CN220491916U - Lithium battery composite copper foil structure - Google Patents
Lithium battery composite copper foil structure Download PDFInfo
- Publication number
- CN220491916U CN220491916U CN202321930491.0U CN202321930491U CN220491916U CN 220491916 U CN220491916 U CN 220491916U CN 202321930491 U CN202321930491 U CN 202321930491U CN 220491916 U CN220491916 U CN 220491916U
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- CN
- China
- Prior art keywords
- layer
- copper foil
- hot melt
- melt adhesive
- lithium battery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 53
- 239000002131 composite material Substances 0.000 title claims abstract description 24
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 title claims abstract description 16
- 229910052744 lithium Inorganic materials 0.000 title claims abstract description 16
- 239000010410 layer Substances 0.000 claims abstract description 100
- 239000011127 biaxially oriented polypropylene Substances 0.000 claims abstract description 35
- 229920006378 biaxially oriented polypropylene Polymers 0.000 claims abstract description 35
- 239000004831 Hot glue Substances 0.000 claims abstract description 28
- 229910052802 copper Inorganic materials 0.000 claims abstract description 25
- 239000010949 copper Substances 0.000 claims abstract description 25
- 239000002184 metal Substances 0.000 claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims abstract description 24
- 238000001755 magnetron sputter deposition Methods 0.000 claims abstract description 21
- 238000007747 plating Methods 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229920000098 polyolefin Polymers 0.000 claims description 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 abstract description 5
- 238000000576 coating method Methods 0.000 abstract description 5
- 239000011889 copper foil Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 239000000047 product Substances 0.000 description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N argon Substances [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 238000010096 film blowing Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- -1 argon ions Chemical class 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Abstract
The utility model discloses a lithium battery composite copper foil structure, which comprises: the modified BOPP substrate layer comprises a BOPP film layer and hot melt adhesive layers formed on two sides of the BOPP film layer in the thickness direction; the magnetron sputtering metal layer is arranged on one side of the hot melt adhesive layer, which is away from the BOPP film layer; the water copper plating layer is arranged on one side of the magnetron sputtering metal layer, which is away from the hot melt adhesive layer. The lithium battery composite copper foil structure provided by the utility model can improve the binding force of the metal coating and the BOPP substrate layer, thereby improving the service performance of the product.
Description
Technical Field
The utility model relates to the technical field of battery manufacturing, in particular to a lithium battery composite copper foil structure.
Background
The composite copper foil is a sandwich structure formed by copper plating on the front side and the back side of an organic plastic film such as PET, BOPP, PI. Although the composite copper foil has a plurality of technical advantages, as the metal coating layer is physically deposited on the surface of the organic plastic film, for example, chinese patent No. 115732698A discloses a composite copper foil film, the bonding force between the organic material and the metal coating layer is low, so that the composite copper foil and the organic plastic are easy to separate and fall off in the use process, and the service performance and the service life of the product are affected. In particular, for BOPP substrates, the binding force with the metal coating is lower than for PET substrates.
The present utility model has been made in order to solve the above-mentioned problems.
Disclosure of Invention
The utility model aims to provide a lithium battery composite copper foil structure which can improve the binding force of a metal coating and a substrate layer.
Based on the problems, the technical scheme provided by the utility model is as follows:
a lithium battery composite copper foil structure comprising:
the modified BOPP substrate layer comprises a BOPP film layer and hot melt adhesive layers formed on two sides of the BOPP film layer in the thickness direction;
the magnetron sputtering metal layer is arranged on one side of the hot melt adhesive layer, which is away from the BOPP film layer;
the water copper plating layer is arranged on one side of the magnetron sputtering metal layer, which is away from the hot melt adhesive layer.
In some of these embodiments, the BOPP film layer has a thickness of 3.6 to 4.0 μm.
In some embodiments thereof, the hot melt adhesive layer is a polar polyolefin hot melt adhesive.
In some of these embodiments, the thickness of the hot melt adhesive layer is 0.3 to 0.4 μm.
In some embodiments, the magnetron sputtered metal layer is a copper layer or a copper alloy layer.
In some embodiments, the magnetron sputtered metal layer has a thickness of 50 to 60nm.
In some embodiments, the thickness of the aqueous copper plating layer is 0.9 to 1.1 μm.
Compared with the prior art, the utility model has the advantages that:
the BOPP film is improved, a three-layer coextrusion film blowing device is used for manufacturing a modified BOPP substrate with a sandwich structure, a structure of a hot melt adhesive layer, the BOPP film and the hot melt adhesive layer is obtained, the hot melt adhesive layer is solid at normal temperature and can be melted in the magnetron sputtering process, so that the adhesive force between a magnetron sputtering metal layer and the BOPP film layer is improved, finally copper atoms are deposited on the surface of the magnetron sputtering metal layer through water copper plating, and the structure improves the bonding force between a metal coating and the substrate layer and improves the quality of products.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the description of the embodiments will be briefly described below, in which the drawings are only some embodiments of the present utility model, and other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a composite copper foil structure for a lithium battery according to an embodiment of the present utility model;
wherein:
1. a modified BOPP substrate layer; 1-1, a BOPP film layer; 1-2, a hot melt adhesive layer;
2. magnetron sputtering a metal layer;
3. and (5) plating a copper layer with water.
Detailed Description
The above-described aspects are further described below in conjunction with specific embodiments. It should be understood that these examples are illustrative of the present utility model and are not intended to limit the scope of the present utility model. The implementation conditions used in the examples may be further adjusted according to the conditions of the specific manufacturer, and the implementation conditions not specified are generally those in routine experiments.
Referring to fig. 1, for a schematic structural diagram of an embodiment of the present utility model, a lithium battery composite copper foil structure is provided, which includes a modified BOPP substrate layer 1, a magnetron sputtering metal layer 2, and a water copper plating layer 3.
The modified BOPP substrate layer 1 is a modified BOPP film with a sandwich structure manufactured by using three-layer coextrusion film blowing equipment, and comprises a BOPP film layer 1-1 and hot melt adhesive layers 1-2 formed on two sides of the BOPP film layer 1-1 in the thickness direction, wherein the thickness of the BOPP film layer 1-1 is 3.6-4.0 mu m, the hot melt adhesive layer 1-2 is polar polyolefin hot melt adhesive, and the thickness is 0.3-0.4 mu m. The hot melt adhesive layer 1-2 is polar polyolefin, has ultrahigh polarity, but does not contain ester in molecular chain, so that the bonding force of a copper layer can be increased, and hydrolysis can not occur under acidic or alkaline conditions. The hot melt adhesive layer 1-2 has no viscosity at normal temperature, is solid at normal temperature, needs to be melted at a certain temperature, has a melting temperature of 80-150 ℃, belongs to environment-friendly materials, and does not contain organic solvents.
The magnetron sputtering metal layer 2 is a copper layer or a copper alloy layer, and is deposited on one side of the hot melt adhesive layer 1-2, which is far away from the BOPP film layer 1-1, by adopting a magnetron sputtering process.
In this example, the magnetron sputtering metal layer 2 is a copper layer, and the specific process is as follows: in a high vacuum environment, a copper target with the purity of 99.99% is used as a cathode, argon ions are used for bombarding the target, cathode sputtering is generated, copper atoms are sputtered on the modified BOPP substrate layer 1 to form copper layer deposition, and the copper target is kept in a solid state all the time and does not form a molten pool. In the process of magnetron sputtering, the temperature of the surface layer of the BOPP film layer 1-1 is about 130 ℃, the melting temperature of the hot melt adhesive layer 1-2 can be reached, sputtered copper atoms are fused with the hot melt adhesive layer 1-2, and the adhesive force between the copper layer and the BOPP film layer 1-1 is increased; the magnetron sputtering copper layer 2 is a bottom layer, a conductive substrate is provided for the subsequent water plating process, the thickness of single double-sided copper plating is 50-60 nm, and the surface sheet resistance is about 2 omega.
The water copper plating layer 3 is arranged on one side of the magnetron sputtering metal layer 2 away from the hot melt adhesive layer 1-2. Under the influence of an external electric field, copper ions in the copper sulfate solution are diffused to the surface of the cathode to obtain electrons, copper atoms are generated through reduction and deposited on the magnetron sputtering copper layer, the thickness of the copper layer is finally increased to about 0.9-1.1 mu m, and finally the surface sheet resistance can reach 20+/-3 mΩ/≡.
The following are specific examples:
a modified BOPP substrate coiled film with W1290mm, L15000m and D4.5 mu m is arranged in a coiling magnetron sputtering machine, and the ion source voltage is set to 1800V, and the argon flow is set to 800sccm; 12 copper targets on one side, wherein the power of each target is 6kw, the running speed is 18m/min, the test sheet resistance is 1.8-2.5 omega after the manufacture is finished, other relevant performance data are tested, the test sheet resistance is recorded and then is trimmed by a slitting machine, the slitter edges with 35mm are cut off on two sides respectively, and then the slitter edges are rewound, so that a roll of composite copper foil semi-finished product with W1220mm x L14500m x 4.6 mu m is obtained; then the coiled film is subjected to water plating by a water plating line, so that a copper layer is thickened rapidly, and the total current of single-sided water plating parameters is as follows: 11000A, operating speed: and (3) carrying out synchronous trimming on a blanking end at 14m/min to obtain a composite copper foil with the thickness of W1140mm L14000m D6.5 mu m, and finally carrying out slitting inspection and shipment according to the requirements of customers.
The following is a 180 ° peel force test comparison for each coating structure:
180 ° peel force test method: and (3) respectively cutting the left, the middle and the right of the product to be tested transversely to obtain 1 sample, wherein the width is 15mm, the length is 200mm, using 3M double faced adhesive tape under the conditions of room temperature and normal pressure, uniformly attaching the sample to be tested to a stainless steel plate, and uniformly attaching the sample to be tested to the double faced adhesive tape. And reversely stripping the conductive layer and the insulating layer of the sample to be tested at the speed of 180 DEG and 50mm/min by using a pulling machine, and reading the maximum pulling force N according to the pulling force and displacement data graph.
In conclusion, the composite copper foil structure can improve the binding force between the metal plating layer and the BOPP substrate layer, so that the service performance of a composite copper foil finished product is improved, and the cycle life of the battery is prolonged.
The above examples are provided for illustrating the technical concept and features of the present utility model and are intended to enable those skilled in the art to understand the contents of the present utility model and to implement the same, and are not intended to limit the scope of the present utility model. All equivalent changes or modifications made according to the spirit of the present utility model should be included in the scope of the present utility model.
Claims (7)
1. A lithium battery composite copper foil structure, comprising:
the modified BOPP substrate layer comprises a BOPP film layer and hot melt adhesive layers formed on two sides of the BOPP film layer in the thickness direction;
the magnetron sputtering metal layer is arranged on one side of the hot melt adhesive layer, which is away from the BOPP film layer;
the water copper plating layer is arranged on one side of the magnetron sputtering metal layer, which is away from the hot melt adhesive layer.
2. The lithium battery composite copper foil structure according to claim 1, wherein: the thickness of the BOPP film layer is 3.6-4.0 mu m.
3. The lithium battery composite copper foil structure according to claim 1, wherein: the hot melt adhesive layer is a polar polyolefin hot melt adhesive.
4. The lithium battery composite copper foil structure according to claim 3, wherein: the thickness of the hot melt adhesive layer is 0.3-0.4 mu m.
5. The lithium battery composite copper foil structure according to claim 1, wherein: the magnetron sputtering metal layer is a copper layer or a copper alloy layer.
6. The lithium battery composite copper foil structure according to claim 5, wherein: the thickness of the magnetron sputtering metal layer is 50-60 nm.
7. The lithium battery composite copper foil structure according to claim 1, wherein: the thickness of the water copper plating layer is 0.9-1.1 mu m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321930491.0U CN220491916U (en) | 2023-07-21 | 2023-07-21 | Lithium battery composite copper foil structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321930491.0U CN220491916U (en) | 2023-07-21 | 2023-07-21 | Lithium battery composite copper foil structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220491916U true CN220491916U (en) | 2024-02-13 |
Family
ID=89830096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321930491.0U Active CN220491916U (en) | 2023-07-21 | 2023-07-21 | Lithium battery composite copper foil structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220491916U (en) |
-
2023
- 2023-07-21 CN CN202321930491.0U patent/CN220491916U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |