CN220492297U

CN220492297U - EEUI-upgraded high-current version interface

Info

Publication number: CN220492297U
Application number: CN202321910771.5U
Authority: CN
Inventors: 童永灯; 吴航铝; 蓝光明
Original assignee: Xinglian Precision Industry Shenzhen Co ltd
Current assignee: Xinglian Precision Industry Shenzhen Co ltd
Priority date: 2023-07-20
Filing date: 2023-07-20
Publication date: 2024-02-13
Anticipated expiration: 2033-07-20

Abstract

The utility model relates to the technical field of interfaces, and discloses an EEUI-upgraded high-current version interface, which comprises an interface mechanism, wherein a heat dissipation mechanism is connected to the outside of the interface mechanism, and a dustproof sealing mechanism is connected to the heat dissipation mechanism; the heat dissipation mechanism comprises a heat conduction shell, and the bottom of the heat conduction shell is connected with supporting feet; the dustproof sealing mechanism comprises a sealing plate and a sleeve shell, wherein the sealing plate is connected with a permanent magnet piece, and the permanent magnet piece is connected with an iron piece. This high-current version interface of EEUI upgrading carries out conduction heat dissipation through heat conduction shell when interface body gives off a large amount of heat through the heavy current, and heat conduction shell carries out comprehensive parcel to interface body, can guarantee the radiating efficiency of interface, seals the protection through dustproof mechanism to the socket and the pin of interface, prevents that the dust from falling into the circular telegram in the interface and causing the short circuit, avoids the pin to take place wearing and tearing to appear the mar, extension interface's life.

Description

EEUI-upgraded high-current version interface

Technical Field

The utility model relates to the technical field of interfaces, in particular to a high-current version interface for EEUI upgrading.

Background

The hardware interface refers to a connection mode between two hardware devices, and the hardware interface includes both a physical interface and a logical data transfer protocol.

The high-current interface in the market at present does not have a heat dissipation mechanism and can not shelter from the protection to the dust, CN 216818709U's a high-rate data transmission typeC connector like that chinese patent website discloses, screw thread post through the terminal, rubber block and movable block are fixed the joint of connection, typeC's structure can make the interface support heavy current and stable data transmission simultaneously, but in heavy current interface use, the interface can produce a large amount of heats, can influence the transmission efficiency of interface, and the interface does not possess dustproof shielding mechanism, the dust can make the interface electric shock contact failure when using, cause the short circuit, consequently, propose a high-current version interface of EEUI upgrading for solve the problem mentioned in the above-mentioned background.

Disclosure of Invention

(one) solving the technical problems

The utility model aims to provide a high-current version interface for EEUI upgrading so as to solve the problems in the background technology.

(II) technical scheme

In order to solve the technical problems, the utility model provides the following technical scheme: the EEUI upgrading high-current version interface comprises an interface mechanism, wherein the outside of the interface mechanism is connected with a heat dissipation mechanism, and the heat dissipation mechanism is connected with a dustproof sealing mechanism;

the heat dissipation mechanism comprises a heat conduction shell, and the bottom of the heat conduction shell is connected with supporting feet;

the dustproof sealing mechanism comprises a sealing plate and a sleeve shell, wherein the sealing plate is connected with a permanent magnet piece, the permanent magnet piece is connected with an iron piece, the side face of the sealing plate is connected with a moving rod, the moving rod is connected with a sliding rod, the sliding rod is externally connected with a sliding groove, and a clamping groove is formed in the sleeve shell.

Preferably, the interface mechanism comprises an interface body, and pins are connected to the bottom of the interface body.

The interface body and the pins can enable the high-current version interface to allow high current to pass through, support data transmission and improve the functionality of the interface.

Preferably, the iron sheet is mounted on the thermally conductive housing.

The sealing plate is connected to the heat-conducting shell by the attractive force of the permanent magnet sheet to the iron sheet, so that the sealing plate is prevented from falling out of the heat-conducting shell.

Preferably, the size of the clamping groove is the same as the size of the pin.

The size of the clamping groove is the same as the size of the pin, so that the shell can protect the pin inside.

Preferably, the sliding groove is arranged on the side surface of the heat conducting shell.

The sliding rod moves on the side surface of the heat conducting shell through the sliding groove, and the heat conducting shell is opened or closed.

Compared with the prior art, the utility model has the following beneficial effects:

1. this EEUI upgrades heavy current version interface, when interface body passes through heavy current and gives off a large amount of heat through heat conduction shell, carries out conduction heat dissipation with the heat, and heat conduction shell carries out comprehensive parcel to interface body, can guarantee the radiating efficiency of interface.

2. According to the high-current version interface for EEUI upgrading, the dustproof sealing mechanism seals and protects the socket and the pins of the interface, so that dust is prevented from falling into the interface to cause short circuit when the power is applied, the pins are prevented from being worn, scratches are prevented from occurring, and the service life of the interface is prolonged.

Drawings

FIG. 1 is a schematic diagram of a front cross-sectional structure of the present utility model;

FIG. 2 is an enlarged schematic view of portion A of FIG. 1 in accordance with the present utility model;

FIG. 3 is a schematic side sectional view of the present utility model;

fig. 4 is a schematic side view of the present utility model.

Wherein: 1. an interface mechanism; 11. an interface body; 12. pins; 2. a heat dissipation mechanism; 21. a thermally conductive housing; 22. supporting feet; 3. a dustproof sealing mechanism; 31. a sealing plate; 32. a casing; 33. a permanent magnet sheet; 34. iron sheet; 35. a moving rod; 36. a slide bar; 37. a chute; 38. a clamping groove.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-4, an EEUI-upgraded high-current version interface comprises an interface mechanism 1, wherein a heat dissipation mechanism 2 is connected to the outside of the interface mechanism 1, and a dustproof sealing mechanism 3 is connected to the heat dissipation mechanism 2;

the heat dissipation mechanism 2 comprises a heat conduction shell 21, and the bottom of the heat conduction shell 21 is connected with a supporting leg 22;

the dustproof sealing mechanism 3 comprises a sealing plate 31 and a sleeve shell 32, wherein the sealing plate 31 is connected with a permanent magnet sheet 33, the permanent magnet sheet 33 is connected with an iron sheet 34, the side surface of the sealing plate 31 is connected with a moving rod 35, the moving rod 35 is connected with a sliding rod 36, the sliding rod 36 is externally connected with a sliding groove 37, and a clamping groove 38 is formed in the sleeve shell 32.

Specifically, the interface mechanism 1 includes an interface body 11, and a pin 12 is connected to the bottom of the interface body 11.

Through the technical scheme, the interface body 11 and the pins 12 can enable the high-current version interface to not only allow high current to pass through, but also support data transmission, and the functionality of the interface is improved.

Specifically, the iron piece 34 is mounted on the heat conductive housing 21.

Through the technical scheme, the iron sheet 34 is arranged on the heat-conducting shell 21, and the sealing plate 31 is connected to the heat-conducting shell 21 by utilizing the attractive force of the permanent magnet sheet 33 to the iron sheet 34, so that the sealing plate 31 is prevented from being separated from the heat-conducting shell 21.

Specifically, the dimensions of the card slot 38 are the same as the dimensions of the pin 12.

Through the above technical solution, the dimensions of the clamping groove 38 are the same as those of the pins 12, so that the casing 32 can protect the pins 12 inside.

Specifically, the chute 37 is provided on the side of the heat conductive housing 21.

By the above-described means, the slide groove 37 moves the slide bar 36 on the side surface of the heat conductive housing 21, and the heat conductive housing 21 is opened or closed.

When the portable electronic equipment is used, the shell 32 is opened to expose the pins 12, the pins 12 are connected to external equipment, the sliding rod 36 moves in the sliding groove 37 to drive the moving rod 35 and the sealing plate 31 to move leftwards, the sliding rod 36 rotates in the sliding groove 37 to enable the moving rod 35 to drive the sealing plate 31 to move upwards to expose the interface body 11 for connection, when the interface generates a heating phenomenon through high current, the interface is wrapped on the heat conducting shell 21 outside the interface body 11, heat generated by the interface body 11 is outwards dispersed through conduction, heat is dissipated to the interface body 11, and stable high current and data transmission are provided during EEUI upgrading.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a high current version interface of EEUI upgrading, includes interface mechanism (1), its characterized in that: the interface mechanism (1) is externally connected with a heat dissipation mechanism (2), and the heat dissipation mechanism (2) is connected with a dustproof sealing mechanism (3);

the heat dissipation mechanism (2) comprises a heat conduction shell (21), and a supporting foot (22) is connected to the bottom of the heat conduction shell (21);

the dustproof sealing mechanism (3) comprises a sealing plate (31) and a shell (32), wherein the sealing plate (31) is connected with a permanent magnet piece (33), the permanent magnet piece (33) is connected with an iron piece (34), the side face of the sealing plate (31) is connected with a moving rod (35), the moving rod (35) is connected with a sliding rod (36), the sliding rod (36) is externally connected with a sliding groove (37), a clamping groove (38) is formed in the shell (32), the iron piece (34) is arranged on the heat conducting shell (21), the clamping groove (38) is the same as the pin (12) in size, and the sliding groove (37) is formed in the side face of the heat conducting shell (21);

the interface mechanism (1) comprises an interface body (11), and pins (12) are connected to the bottom of the interface body (11).