouth.
Claims (5)
1. A filling device for a solder resist coating, comprising a solder resist ink reservoir (1), characterized in that: the bottom end fixing of welding-resistant ink holding vessel (1) is provided with discharging pipe (2), the bottom of discharging pipe (2) is provided with filling tube body (3), the fixed solenoid valve (4) that alternates in filling tube body (3) that are provided with in the top in filling tube body (3) outside, the bottom end fixing in filling tube body (3) outside is provided with solenoid valve (5) that alternates in filling tube body (3), the fixed quantitative filling barrel (6) that is provided with in intermediate position that solenoid valve (4) and solenoid valve (5) one side were kept away from to filling tube body (3), the inside activity of quantitative filling barrel (6) is provided with piston (7), the fixed cylinder (8) that are connected with piston (7) that are provided with in one end that quantitative filling barrel (6) kept away from filling tube body (3), the bottom fixing of filling tube body (3) is provided with filling mouth (9), the inside activity of filling mouth (9) is provided with leak protection material sealing mechanism (10) that cooperatees and be connected with solenoid valve (5), the bottom of filling mouth (9) is provided with filling material container (11).
2. A filling device for solder resist according to claim 1, wherein: the electromagnetic valve I (4) and the electromagnetic valve II (5) are both composed of a valve body (12) and a valve plate (13), the valve body (12) is fixedly connected to the outer side edge of the filling pipe body (3), and the valve plate (13) is located in the filling pipe body (3) and fixedly connected with an output shaft of the valve body (12).
3. A filling device for solder resist according to claim 2, wherein: the anti-leakage plugging mechanism (10) is composed of a connecting rod (14), a first connecting plate (15), a second connecting plate (16) and a plugging head (17), wherein the first connecting plate (15) is fixedly connected to one side of the bottom end of a valve plate (13) on the second electromagnetic valve (5), the second connecting plate (16) is fixedly connected to the middle position of the top end of the plugging head (17), and the connecting rod (14) is movably connected between the first connecting plate (15) and the second connecting plate (16).
4. A filling device for solder resist according to claim 3, wherein: the sealing head (17) is of a conical structure, the maximum outer diameter of the sealing head (17) is the same as the minimum inner diameter of the filling opening (9), the diameter of the filling opening (9) decreases gradually from top to bottom, and a sealing ring (18) matched with the filling opening (9) is fixedly arranged at the bottom end of the outer side edge of the sealing head (17).
5. A filling device for solder resist according to claim 3, wherein: both sides on the top end of the plugging head (17) are provided with limit sleeves (19), the bottom ends of the limit sleeves (19) are inserted into the plugging head (17) and fixedly connected with the plugging head (17), both sides inside the filling opening (9) are fixedly provided with L-shaped guide rods (20) matched with the limit sleeves (19), and the L-shaped guide rods (20) are inserted into the limit sleeves (19) and are in sliding connection with the limit sleeves (19).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321851990.0U CN220502665U (en) | 2023-07-14 | 2023-07-14 | Filling device for solder resist coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321851990.0U CN220502665U (en) | 2023-07-14 | 2023-07-14 | Filling device for solder resist coating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220502665U true CN220502665U (en) | 2024-02-20 |
Family
ID=89868331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321851990.0U Active CN220502665U (en) | 2023-07-14 | 2023-07-14 | Filling device for solder resist coating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220502665U (en) |
-
2023
- 2023-07-14 CN CN202321851990.0U patent/CN220502665U/en active Active
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| GR01 | Patent grant |